Global Supply Management Global Supply Management

Members: Samantha Caves, Nicole Clark, Michael Jones, Michael Keller, Hali MacMillan, Nicholas Schulte

Alternative Supply Line Design for Intel’s Assembly Test Factory Network

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Intel’s Vision

“If it is smart and connected, it is best with Intel.”

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Intel’s Mission

“Utilize the power of Moore’s Law to bring smart, connected devices to every person on Earth.”

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Executing Moore’s Law

“Enabling new devices with higher functionality and complexity while controlling power, cost,

and size”

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Introduction ●  Computers and processors are vital to Intel and nearly

all of our daily lives o  Keeping these in proper working order is critical

●  What are heat spreaders? ●  Sustainable options

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Problem Details ●  Heat spreaders manufactured from C101 Copper Alloy ●  Goal:

o  Determine alternative material §  Meets mechanical properties and cost effective

o  Determine supplier selection and sourcing ●  Necessary to understand the specs and manufacturing

process

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C101 Copper ●  Electrically refined copper alloy

o  Contains less than .001 % oxygen ●  High thermal conductivity and coefficient of thermal

expansion (CTE) o  390 - 400 W/mK and 16 - 17 ppm/C

●  Worldwide availability ●  Stamping makes it cost effective to manufacture ●  Commonly used in electronics

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Project Scope ●  Separated the project into two parts:

o  Material research and selection o  Material sourcing, supplier selection, manufacturing process

●  Focus on increasing heat efficiency of Integrated Heat Spreader (IHS) and lowering cost

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Material Specific Criteria ●  Thermal conductivity (W/mK) ●  Coefficient of thermal expansion, CTE (ppm/C) ●  Dimensions (32mm x 34mm) ●  Surface finish (nickel plating/alternative technique) ●  Material manufacturing (conflict free)

o  Conflict Minerals- Minerals that come from the Democratic Republic of Congo (DRC), where the profits of these minerals fund violence committed by the rebel groups

●  Cost ●  Availability of material

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Initial Material Research ●  CuB-42MBD4(120/140)(70/80) ●  CuMo ●  Aluminum Nitride ●  Copper-Tungsten Alloy ●  Tungsten Carbide ●  Al-Diamond ●  CarbAl ●  Cubic Boron Arsenide ●  Silicon Carbide ●  Dymalloy ●  Silver Diamond ●  Cubic Boron Arsenide

●  Copper Graphite ●  Natural Graphite ●  Aluminum Graphite ●  Aluminum Silicon Carbide

Thermal conductivity

and dimensions

Research Criteria:

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Short List ●  CarbAl ●  Copper Graphite ●  Aluminum Graphite ●  CuB - 42MBD4 (120/140)

(70/80) ●  Silicon Carbide (C6H) ●  Aluminum Diamond

Research Criteria:

Minimum dimensions,

surface finish, location and availability of material, cost

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Copper Graphite

Material Name

Thermal Conductivity

(W/mK)

CTE (ppm/C) Minimum Material

Dimensions (32 mm by 34

mm)

Surface Plating

Material Production (location)

Cost/Yield Notes:

C101 Copper

390-400 16-17 Yes Nickel Plated South East Asia

Cheap/High Yield

Current material for heat spreader

Copper Graphite (GR-CU)

265-300

4-7

No

Nickel Plated

North America

Expensive/Low Yield

Adding graphite makes the

manufacturing process more

intense

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CuB-42MBD4(120/140)(70/80) Material Name

Thermal Conductivity

(W/mK)

CTE (ppm/C) Minimum Material

Dimensions (32 mm by 34

mm)

Surface Plating

Material Production (location)

Cost/Yield

Notes:

C101 Copper

390-400 16-17 Yes Nickel Plated South East Asia

Cheap/High Yield

Current material for heat spreader

CuB- 42MBD4 (120/140)(70/80)

520-598 10.1/12.4 N/A N/A Dresden, Germany

Expensive/ Low Yield

Due to this material

containing synthetic

diamonds it is very expensive

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Aluminum Diamond

Material Name Thermal Conductivity

(W/mK)

CTE (ppm/C)

Minimum Material

Dimensions (32 mm by

34 mm)

Surface Plating

Material Production (location)

Cost/Yield

Notes:

C101 Copper

390-400 16-17 Yes Nickel Plated

South East Asia

Cheap/High Yield

Current material for heat spreader

Aluminum Diamond 500 6.1-7.9 Yes

Nickel Plated

Europe North

America

Expensive/ Low Yield

Diamond is very expensive and hard to

work with

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Top Three Materials ●  CarbAl

o  Applied Nanotech, Inc. ●  Aluminum Graphite

o  Mersen

o  Schunk Hoffman

o  MMCC

o  Bracalente

●  Silicon Carbide (C6H) o  Genesic o  BayCarbon o  Stanford Advanced Materials o  II-VI Incorporated o  Dow Corning o  Nitride Crystals Group o  SiCrystal AG o  TanKeBlue Ltd.

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CarbAl

Material Name

Thermal Conductivity

(W/mK)

CTE (ppm/C) Minimum Material

Dimensions

Surface Plating

Material Production (location)

Cost/Yield

Notes:

C101 Copper

390-400 16-17 Yes Nickel Plated South East Asia

Cheap/High Yield

Current material for heat spreader

CarbAl 350 2 No Nickel Plated Austin, Texas

Applied Nanotech

Cheap/Low Yield

Can be inlayed and plated in copper and is currently being

looked at by NASA for heat

sink applications

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Aluminum Graphite

Material Name

Thermal Conductivity

(W/mK)

CTE (ppm/C) Minimum Material

Dimensions

Surface Plating

Material Production (location)

Cost/Yield

Notes:

C101 Copper

390-400 16-17 Yes Nickel Plated South East Asia

Cheap/High Yield

Current material for heat spreader

AlGrp (Range is 10-90% graphite)

324-783 Matched: Parallel

(16.9-2.5) Perpendicular

(15.2-10.1)

No Nickel Plated Worldwide

MMCC

Mersen

Expensive/Low Yield

Further research suggests that the

manufacturing process is not

readily available

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Final Material - Silicon Carbide

Material Name

Thermal Conductivity

(W/mK)

CTE (ppm/C) Minimum Material

Dimensions

Surface Plating

Material Production (location)

Cost/Yield

Notes:

C101 Copper

390-400 16-17 Yes Nickel Plated South East Asia

Cheap/High Yield

Current material for heat spreader

Silicon Carbide

360-490 1.2-7.9 Yes Nickel Plated Worldwide

Dow Corning

Stanford Advanced Materials

Cheap/High Yield

Available worldwide and

meets all requirements for

alternative material

Silicon Carbide Process Flow - Dow Corning Crystal Growth

Epi Polish

Stock Polish

Wafer Shaping

Wafer Slicing

Ingot Shaping Epi Growth

Clean/Package

Final Polish

Clean/Package

M

CMetrology Steps

Cleaning Steps

M

M

M

M

M

M

M

M

C

C

C

C

C

C

Seed Surface Prep

Seed Slicing

Seed Ingot Shaping

M

M

M

M C

C

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Stanford Advanced Materials -SiC Process Flow-

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Cost

●  Stanford quoted $11 per unit o  Quantity of 50,000 pieces

●  Dow Corning has no bid o  Would need a secondary company

to diamond machine ●  Alternate materials meeting

performance requirements are higher cost than stamped copper

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Major Challenges ●  Finding suppliers of high grade SiC ●  Working with manufacturers ●  Complex manufacturing/machining process

o  Competitive cost ●  Issues with procuring a sample ●  Integrated package performance due to CTE of IHS ●  Meeting strict design criteria

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Conclusion ●  Many materials with novel properties meeting requirement

o  Continue monitoring CarbAl and AlGrp ●  Silicon Carbide

o  Viable option for large complex operations o  More sustainable than Copper and Gold o  Very strong, low density material o  Uniform structure, most reliable in long run o  High thermal conductivity capabilities o  Can be Nickel plated

§  Same laser etching process

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A special thanks to our Intel sponsors, Sabina Houle and Mark Norwil!

Thank you Intel!

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