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NANOTECHNOLOGY 2008. 3. 13 (목) 이길선

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  • NANOTECHNOLOGY

    2008. 3. 13 (목)

    이 길 선

  • 나노 기술 (Nano Technology)( gy)“나노미터(1nm = 1x10-9 m : 10억분의 1미터) 크기의 물질을

    조작하고 제어하는 기술”조작하고 제어하는 기술

    나노: 그리스어로 난쟁이를 의미함

    사람 적혈구 DNA 원자백두산지구 핀 머리

    m nm(1/십억)

    μm(1/백만)

    mm(1/천)

    km(천)

    103 km(백만) (1)

  • 나노기술의 응용

  • 재미있는 나노 현상

    크기에 따라 색깔이 바뀌는 나노입자

  • 재미있는 나노 현상합성조건에 따른 다양한 모양의

    나노입자

  • 춤추는 자성액체: 콜로이드 상태의 액체 자석(지름 수십 f 로 안정화 $100/ )(지름 : 수십 nm, surfactant로 안정화, >$100/g)

  • 나노기술역사

    Si(111)-7x7fu

    Si(111)-7x7

    5 nm

  • 나노 크기를 어떻게 관찰하는가?

    주사형 터널 현미경(STM)

    전자현미경

  • 여러가지표면의원자배열

    8x8 silicon nitride / Si(111)

    fu

    Si(111)-7x7 3 x 3Sb/Si(111)-

    5 nm

    5 3 x5 3Sb/Si(111) Sb/Si(111)-2x1 Si(100)-2x1-

  • 전자의 터널링전자의 터널링

    도체 도체절연체

  • 분자주판 단분자의합성

    C60 on stepped Cu surface Fe(CO)2

  • 작은 것으로부터 나노크기로 (Bottom-up 방식)

  • E l Q t C lExample: Quantum Corral

    D Ei l IBM

    (1) STM manipulation(2) Visualization of the spatial D. Eigler, IBMof the spatial distribution of certain quantum states of thestates of the corral

    • Surface state electrons on Cu(111) were confined to closed• Surface state electrons on Cu(111) were confined to closedstructures (corrals) defined by barriers built from Fe datoms.

    • A circular corral of radius 71.3 Angstrom was constructed inthis way out of 48 Fe adatoms.

  • Atomic Manipulation by STMIron on Copper (111):

    Circular corralradius= 71 3 Aradius= 71.3 A 48 Fe atoms

    Quantum-mechanicalQuantum mechanicalinterference patterns

    M.F. Crommie, C.P. Lutz, D.M. Eigler. Science 262, 218-220 (1993).

  • 전자의 파동성 : STM 이미지

    48 Fe atoms on Cu(111)( )

  • STM Manipulation of Atoms and MoleculesSTM Manipulation of Atoms and Molecules

    Xenon/Ni(110)Xenon/Ni(110)

    Iron/Cu(111)CO/Pt(111)

  • Atomic Force Microscope (AFM) and Lateral Force Microscope (LFM)

    PhotodiodeL

    ~PiezoLaser

    Feedback andx,y,z ScanControl

    ImageControl

    x,y,z PiezoDrum Scanner

    Topography,LFM, etc.

    ×500 ×20000

    < Microscope image > < FE-SEM image >

  • 단분자의 정렬 모양 : AFM 이미지단분자의 정렬 모양 : AFM 이미지

  • Molecular Images of Au (111) and ODT on Au/micaTopography FFT filtered image Spacing

    Au (111) 2 9 ÅAu (111) 2.9 Å

    2 5 Å 2 5 Å

    5.0 ÅODT 5.0 ÅODT on Au/mica Au (111)

    4 0 Å4 0 Å

  • 나노기술의 기술적 접근

    □ T d 방식□ Top-down 방식

    ▶ 나노미터 수준의 가공을 통해 나노미터크기의 구조체를 인공적

    으로 형성하는 기술 (거시적 → 미시적, 일반적인 반도체 공정)

    □ Bottom-up 방식p

    물질의 최소 단위인 원자나 분자를 자유자재로 조작하여 원하는

    기능 구조체를 형성하는 기술(미시적 → 거시적 예를 들면 레고처럼기능, 구조체를 형성하는 기술(미시적 → 거시적, 예를 들면 레고처럼

    각 조각을 조립하여 전체를 만드는 경우)

  • ( )Dip Pen Lithography (DPN)

  • Dip-pen nanolithography의 개념

    □ Mirkin박사는 AFM측정에서 극복해야 할 단점인 대기 중의 물분자의 기판으로의

    이동을 이용하여 코팅하고자 하는 물질을 물과 함께 이동가능성을 생각

    Fountain penAFM tip을 이용한 물질전달 개념도

    □ 만년필과 DPN의 비교

    Fountain pen

    DPN Fountain pen

    AFM tip Nib (end part of pen)

    Solid substrate PaperSolid substrate Paper

    Molecules Ink

  • Dip Pen Nanolithography (DPN)

    Invention of DPN• Capillary forces between the AFM tip and the sample → Difficult to achieve molecular resolution in air (water condensation)

    Mirkin at el, Science, 283, 1999.Advantages

    Key Factors of DPN Resolution• The grain size of substrate

    Advantages• Positive patterning • Delivery of different types of

    • Interaction between molecules and substrate • The tip-substrate contact time and the scan speed• Relative humidity

    molecules at specific sites• Not resist, stamp, complicated processing

    Si l i i ( l AFM)Relative humidity • Simple instrumentation (general AFM)

  • Examples of Direct Nanopatterns by DPN (Mirkin’s group)

    Au (111)Amorphous Au Amorphous AuAu (111)Amorphous Au Amorphous Au

    HMDS (hexamethyldisilazane) : (H3C)3-Si-NH-Si-(CH3)y 3 3 3

    On Oxide surfaces

    Amorphous Au

  • Nanofabrication: Dip Pen NanolithographyNanofabrication: Dip Pen NanolithographyS. Hong and C.A. Mirkin, Northwestern Univ.

  • Multiple DPN - 8

  • Protein Detection using DPN

  • Multiple DPN - 55000

    8773 dots

  • Electrochemical DPN (Liu’s group)

    Ag, Ge, Pd, Cu nanowires Au nanowires

  • Lith hLithography

    PhotolithographyPhotolithography

    E-beam lithography

    Microcontact Printing (uCP)Microcontact Printing (uCP)

    Imprinting

  • Image Display Using Immobilized Vesicles

    Immobilized diacetylene liposome

    glass substrate

    254 nm UV exposure

    mask+ polymerization

    p

    M k P ttp yon exposed areas

    Heating at 100 oC

    Mask Pattern

    blue-to-redcolor transition

    Observe patternwith a fluorescence microscope

    Patterned Polydiacetylene Image

  • Nano-meter spacing electrode fabricationp g

    SiO / Si waferResist coatingPMMA 950K C2SiO2 / Si wafer

    SiO2 thickness: 200 nmPMMA 950K C2Thickness: 80 nm

    e-beam lithography& develop PMMA

    Metallization 5 nm Ti/10 nm Au

    Nano patternChannel width: 20 nm

    thermal evaporation& lift off

    iQUIPS Korea Univ.

  • Photo & E-beam Lithography Process

    PMMA spin coatingPR spin coating

    E-beam LithographyPhoto Lithography

    PMMA spin coating(thickness: ~100 nm )

    PR spin coating(thickness: ~1 μm )

    UV or laser exposureiti ith k

    e-beam exposuredi t iti

    developmentdevelopmentwaferPRmask

    writing with mask direct writing

    metallization

    lift-off

    metallization

    lift-off

    maskPMMAexposed areametal

    lift offlift off

    • resist: photo sensitive polymer• light source: UV or ArF laser

    • resist: PMMA• light source: e beam• light source: UV or ArF laser

    • critical size: ~100 nm• light source: e-beam• critical size:

  • Nano Pattern Fabrication Process(Dr. Hwang, iQUIPS, Seoul University)( g Q y)

    E-beam lithography for nano pattern fabrication

    Photo lithography for pad pattern fabrication

  • SEM Images of Typical Nano-Electrode(Dr H ang iQUIPS Seo l Uni ersit )(Dr. Hwang, iQUIPS, Seoul University)

  • FE-SEM and AFM Images of Nanoelectrode

    7 5 0 n m1 0 0 0 n m

  • E-beam patterning examplesp g p

    D l ttDevelop patternLine width/spacing1. 200 nm/300 nm2. 100 nm/400 nm3 50 /450

    12

    34 D l tt3. 50 nm/450 nm

    4. 100 nm/100 nm5. 50 nm/50 nm

    4 5 Develop patternLine width/spacing20 nm/180 nm

    Liftoff patternLiftoff pattern Liftoff patternLine width/spacing50 nm/50 nm

    Liftoff pattern6 um diameter150 nm line width

    iQUIPS Korea Univ.

  • 세상에서 가장 작은 기타: 전자빔 식각 방법

  • Self-assembled monolayer (SAM) and μCP

    ▲ LFM images of a gold surface patterned with SAMs terminated in different head groups.

    ▲ SEM images of test patterns on layers of silver (A, B, C: 50 nm thick; D: 200 nm thick) that were fabricated by mCP with HDT

    Angew. Chem. Int. Ed, 37, 550-575 (1998)

  • Self-assembled monolayer (SAM) and μCPCrystal growth

    Whitesides et al., Nature, 398, 495 (1999)

  • 21세기는 나노의 시대21세기는 나노의 시대

    수학, 화학, 물리, 생물, 공학의융합 기술