mod 6 smart mat lec 40
TRANSCRIPT
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based on SmartMaterials
Bishakh Bhattacharya and Nachiketa Tiwari
Indian Institute of Technology, Kanpur
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Lecture 40: MEMSbased Actuators
"Courtesy Sandia National Laboratories,SUMMiT Technologies,mems.sandia.gov"
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ezoe ec r c nc worm ev ces
Inchworm devices for Actuation
Rainbow and Thunder Actuation
Active Elasto-dynamic Motion
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A Case history of Sensor
u v
MEMS based Accelerometers
How to develop MEMS?
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Till 1960 Radio was the only electronics system
Engine systems were controlled mechanically
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conven ona mec anca y ac ua e gn on an
fuel systems weren't precise enough to control
1960-70: Electronic ignition system was
Crankshaft position sensor
Airflow rate sensor
Throttle position sensor
Microcontroller to control i nition
http://auto.howstuffworks.com/engine3.htm
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Late 1970: ABS (Antilock Brake Device)
Sense locking of wheels and modulate hydraulicpressure to minimize sliding
Mid 1990: TCS(Traction Control System)
Sense slippage during acceleration and modulatepower to prevent slipping
More advances like VDS (Vehicle Dynamics
Control), Millimeter wave Radar Technology withGPS based traffic updating etc.
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ensors xposure to a spec c
Physical/Chemical/Biological Phenomenonwould produce a significant output signal(electrical/mechanical/optical/acoustic etc.)
Actuators Accept a Control Commandmostl in the form of an electric si nal and
produce a change in the physical system by
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Wh MEMS based S stems?
MEMS as the name suggests refers tomcro-sca e e ectro-mec anca systems.
Th v nt f MEM t m v rmacro systems are:
, high sensitivity, easy to integrate/communicate
low noise, high machine precision
decreased cost due to removal of manualassembly and substitution by batch fabrication)
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Earliest MEMS products: MEMS
Accelerometer & ..
Sensing, Piezoresistivity, Piezoelectricity,ptical Inter erometry, thermal expansion
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developed at Stanford in 1979!
yroscopes e ner a easuremen n s
(IMUs) Digital Micro Mirrors (DMMs)
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MEMS Accelerometers: Fact
between them. When a voltage is applied to one of
,stored on the surfaces of the plates will cause an
.
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0 = absolute permittivity of free space (8.85 10-12)
r = re a ve perm v y e ec rc cons an o
medium in gap between plates =
d = plate separation (displacement)
There are three ways to change the capacitance of the-
Variation of the shared area of the plates (A)
ara on o e e ec rc cons an r
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MEMS Accelerometers: based
x Ref:
2
212
xd
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Active Control of Optical Aperture
Source:A. P.
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MEMS based Actuators
MEMS as the name suggests refers tomcro-sca e e ectro-mec anca systems.
A t m tiv t r A li ti n : Airbag System
u Active Suspension
Consumer Sector Applications:
Subwoofers
ports ra nng evces
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c now e gemen : ona a a u e n vers y
A lication of AC between the electrode and silicon
develops electrostatic force and create oscillation.
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.
times Youngs Modulus of Steel bout 700a, u as g as umnumKg/m3
It is mechanically stable and can be easilydeveloped by using micro-fabrication
.
For signal transductions, p or n type
semiconductors can be readily integrated withthe Si subsrtate.
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Melting point around 1400 degree centigrade
smaller than Aluminium
Very Flat for coating
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Sin le Cr stal Silicon
Czocharlski Method Raw Silica (Quatzite) ismolten in a chamber. The crystal formation
process is initiated with a seed crystal which isgradually pulled to get the complete biggercrystal.
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Three common techniques
used for MEMS fabrications Bulk Micromachining removal of
materials from Bulk substrates either bisotropic or anisotropic wet etching
Wafer bonding - using precisely alignedwafers
fabrication
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Micro-mechatronics by Uchino &
Giniewicz, Marcel, Dekke Microsensors MEMS and Smart Devices,
,
Donald Lab at Duke University
Fundamentals of Microfabrication, Marc
, , .
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