microtek laboratories

Global Headquarters:

Microtek Laboratories 1435 Allec Street

Anaheim, California 92805-6306 U.S.A.

eMail: [email protected] (P) 714.999.1616 (F) 714.999.1636

Toll Free (USA only) 800.878.6601

“Global Leader in Test Technology and Expertise”

www.THETESTLAB.com

Summary of Services

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Microsec onal (Cross‐sec on) Analysis

PCB / PCBA Failure Analysis (F/A)

Advanced Analy cal Techniques:

Differen al Scanning Calorimetry (DSC)

Dynamic Mechanical Analysis (DMA)

Fourier Transform Interferometry (FTIR)

Scanning Acous c Microscopy (CSAM)

Scanning Electron Microscopy (SEM)

Thermal Gravinetric Analysis (TGA)

Themal Mechanical Analysis (TMA)

Environmental Simula on

Condu ve Anodic Filament (CAF)

Dielectric Withstanding Voltage (DWV)

ElectroChemical Migra on (ECM)

Moisture and Insula on Resistance (MIR)

Surface Insula on Resistance (SIR)

Humidity (Steady State & Cycling)

Temperature (Thermal Aging/Accelera on)

Electrical Tes ng

Visual and Dimen on Inspec on

Mechanical Proper es

Tensile Strength

Peel Strength

Bond Strength / Bond Pull

Microtek Laboratories has the capabilities to perform physical, mechanical, electrical, visual & dimensional testing and verification at the PCB bare board level, raw materials as well as the assembled PCBA’s. Microtek can evaluate to both military and commercial standards including IPC specification and test methods, MIL-PRF-55110; MIL-PRF-31032; MIL-P-50884, ASTM, IEC as well as customer procurement documents. Since 1986, our highly-qualified staff includes mechanical and chem-ical engineers, technicians and laboratory management in industry knowledge and experience.

PCB/PWB & PCBA TESTING


Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.

eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com

Global Leader in Test Technology and Expertise

Copyright 2013 - Microtek Laboratories Scan to Learn More

IPC-A-600 IPC-A-610 IPC-6012 IPC-6013 IPC-6016 IPC-6018 IPC-TM-650

MIL-PRF-55110 MIL-PRF-31032 MIL-P-50884 ASTM IEC Bellcore (Telcordia) UL

IPC‐4101 Specifica on for base Material for Rigid and Mul layer PCB

IPC‐4102 Flexible Base Dielectrics for use in Flexible Printed Circuitry

IPC‐4202 Flexible Base Dielectrics for use in Flexible Printed Circuitry

IPC‐4104 Flexible Metal‐Clad Dielectrics for use in Fabrica on of Flexible PCB

IPC‐6012 Qualifica on and Performance Specifica on for Rigid Printed Boards

IPC‐6013 Qualifica on and Performance Specifica on for Flexible PCB

IPC‐6018 Qualifica on and Performance Specifica on for High Frequency PCB

IPC‐9202 Material and Process Characteriza on/Qualifica on Test Protocol

for Assessing Electromechanical Performance

IPC‐A‐600 Acceptability of Printed Boards

IPC‐A‐610 Acceptability of Electronic Assemblies

IPC‐CC‐830 Qualifica on and Performance of Electrical Insula ng Compounds

J‐STD‐001 Requirements for Soldered Electrical and Electronic Assemblies

J‐STD‐002 Solderability Test for Component Leads, Termina ons, Lugs & Wires

J‐STD‐003 Solderability Test for Printed Boards (ANSI)

IPC‐TM‐650 Test Methods

Sec on 2.1 ‐ Visual Test Methods

Sec on 2.2 ‐ Dimensional Test Methods

Sec on 2.3 ‐ Chemical Test Methods

Sec on 2.4 ‐ Mechanical Test Methods

Sec on 2.5 ‐ Electrical Test Methods

Sec on 2.6 ‐ Environmental Test Methods

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Microtek Laboratories an A2LA ISO/IEC 17025 Accred-ited test lab with the capabilities to assess the physical and mechanical properties of both military and commer-cial applications that reference testing in accordance with IPC Standards and Test Methods. Our IPC testing exper-tise includes testing for printed circuit boards (PCB), Copper-Clad Laminates (CCL), solderability of materi-als, soldermasks and coatings. Our highly-qualified staff includes mechanical and chemical engineers, technicians and laboratory management with over 25-years in indus-try knowledge and experience. The full spectrum of IPC Standards and Test Methods and Training services are available from Microtek La-boratories. Working in close partnership with its custom-ers, Microtek may serve as an extension of its custom-er’s facilities, helping to sharpen the product manufactur-ing and development picture. In addition to providing test results and data interpretation, Microtek provides specialized client services such as failure analysis and test program development. Our technical staff will pro-duce customized test programs that aid in identifying the cause of manufacturing problems. If necessary, Microtek can also assist in mediating and resolving customer-

IPC TESTING






www.IPCTesting.com

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PCB / PCBA Conformance and Failure Analysis

Advanced Analytical Techniques:

Differential Scanning Calorimetric (DSC)

Thermal Mechanical Analysis (TMA)

Environmental Simulation and Electrical Properties

Conductive Anodic Filament (CAF)

Electrochemical Migration (ECM)

Moisture and Insulation Resistance (MIR)

Surface Insulation Resistance (SIR)

Humidity (Steady State & Cycling)

Temperature (Thermal Aging/Acceleration)

Thermal Shock


Continuity / Shorts

Volume and Surface Resistivity

Physical Properties

Bond Strength / Bond Pull

Folding Flexibility & Flexibility Endurance

Microsectional (Cross-Section) Analysis

Peel Strength

Thermal Stress

Solderability (Surface and Hole)

Rework Simulation

Tensile Strength and Elongation

Peel Strength

Visual and Dimensional Inspection / Verification

Microtek Laboratories has more than 25‐

years of Military Specifica on (MIL‐Spec) tes ng for the PCB industry. Microtek is an in‐terna onally accredited company to A2LA ISO/IEC 17025 and also has commercial Laboratory Suitability Status to the Department of De‐fense – DLA. Microtek can provide the full range of MIL‐Spec tes ng including; Qualifica‐

on, lot conformance and periodic conform‐ance tes ng for rigid, flex, rigid‐flex and high reliability printed circuits boards and electron‐ic components.

DEFENSE AND MILITARY TESTING






MIL‐PRF‐55110

Group A, Group B and Qualifica on

MIL‐PRF‐31032

Lot, & Periodic Conformance and Qualifica on

MIL‐P‐50884

Group A, Group B, Group C and Qualifica on

MIL‐STD‐202

Test Method Standard for Electronic Parts

MIL‐STD‐810

Environmental Engineering and Tests

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Failure Analysis (F/A)

Op cal Inspec on and external package analysis


Live‐Time X‐ray

Curve trace / Electrical characteriza on

Decapsula on: Jet‐etch and acid decapsula on

Wire bond pull tes ng

Ball shear tes ng

Die shear tes ng


Cross‐sec onal Analysis


Materials Characteriza on:

Differen al Scanning Calorimetric (DSC)



Thermal Gravimetric Analysis (TGA)

Thermal Conduc vity

Microtek Laboratories’ Aerospace, Military and Defense

tes ng experience includes an extensive experience in

tes ng and cer fica on for a mul tude of commercial,

industrial and military applica ons. As a result, we un-

derstand the requirements involved when working in

the aerospace and defense industries.

Microtek’s staff and facility are equipped to work with

an array of metals, composites and cu ng edge materi-

als that are required for aerospace and defense applica-

ons. Microtek Lab’s mechanical tes ng qualifica ons

can provide the informa on necessary to improve the

mechanical performance of materials and components

for the Aerospace and Defense Industry. Microtek also

performs metallographic and failure evalua ons involv-

ing printed circuit boards and PC assemblies.

Our test programs may be customized to client product

protocols or to meet product performance goals. Our

full-service tes ng facility can also provide specialized

solu ons to meet your tes ng needs.

AEROSPACE TESTING






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94HB - Horizontal Burning Test

94V-0 -Vertical Burning Testing

94VTM - Thin Material Vertical Burning Test

Ash Content

Bond Strength

Cold Bend

Comparative Tracking Index (CTI)

Deflection Temperature of Polymeric Materials Under Load

Delamination and Blistering

Dielectric Breakdown and Voltage Strength

Flexural Strength

Glow Wire Ignitability (GWI)

High Current Arc Ignition (HAI)

High Voltage Arc Resistance (HVAR)

High Voltage Arc Tracking Rate Resistance (HVTR)

High Voltage, Low Current Dry Arc Resistance (D495)

Hot Wire Ignition (HWI)

Long-Term Thermal Aging (LTTA)

Moisture Absorption

Repeated Flexing

Specific Gravity of Polymers

Stiffener Bond Strength

Tensile Impact

Tensile Strength of Thermoplastic Polymeric Materials

Tensile Strength of Thin Polymeric Sheeting

Thermal Cycling / Shock

Vicat Softening Point for Polymeric Materials Volume and Surface Resistivity

Microtek Laboratories has unparalleled experience providing UL Engineering and Administrative Client Agent Services and Testing to achieve your UL Recogni-tion for PCB and Laminate manufacturers for more than 25-years.

We can help you achieve your recognition and listings with UL in the shortest possible time. In addition prod-uct safety certifications, we can also help you optimize your test program for optimal ratings, from specially design test sample artwork to our experienced staff of engineers managing your test program throughout the process. Partner with Microtek Laboratories’ experi-enced team of Product Safety specialists operating on your behalf, coordinating with key UL personnel under the Client Agent Program (CAP), expediting the certifi-cation process and minimizing disruptions to your prod-uct release plans to apply the certification mark to your products.

SAFETY AND UL TESTING




“Global Leader in Test Technology and Expertise”


UL 94

UL‐746A

UL‐746B

UL‐746E

UL‐746F

UL‐796

UL‐796F

Microtek Laboratories is an UL CAP Agent for the following categories:

ZPMV2, ZPXK2, QMTS2, QMJU2, QMFZ2 & OCDT2

www.ULTesting.com

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Live‐Time X‐ray




Ball shear tes ng

Die shear tes ng









Thermal Conduc vity

Microtek Laboratories offers a wide range of Component Testing and inspection services that can be utilized to improve yield, determine root cause of failure, extrapolate life expectan-cy and improve reliability, and increase perfor-mance on integrated circuits (ICs), printed cir-cuit boards (PCBs), and passive surface mount devices (such as capacitors, inductors, diodes, etc.), as well as materials and assemblies.

Microtek Labs has an extensive array of equip-ment and technical experience to provide you with the tools and data necessary to overcome your shortfalls and failures.

COMPONENT TESTING






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Imperfec ons in logo

Spelling and layout errors on labels

Examina on of the Indents

Incorrectly packaged devices

Label date codes labels not matching component

Date codes that are not possible

Date codes that are in the future

Checking country of origin against lot codes

Variance in texture


Live‐Time X‐ray




Ball shear tes ng

Die shear tes ng








Counterfeit Component Inspec on and detec on

has become a widespread concern throughout the electronics manufacturing supply chain. Microtek Laboratories offers a wide range of component inspec on and verifica on services that can be u -lized to verify the accuracy of sourced components and materials. When it comes to guarding against counterfeit components, it's important to note that compo-nent counterfeiters are con nually evolving and improving their techniques con nuously. Accord-ingly, Microtek is inves ng in our people, systems and equipment to ensure we are ahead of the curve. Microtek Laboratories has the latest test equipment, detailed procedures, and highly-trained staff to properly inspect, detect, and iden -fy counterfeit components.

COUNTERFEIT COMPONENT INSPECTION






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Live‐Time X‐ray

Curve trace / Electrical characteriza on / Leakage

Microprobing



Ball shear tes ng

Die shear tes ng



Moisture sensi vity tes ng & qualifica on (MSL)

Dye and pry analysis







Thermal Conduc vity

Microtek Laboratories offers a wide range of failure analysis and environmental services that can be utilized to improve yield, determine root cause of failure, extrapolate life expectancy and improve reliability, and increase performance on integrated circuits (ICs), printed circuit boards (PCBs), and passive surface mount devices (such as capacitors, inductors, diodes, etc.), as well as materials and assemblies.

Failure analysis can provide detailed information regarding the performance of materials and devices in their intended end-use application. When a device or material does not meet its performance expectations, a failure analysis should be performed to identify the root cause of failure. The information presented in the root cause failure analysis will allow the product designer, manager, test and process engineers, or end-user to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. By having an unbiased failure analysis performed by an independent test laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products and improved yield.

FAILURE ANALYSIS (F/A)






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Curve Trace Automated Test Equipment (ATE) Arc Resistance Capacitance Testing Comparative Tracking Index (CTI)

Conductivity Contact Resistance

Continuity

Dielectric Breakdown

Dielectric Strength


Dissipation Factor DF (Loss)

Permittivity (Dielectric Constant)

High Current Arc Ignition (HAI)

Insulation Resistance (IR)

Interconnection Resistance

Surface Insulation Resistance (SIR)

Volume and Surface Resistivity

Wrapper Resistance (Wire Wrap)

Electrical and Electronics Testing characterizes the interaction between resistance, capacitance and inductance in electronics interconnection products. The electrical tests Microtek Laborato-ries performs help demonstrate attributes critical to the performance of the product. Electrical test and analysis are at the core capability of Microtek Laboratories, having over 25-years of experience servicing the electronics and printed circuit board (PCB) industries. Microtek Laboratories complies with the most demanding requirements of the Military, Aero-space, Automotive, Telecommunications and Med-ical industries, as well as those of Underwriters Laboratories (UL). In addition, our engineers routinely provide program insight, allowing our customers the flexibility to enhance and/or structure their testing accordingly. Improved product design, enhanced reliability, and better quality are just some of the valuable results you will realize by testing your products for compliance with their electrical operating parameters. Electrical testing may be performed as an independent analysis of the product’s electrical properties or it may be performed in conjunction with environmental simulation.

ELECTRICAL TESTING






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CONDUCTIVE ANODIC FILAMENT (CAF) CORROSION DIFFERENTIAL SCANNING CALORITMETRY (DSC) ELECTROMIGRATION RESISTANCE (ECM) FLAMMABILITY GAS TIGHT HUMIDITY IMMERSION MOISTURE RESISTANCE STEAM AGING SURFACE INSULATION RESISTANCE (SIR) TEMPERATURE AGING TEMPERATURE CYCLING THERMAL SHOCK THERMAL STRESS UL LONG-TERM THERMAL AGING VICAT SOFTENING POINT

Environmental Simulation is a method of determining how a product will perform in a specific environment by accelerating the exposure to that environment. The accelerated test environment may contain elevated or reduced temperatures, in-creased relative humidity, pressure or other simulated condition. Electrical and mechanical attributes are often evaluated during or after accelerated environmental exposures to further ascertain the product’s performance under severe con-ditions. This accelerated aging allows the prediction of how a product will perform throughout its life cycle. Environmental simulation is at the core capability of Microtek Laboratories, hav-ing over 25-years of experience servicing the electronics Military, Aerospace, Auto-motive, Telecommunications and Medical industries, as well as those of Underwriters Laboratories (UL).

ENVIRONMENTAL SIMULATION





Copyright 2013 - Microtek Laboratories Scan For More Info

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AdhesionAdhesionAdhesion

Bond StrengthBond StrengthBond Strength

Differen al Scanning Calorimetry (DSC)Differen al Scanning Calorimetry (DSC)Differen al Scanning Calorimetry (DSC)

Dynamic Mechanical Analysis (DMA)Dynamic Mechanical Analysis (DMA)Dynamic Mechanical Analysis (DMA)

Elonga onElonga onElonga on

Flexibility EnduranceFlexibility EnduranceFlexibility Endurance

Flexural Fa gueFlexural Fa gueFlexural Fa gue

Flexural StrengthFlexural StrengthFlexural Strength

Folding FlexibilityFolding FlexibilityFolding Flexibility

Fracture ToughnessFracture ToughnessFracture Toughness

Glass Transi on Temperature by TMAGlass Transi on Temperature by TMAGlass Transi on Temperature by TMA

Lap ShearLap ShearLap Shear

Peel StrengthPeel StrengthPeel Strength

Rework Simula onRework Simula onRework Simula on

Shear StrengthShear StrengthShear Strength

Tensile Strength )Tensile Strength )Tensile Strength )

Tension and CompressionTension and CompressionTension and Compression

Terminal StrengthTerminal StrengthTerminal Strength

Thermal Gravimetric Analysis (TGA)Thermal Gravimetric Analysis (TGA)Thermal Gravimetric Analysis (TGA)

Tensile ImpactTensile ImpactTensile Impact

Mechanical tes ng characterizes the mechanical prop-

er es of a product. Mechanical stresses are defined as those typically experienced by the product in both oper-a ng and non-opera ng environments. Opera onal mechanical stress relates to the breaking, bending, ex-panding, compressing, flexing, pulling and shaking the product during opera on. Non-opera onal mechanical stress experienced during delivery, setup and storage are typically the worst mechanical stresses the product will see and must also be considered.

Microtek Laboratories is an A2LA ISO/IEC 17025 Accred-ited test lab with the capabili es to assess the physical and mechanical proper es of both military and com-mercial applica ons. Tes ng is performed in accord-ance with ASTM Test Methods and other industry recog-nized specifica ons. Depend on Microtek Laboratories for mely, reliable mechanical and physical test require-ments. For the highest degree of accuracy, we minimize factors that contribute to measurement uncertainty. At Microtek, all inspec ons are performed in an environ-mentally-controlled laboratory.

MECHANICAL TESTING






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Visual Inspec on:

IPC‐A‐600—Acceptability of Printed Boards

IPC‐A‐610—Acceptability of Electronic Assemblies

Microsec onal (cross‐sec on) Evalua on

PCB Plated‐through Hole Structural Integrity

Surface Examina on

Workmanship

Dimensional Verifica on:

Coordinate Measuring Machine (CMM)

Dimensional Stability

Part Feature Width & Spacing

Hole Size Verifica on & Pa ern Loca on

Material Thickness

Surface Pla ng/Coa ng Thickness

X‐Ray Fluorescence (XRF)

‐ Nickel/Gold Thickness

‐ Solder Thickness/Composi on

‐ Soldermask Thickness

All visual inspec on at Microtek Laboratories is per-formed by highly-trained personnel to interpret custom-er drawings. All inspectors are cer fied to IPC-A-600 and IPC-A-610 visual acceptability standards for elec-tronic parts and components. Microtek Laboratories performs dimensional verifica on on surface and specialty features of finished parts as well as raw materials and components. Our measure-ment capabili es range from basic plug/pin gauges for hole diameter verifica on to digital micrometers & cali-pers, to high-precision CMM and digital microscope technology to verify part compliance. First-ar cle and third-party dimensional inspec on can be performed according to both commercial and military require-ments. Our dimensional inspec on and measurement capabili es are accredited to A2LA ISO/IEC 17025. Depend on Microtek Laboratories for mely, reliable and repeatable visual and dimensional inspec on and verifica on. For the highest degree of accuracy, we min-imize factors that contribute to measurement uncer-tainty. At Microtek, all inspec ons are performed in an environmentally-controlled laboratory.

VISUAL AND DIMENSIONAL INSPECTION






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Improve Microsec on Quality

Achieve the highest quality

Improve evalua on skills

Use of Proper Materials

Proper Measurement Techniques

Iden fica on of Poorly Prepared Sample

Hidden Defects

Accurate Features and Defects Analysis of:

Structural Integrity

Pla ng / Dielectric Thickness

Blind / Buried Vias

Pla ng Voids / Cracks

Laminate Voids / Cracks

Delamina on

Layer‐to‐Layer Registra on

Annular Ring (Internal & External)

Etchback / Smear Removal

Wicking

Li ed Lands

Wrap Copper

Cap Pla ng

Pla ng Separa on

The Microsectional (Cross-section) Preparation and Analysis training course will provide you with the skills and knowledge to improve your PCB Microsectional preparation techniques and develop the ability to accu-rately evaluate the prepared Microsection for common defects. Both technicians and inspectors will benefit from this dynamic combination of classroom presenta-tion with defect analysis images and hands-on laboratory training. This course is conducted at Microtek Laborato-ries, state-of-the-art Anaheim, California facility or can be customized and presented at your facility utilizing you own in-house equipment.

The 1-Day Course Description

The first half of this 1-day course covers both manual and semi-automatic Microsectional preparation tech-niques and will provide the technician with the base knowledge needed to prepare accurate, scratch-free Mi-crosectional mounts. The second half covers much of the evaluation criteria required by today’s demanding mili-tary and commercial standards.

MICROSECTIONAL PREPARATION & ANALYSIS TRAINING






microtek laboratories

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