mz-e60 - minidisc.org€¦ · mz-e60 service manual portable minidisc player specifications us...
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– 1 –
MICROFILM
MZ-E60SERVICE MANUAL
PORTABLE MINIDISC PLAYER
SPECIFICATIONS
US ModelCanadian Model
AEP ModelE Model
SystemAudio playing systemMiniDisc digital audio systemLaser diode propertiesMaterial: GaAlAsWavelength: λ = 790 nmEmission duration: continuousLaser output: less than 44.6 µW(This output is the value measured at a distanceof 200 mm from the objective lens surface on theoptical pick-up block with 7 mm aperture.)Revolutions800 rpm to 1,800 rpmError correctionAdvanced Cross Interleave Reed SolomonCode (ACIRC)Sampling frequency44.1 kHzCodingAdaptive TRansform Acoustic Coding (ATRAC)Modulation systemEFM (Eight to Fourteen Modulation)Number of channels2 stereo channels1 monaural channelFrequency response20 to 20,000 Hz ± 3 dBWow and FlutterBelow measurable limitOutputsHeadphones: stereo mini-jack,maximum output level 5 mW + 5 mW, loadimpedance 16 ohms
GeneralPower requirementsOne LR6 (size AA) battery (not supplied)Battery operation timeYou can check the battery condition with thebattery indication which is displayed while usingthe player.t Battery power decreasingvr Weak batteryve The battery has gone out. “LOW BATT”
flashes in the display on the remote control,and the power goes off.
Battery LifeApproximately 12 hours of playback can beexpected with one LR6 (size AA) alkaline battery(not supplied).NoteThe battery life may shorter depending onoperating conditions and temperature of thelocation.
– Continued on next page –
US and foreign patents licensed from DolbyLaboratories Licensing Corporation.
Model Name Using Similar Mechanism MZ-E90
MD Mechanism Type MT-MZE60-169
Optical Pick-up Mechanism Type LCX-2E
(Photo: Silver)
– 2 –
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITHMARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTSLIST ARE CRITICAL TO SAFE OPERATION.REPLACE THESE COMPONENTS WITH SONY PARTS WHOSEPART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR INSUPPLEMENTS PUBLISHED BY SONY.
Flexible Circuit Board Repairing• Keep the temperature of the soldering iron around 270°C
during repairing.• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement• Never reuse a disconnected chip component.• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Precautions for Laser Diode Emission CheckWhen checking the emission of the laser diode during adjust-ments, never view directly downwards as this may lead toblindness.
Precautions for Using Optical Pick-up (LCX-2E)As the laser diode inside the optical pick-up damages by staticelectricity easily, solder the laser tap of the Optical pick-upflexible board when handling. Also take the necessary measuresto prevent damages by static electricity. Handle the Optical pick-up flexible board with care as it breaks easily.
Laser tap
Optical Pick-up flexible board
CAUTIONUse of controls or adjustments or performance of proceduresother than those specified herein may result in hazardousradiation exposure.
IN NO EVENT SHALL SELLER BELIABLE FOR ANY DIRECT,INCIDENTAL OR CONSEQUENTIALDAMAGES OF ANY NATURE, ORLOSSES OR EXPENSES RESULTINGFROM ANY DEFECTIVE PRODUCTOR THE USE OF ANY PRODUCT.
“MD WALKMAN” is a trademark of SonyCorporation.
This MiniDisc player is classi-fied as a CLASS 1 LASERproduct.The CLASS 1 LASERPRODUCT label is located onthe bottom exterior.
DimensionsApprox. 81 × 25 × 74 mm (w/h/d)(3 1/4 × 1 × 3 in.) not including projectingparts and controlsMassApprox. 95 g (3.4 oz.) the player onlyApprox. 136 g (4.8 oz.) incl. a premastered MDand a LR6 (size AA) alkaline batterySupplied accessoriesHeadphones with a remote control (1)Carrying pouch (1)
Design and specifications are subject to changewithout notice.
ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LESDIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCESSONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCESSONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUELOU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
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1. SERVICING NOTE ......................................................... 4
2. GENERAL ......................................................................... 5Playing an MD right away! ................................................... 5
3. DISASSEMBLY ............................................................... 73-1. Panel Assy, Upper ................................................................. 73-2. Holder Assy ........................................................................... 73-3. Mechanism Deck .................................................................. 83-4. Main Board ........................................................................... 83-5. Service Assy, OP ................................................................... 9
4. TEST MODE ................................................................... 104-1. General ................................................................................ 104-2. Setting the Test Mode ......................................................... 10
4-2-1. How to Set the Test Mode ........................................... 104-2-2. Operations when the Test Mode is Set ........................ 104-2-3. How to Release the Test Mode .................................... 10
4-3. Test Mode Structure ............................................................ 104-4. Manual Mode ...................................................................... 11
4-4-1. Outline of the Function ............................................... 114-4-2. How to Set the Manual Mode ...................................... 11
4-5. Overall Adjustment Mode ................................................... 114-5-1. Outline of the Function ............................................... 11
5. ELECTRICAL ADJUSTMENTS .............................. 125-1. General ................................................................................ 125-2. Notes for Adjustment .......................................................... 12
5-2-1. Jigs ............................................................................... 125-2-2. Adjustment Sequence .................................................. 125-2-3. Power ........................................................................... 12
5-3. Reset NV ............................................................................. 125-3-1. How to Reset NV ........................................................ 12
5-4. Overall Adjustment Mode ................................................... 125-4-1. Overall Adjustment Mode Structure ............................ 125-4-2. Overall CD and MO Adjustment Method ................... 125-4-3. Overall CD and MO Adjustment Items ....................... 13
TABLE OF CONTENTS
6. DIAGRAMS ..................................................................... 146-1. IC Pin Description .............................................................. 14
6-1-1. IC801 RU6915MF-0006 (System Control) ................. 146-2. Block Diagrams .................................................................. 17
6-2-1. MD Block Diagram ..................................................... 176-2-2. Servo, System Control Block Diagram ....................... 19
6-3. Printed Wiring Boards and Schematic Diagrams ................ 216-3-1. Printed Wiring Board – Main Board – ........................ 216-3-2. Schematic Diagram – Main Board (1/4) – .................. 256-3-3. Schematic Diagram – Main Board (2/4) – .................. 276-3-4. Schematic Diagram – Main Board (3/4) – .................. 296-3-5. Schematic Diagram – Main Board (4/4) – .................. 31
6-4. IC Block Diagrams ............................................................. 33
7. EXPLODED VIEWS ..................................................... 377-1. Main Unit Section ............................................................... 377-2. Mechanism Deck Section ................................................... 38
8. ELECTRICAL PARTS LIST ...................................... 39
– 4 –
1) When repairing this device with the power on, if you removethe main board or open the upper panel assy, this device stopsworking.In this case, you can work without the device stopping byfastening the hook of the OPEN/CLOSE switch (MAIN boardS809) with tape.
2) This set is designed to perform automatic adjustment for eachadjustment and write its value to EEPROM. Therefore, whenEEPROM (MAIN board IC802) has been replaced in service,be sure to perform automatic adjustment and write resultantvalues to the new EEPROM.Refer to section 4 Test Mode (page 10) for details.
SECTION 1SERVICING NOTE
MAIN board S809
– 5 –
SECTION 2GENERAL This section is extracted from
instruction manual.
– 6 –
– 7 –
Note : This set can be disassemble according to the following sequence.
SECTION 3DISASSEMBLY
3-1. PANEL ASSY, UPPER
3-2. HOLDER ASSY
Note : Follow the disassembly procedure in the numerical order given.
Set Panel Assy, Upper Holder Assy Mechanism Deck
Service Assy, OP
Main Board
4 screws(1.4),MI
3 screws(1.4),MI
5 panel assy, upper
1
2
2 shaft
3 holder assy
1 shaft
– 8 –
3-3. MECHANISM DECK
3-4. MAIN BOARD
7 mechanism deck
1 sheet (BLIND)
6 CN551
5 CN501
claw
2 screw (MD), step
3
4
3
2 screws(1.7x2.5)
1 screws(1.7x2.5)
4 MAIN board
knob (HOLD)
S808S806
S807
knobs (MB)
Note : When installing, fit the knobs (HOLD, MB) and the switchs (S806, 807, 808).
– 9 –
3-7. SERVICE ASSY, OP
4 M 1.4
3 M 1.4
1 washer
2 gear (SA)
5 service assy, OP
– 10 –
• Press and hold down PLAY MODE to hold the current displaywhile the key is being pressed.
4-2-3. How to release the TEST MODEWhen method 1 was used:
Turn off the power and open the solder bridge on TAP801 on themain board.Note: The solder should be removed clean. The remaining
solder may make a short with the chassis and other part.When method 2 was used:
Turn off the power.
4-3. TEST MODE STRUCTURE
SECTION 4TEST MODE
4-1. GENERAL• When entered in the TEST MODE, this set provides the Overall
Adjustment mode which allows CD and MO discs to be auto-matically adjusted. In the Overall Adjustment mode , the systemdiscriminates between CD and MO discs, performs adjustmentsin sequence automatically, and displays the faulty location if anyfault is found. In the Manual mode, selected adjustments can beperformed automatically.
• The attached remote control is used to operate the TEST MODE.Unless otherwise specified in the text, the key means that on theremote control.
4-2. SETTING THE TEST MODE
4-2-1. How to set the TEST MODETo set the TEST MODE, two methods are available.1 Solder bridge and short TAP801 (TEST) on the main board.
Then turn on the power.
2 In the normal mode, operate the keys on the set and those on theremote control as specified below:Turn on HOLD switch on the set. Holding down x (STOP)key on the set, press the keys on the remote control in thefollowing sequence:
> N t > N t . t . t > N
t . t > N t . t X t X
4-2-2. Operations when the TEST MODE is setWhen the TEST MODE is entered, the system switches to thedisplay check mode within the TEST MODE. From this mode, theother Test modes can be accessed.When the TEST MODE is set, the LCD repeats a cycle of thefollowing displays:
Remote control LCD
L501
C518
CN551
8 15
TP518
CN50
1
1
5
10
15
20
TAP801
TAP801
MAIN BOARD (SIDE B)
888 u
004 V1.100
All on
All off
Microprocessorversiondisplay
Test Mode(Display Check Mode)
Manual Mode
Servo Mode
Audio Mode
Power Mode
OP Alignment Mode
key
key
+
key+
key
x
x
key
key
Overall Adjustment Mode
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Note: In the Power mode, the power adjustment value is onlydisplayed.
4. During each test, press and hold down > N key or .key for a while to move the optical pickup on the sled outer orinner perimeter.
5. To terminate the Manual mode and return to the TEST MODE,press x key.
4-5. OVERALL ADJUSTMENT MODE
4-5-1. Outline of the functionThis mode is designed to adjust the servo system automatically bygoing through all the adjustment items.Usually, this mode is used to perform automatic adjustments whenservicing the set.
For further information, refer to section 5. ELECTRICAL ADJUST-MENTS (page 12).
4-4. MANUAL MODE
4-4-1. Outline of the functionThe Manual mode is designed to perform adjustments andoperational checks on the set’s operation according to eachindividual function.Usually, no adjustments are made in this mode.However, the Manual mode is used to clear the memory beforeperforming automatic adjustments in the Overall Adjustment mode.
4-4-2. How to set the Manual mode1. Set the TEST MODE and press + key to set the Manual mode.
Remote control LCD display
3. During each test mode, the display is changed from one toanother each time DISPLAY key is pressed.
2. Each test item is assigned with a three-digit item number. Thethird digit stands for a major item, the second digit for a middleitem, and the first digit for a moniro item.
000 AAASCC
Change Major Item
Change Middle Item
Change Minor Item
Change Adjustment Value
Write Adjustment Value
.
key : Up+
key : Down
key : Up+
key : Down
key : Up+
key : Down
key : Write
keykey x
keyx
> N
key> N
key : Upkey : Down
> N
X
011 XXXSXX
011 XX BXX
011 XX AXX
011 XXXJXX
011 XX RXX
731 XX VXX
Address Value & Adjustment Value
Block Error Value & Adjustment Value
ADIP Error Value & Adjustment Value
Jitter Value & Adjustment Value
Asy Mmetry Feed Back Gain Value & Adjustment Value
Power Adjustment Value
XXX: Each ValueXX: Adjustment Value
for Item number
Memory Monitor Mode
LCD display
LCD display
LCD display
LCD display
LCD display
LCD display
– 12 –
5-4. OVERALL ADJUSTMENT MODE
5-4-1. Overall adjustment mode structure
Note: The overall adjustments should be always performed in thesequence of CD t MD adjustments.
5-4-2. Overall CD and MO adjustment method1. Set the TEST MODE (see page 10) and press – key to set the
Overall Adjustment mode.
LCD display
2. Insert CD disc in the set, and press . key to set the OverallCD Adjustment mode.Automatic adjustments are made.
LCD display
XXX: Item No. for which an adjustment is being executed.
3. If NG in the overall CD adjustments, return to Reset NV andperform the adjustment again.
LCD display
XXX: NG item No.
4. If OK through the overall CD adjustments, then perform overallMO adjustments.
LCD display
5. Insert MO disc in the set, and press > N key to set theOverall MO Adjustment mode. Automatic adjustments are made.
LCD display
XXX: Item No. for which an adjustment is being executed.
Overall CD Adjustment
Overall Adjustment Mode
Overall MO Adjustment
key> N
key> N
. key
. key
keyx
keyx
044 Assy ?
XXX XXXSXX
Display on Adjustment state for Each Items.
XXX NGXX
Adjustment Value becomed to NG.
XXX End-OK
XXX XXXSXX
SECTION 5ELECTRICAL ADJUSTMENTS
5-1. GENERALIn this set, CD and MO discs can be automatically adjusted by set-ting the Overall Adjustment mode within the TEST MODE,Before performing these automatic adjustments, it is necessary toclear the memory and adjust the power in the Manual mode.
5-2. NOTES FOR ADJUSTMENT
5-2-1. Jigs• CD disc TDYS-1 (part code: 4-963-646-01)• MO disc PTDM-1 (part code: J-2501-054-A)
or commercially available MO disc (recorded)• Digital voltmeter
5-2-2. Adjustment sequenceThe adjustments should be always performed in the followingsequence:
5-2-3. PowerA stablized power supply is used to supply 1.5 V DC to the batteryterminal.Otherwise, an AA alkali battery with the remaining level of 1.5 VDC or more is used. (In this case, make sure that the batteryindication on the remote control is “FULL”)
5-3. RESET NV
5-3-1. How to reset NV1. Set the TEST MODE. (See page 10)
2. Set the Manual mode and set the item No. 021, Reset NV.
LCD display
1 Reset NV (Clear the memory)
2 Overall CD adjustments
3 Overall MO adjustments Overall adjustment mode
Manual mode
3. Press X key on the remote control.
LCD display
4. Press X key on the remote control again.
LCD display
5. Press x key to terminate the Manual mode and return to theTEST MODE.
021 AAASCC
021 AAASCCNote: CC is blink.
021 AAASCCNote: CC blink. t Finish the CC light on.
– 13 –
6. If NG in the overall MO adjustments, return to Reset NV andperform the adjustment again.
LCD display
XXX: NG item No.
7. If OK through the overall MO adjustments, press x key toreturn to the TEST MODE and terminate the Overall Adjust-ment mode.
LCD display
XXX NGXX
XXX End-OK
5-4-3. Overall CD and MO adjustment items1. Overall CD adjustment items
Item No. Contents
312
313 CD electrical offset adjustment
314
321 CD TE gain adjustment
328 CD TWPP gain adjustment
323 CD TE offset adjustment
336 CD ABCD gain adjustment
344 CD focus gain adjustment
345 CD tracking gain adjustment
521CD two-axis sensitivity adjustment
522
341 CD focus bias adjustment
2. Overall MO adjustment items
Item No. Contents
112
113 MO electrical offset adjustment
114
221 Low reflective CD TE gain adjustment
223 Low reflective CD TE offset adjustment
236 Low reflective CD ABCD gain adjustment
244 Low reflective CD focus gain adjustment
245 Low reflective CD tracking gain adjustment
121 MO TE gain adjustment
122 MO TE offset adjustment
144 MO focus gain adjustment
145 MO tracking gain adjustment
131MO TWPP offset adjustment
132
136 MO ABCD gain adjustment
134 MO TWPP gain adjustment
141 MO focus bias adjustment
– 14 –
Pin No. Pin Name I/O Description1 S MON I S-MON monitor signal input from the µPD63732GC (IC601)
2 UREG MON I Un-regulator power supply voltage monitor input terminal (A/D input)
3 NC — Not used. (open)
4 VREF I Input terminal for power supply voltage adjustment reference voltage (+2 V) (A/D input)
5 DVDD MON I Not used. (Fixed at “H”.)
6 NC — Not used. (open)
7 RMC KEY I Remote commander with headphone key input terminal (A/D input)
8 SET KEY I Set key input terminal (A/D input) S801 to S804 (x, >/N, ., +/– VOLUME keys input)
9 MRST ISystem reset signal input “L”: reset
For several hundreds msec. after the power supply rises, “L” is input, then it change to “H”
10 AVDD — Power supply pin (+2.4 V or +2.8 V)
11 AVSS — Ground terminal (for A/D converter)
12 – 15 TYPE0 – 3 I Setting terminal for model discrimination (bit 0 to bit 3) Fixed at “L” in this set
16 XOUT O Main system clock output terminal (16.9344 MHz)
17 XIN I Main system clock input terminal (16.9344 MHz)
18 SX OUT O Sub system clock output terminal Not used. (open)
19 SXIN I Sub system clock input terminal Not used. (fixed at “L”)
20 COUT O Not used. (open)
21 VDD — Power supply terminal (+2 V) (digital system)
22 VSS — Ground terminal (digital system)
23 HOLD SW I HOLD switch (S808) input terminal “L”: hold off, “H”: hold on
24 VG CON O Power supply control signal output to each ICs
25 XCLK OSystem clock supply output terminal (16.934 MHz) to the µPD63732GC (IC601) or AK4352
(IC302)
26 KEY EN O Ground control output terminal of remote control
27 AVLS SW I AVLS switch (S803) input terminal “L”: LIMIT “H”: NORM
28 DSP SINT I Interruption status input from the µPD63732GC (IC601)
29, 30 DBB0, DBB1 I DIGITAL MEGABASS switch (S806) input terminal *1
31 OPR LED O OPERATE LED (D802) drive signal output terminal “H”: LED on
32 OPEN CLS SW IUpper panel open/close detect switch (S801) input terminal
“L”: upper panel close, “H” : upper panel open
33 XWAKE RMC I Wake up signal input from remote control key
34 XWAKE SET I Wake up signal input from this set key
35 SBUS CLK O SSB serial clock signal output terminal
36 SBUS DATA I/O SSB serial data input/output terminal
37 XRST O Reset signal output terminal to each ICs
38 SLD 1 MON I Sled servo timing signal input from the TLC372CPW (IC552)
39 SLD 2 MON I Sled servo timing signal input from the TLC372CPW (IC552)
40 VDD — Power supply terminal
41 VPP — Test terminal (fixed at “L”)
42 CLV VCON OSpindle servo drive voltage control signal output to the BD6602KUT (IC551) or µPD63732GC
(IC601)
43 APC REF O Laser power control signal output terminal
44 RM VCON O Remote control power voltage select signal output to power circuit “L”:2.4 V, “H”: 2.8 V
45 CLV U MON I Spindle servo (U) timing signal input from the BD6602KUT (IC551)
46 CLV V MON I Spindle servo (V) timing signal input from the BD6602KUT (IC551)
47 CLV W MON I Spindle servo (W) timing signal input from the BD6602KUT (IC551)
48 CLV U CON I Spindle servo (U) drive signal input from the BD6602KUT (IC551)
49 CLV V CON I Spindle servo (V) drive signal input from the BD6602KUT (IC551)
SECTION 6DIAGRAMS
6-1. IC PIN DESCRIPTION
6-1-1. IC801 RU6915MF-0006 (SYSTEM CONTROL)
– 15 – – 16 –
Pin No. Pin Name I/O Description50 CLV W CON I Spindle servo (W) drive signal input from the BD6602KUT (IC551)
51 DRV VCON O Driver output control terminal to the DB6602KUT (IC551) “L”: prohibited, “H”: permission
52 NC — Not used. (open)
53 SLED 1R CON O Sled motor control signal output to the BD6602KUT (IC551)
54 SLED 1F CON O Sled motor control signal output to the BD6602KUT (IC551)
55 SLED 2R CON O Sled motor control signal output to the BD6602KUT (IC551)
56 SLED 2F CON O Sled motor control signal output to the BD6602KUT (IC551)
57 – 60 NC — Not used. (open)
61 VSS — Ground terminal (digital system)
62 NC — Not used. (open)
63 RMC DTCK I/O TSB serial communication data input/output terminal for remote commander with headphone
64 S0 O PD-IC mode select signal output
65 S1 O PD-IC mode select signal output
66, 67 NC — Not used. (open)
68 SLD VCON O Sled servo control PWM signal output to the BD6602KUT (IC551)
69 NC — Not used. (open)
70 HP MUTE O Muting on/off control signal output to the headphone amplifier (IC301) “H”: muting on
71 HP STBY OStandby on/off control signal output to the headphone amplifier (IC301)
“L”: standby mode, “H”: amplifier on
72 NC — Not used. (open)
73 NV DI I Serial data input from the EEPROM (IC802)
74 NV DO O Serial data output from the EEPROM (IC802)
75 NV CLK O Serial clock signal output to the EEPROM (IC802)
76 NV CS1 O Chip select signal output to the EEPROM (IC802)
77 ADJUST I Test mode institution input terminal “L”: test mode (Normally, fixed at “H”)
78 XREBOOT O System reboot control output terminal
79 VDD — Power supply terminal (+2 V) (digital system)
80 VSS — Ground terminal (digital system)
6-2. BLOCK DIAGRAMS6-2-1. MD BLOCK DIAGRAM
– 17 – – 18 –
+–
+–
+–
+–
+–
+–
+–
+–
+–
ly
lx
Jx
Jy
AA
B
C
D
MON
Jx Jy Jx
lx ly lx
a b c d
F
MINIDISCOPTICAL PICK-UP BLOCK
(LCX-2E)
BCD
MON
LD-A
JyJxlxly
VREF
161514109
6
1778
18
5
12
2
1
LD-K13
AVCC20
CN501
LD
AVCCS0
1119
S0S1
S1
TRACKINGCOIL
AVCC (Q907)
LASERAUTO POWER
CONTROLQ501
PD-DRV
XRSTSCK
S BUS
LD-VDDPD-NI
DCBAJyJxIxIy
VREF
D-CA-C
LD-EMITAPC
AVCC(Q907)
TPP/WPP
RF AMP,FOCUSERROR,
TRACKINGERROR
DFCT
OFTRK
RF OUT
82V
DFCT
OFTRK
ABCDFETE
S MON
PD-I
PD-O
T COUNT
ADIP INADIP
ADIP T-COUNT
SERIALI/F
54131110987
3
33
27
26
30
AVCC 38DVDD 21
39404441
612
RF AMP, FOCUS/TRACKING ERROR AMPIC501
B+(Q907)
B+(Q907)
16
17
28
4342
242322
27 XRESET
9 ADIP
12 T COUNT
5 TEMCLK
3 FE4 ABCD
14 OFTRK
13 DEFECT
7 RF
ID4ID3MCK I/O
VDD
989747
XRAS
DRD0|
DRD3
D0|
D3
A0|
A11DRA0
|DRA11
63XOE 60
XCAS 59XWE
XRAS
54
XOEXCAS
VSSVSS
LRCK 39AUDATA 40
BCK 41
XWE
MCLK 50
BICKSDATALRCK
FF OUT 24
SINT 30SCK 29
S BUS 28
FR OUT 23TR OUT 22TF OUT 21
VDD ADJ1
VREF2
20•
37•
51•
75•
87
52•
53•
58•
57
71
74•
70
66•
62•
65•
64
IC60116M DRAM
IC602
9
12•
15
19•
21•8•6
2•3•
24•
25
52223
1426
VSSVSS
113
4
B+(Q907)
SERIALINPUT
INTERFACE
8XINTERPOLATOR LPF
∆ Σ MODULATOR
8XINTERPOLATOR
CLOCKDIVIDER
LPF∆ Σ
MODULATOR
1
345
14
13
AOUTL
AOUTR
11VREF
16CKS
10VDD
2PD
18BIT D/A CONVERTERIC302
B+(Q907)
AOUTL
AOUTR
TF1TR1FR1FF1
VREFMCLKSINT
XRSTS MONPDSSB CLKSSB DATA
S0S1
SERVO,SYSTEM CONTROL
SECTION2
SERVO,SYSTEM CONTROL
SECTION3
SERVO,SYSTEM CONTROL
SECTION4
18
19
2015
TRK+
TRK–
4
3
FOCUSCOIL
FCS+
FCS–
SERVO,SYSTEM CONTROL
SECTION1
04
MAIN BOARD (1/2) MD SECTION
• Signal path: MD
DIGITAL SERVOATRAC
MZ-E60
(Page 19)
(Page 19)
(Page 19)
(Page 19)
– 19 – – 20 –
MZ-E60
MAIN BOARD (2/2)
VREFMCLK
AOUTLAOUTR
SINT
VCC
PE
CSSKDODI
1234
8
7
B+(Q907)
EEPROMIC802
XRSTS MON
PDSSB CLK
SSB DATA
S0S1
SLEDVOLTAGE MONITOR
IC552
FOCUS/TRACKING COIL DRIVE,SPINDLE/SERVO MOTOR DRIVE
IC551
+–
56
7
+–
32
42
1
PREDRIVE
4340413839
10
PREDRIVE
PREDRIVE
11896
6160
7
62
PREDRIVE5250
3334
32
16151413
4
17
46
51
56
5554
5857
3
2
1
64
45
PREDRIVE24262928
23
DECODER
+–
36+–
35+–
VG
OE
VCC2B+
(Q907)
B+(Q907)
B+(UNREG)
TRK+
TRK–
FCS+
FCS–
MDSECTION 4
MDSECTION 2
MDSECTION 1
5
7
68
1
2
3
4
SLED2–SLED2+
SLED1–
SLED1+
CLVU
CLVN
CLVV
CLVW
CN551M902(SLED)
M901(SPINDLE)
MINIDISCMECHANISM
BLOCK
STANDBY
BIAS
VCC1
VCC2
TO EACHBLOCK
TO BEMFCOMPARATOR
31
30
VCC1
TF1
TR1
FF1
FR1
MDSECTION3
X60116.9344MHz
76 NV CS175 NV CLK74 NV DI73 NV DO
4 VREF25 XCLK28 DSP SINT
37 XRST1 S MON43 APC REF35 SBUS CLK36 SBUS DATA
64 S065 S1
39 SLD 2 MON
38 SLD 1 MON
17 XIN
16 XOUT
53 SLD 1R CON54 SLD 1F CON68 SLD VCON
55 SLD 2R CON56 SLD2F CON
OUT
VOUT
46 CLV V MON
45 CLV W MON
48 CLV U CON49 CLV V CON50 CLV W CON42 CLV V CON
51 24DRV VCON
VG
VG CON
44RM VCOM
2UNREG MON
78XREBOOT9MRST
VDD
VSS
47 CLV W MON
31OPR LED7732
ADJUSTOPEN CLS SW
34XWAKE SET8SET KEY
2327
HOLD SWAVLS SW
30DBB129DBB0
63RMC DTCLK
33XWAKE RMC
B+(UNREG)
RESETIC803
D802OPERATE
TAP801 TAP803S809OPEN/CLOSE
S805–
S801
S804+
S803.
S802>N
VOL
34
5
B+(D901)
POWER SUPPLYVOLTAGE CONTROL
SWITCHQ906
1
VDD2EXT
B+
VGB+
5
PWM/PFM CONTROLIC903
EXT5
VDD2VOUT 1
PWM/PFM CONTROLIC901
CE3
VDD2FB1 EXT 5
PWM/PFM CONTROLIC902
B+D903
D901
Q905
Q901
Q903
Q908
Q907
Q904(1/2)
Q904(2/2)
B+(UNREG)
B+ SWITCHQ902
DIGITAL MEGABASSS806
0 1 2AVLSS807
NORM LIMITHOLDS808
Q801
7RMC KEY26KEY EN
71HP STB70HP MUTE
10AVDD
21•
40•
79VDD
Q802
B+(D903)
5DVDD MON
B+(Q907)
B+(D901)SYSTEM
CONTROLIC801
REFERENCEVOLTAGE
SWITCHINGQ301
VREF
PWSW
MUTE
VCC
B+
22
20
21
12
13
1
17
18
4
2
PW A
GNDKEYDATAVDD
J301
PW B
HEADPHONEAMPIC301
B+(UNREG)
B+(Q907)
B+(D903)
SERVO, SYSTEM CONTROL SECTION
DRY BATTERYSIZE "AA"
(IEC DESIGNATION R6)1PC, 1.5V
04
i
• Signal path: MD
6-2-2. SERVO, SYSTEM CONTROL BLOCK DIAGRAM
(Page 18)
(Page 18)
(Page 18)(Page 17)
MZ-E60
– 21 – – 22 –
1-676-495- 11
MAIN BOARD (SIDE A)
C952
C911
C610
C305
C303
C201
C101
C302
L903
C609
C524
L601
L502
C909
R919
R922 D802OPERATE
R920 R921
R925
R923
R924R816
R827
R837 R825
C812
R822
R835
FB80
3R8
04
C805
C611
C605
R813
C607
C851 TP811
TP810
GND2
GND1
TP812
TP813
TP302
TP103
TP203
C852
C853
C854
D354
D352
D351
D353
D855
R817 Q802
RB802
FB801
R818
FB802
C351
C304
R101
R102
TP825 TP826
R821C809
IC802
C813R806
C801
C612
R809IC803
R201
R202
04
R301
(CHASSIS)
C814
R819
R802
R801
C815
R556
C558
C559
RB55
2RB
551
C552
C551
C608
C502
C515
R814
C511
C603
C602
C604
R513
R507
R508
R501
C501
C512
R509
R812
R811
C601
C614
C557
R553
R554
R555
R832
R601
R823
C806
R833 R810
R836
R826
Q801
Q906
IC90
3Q9
05
C811
TP530
VOL
TP531
TP529
X601
C
C
ED
G
4
5
321
123
5
4
SB
E
B
CE
B R824
S G
D
Q908
4
1
5
8
S808
HOLD S801x
S803.
S802> N
S804S805
S806DIGITAL MEGABASS
2 1 0
S807AVLS
LIMIT NORM
R903
D903
C910
8075706561
212530354041
169
8 1
IC30245
50
55
60
20
15
10
5
1
IC801
4
3
1
2
70 7565605551
5 11015202526
30
35
40
45
50
100
95
90
85
80
76
IC601
IC602
16813
26211914
1510152022
44
IC501
4035302523
11( )
1
A
B
C
D
E
F
G
H
I
2 3 4 5 6 7 8 9 10 11 12 13 14
6-3. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS6-3-1. PRINTED WIRING BOARD — MAIN BOARD —
D351 F-2D352 F-3D353 F-3D354 E-3D802 C-5D855 F-3D903 B-4
IC302 F-4IC501 B-9IC601 E-9IC602 F-11IC801 G-6IC802 H-6IC803 G-7IC903 C-4
Q801 D-4Q802 D-3Q905 C-4Q906 D-4Q908 B-5
• SemiconductorLocation
Ref. No. Location
Note:• Y : parts extracted from the conductor side.• f : internal component.• b : Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:Pattern face side: Parts on the pattern face side seen from the(Side B) pattern face are indicated.Parts face side: Parts on the parts face side seen from the(Side A) parts face are indicated.
• Main board is four-layer printed board.However, the patterns of layers 2 and 3 have not been in-cluded in this diagrams.
MZ-E60
– 23 – – 24 –
C510
R505
R929
C912
R504
R503
R514
R506
R926 R902
R913
C906
R914
R912
R917
C903
C904
L901 C901
D902
C951
C908IC901
IC902
D901
C907
R928
R915
R203C203
C103
C307
Q301
Q501
IC301
C306
R103
C102
C202
R204
R916 Q9
04
R803
C803
R104
C310
R302
C308
C309C554
C553
R911
L553
L554
L551
L552
C503
C505
C513
C521
C516
C504
C517
C613 C561
L501
L902
C518
R551
C555
C556
IC552
R552
C509
R502
1
6
18
13712
2419
3316
10
5
1
35
40
45
4849556064
30 32252017
1-676-495- 11
MAIN BOARD (SIDE B)
J301
S809(OPEN/CLOSE)
B
C
5
1 2 3
4
E
Q902
Q901
B
EC
GBE
CS
D
CN551
8 15
TP511
E B
C
321
1
4
5
6
7 VDD
DATA
KEY
GND
J301
23
4 5
456
14
85
04
i
TP804
TP526
MINI-DISCOPTICAL
PICK-UP BLOCK(LCX-2E)
M901SPINDLEMOTOR
M902SLED
MOTOR5
1NU
V
W
2
3
4
6
87
TP558
TP555 TP502
TP503TP504
TP564
TP565
TP559
TP557
TP560
TP563
TP501
TP567
TP552 TP551
TP803
TP562
TP553TP801
TP561
TP814
TP569
TP615 TP602
TP911
TP952
TP528
TP523
TP809 TP610
TP607TP613
TP608
TP609TP606 TP603
TP604 TP605
TP601
TP612 TP611
TP524
TP505
TP566
TP568
TP518
TP570TP573TP575TP577
TP512TP576
TP574
TP522
TP572
TP527
TP507TP514
TP519TP516
TP520
TP525
TP508
TP509 TP510 TP515
CN50
1
1
5
10
15
20
TP554
TP802
TP556TP202TP102
TP808
TP517
TP301
TP806
TP951
TAP803
TAP801
S
GD
TP513
IC551
DRY BATTERYSIZE"AA"
(IEC DESIGNATION R6)1PC,1.5V
R927
Q907
TP805TP903
TP571
Q903
TP506
C514
MOTOR FLEXIBLE BOARD 1-675-668-
11
12
11( )
1
A
B
C
D
E
F
G
H
I
234567891011121314
D901 C-5D902 D-5
IC301 H-5IC551 G-10IC552 G-13IC901 B-5IC902 D-4
Q301 H-6Q501 C-7Q901 B-4Q902 B-3Q903 D-4Q904 E-4Q907 C-6
• SemiconductorLocation
Ref. No. Location
– 25 – – 26 –
6-3-2. SCHEMATIC DIAGRAM — MAIN BOARD (1/4) — • Refer to page 33 for IC Block Diagrams.
MZ-E60
Note:• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolyticsand tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwisespecified.
Note:The components identi-fied by mark 0 or dottedline with mark 0 are criti-cal for safety.Replace only with partnumber specified.
Note:Les composants identifiés parune marque 0 sont critiquespour la sécurité.Ne les remplacer que par unepiéce portant le numérospécifié.
• A : B+ Line.• Power voltage is dc 1.5V and fed with regulated dc power
supply from battery terminal.• Voltage and waveforms are dc with respect to ground
under no-signal conditions.no mark : PB
∗ : Impossible to measure• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-tion tolerances.
• Waveforms are taken with a oscilloscope.Voltage variations may be noted due to normal produc-tion tolerances.
• Circled numbers refer to waveforms.• Signal path.
F : PB
(Page 29)
(Page27)
(Page31)
1
IC501 r; (FE) (TP525)
2
IC501 7890
Approx.10mVp-p
Approx.180mVp-p
3
IC501 ed (RF OUT) (TP528)
Approx.0.8Vp-p
• Waveforms (MODE:PLAY)
4
IC501 rf (TE) (TP523)
Approx.12mVp-p
100mV/div 5µs/div 0.5V/div 5µs/div 5mV/div 1µs/div 5mV/div 1µs/div
– 27 –
6-3-3. SCHEMATIC DIAGRAM — MAIN BOARD (2/4) — • Refer to page 34 for IC Block Diagrams.
– 28 –
MZ-E60
(OPEN/CLOSE)
Note:• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolyticsand tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specified.• % : indicates tolerance.• C : panel designation.• A : B+ Line.• Power voltage is dc 1.5V and fed with regulated dc power
supply from battery terminal.• Voltage is dc with respect to ground under no-signal
condition.no mark : PB
∗ : Impossible to measure• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-tion tolerances.
• Signal path.F : PB
(Page26)
(Page 31)
– 29 – – 30 –
6-3-4. SCHEMATIC DIAGRAM — MAIN BOARD (3/4) — • Refer to page 34 for IC Block Diagrams.
MZ-E60
TOTAL CURRENTPLAY : 40mAPAUSE : 36mAFF/REW : 60mA
Note:• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolyticsand tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specified.• % : indicates tolerance.• A : B+ Line.• Power voltage is dc 1.5V and fed with regulated dc power
supply from battery terminal.• Voltage is dc with respect to ground under no-signal
condition.no mark : PB
∗ : Impossible to measure• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-tion tolerances.
(Page 31)
(Page 31)
(Page 26)
6-3-5. SCHEMATIC DIAGRAM — MAIN BOARD (4/4) — • Refer to page 35 for IC Block Diagrams.
– 31 – – 32 –
MZ-E60
Note:• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolyticsand tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwisespecified.
• A : B+ Line.
• Power voltage is dc 1.5V and fed with regulated dc powersupply from battery terminal.
• Voltage and waveforms are dc with respect to groundunder no-signal conditions.no mark : PB
• Voltages are taken with a VOM (Input impedance 10 MΩ).Voltage variations may be noted due to normal produc-tion tolerances.
• Waveforms are taken with a oscilloscope.Voltage variations may be noted due to normal produc-tion tolerances.
• Circled numbers refer to waveforms.
(Page 27)
(Page 30)
(Page 26)
(Page 30)
5
IC801 qj (XIN)
0.46Vp-p
16.9344MHz
• Waveform (MODE:PLAY)
0.2V/div 0.05µs/div
– 33 – – 34 –
IC501 SN761056DBT
IC301 TA2131FL
IC302 AK4352VT-E2
6-6. IC BLOCK DIAGRAMS
CLOCK DIVIDER
LPF
SERIALINPUT
INTERFACE
∆ΣMODULATOR
8XINTERPOLATOR
LPF∆ΣMODULATOR
8XINTERPOLATOR
DE-EMPHASISCONTROL
1
2
3
4
5
6
7
8
15
14
12
11
10
9
13
16MCLK
PD
BICK
SDATA
LRCK
DIF0
DIF1
DEM
CKS
VCML
AOUTL
AOUTR
VCMR
VREF
VDD
VSS
1REXT
Wpp-LPFVREF 1.1
C
D
D-C
Iy
Ix
Jx
Jy
A
A-C
B
TE
FE
ABCDAVCC
OFC C1OFC C2
OFC C3
OFC C4
RFOUTAGNDLP
DGNDRESETSCK
82VTPP LPFT COUNT
DFCT
OFTRK
ADIP IN
TON-CPD-NI
PD-I
DVDDSBUS
PD-OLD-DRV
LD-EMIT
43ADIP42
S MONIT41
44
40
36
3534
31302928
27
26
252423
37
3938
23
4
5
6
7
8
9
10
11
12
13
141516171819
LD-VDD 20
2122
820mVALFA B
IJ BTE C
TON CTWpp CAwDw C
TON PEAKTON BOTM
3332
S-MONITOR
FE
APC
ADIP
TON-C
SERIALI/F
ABCD
Tpp/Wpp
OFTRK
DFCT
RF
T COUNT
TE
V REFMTSW
BSTSW
BEEP
19
20
21
22
23
24
18 17 16 15 14 13
PWSW 12
11
10
8
7
BST1
9
BST2
654321
BSTAGC
PWB
PWA
ADD
TC MT
VCC1
VINR
VINL
BEEPOUTB
BEEPOUTA
+B
LOUT
PWR
GND
ROUT DE
T
AGC
IN
BST OUT
BST NF2
LPF2
BST NF1
LPF1
VREF
VREF
IN
GND
BEEP
IN
RST
SW
MUT
E
PWST
B
+–
+–
VREF WITHSOFT START,
CE
RAMP WAVEGENERATOR,
OSC
PWM/PFMCONTROLAR
PHASECOMPENSATION
3CE
2VDD
1FB
5EXT
4GND
BUFFER,DRIVER
IC902 XC6368B101MR
IC601 UPD63731GC-9EU
2122232425
26 27 28 29 30
23
54
6
7
8
9
10
1
11
12
131415
1617181920
31 32 33 34 35 36 37 38 39 40
5152535455565758596061626364656667686970
41 42 43 44 45 46 47 48 49 50
7172737475
767778798081828384858687868990100 919293949597 969899
ADC
ADIP
RF
FEABCD
TEDSSP
ADIPPLL
EFMPLL
SUBQ/ADIPDECODER
EFM ACIRCDECODER
SECTORDECODER
SSB CONTROLMONITOR I/O etc.
DRAM
& P
ERIP
HERA
L CO
NTRO
L AD
DRES
S GE
NERA
TOR
ACWDCK
S DATA
8
8
16
16
8
8
12
10
CLOCKGENERATOR
ATRACDECODER
FLAG
AC LRCKAC WDCK
AC BYCK
AC DATA
EFM DATA A/BECC DATA
EBA
WR REQ etc.RD DT ECC
ATDT
XATWEDREQ
XBUSY
58
8
SBD
SBA
SBW
SBR
SQRE
Q
2nd
MSB
EFM
PLCK
3 4
8
VDD ADCVREF
FEABCD
TEVRT1
RF
VRT2
ADIP
VRT3
VSS ADC
T COUNT
DEFECT
OF TRX
VSS
NC
NC
NC
NC
VDD
TFOUT
TROUT
FROUT
FFOUT
CK176
VDDDRA3DRA2DRA1DRA0DRA4DRA5DRA6DRA7DRA8DRA10DRA11XRASDRA9XOE2XOEXCASDRD2DRD3VSSXWE2XWEDRD1DRD0VDD
NCXR
ESET
SBUS SC
KSI
NTXB
SYDA
-AVD
DAO
VTR
VCON
AOUT
LDA
AGN
DVD
DEM
PLR
CKAU
DATA
BCK
VSS
DOUT
PMCK
MCK
/2VS
SM
CK I-
O X1 X0M
CK
IO0
IO1
IO2
IO3
FOK
FON
ERFL
AGCR
CFTE
STAD
IP–D
ATA
ADPL
CKEF
MPL
CKVD
DM
O3M
O2M
O1M
O0M
OCK
MIC
KM
I3M
I2M
I1M
I0VS
S
– 35 –
IC602 MN41X17400CTT-10T1
IC552 TLC372CPWIC903 S-8328E20MC-EYA-T2
ROWADDRESSBUFFERS
COLUMNADDRESSBUFFERS
4MARRAY
4MARRAY
4MARRAY
4MARRAY
COLUMNDECODER
ROW
DEC
ODER
I/OBUFFER
TIMING AND CONTROL
24 D225 D3
26 VSS
23 XCAS22 XOE
8A10
6A11
5XRAS4
321
XWE
D1D0
VCC
7NC
9A010A111A212A3
13VCC
21 A920 NC19 A818 A717 A616 A515 A414 VSS
+ –
VREF
PWMCONTROLCIRCUIT
SOFTSTART
CIRCUIT
3NC
2VDD
1VOUT
5EXT
4VSS
2 3
5
4
678
1
V+
V–
VREF
1NC
2VSS
3 OUT
4 VDD
+–
IC803 S-8081ANNP-EDF-T2
– 36 –
IC551 BD6602KUT
PRE-DRIVE
PRE-DRIVE
PRE-DRIVE
PRE-DRIVE
DECODER
PRE-DRIVE
BIAS
STANDBYTO
EACHBLOCK
TOBEMF
COMPARATOR
+ –+ –+ –VCC2
1
RI3
2
FI1
3
RI1
4
VG
5
H1PG
1
6
FO1
7
FO1
8
H1VM
H1VM
9
H1PG
2
12
PWM
13
WI
14
VI
15
UI
1610
RO1
RO1
11
4950
51
5253
54
H4PG2RO4
H4VM
FO4H4PG1
RI455FI4
57RI258FI2
59H2PG260RO2
61H2VM
62FO263H2PG164FI3
56PWM24
33343536373839404142434445464748NC NC VC
C2VC
C1
H3PG
1
FO3
FO3
H3VM
H3VM
RO3
RO3
H3PG
2
CPUI
CPVI
CPW
I
COM
25 NC
26 VO27 GNDUV
28 UO
29 VMU
CPUO31 CPVO32 CPWO
30
18
17
ASGND19 SGND20 NC21 NC22 GNDW
23 WO
24 VMVW
OE
VCC2
VCC1
1XCS
SK
DO
DI
VCC
XBUSY
RST
GND
2
INSTRUCTIONDECODE
CONTROLAND
CLOCKGENERATION
3
4
8
7
6
5INSTRUCTION
REGISTER
ADDBUFFERS
VPPGENERATOR
R/W AMPSAND
AUTO ERASEDATA
REGISTER
VREF
EEPROM
VPP SW
DECODER
IC802 AK93C55AV-L
– 37 –
SECTION 7EXPLODED VIEWS
NOTE:• The mechanical parts with no reference
number in the exploded views are not supplied.• Items marked “*” are not stocked since
they are seldom required for routine service.Some delay should be anticipatedwhen ordering these items.
• AbbreviationFR : French model
• -XX and -X mean standardized parts, sothey may have some difference from theoriginal one.
• Color Indication of Appearance PartsExample :
KNOB, BALANCE (WHITE) ... (RED)
Parts Color Cabinet’s Color• Accessories and packing materials are
given in the last of this parts list.
Ref. No. Part No. Description Remark
7-1. MAIN UNIT SECTION
Ref. No. Part No. Description Remark
1 4-225-573-01 KNOB (MB)2 4-225-574-01 BUTTON (OPEN)3 X-3378-853-1 CASE (REAR) ASSY (S1)
(SILVER)...(SILVER) (EXCEPT US)3 X-3378-854-1 CASE (REAR) ASSY (L1) (BLUE)...(BLUE)4 4-225-572-01 KNOB (HOLD)
5 X-3378-849-1 LID ASSY (S), BATTERY CASE(SILVER)...(SILVER) (EXCEPT US)
5 X-3378-850-1 LID ASSY (L), BATTERY CASE (BLUE)...(BLUE)6 4-225-566-01 FULCRUM (BATTERY CASE LID)
(SILVER)...(SILVER) (EXCEPT US)6 4-225-566-11 FULCRUM (BATTERY CASE LID)
(BLUE)...(BLUE)7 4-225-569-01 SHEET (BLIND)
8 4-218-229-17 SCREW (1.4), MI (SILVER)...(SILVER)(EXCEPT US)
8 4-218-229-19 SCREW (1.4), MI (BLUE)...(BLUE)
9 X-3378-851-1 PANEL ASSY, (S-S), UPPER (SILVER)...(SILVER)(EXCEPT US)
9 X-3378-852-1 PANEL ASSY, (S-L), UPPER (BLUE)...(BLUE)10 4-225-587-01 SCREW (MD), STEP11 X-4951-947-1 HOLDER ASSY12 3-318-382-91 SCREW (1.7X2.5), TAPPING
13 A-3323-416-A MAIN BOARD, COMPLETE (EXCEPT FR)13 A-3323-417-A MAIN BOARD, COMPLETE (FR)14 4-225-567-01 SPRING (CONTACT)15 4-225-568-01 SPRING, BATTERY COIL16 4-225-580-01 SPRING (POP UP L)
17 X-4952-479-1 CHASSIS ASSY, REAR18 4-225-581-01 SPRING (POP UP R)19 4-225-583-01 SHEET, INSULATING20 4-989-078-01 SPRING (OPEN), TENSION21 3-045-227-01 SPACER (HOOK)
22 3-045-576-01 SPACER (KNOB)23 3-045-221-01 RETAINER (REAR), SPACER CHASSIS
R R
1
2
21
3
45
6
7
8
8 9
10
11
12
12 13
12
14
15
16
23
18
19
20
22
17
A
A
MT-MZE60-169
The components identified bymark 0 or dotted line with mark0 are critical for safety.Replace only with part numberspecified.
Les composants identifiés par unemarque 0 sont critiques pourla sécurité.Ne les remplacer que par une piéceportant le numéro spécifié.
– 38 –
7-2. MECHANISM DECK SECTION(MT-MZE60-169)
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
51 1-675-668-11 MOTOR FLEXIBLE BOARD52 4-963-883-42 SCREW (M1.4), PRECISION PAN53 X-4951-926-1 CHASSIS ASSY54 4-222-206-01 SPRING, THRUST55 4-222-216-01 GEAR (SA)
56 3-338-645-31 WASHER (0.8-2.5)57 4-963-883-31 SCREW (M1.4), PRECISION PAN58 3-349-825-21 SCREW
59 4-222-208-01 GEAR (SB)60 4-222-204-01 BEARING61 4-222-203-01 SCREW, LEAD
062 X-4952-387-1 SERVICE ASSY, OP (LCX-2E)63 4-222-205-01 SPRING, RACK
M901 8-835-666-01 MOTOR, DC SSM-01C14A/C-NP (SPINDLE)M902 1-763-399-11 MOTOR, DC (SLED) (WITH PULLEY GEAR)
A
A
51
52
53
M901
M902
5455
5657
59
61
6257
63
60
60
58
5757
The components identified bymark 0 or dotted line with mark0 are critical for safety.Replace only with part numberspecified.
Les composants identifiés par unemarque 0 sont critiques pour lasécurité.Ne les remplacer que par une piéceportant le numéro spécifié.
– 39 –
SECTION 8ELECTRICAL PARTS LIST
NOTE:• Due to standardization, replacements in
the parts list may be different from theparts specified in the diagrams or thecomponents used on the set.
• -XX and -X mean standardized parts, sothey may have some difference from theoriginal one.
• RESISTORSAll resistors are in ohms.METAL:Metal-film resistor.METAL OXIDE: Metal oxide-film resistor.F:nonflammable
• Items marked “*” are not stocked sincethey are seldom required for routine service.Some delay should be anticipatedwhen ordering these items.
• SEMICONDUCTORSIn each case, u : µ, for example:uA.. : µA.. uPA.. : µPA..uPB.. : µPB.. uPC.. : µPC.. uPD.. : µPD..
• CAPACITORSuF : µF
• COILSuH : µH
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
A-3323-416-A MAIN BOARD, COMPLETE (EXCEPT FR)A-3323-417-A MAIN BOARD, COMPLETE (FR)
*********************
< CAPACITOR >
C101 1-135-181-21 TANTALUM CHIP 4.7uF 20% 6.3VC102 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10VC103 1-113-690-11 ELECT CHIP 220uF 20% 4VC201 1-135-181-21 TANTALUM CHIP 4.7uF 20% 6.3VC202 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C203 1-113-690-11 ELECT CHIP 220uF 20% 4VC302 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3VC303 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3VC304 1-164-156-11 CERAMIC CHIP 0.1uF 25VC305 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3V
C306 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC307 1-125-838-11 CERAMIC CHIP 2.2uF 10% 6.3VC308 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3VC309 1-135-181-21 TANTALUM CHIP 4.7uF 20% 6.3VC310 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C351 1-164-156-11 CERAMIC CHIP 0.1uF 25VC501 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC502 1-110-563-11 CERAMIC CHIP 0.068uF 10% 16VC503 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25VC504 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V
C505 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC509 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25VC510 1-162-962-11 CERAMIC CHIP 470PF 10% 50VC511 1-164-156-11 CERAMIC CHIP 0.1uF 25VC512 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V
C513 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3VC514 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3VC515 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50VC516 1-162-945-11 CERAMIC CHIP 22PF 5% 50VC517 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C518 1-117-720-11 CERAMIC CHIP 4.7uF 10VC521 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16VC524 1-117-920-11 TANTAL. CHIP 10uF 20% 6.3VC551 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC552 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C553 1-107-765-11 TANTAL. CHIP 3.3uF 20% 16VC554 1-107-765-11 TANTAL. CHIP 3.3uF 20% 16VC555 1-135-238-21 TANTAL. CHIP 6.8uF 20% 10VC556 1-135-238-21 TANTAL. CHIP 6.8uF 20% 10VC557 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16V
C558 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16VC559 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16VC561 1-164-156-11 CERAMIC CHIP 0.1uF 25VC601 1-164-156-11 CERAMIC CHIP 0.1uF 25VC602 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C603 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC604 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC605 1-164-156-11 CERAMIC CHIP 0.1uF 25VC607 1-164-156-11 CERAMIC CHIP 0.1uF 25VC608 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C609 1-119-750-11 TANTAL. CHIP 22uF 20% 6.3VC610 1-110-569-11 TANTAL. CHIP 47uF 20% 6.3VC611 1-164-156-11 CERAMIC CHIP 0.1uF 25VC612 1-164-156-11 CERAMIC CHIP 0.1uF 25VC613 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C614 1-164-156-11 CERAMIC CHIP 0.1uF 25VC801 1-162-962-11 CERAMIC CHIP 470PF 10% 50VC803 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC805 1-164-156-11 CERAMIC CHIP 0.1uF 25VC806 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C809 1-164-156-11 CERAMIC CHIP 0.1uF 25VC811 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC812 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3VC813 1-164-156-11 CERAMIC CHIP 0.1uF 25VC814 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C815 1-164-156-11 CERAMIC CHIP 0.1uF 25VC851 1-164-156-11 CERAMIC CHIP 0.1uF 25VC852 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50VC853 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50VC854 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C901 1-119-749-11 TANTAL. CHIP 33uF 20% 4VC903 1-110-975-11 TANTAL. CHIP 47uF 20% 6.3VC904 1-110-975-11 TANTAL. CHIP 47uF 20% 6.3VC906 1-162-923-11 CERAMIC CHIP 47PF 5% 50VC907 1-109-982-11 CERAMIC CHIP 1uF 10% 10V
C908 1-119-749-11 TANTAL. CHIP 33uF 20% 4VC909 1-162-962-11 CERAMIC CHIP 470PF 10% 50VC910 1-162-923-11 CERAMIC CHIP 47PF 5% 50VC911 1-104-630-11 TANTAL. CHIP 33uF 20% 6.3VC912 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C951 1-164-156-11 CERAMIC CHIP 0.1uF 25VC952 1-125-976-11 TANTAL. CHIP 150uF 20% 2.5V
MAIN
• AbbreviationFR : France model
The components identified bymark 0 or dotted line with mark0 are critical for safety.Replace only with part numberspecified.
Les composants identifiés par unemarque 0 sont critiques pourla sécurité.Ne les remplacer que par une piéceportant le numéro spécifié.
When indicating parts by referencenumber, please include the board.
– 40 –
< CONNECTOR >
* CN501 1-778-168-11 CONNECTOR, FFC/FPC (ZIF) 20PCN551 1-784-228-21 CONNECTOR, FFC/FPC (ZIF) 8P
< DIODE >
D351 8-719-017-58 DIODE MA8068D352 8-719-056-72 DIODE UDZ-TE-17-2.4BD353 8-719-056-72 DIODE UDZ-TE-17-2.4BD354 8-719-056-80 DIODE UDZ-TE-17-5.1BD802 8-719-061-82 LED TLSU1002(TPX1,SONY) (OPERATE)
D855 8-719-066-17 DIODE FTZ6.8E-T148D901 8-719-072-27 DIODE MA2Z748001S0D902 8-719-049-09 DIODE 1SS367-T3SONYD903 8-719-049-09 DIODE 1SS367-T3SONY
< FERRITE BEAD >
FB801 1-414-228-11 FERRITE BEAD INDUCTORFB802 1-414-228-11 FERRITE BEAD INDUCTOR
< IC >
IC301 8-759-598-15 IC TA2131FL-ELIC302 8-759-665-50 IC AK4352VT-E2IC501 8-759-657-49 IC SN761055DBTIC551 8-759-657-50 IC BD6602KUTIC552 8-759-358-40 IC TLC372CPW-E20
IC601 8-759-657-48 IC uPD63732GC-9EUIC602 8-759-559-57 IC MN41X17400CTT-10T1IC801 8-759-659-63 IC RU6915MF-0006IC802 8-759-449-23 IC AK93C55AV-LIC803 8-759-665-49 IC S-80818ANNP-EDF-T2
IC901 8-759-665-47 IC S-8328B24MCIC902 8-759-657-26 IC XC6368B101MRIC903 8-759-665-48 IC S-8328E20MC-EYA-T2
< JACK >
J301 1-778-368-11 JACK, HEADPHONE (i)
< COIL >
L501 1-412-006-31 INDUCTOR CHIP 10uHL502 1-412-006-31 INDUCTOR CHIP 10uHL551 1-410-389-31 INDUCTOR CHIP 47uHL552 1-410-389-31 INDUCTOR CHIP 47uHL553 1-414-400-41 INDUCTOR 22uH
L554 1-414-400-41 INDUCTOR 22uHL601 1-412-006-31 INDUCTOR CHIP 10uHL901 1-419-478-11 COIL, CHOKE 22uHL902 1-412-064-11 INDUCTOR CHIP 100uHL903 1-412-064-11 INDUCTOR CHIP 100uH
< TRANSISTOR >
Q301 8-729-037-52 TRANSISTOR 2SD2216J-QRQ501 8-729-922-10 TRANSISTOR 2SA1577-QR
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
MAIN
Q801 8-729-905-35 TRANSISTOR 2SC4081-RQ802 8-729-046-48 FET FDV303NQ901 8-729-044-50 TRANSISTOR 2SD2153Q902 8-729-230-60 TRANSISTOR 2SA1586-YGQ903 8-729-046-48 FET FDV303N
Q904 8-729-402-16 TRANSISTOR XN4608Q905 8-729-809-46 TRANSISTOR 2SD1935-CT6Q906 8-729-420-44 TRANSISTOR UN5210Q907 8-729-046-48 FET FDV303NQ908 8-729-046-48 FET FDV303N
< RESISTOR >
R101 1-216-833-11 RES-CHIP 10K 5% 1/16WR102 1-216-827-11 METAL CHIP 3.3K 5% 1/16WR103 1-216-797-11 METAL CHIP 10 5% 1/16WR104 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR201 1-216-833-11 RES-CHIP 10K 5% 1/16W
R202 1-216-827-11 METAL CHIP 3.3K 5% 1/16WR203 1-216-797-11 METAL CHIP 10 5% 1/16WR204 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR301 1-216-803-11 METAL CHIP 33 5% 1/16WR302 1-216-831-11 METAL CHIP 6.8K 5% 1/16W
R501 1-216-839-11 METAL CHIP 33K 5% 1/16WR502 1-216-853-11 METAL CHIP 470K 5% 1/16WR503 1-216-827-11 METAL CHIP 3.3K 5% 1/16WR504 1-216-821-11 METAL CHIP 1K 5% 1/16WR505 1-216-864-11 METAL CHIP 0 5% 1/16W
R506 1-216-793-11 RES-CHIP 4.7 5% 1/16WR507 1-216-843-11 METAL CHIP 68K 5% 1/16WR508 1-216-864-11 METAL CHIP 0 5% 1/16WR509 1-216-864-11 METAL CHIP 0 5% 1/16WR513 1-216-864-11 METAL CHIP 0 5% 1/16W
R514 1-216-864-11 METAL CHIP 0 5% 1/16WR551 1-216-833-11 RES-CHIP 10K 5% 1/16WR552 1-216-833-11 RES-CHIP 10K 5% 1/16WR553 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR554 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R555 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR556 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR601 1-216-803-11 METAL CHIP 33 5% 1/16WR801 1-218-895-11 METAL CHIP 100K 0.5% 1/16WR802 1-218-895-11 METAL CHIP 100K 0.5% 1/16W
R803 1-216-853-11 METAL CHIP 470K 5% 1/16WR804 1-216-853-11 METAL CHIP 470K 5% 1/16WR806 1-216-841-11 METAL CHIP 47K 5% 1/16WR809 1-216-833-11 RES-CHIP 10K 5% 1/16WR810 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
R811 1-216-825-11 METAL CHIP 2.2K 5% 1/16WR812 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR813 1-216-831-11 METAL CHIP 6.8K 5% 1/16WR814 1-216-835-11 METAL CHIP 15K 5% 1/16WR816 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R817 1-216-809-11 METAL CHIP 100 5% 1/16W
– 41 –
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
R818 1-216-809-11 METAL CHIP 100 5% 1/16WR819 1-216-853-11 METAL CHIP 470K 5% 1/16WR821 1-216-857-11 METAL CHIP 1M 5% 1/16WR822 1-216-845-11 METAL CHIP 100K 5% 1/16WR823 1-216-864-11 METAL CHIP 0 5% 1/16W
R824 1-218-871-11 METAL CHIP 10K 0.5% 1/16WR825 1-218-887-11 METAL CHIP 47K 0.5% 1/16WR826 1-216-857-11 METAL CHIP 1M 5% 1/16WR827 1-216-857-11 METAL CHIP 1M 5% 1/16WR832 1-216-845-11 METAL CHIP 100K 5% 1/16W
R833 1-216-864-11 METAL CHIP 0 5% 1/16WR835 1-216-864-11 METAL CHIP 0 5% 1/16WR836 1-216-839-11 METAL CHIP 33K 5% 1/16WR837 1-216-864-11 METAL CHIP 0 5% 1/16WR902 1-216-853-11 METAL CHIP 470K 5% 1/16W
R903 1-216-857-11 METAL CHIP 1M 5% 1/16WR911 1-216-864-11 METAL CHIP 0 5% 1/16WR912 1-218-895-11 METAL CHIP 100K 0.5% 1/16WR913 1-218-911-11 METAL CHIP 470K 0.5% 1/16WR914 1-218-883-11 METAL CHIP 33K 0.5% 1/16W
R915 1-216-863-11 RES-CHIP 3.3M 5% 1/16WR916 1-216-851-11 METAL CHIP 330K 5% 1/16WR917 1-216-853-11 METAL CHIP 470K 5% 1/16WR919 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR920 1-216-864-11 METAL CHIP 0 5% 1/16W
R921 1-218-879-11 METAL CHIP 22K 0.5% 1/16WR922 1-218-895-11 METAL CHIP 100K 0.5% 1/16WR923 1-218-911-11 METAL CHIP 470K 0.5% 1/16WR924 1-218-911-11 METAL CHIP 470K 0.5% 1/16WR925 1-218-891-11 METAL CHIP 68K 0.5% 1/16W
R926 1-216-853-11 METAL CHIP 470K 5% 1/16WR927 1-216-857-11 METAL CHIP 1M 5% 1/16WR928 1-216-857-11 METAL CHIP 1M 5% 1/16WR929 1-216-823-11 METAL CHIP 1.5K 5% 1/16W
< NETWORK RESISTOR >
RB551 1-233-965-11 RES, NETWORK (CHIP TYPE) 4.7KRB552 1-233-979-11 RES, NETWORK (CHIP TYPE) 1MRB802 1-233-977-11 RES, NETWORK (CHIP TYPE) 470K
< SWITCH >
S801 1-771-138-21 SWITCH, KEY BOARD (x)S802 1-771-138-21 SWITCH, KEY BOARD (> N)S803 1-771-138-21 SWITCH, KEY BOARD (.)S804 1-771-138-21 SWITCH, KEY BOARD (VOL +)S805 1-771-138-21 SWITCH, KEY BOARD (VOL –)
S806 1-762-079-11 SWITCH, SLIDE (DIGITAL MEGABASS)S807 1-762-078-11 SWITCH, SLIDE (AVLS)S808 1-762-078-11 SWITCH, SLIDE (HOLD)S809 1-762-342-11 SWITCH, PUSH (1 KEY) (OPEN/CLOSE)
< VIBRATOR >
X601 1-767-621-11 VIBRATOR, CERAMIC (16.9344MHz)*************************************************************
MISCELLANEOUS***************
51 1-675-668-12 MOTOR FLEXIBLE BOARD062 X-4952-387-1 SERVICE ASSY, OP (LCX-2E)
M901 8-835-666-01 MOTOR, DC SSM-01C14A/C-NP (SPINDLE)M902 1-763-399-11 MOTOR, DC (SLED) (WITH PULLEY GEAR)
*************************************************************
ACCESSORIES & PACKING MATERIALS********************************
1-418-493-71 REMOTE CONTROL UNIT (RM-MZ2N)3-043-288-11 MANUAL, INSTRUCTION (ENGLISH,SPANISH,
TRADITIONAL CHINESE) (E)3-043-288-21 MANUAL, INSTRUCTION (ENGLISH,FRENCH)
(US/CND/AEP)3-043-288-31 MANUAL, INSTRUCTION (GERMAN,ITALIAN)
(AEP)3-043-288-41 MANUAL, INSTRUCTION (DUTCH,PORTUGUESE)
(AEP)
3-043-288-51 MANUAL, INSTRUCTION (SWEDISH,FINNISH)(AEP)
3-043-288-61 MANUAL, INSTRUCTION (SPANISH,RUSSIAN)(AEP)
4-221-117-01 CASE, CARRYING8-953-278-90 HEADPHONE MDR-A34SP SET (US)8-953-304-90 RECEIVER MDR-E805SP SET (EXCEPT US)
MAIN
The components identified bymark 0 or dotted line with mark0 are critical for safety.Replace only with part numberspecified.
Les composants identifiés par unemarque 0 sont critiques pour lasécurité.Ne les remplacer que par une piéceportant le numéro spécifié.
– 42 –
MZ-E60
Sony CorporationPersonal Audio Division Company9-927-633-11 2000A0478-1
Printed in Japan C2000. 1Published by General Engineering Dept.