Multichannel readout system of inner tracker for NICA-MPD

Rogov VictorAFI, JINR, Dubna

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Short data about NICA/MPD

Short data about Inner Tracker

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The work purpose• The development of a prototype of front-end-

electronics for readout information from CBM01-B2 board

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Collaboration– Scientific Research Technological Institute of

Instrument Engineering (SE SRTIIE Ukraine) – Helmholtz Centre for Heavy Ion Research (GSI

Germany) – Joint institute for nuclear research (JINR Russia)

Problems• The analysis of the existing multichannel

chargesensetive preamplifiers for experiments of physics (JINR);

• The analysis of main principles and methods of development of chips-adapters for open-frame installation of multichannel preamplifiers (JINR- SE SRTIIE);

• Research of technological parameters, development and manufacture of chip-adapter (SE SRTIIE);

• PCB layout development (JINR);• Assembling and testing sample modules of

front-end-electronics (JINR);Afi.jinr.ru

The base readout system

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The sensor board СВМ01В2

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Key Features• mixed signal chip, 128 channels,1 test channel with

analogue diagnostic output, available for positive and negative signals

• self triggered, data driven de-randomizing, readout at 32 MHz

• digital time stamp output, analogue peak hight output

• analogue pile-up registry, programmable dead time, local threshold adjustment, dynamic Range: 120000 e

• Shaping time and noise performance:• 18 ns fast shaper at 30 pF input, 850 enc for

positive signals, 1000 enc for negative signals• 140 ns slow shaper at 30 pF input, 600 enc• Timing resolution ~ 2-3 ns, time stamp resolution 1

ns

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The problems of existing FEB’s

-three layer pads-small pitch of pads – 50 uM-A considerable quantity of bonding points - Low mechanical durability-Possibility of short circuit of donding

conductors

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The offered solutions • For decrease in probability of short circuit at bonding

point’s, augmentations of a conductors pitch, total reduction of bonding point’s on PCB, augmentations of mechanical strength, a possibility of testing n-Xyter before bonding on pcb, suggested to develop the chip-adapter, which:

• Increases pitch of tab bonding point’s with 100 to 300 microns for entrance pad’s, and 100 microns to 400 for out pad’s;

• Provides installation of the chip-adapter with a microcircuit at one layer of PCB.Afi.jinr.ru

TAB Bonding point’s of chip-adapter with PCB

Chip-cableAfi.jinr.ru

The design sketch

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3D model and manufactured FEB

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Chip-adapter with n-Xyter

Input’s

Output&CTRLCTRL(i2c)

ADC

DCinput

Evolution of system with chip adapters

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Conclusions–The first prototype and tests of FEB ware made

–Research of testing with senson board СВМ01В2

–New FEB with new n-XyterAfi.jinr.ru

Thank you

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Research of a photoresistive maskthickness (250 seconds are chosen)

Research of exhibiting time of a photoresistive mask from a conductive layer(7 seconds are chosen)

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Research of influence the maintenance of SAS in etchant at etching of aluminium layer on a etching wedge (0,7 %)

Research of etching time of a conductive layer of aluminium (75 seconds chosen)

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Research of polyimide layer etching time (40 seconds are chosen)

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