Proceedings

MICRO.tec 2003Applications - Trends - Visions

2nd VDE World Microtechnologies Congress

October 13-15, 2003International Congress Centre, Munich, Germany

Organized byVDE Association for

Electrical, Electronic & Information Technologies

Sponsored byEUREL, IEE, VDI/VDE-IT, VDMA, ZVEI

m vw i VDE ITConvention of National Soctitiis at Eltctrical Engine«ri of Europe

X/DAA A Elektrotechnik- undZentralverbandElektrotechnik-1Elektronikindustrie e.V.

UB/TIB Hannover 89

VDE VERLAG GMBH • Berlin • Offenbach

Contents

Plenary Session I

PL 1.1 Opportunities of Micro Systems Technology in Life Siences, Communicationand Control 17N. F. de Rooij, University of Neuchatel and EPFL, Switzerland

PL 1.2 A Micro/Nanotechnology Approach for Probe Based Data Storage 25Peter Vettiger, T. Albrecht, M. Despont, U. Drechsler, U. Diirig, B. Gotsmann, D. Jobin,W. Haberle, M. A. Lantz, H. Rothuizen, R. Stutz, D. Wiesmann, G.K. Binnig, P. Bachtold,G. Cherubini, A. Dholakia, Ch. Hagleitner, T. Loeliger, H. Pozidis, E. Eleftheriou,IBM Research, Zurich Research Laboratory, Riischlikon, Switzerland

Plenary Session II

PL 2.1 Trends in System Integration Technologies 29H. Reichl, M. J. Wolf. R. Aschenbrenner, Fraunhofer Institute, Berlin, Germany

PL 2.2 Industrial Manufacturing of Microsystems 37E. Westkamper, Fraunhofer Institute, Stuttgart, Germany

Technical Session 1 - Micro- and Nano Fabrication

1.1 KeynoteMicro- and IMano-Powder-Technologies for Advancend Ceramic Micro-Components . 45J. HauRelt, Forschungszentrum Karlsruhe, Germany

1.2 Non-reactive and Reactive Ion Etching Processes for Patterning Magnetic MEMSComponents 51M. Balke, H. Liithje, G. Brauer, Fraunhofer Institute, Braunschweig;T. Budde, H. H. Gatzen, Hannover University, Germany

1.3 Ensuring Reliability and Repeatability in Deep X-Ray LIGA Process -State of Standardization 53P. Meyer, L. Hahn, J. Schulz, K. Bade, A. Janssen, R. Thelen, Forschungszentrum Karlsruhe,Germany; J. Lange, Precision Engineering AG, Schaffhausen, Swizerland;M. Arendt, ANKA GmbH, Karlsruhe, Germany

1.4 Investigatipn and First Results of uECM Processing of Microstructuresfor Micro Moulds 59A. Schoth, R. Forster, W. Menz, Albert Ludwig University Freiburg, Germany

Technical Session 2 - Microfluidic Systems I

2.1 KeynoteMicro-Liquid Handling Devices for Biochemical Analysis 67R. Miyake, Hitachi Ltd., Ibaraki, Japan

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2.2 Highly Parallel Droplet Release in a Nanoliter Dispenser 730. Gutmann, R. Kuehlewein, R. Niekrawietz, C. Steinert, B. de Heij, M. Daub, R. Zengerle,IMTEK University of Freiburg, Germany

2.3 Micromachined ESI Nozzle for On-Chip Application 77A. Rudzinski, T. Muiler, A. Neyer, University of Dortmund; W. Nigge, M. Schilling,R. Hergenroder, Institute of Spectrochemistry and Applied Spectroscopy, Dortmund, Germany

2.4 Plastic Capillary Systems for Biomedical Research and Diagnosis 81D. Herrmann, A. E. Guber, M. Heckele, P. Henzi, A. Muslija, R. Truckenmiiller, L. Eichhorn,Th. Gietzelt, Th. Schaller, W. Hoffmann, A. Gerlach, N. Gottschlich, G. Knebel,Forschungszentrum Karlsruhe, Germany

Technical Session 3 - Measuring and Control Systems I

3.1 KeynoteEngineering Microsystems 87A. El-Fatatry, BAE SYSTEMS Advanced Technology Centre, Loughborough, UK

3.2 Experimental Study of Microforces in a Controlled Environment 89B. Chang, H. N. Koivo, Helsinki University of Technology; Q. Zhou, Tampere Universityof Technology, Finland

3.3 3D Evaluation of Tensile Tests by SEM-Microscopy 95G. Molnar, R. Tutsch, G. Fischer, Technical University of Braunschweig, Germany

3.4 Microengineered Dynamometer for Microfan Thrust Measurement 99J. Armstrong, M. Desmulliez, M. Faizal Ahmad, B. Reuben, M. Leonard, R. Dhariwal,P. Chowti, Heriot Watt University, Edinburgh, UK

Technical Session 4 -Technologies for Information and Communication Applications I

4.1 KeynoteMoore's Law at its End? Challenges in Chip Design 105E. Barke, University of Hanover, Germany

4.2 Low Loss and High Temperature Stable Polymer Waveguides for HybridElectrical-Optical Devices 109S. Kopetz, A. Neyer, University of Dortmund, Germany

4.3 Silicon Nitride Membrane Suspended Stripline Filter Technology I l lD. Voyce, R. Greed, R. Jeffries, BAE SYSTEMS Advanced Technology Centre, Gt. Baddow,Chelmsford, UK

4.4 Investigation of Bit Resolution Reduction in Analog-to-Digital Converter forSmart Antennas Systems 113J. Vagner Vital, T. Do-Hong, P. Russer, Technical University of Munich, Germany

Technical Session 5 - Packaging and Molding

5.1 Tool-less Batch Production of MST Products 119R. Gotzen, microTEC Gesellschaft fiir Mikrotechnologie mbH, Duisburg, Germany

5.2 A High Volume, Low Cost and Low Temperature MEMS Packaging TechnologyBased on a Flip-Chip Assembly Process 123R. Kay, M. Desmulliez, Heriot Watt University; St. Stoyanov, G. Glinski, Ch. Bailey, R. Durairaj,N. Ekere, University of Greenwich; M. Hendriksen, B. Smith, Celestica Limited; D. Price,A. Roberts, Merlin Circuit Technology Limited; M. Whitmore, DEK Printing Machines Limited;P. Ongley, Electronic Technology Services; J. Gourlay, MicroEmissive Displays, UK;

5.3 Low Cost Fabrication Technology for Microfluidic Devices Based on MicroInjection Moulding 129W. Eberhardt, H. Kiick, M. Munch, H. Sandmaier, M. Spritzendorfer, M. Willmann,Hahn-Schickard-Gesellschaft, Stuttgart; P. Koltay, R. Steger, R. Zengerle, Universityof Freiburg, Germany

5.4 Simultaneous Replication of both Refractive and Diffractive Optical Componentsusing Elektroformed Tools and Injection Moulding 135P. T. Tang, Technical University of Denmark, Lyngby, T. R. Christensen, Danish TechnologicalInstitute, Taastrup, Denmark

Technical Session 6 - Cryobiotechnology/Cell Manipulation

6.1 Cryopreservation in Miniaturized Substrates: Components for"High Throughput Freezing" 139H. Zimmermann, G. R. Fuhr, Fraunhofer Institute, St. Ingbert, Germany

6.2 A Microfluidic Syringe Chip for Microinjection with Integrated Actuator 141F. Tagliareni, B. Stadelbauer, S. Tahreem Ahmed, Th. Velten, Fraunhofer Institute, St. Ingbert,Germany

6.3 A Novel Fabrication Method for Microstructured Cell Culture Systems 147S. Giselbrecht, R. Truckenmiiller, E. Gottwald, A. E. Guber, K. F. Weibezahn,W. K. Schomburg, L. Eichhorn, Th. Gietzelt, Forschungszentrum Karlsruhe, Germany

6.4 Transporting and Sorting of Cells with Microrobots 153T. Triiper, A. Kortschack, M. Jahnisch, H. Hulsen, S. Fatikow, University of Oldenburg, Germany

Technical Session 7 - Measuring and Control Systems II

7.1 Development of New Inductive Microsensors for Angular Position Measurement. . . 159A. Wogersien, S. BeiBner, S. Samson, S. Buttgenbach, Technical University of Braunschweig,Germany

7.2 Tungsten Carbide Layers for Nanomeasuring Systems 165L. Spiess, M. Gubisch, H. Romanus, M. Breiter, Ch. Miiller, V. Cimalla, G. Ecke, Y. Liu,Ch. Knedlik, Technical University llmenau, Germany

7.3 Microscopic Characterisation of Flow Patterns in Rotating Microchannels 171T. Brenner, M. Grumann, Ch. Beer, R. Zengerle, J. Ducree, University of Freiburg, Germany

and Rapid Prototyping of a Smart Sensor Using Simulink 175E. UlJcna, IMMS gGmbH, llmenau, Germany

Technical Session 8 -Technologies for Information and Communication Applications II

8 . 1 Integration of Optics, Electronics and Mechatronics on Miniaturized Platforms . . . . 1 7 9E. Beckert, C. Damm, R. Eberhardt, P. Schreiber, Fraunhofer Institute, Jena, Germany

8.2 Novel Micromechanical Fiber Optic Modules with Integrated 2x2-Switchesand Variable Optical Attenuators 185M. Voit, T. Schary, H. F. Schlaak, Technical University of Darmstadt, Germany

8.3 Planning WDM Networks with Semi-Transparent Optical Cross-Connectors 191M. Korkel, H. Schmidt, T-Systems Nova GmbH, Darmstadt, Germany

8.4 Manufacturing Line for the Distributed Fabrication of Modular MicroopticalSystems 195U. Wallrabe, U. Hollenbach, J. Mohr, Forschungszentrum Karlsruhe, Germany;T. Oka, Mitsubishi Electric Co., Amagasaki City, Japan

Technical Session 9 - Micro-Nano Interface

9.1 Micro and Nano Filled Ceramic Polymer Composites: Properties and PotentialApplications in Microsystem Technology 201Th. Hanemann, J. Bb'hm, K. Honnef, J. Hausselt, Forschungszentrum Karlsruhe und Albert-Ludwigs-University Freiburg; P. Henzi, Forschungszentrum Karlsruhe, Germany

9.2 Atomic Force Microscopy Studies of Thin and Ultra-thin SiO2 Films 207W. Frammelsberger, G. Benstetter, P. Breitschopf, University of Applied Sciences, Deggendorf;T. Schweinboeck, Infineon Technologies, Munich, Germany;R. Stamp, J. Kiely, University of the West of England, Bristol, UK

9.3 Manufacturing of Field Electron Emitters: Turn from "Self-Organized" Systemsto Nanoengineering 215V. D. Frolov, S. M. Pimenov, V. I. Konov, V. I. Kuzkin, General Physics Institute of RAS,Moscow, Russia

9.4 Fabrication Conditions and Detecting Properties of a Metal Oxide GradientMicroarray Based on Nanocrystalline Tin Dioxide 221J. Goschnick, K. Betsarkis, T. Schneider, Forschungszentrum Karlsruhe, Germany

Technical Session 10 - Medical Diagnostics and Therapy Devices

10.1 New Aspects in the Automated Analysis of Cardiac Arrhythmias 225I. Tchoudovski, K. Egorouchkina, A. Bolz, University of Karlsruhe;L. Pang, University of Erlangen-Niirnberg, Germany

10.2 Multiparametric Sensor Chips for Therapy and Intervention 229C. Stepper, B. Wolf, H. Grothe, A. M. Otto, E. Motrescu, Technical University of Munich,Germany

10.3 Development and Functional Test of an Epiretinal Prosthesis 233I. Krisch, M. Gbrtz, H. K. Trieu, W. Mokwa, B. J. Hosticka, Fraunhofer Institute ofMicroelectronic Circuits and Systems, Duisburg, Germany

10.4 A 6-Axis Force/Torque Sensor Design for Haptic Feedback in Minimally InvasiveRobotic Surgery 239U. Seibold, G. Hirzinger, German Aerospace Center (DLR), Oberpfaffenhofen, German

Technical Session 11 - Smart Energy

11.1 KeynoteSmart Energy for Sensors and MicrosystemsM. Klein, DaimlerChrysler AG, Ulm, Germany(The Paper is not available)

11.2 Solar Cells and Fuel Cells as Device Integrated Power SourcesC. Hebling, A. Schmitz, Fraunhofer-lnstitut for Solar Energy Systems, Freiburg, Germany(The Paper is not available)

11.3 Power Management in Wireless Sensor Systems for Home Applications 2450. Kanoun, U. Trbltzsch, H. Ruser, H.-R. Trankler, University of the Bundeswehr Miinchen,Neubiberg, Germany

11.4 Wireless Sensors enabled by Smart Energy - Concepts and Solutions 251F. Schmidt, M. Heiden, EnOcean GmbH, Oberhaching, Germany

Technical Session 12 - Microelectronics

12.1 KeynoteChallenges of Future On-Chip Interconnects 259M. Engelhardt, G. Schindler, W. Steinhoegel, G. Steinlesberger, M. Traving,Infineon Technologies AG, Munich, Germany

12.2 AIGaN/GaN HEMT on Silicon Substrates 261Y. Dikme, M. Fieger, A. Szymakowski, H. Kalisch, R. H. Jansen, RWTH Aachen;H. M. Chern, M. Heuken, AIXTRON AG, Aachen; P. Javorka, M. Marso, N. Kaluza, P. Kordos,H. Luth, Forschungszentrum Julich, Germany; J. F. Woitok, PANalytical Application Laboratory,Almelo, The Netherlands

12.3 Nanostructural Field Emission Triodes as Active Components for a NewGeneration of Microsystems 267N. I. Tatarenko, Russian Aerospace Agency; A. Y. Vorobyev, Bauman Moscow StateUniversity, Moscow, Russia

12.4 Transistor Architectures for Future Technologies 273T. Schulz, L. Dreeskomfeld, J. Hartwich, F. Hofmann, J. Kretz, E. Landgraf, H. Luyken,W. Rosner, M. Specht, M. Stadele, Infineon Technologies AG, Munich, Germany

Technical Session 13 - Micro Assembly

13.1 A Modular System for Microassembly with Standardised Interface 279A. Hoch, Schunk GmbH & Co. KG, Lauffen, Germany

13.2 Non-Contact Handling and Assembly in Microfabrication 289M. F. Zaeh, J. Zimmermann, M. Schilp, A. Zitzmann, Technical University of Munich,Germany

13.3 Handling and Assembly of Micro-Optical Components - Modules and Solutions . . . 289A. Hofmann, U. Gengenbach, R. Scharnowell, Forschungszentrum Karlsruhe;M. Bar, lEF-Wemer GmbH, Furtwangen, Germany

13.4 Droplet Based Self-Assembly of SU-8 Microparts 293C. del Corral, Q. Zhou, A. Albut, Tampere University of Technology;B. Chang, H. N. Koivo, S. Franssila, S. Tuomikoski, Helsinki University of Technology, Finland

Technical Session 14 - Micro Analytical Devices

14.1 Miniaturised Quartz Crystal Microbalance (QCM) Array for ImmunosensorApplication 299M. Liekefett, J. Rabe, S. Buttgenbach, J. Wendler, U. Bilitewski, Technical University ofBraunschweig, Germany

14.2 Atmospheric Pressure Plasma Printing for Patterned Surface Functionalizationand Coating 305C. Penache, C. Gessner, T. Betker, V. Bartels, C.-P. Klages, Fraunhofer Institute,Braunschweig, Germany

14.3 Polymeric Analytical Devices with Integrated Polymer Waveguides for OpticalDetection in Microfluidic Channels 311M. Fleger, B. Bauer, D. Siepe, A. Neyer, AG Mikrostrukturtechnik, University of Dortmund,Germany

14.4 Manufacturing of Flexible Polymer Film Capillary Electrophoresis Chips byMicrothermoforming 315R. Truckenmiiller, S. Giselbrecht, T. Schaller, W.K. Schomburg, Forschungszentrum Karlsruhe,Germany

Technical Session 15 - Measuring and Control Systems III

15.1 Fabrication of an Electrostatic Miniature Valve from Metallized MicroinjectionMolded Polymers 219M. Arnold, W. Eberhardt, H. Kuck, M. Munch, Hahn-Schickard-Gesellschaft, Stuttgart;D. Warkentin, University of Stuttgart; M. Giousouf, G. Munz, Festo AG & Co., Esslingen;M. Oprea, Endress+Hauser, Gerlingen, Germany

15.2 Current Control of Piezoelectric Actuators with Environmental Compensation . . . . 323P. Ronkanen, P. Kallio, Tampere University of Technology; Q. Zhou, H. N. Koivo,Helsinki University of Technology, Finland

15.3 Function and Performance of a Piezo InkJet Printhead with Bimorph Beams 329G. Beurer, J. Stempfle, G. Schmidt, Tally Computerdrucker GmbH, Ulm, Germany

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15.4 A New Quality Management System for PZT Bending Actuators 335M. Schindler, J. Rucha, J. Heinzl, Technical University of Munich, Germany

Technical Session 16 -Microtechnology in Driver Assistance and Comfort Applications

16.1 KeynoteDriver Assistance Systems - Driver Support or Driver Tutelage? 341P. M. Knoll, Robert Bosch GmbH, Leonberg, Germany

16.2 Micro-Technologies and their Impact on Automotive Radar 347J. Wenger, DaimlerChrysler, Ulm, Germany,

16.3 Thermal Image Sensor for Safety and Comfort Application First Technology 353B. Johnson, J. Milne, First Technology, Farnborough, UK; Alec Williams, QinetiQ, UK

16.4 Evolution in Steering Systems 359S. Schrabler, 0. Hoffmann, St. Linkenbach, A. Schirling, A. Netz, J. Nell,Continental Teves AG & Co. oHG, Frankfurt am Main, Germany

Technical Session 17 - Simulation

17.1 Reliability of Micro- and Nanosystems 365B. Michel, Fraunhofer Institute, Berlin, Germany

17.2 Compact Modelling of an InkJet Printhead with Piezoelectrical CantileverBeams 369R. Scheicher, J. Heinzl, Technical University of Munich, Germany

17.3 Microtribological Characterisation of Ceramic Materials under Slidingand Sliprolling Conditions 375J. Herz, J. Schneider, K.-H. Zum Gahr, University of Karlsruhe, Germany

17.4 Application of the Microoptical Construction Kit to a Microoptical DistanceSensor 381I. Sieber, A. Hofmann, U. Hollenbach, Forschungszentrum Karlsruhe, Germany

Technical Session 18 - Microfluidic Systems II

18.1 The Microfluidic Toolbox - Examples for Fluidic Interfaces and StandardizationConcepts 387C. Gartner, Applikationszentrum Mikrotechnik Jena; B. Anton, 0. Rotting, MicrofluidicChipShop GmbH, Jena, Germany

18.2 Modular Microlabs for Point of Care Use 391A. Schule, D. Mutschler, D. Neumann, Fraunhofer IPA, Stuttgart, Germany

18.3 Coriolis-lnduced Switching and Mixing of Laminar Flows in RotatingMicrochannels 397J. Ducree, T. Brenner, T. Glatzel, R. Zengerle, University of Freiburg, Germany

18.4 Integration of Microfluidics for Lead Discovery 405V. Spikmans, I. Morao, M. Montembault, St. Y. F. Wong, GlaxoSmithKline Pharmaceuticals,Harlow, UK

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Technical Session 19 - Measuring and Control Systems IV

19.1 Highly Integrated VIS Spectrometer 409S. Wuestling, Forschungszentrum Karlsruhe, Germany

19.2 Microspectrometer for Non-Destructive Inline Analysis and Mobil Sensors 415S. Schoenfelder, STEAG microParts GmbH, Germany

19.3 Feasibility of Micro Heating in the Food Industry 421P. de Jong, H. C. van der Horst, NIZO Food Research, The Netherlands;A. Freitag, Mikroglastechnik AG, Mainz, Germany

19.4 The Market for Micro Gas Sensors 4250. Nowak, WTC- Wicht Technologie Consulting, Munich, Germany

Technical Session 20 - Microtechnology in Automotive Sensor Integration

20.1 Automative Sensor Integration 429G. Teepe, Motorola GmbH, Munich, Germany

20.2 Surface Micro Machined Sensor Technology for Future Tire Pressure MonitoringSystems (TPMS) 435W. Gaal, Infineon Technologies AG, Munich, Germany

20.3 RF-MEMS Subsystems for Automotive Radar Sensors with Smart Antennas 439J. Schobel, M. Schneider, Th. Buck, M. Reimann, M. Ulm, Robert Bosch GmbH, Hildesheim,Germany

20.4 High-Sensitivity Uncooled IRFPAs for Driver Vision Enhancement 445J. J. Yon, L. Biancardini, E. Mottin, L. Letellier, CEA - Commissariat a I'Energie Atomique;J. L. Tissot, ULIS, Veurey-Voroise, France

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Poster Session

Technology - Micro and Nano Fabrication

PI . 1.1 Micropatterned Thin Films for Optimisation of the Microtribological Behaviourin MEMS and Microactuators 451R. Bandorf, H. Liithje, C. Henke, J.-H. Sick, Fraunhofer Institute for Surface Engineeringand Thin Films 1ST, Braunschweig, Germany

PI . 1.2 Factory Planning for Miniaturized Mechatronical Systems 453J. Fleischer, H. Weule, A. Blessing, T. Volkmann, University of Karlsruhe, Germany

PI . 1.3 Near-Field Optical Lithography Method for Fabrication of the NanodimensionalObjects 459V. F. Dryakhlushin, A. Yu. Klimov, V. V. Rogov, N. V. Vostokov, Institute for Physics ofMicrostructure RAS, Nizhny Novgorod, Russia

PI . 1.4 Selective Plasma Etching Ill-V Multilayer Heterostructures 463V. I. Shashkin, G. L. Pakhomov, N. V. Vostokov, V. M. Daniltsev, Y. N. Drozdov,S. A. Gusav, Institute for Physics of Microstmctures RAS, Nizhny Novgorod, Russia

PI.1.5 Miniaturized and Flexible Fabrication of Microarrays Using Variable DispensingTechniques - the Biochip Microproduction System 467D. Malthan, H. Dobler, T. Gaugel, Fraunhofer-IPA, Stuttgart; N. Gajovic-Eichelmann,E. Ehrentreich-Forster, F. F. Bier, Fraunhofer-IBMT, Bergholz-Rehbrucke;M. Kuhn, CONGEN Biotechnology, Berlin, Germany

PI . 1.7 Planar Fuel Cells for Miniaturized Power Supply 469A. Schmitz, A. Weil, M. Tranitz, C. Hebling, Fraunhofer Institute, Freiburg, Germany

PI . 1.8 New Technology for the Replication of Micro- / Nanostructures 473J. Kiihnholz, G. Lecarpentier, SUSS MicroTec Lithography, Asslar, Germany

PI.1.9 Thick Photo Resist for MEMS Applications 475E. Cullmann, J. Kuehnholz, SUSS MicroTec, Garching, Germany

PI . 1.10 Influence of the Initial Surface Roughness on the Wear Behaviourof Micro Probes under Rotating and Oscillating Flat Micro Contact 477M. Beck, H.-H. Gatzen, Hannover University; R. Bandorf, H. Liithje, J.-H. Sick,Fraunhofer-lnstitut fur Schicht- und Oberflachentechnik 1ST, Braunschweig, Germany

PI.1.11 Technical and Economical Aspects of Micro Injection Moulding 479V. Plotter, K. Plewa, R. Rupprecht, J. Hausselt, Forschungszentrum Karlsruhe, Germany

Technology - Micro Assembly and Packaging

PI.2.1 The Interconnection System for Fabricating Digital Logic Elements Basedon Nanostructural Field Emission Triodes 485N. I. Tatarenko, Russian Aerospace Agency; A. Y. Vorobyev, Bauman Moscow StateTechnical University, Moscow, Russia

PI.2.2 Development of Adaptive Tong Grippers for Automated Microassembly 491J. Schlick, D. Zuehlke, Kaiserslautern University of Technology, Germany

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Pl.2.3 Simulation and Offline Programming of Automated MicroassemblyProcesses 497R. Dabelow, D. Zuehlke, Kaiserslautern University of Technology, Germany

PI.2.4 A Fiber-Based Fringe Projection System 503S. Driessen, T. Pfeifer, Aachen University of Technology, Germany

PI.2.5 Development of Flexible Force-Controlled Piezo-Bimorph MicrogrippingSystem 507A. Albut, C. del Corral, Q. Zhou, Tampere University of Technology;H. N. Koivo, Helsinki University of Technology, Espoo, Finland

Technology - Simulation and Design

PI.3.1 Structure and Parameter Studies of an Aerostatic Linear Guidancefor Microsystems 513B. Denkena, D. Kopp, J. Li, University of Hanover, Germany

PI.3.2 Tribological Studies on Mould Inserts Used in Micro Powder Injection Mouldingwith Ceramic Feedstocks 517J. Schneider, H. Iwanek. K.-H. Zum Gahr, University of Karlsruhe and ForschungszentrumKarlsruhe, Germany

PI.3.3 FEM Analysis of a Via-Line Structure in Cu-Technology with Low-k-Dielectricwith Respect to the Distribution of Current Density and Temperature 523H. Brocke, University of Hannover, Germany

PI.3.4 Comparison of Electrically Powered Micro Heat Exchangers and Evaporators . . 529T. Henning, J. J. Brandner, K. Schubert, Forschungszentrum Karlsruhe, Germany

Life Sciences

P2.1 Biological Evaluation of Miniaturized Cryosubstrates: towards theCryobank-on-a-Chip 535H. Zimmermann, A. D. Katsen, Fraunhofer Institute for Biomedical Engineering,St. Ingbert, Germany

P2.2 Challenges in Packaging of Batch-Fabricated Micro Fluidic Devices 541M. Giousouf, U. Gebhard, C. Hanisch, A. Muth, Festo AG & Co., Esslingen, Germany;A. Enzler, T. Lamprecht, A. Dommann, NTB Interstaatliche Hochschule fur Technik Buchs;W. Tschanun, Reinhardt Microtech AG, Wangs, Switzerland

P2.3 Stacking of Beads into Monolayers by Flow through Flat MicrofluidicChambers 545M. Grumann, P. Schippers, M. Dobmeier, S. Haberle, A. Geipel, T. Brenner, R. Zengerle,J. Ducree, University of Freiburg, Germany

P2.4 Microreactors for Optimisation Chemical Reactions by Raman Spectroscopy . . 551M. Schafer, R. Starzmann, N. Lammerzahl, H. v. Eiff, A. H. Foitzik, University of AppliedSciences Esslingen, Germany

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P2.5 Highly Parallel Picoliter Dispensing Based on Direct Liquid Displacement 555C. P. Steinert, I. Goutier, B. de Heij, 0. Gutmann, M. Daub, R. Zengerle, IMTEK,University of Freiburg; H. Sandmaier, HSG-IMIT, Villingen-Schwenningen, Germany

P2.6 Simulation and Fabrication of a Microturbine Using Fluid-Assisted Levitation . . . 559A. Kanteres, M. Leonard, M. Desmulliez, R. S. Dhariwal, Heriot-Watt University,Edinburgh, UK

P2.7 A Highly Integrated Nanoliter Dispensing System for fast Liquid Handling 563R. Steger, B. Bohl, P. Koltay, C. Moosmann, G. Birkle, R. Zengerle, University of Freiburg,Germany

P2.8 Electrical Detection for DNA Identification with Nanoparticle Probesin an Array-based CMOS Biochip 567C.-C. Pun, C.-Y. Tsai, Y.-C. Cheng, Y.-T. Cheng, P.-H. Chen, P.-Z. Chang, National TaiwanUniversity, ROC

P2.9 A One Way Micro-Device for DNA-Analysis 573M. Schafer, R. Stein, L. Vollmer, G. Schuster, A. H. Foitzik, Universityof Applied Sciences Esslingen, Germany

Measuring Control Systems

P3.1 Lateral Inhomogeneity of Gas Permeable AI2O3 or SiO2 Coatings asTuning Tools for the Gas Analytical Performance of Gradient Microarrays 577J. Goschnick, I. Kiselev, Forschungszentrum Karlsruhe; M. Frietsch, ChristianGlockner GmbH & Co. KG, Knittlingen; K. Halim, Infinieon Technologies AG, Dresden,Germany

P3.2 A Fully Digital Method of the Generation of Sinusoidal Waveform for theBuilt-in Self-Test (BIST) of the Audio Chip 583H. Li, J. Eckmueller, H. Eichfeld, S. Sattler, Infineon AG, Miinchen; R. Weigel, Universityof Erlangen, Germany

P3.3 Noise Measurement with a Digital Storage Oscilloscope 589B. Biittgen, CSEM SA, Zurich, Switzerland

P3.4 Mechanical Material Characterisation in a SEM 595J. Zenke, A. Sill, S. Fatikow, University of Oldenburg, Germany;J. Michler, Swiss Federal Laboratory for Materials Research and Testing, Thun, Swizerland;St. Buttgenbach, Technical University of Braunschweig, Germany

P3.5 Multi-Modal Control Interface for a Microrobot-Based Nanohandling Cell 601S. Garnica, A. Shirinov, T. Sievers, J. Kamenik, 0. C. HanBler, S. Fatikow,University of Oldenburg, Germany

P3.6 Microsystems in Household Appliances 607G. Tschulena, SGT Sensor Consulting, Wehrheim, Germany

P3.7 Thin Film Technologies for Three Dimensional Reference Structures 609A. H. Foitzik, M. Schafer, R. Stein, L. Vollmer, S. Arkhipov, G. Schuster,University of Applied Sciences Esslingen, Germany

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P3.8 Wafer Level Test: Significant Time and Cost Reduction of MEMS Production . . . 613F.-M. Werner, SUSS MicroTec Test Systems GmbH, Sacka, Germany

P3.9 A Calibration System for 3D Micro Probes 619S. Cao, U. Brand, Physikalisch-Technische Bundesanstalt, Braunschweig;S. Buttgenbach, Technical University of Braunschweig, Germany

Technology for Information andCommunication Applications

P4.1 Frequency-Invariant Beam-Pattern and Spatial Interpolation for WidebandBeamforming in Smart Antenna System 626T. Do-Hong, P. Russer, Technical University of Munich, Germany

P4.2 A Novel Alignment-Mechanism for 2D-Fibre-Arrays in Telecom ApplicationsManufactured by DRIE 6310. Krampitz, V. Biefeld, R. Hbper, G. Mannmeusel, A. Menz, Protron Mikrotechnik GmbH,Bremen, Germany

P4.3 Manufacturing, Testing and Packaging of Optical Microsystems 635R. Voelkel, M. Eisner, K. J. Weible, SUSS MicroOptics, Neuchatel, Switzerland;S. Hansen, C. Ossmann, R. Suess, SUSS MicroTec, Munich;J. Hbppner, SUSS MicroTec Lithography, Singen, Germany;W. Noell, U. Staufer, N. F. De Rooij, H. P. Herzig, University of Neuchatel, Switzerland;N. Lindlein, J. Schwider, University of Erlangen-Nuernberg, Germany

Microelectronics

P6.1 High Frequency Suitability of Soft Magnetic FeTaN and FeCoTaN Filmsfor Advanced CMOS-Fabricated Micro Inductors 637K. Seemann, H. Leiste, V. Bekker, Forschungszentrum Karlsruhe, Germany

P6.2 Evaluation and Adaptation of Flash-Memory for CryobiophysicalApplications 643F. R. Ihmig, S. G. Shirley, H. Zimmermann, Fraunhofer Institute for BiomedicalTechnology (IBMT), Sankt Ingbert, Germany

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