micro-electromechanical systems (mems) technology and ......accelerometer – state-of-research...

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Micro-electromechanical Systems (MEMS) Technology and Applications APAC Innovation Summit 2016 Series – Sensors Professor William C. Tang Microbiomechanics Laboratory Department of Biomedical Engineering Department of Electrical Engineering & Computer Science Department of Chemical Engineering & Materials Science Henry Samueli School of Engineering University of California, Irvine

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Micro-electromechanical Systems (MEMS) Technology and Applications APAC Innovation Summit 2016 Series – Sensors

Professor William C. Tang Microbiomechanics Laboratory Department of Biomedical Engineering Department of Electrical Engineering & Computer Science Department of Chemical Engineering & Materials Science Henry Samueli School of Engineering University of California, Irvine

In the Past 20 Years…

Professor William C. Tang 2

50K

100K

150K

200K

250K

300K

Annual Publications

Institute of Electrical and Electronics Engineers (IEEE) – World’s largest, 300,000 members in 160 countries – 4m publications since 1884, 3.2m past 20 years alone

1995 1997 1999 2001 2003 2005 2007 2009 2011 2013 2015

Circuits

5%

10%

15%

20%

25%

30%

Communications

Sensors

% o

f A

ll P

ub

lica

tio

ns

MEMS Advantages: Integration, Miniaturization, & Batch Fabrication

Make IC or MEMS affordable even with a $2B cleanroom

3,140 dies per wafer

25 wafer per batch

78,500 per batch

(a) 20 cm

(b)

3.75 mm

(c)

0.7 mm

(d)

Professor William C. Tang 3

Source: galleryhip.com

Self-limiting etches

Boron-doped Si membrane

{111}

<100> Slanted {111} Vertical {111}

<110>

Anisotropic Wet Etching of Silicon {100}

{111}

{111}

Backside Mask

Frontside Mask

54.74°

Boron-doped Si membrane

Slanted {111}

109.5°

70.5°

Top View

Professor William C. Tang 4

Surface Micromachining

Deposit & pattern poly

Poly-Si

Si substrate

Sacrificial etch

Cantilever Anchor

Si substrate

Deposit & pattern oxide

Oxide

Si substrate

10 µm

Professor William C. Tang 5

1 µm

Deposit Polymer

Polymer(nCF2)

nCFx+

F

Etch

Mask

Silicon

SFx+

Etch

F SFx

+

20 µm

Trenches - Surface Technology Systems

Spring - Klaassen, et al, 1995

Deep Reactive Ion Etching (DRIE)

Professor William C. Tang 6

Source: N. Maluf

Digital Micromirror Device (DMD) Pixel Size: 16 µm 16 µm Switching Time: < 2 ms

1987 – Invented by L. Hornbeck, TI 2004 – #1 MEMS supplier, 40m DLP shipped to-date 2014 – DLP Cinema in 118,000 theater worldwide,

10m moviegoers per day Other applications – medical, auto, mobile, etc.

TI Digital Light Processor®

Professor William C. Tang 7

Source: TI.com

Accelerometer – the Beginning

Professor William C. Tang 8

Displacement sensing (ADXL50)

F m = M a

x

F d = cv Frame

F = kx k Proof mass

Analog Devices ADXL-50: surface-micromachined, integrated BiCMOS

2µm-thick low-stress polysilicon structural layer Integrated BiCMOS capacitive position feedback zeroing BW = 0 Hz to 1.3 KHz; 19 mV/g; +/-50 g full-scale; 6.6mg/Hz noise Overall power consumption = 50mW @ 5V supply

Accelerometer – State-of-Research

Professor William C. Tang 9

Zhao, et al, “A Sub-µg bias-instability MEMS oscillating accelerometer with an ultra-low-noise read-out circuit in CMOS,” IEEE J. Solid-State Circ., Vol. 50, No. 9, 2015, pp. 2113 – 2126.

60µm-thick SOI structural layer Double-ended tuning fork (DETF) differential resonant stress sensors Continuous-time transimpedance amplifier (TIA) on separate CMOS BW = 0.5 Hz to 350 KHz; 140 Hz/g; +/-20 g full-scale; 2µg/Hz noise Overall power consumption = 3.5mW @ 1.5V supply

Compared to ADXL50 – 270X BW; 3,300X lower noise; 7% of the power; FM output

(111)

R1

R3

Bulk Micromachined Pressure Sensor

Bondpad (100) Si diaphragm

P-type diffused piezoresistor

n-type epitaxial layer

Metal conductors

p-type substrate & frame

Anodically bonded Pyrex substrate

Etched cavity

Backside port

(111)

R2 R1

R3

R2 R1

R4 R3

Vbridge

Vout

Deposit insulator

Diffuse piezoresistors

Deposit & pattern metal

Anisotropic etch of backside cavity

Anodic bonding of glass

Professor William C. Tang 10

Source: N. Maluf

Professor William C. Tang 11

Automotive Sensor Applications

Transmission input speed

sensor

Transmission output speed

sensor

Transmission shift position

sensor

Turbo boost sensor

Coolant temperature

sensor

Crankshaft position sensor

Oil temperature sensor

Camshaft position sensor

Transmission temperature

sensor

EGR pressure feedback sensor

Coolant level sensor

Mass air flow sensor

Oxygen sensor

Air cleaner temperature sensor

Manifold absolute pressure sensor

Brake fluid level

sensor

Washer fluid level

sensor

Throttle position sensor

EGR pressure feedback

sensor

EGR Valve position sensor

Knock Sensor

Vehicle height sensor

ABS wheel speed sensor

Accelerator pedal position

sensor

Rear wheel level sensor

Tail light outage sensor

Vehicle speed sensor

Acceleration sensor

Heater core temperature sensor

Air temperature sensor

Ambient air temperature sensor

Barometric pressure sensor

Steering rate sensor

Picture: carcabin

Professor William C. Tang 12

Automotive Sensor Applications

Knock Sensor

Manifold absolute pressure sensor

EGR Valve position sensor

Tail light outage sensor

Steering rate sensor

Rear wheel level sensor

Air temperature sensor

Vehicle height sensor

ABS wheel speed sensor

Washer fluid level

sensor

Brake fluid level

sensor

Acceleration sensor

Turbo boost sensor

Transmission output speed

sensor

EGR pressure feedback sensor

Coolant temperature

sensor

Vehicle speed sensor

Camshaft position sensor

Transmission shift position

sensor

Transmission temperature

sensor

Oxygen sensor

Coolant level sensor

Oil temperature sensor

Transmission input speed

sensor

Mass air flow sensor

Air cleaner temperature sensor

Barometric pressure sensor

Throttle position sensor

Ambient air temperature sensor

Heater core temperature sensor

Crankshaft position sensor

EGR pressure feedback

sensor

Accelerator pedal position

sensor

Picture: carcabin

0.

10.

20.

30.

40.

50.

60.

70.

80.

90.

100.

2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015

World Annual Production (million) Cars Commercial vehicles

High volume ~ 90m per year Ultra-rugged High-reliability > 10 years

Statistics: statista.com

Smart Phone Sensor Applications

Professor William C. Tang 13

Picture: ifixit

Light sensor

Proximity sensor

Finger print sensor

Microphones

Accelerometers and triaxial gyroscopes

Barometer

Smart Phone Sensor Applications

Professor William C. Tang 14

Picture: ifixit

Light sensor

Proximity sensor

Finger print sensor

Microphones

Accelerometers and triaxial gyroscopes

Barometer

Very high volume ~ 1.5b per year Ultra-miniaturized Mid-reliability ~ 3 years

Source: kingdomtelco

Professor William C. Tang 15

Biomedical Applications

Annual world healthcare market: $2 trillion $100 billion for medical instruments

$300 billion for pharmaceuticals

$1 billion FDA approval per drug

Annual cost: $3,000 per person

Drive to decentralized medical care Minimize expensive in-patient care

Minimize time consuming lab tests

Shift Point-of-Care (POC) to home by Miniaturizing and lowering costs of

medical instruments

Real-time health monitoring

Automated reliable therapeutic administrations Source: Forbes

Life Expectancy at Birth, 2012

Professor William C. Tang 16

<50

50-59

60-69

70-79

80-87

No data

N/A

Per-Capita Health Expenditure, 2013

Professor William C. Tang 17

25

26-50

51-100

101-300

301-1,000

No data

N/A

1,001-5,000

>5,000

Health Care Costs vs. Age

Professor William C. Tang 18

0

0.5

1

1.5

2

2.5

3

0 10 20 30 40 50 60 70

2002 - Male 2002 - Female 2010 - Male 2010 - Female

Source: Health Care Cost Institute Independent Report June 2013 Median age population data: US Census Bureau

Year Median Age (Population)

2010 37.2 (309m)

2000 35.3 (282m)

1990 32.9 (250m)

US

$1,0

00

Source: diehardbrain

Leading Cause of Deaths

Professor William C. Tang 19

0 100,000 200,000 300,000 400,000 500,000 600,000 700,000

Heart disease: 611,105

Cancer: 584,881

Chronic lower respiratory diseases: 149,205

Accidents (unintentional injuries): 130,557

Stroke (cerebrovascular diseases): 128,978

Alzheimer's disease: 84,767

Diabetes: 75,578

Death in US (2013)

Source: Center for Disease Control and Prevention

Source: USNews

Source: mymodernmed.com

Professor William C. Tang 20

Application That Need Better Tools

Drug Delivery

Monitoring

Prosthesis

Bio-analyses

Minimally Invasive Surgery

Patches, external and implantable pumps, smart pills

Point-of-care testing, pressure sensing, whole blood analysis

Polymerase chain reaction, genetic tests, electrophoresis, microfluidics

Cochlear implants, retinal implants, neural implants

Cutting tools, smart endoscopes

Professor William C. Tang 21

In-vitro vs. in-vivo Sensors

In-Vitro

Include clinical chemistry, blood gas/electrolytes, hematology/flow cytometry, coagulation, DNA tests, microbiology, diabetes, urinalysis, and histology/cytology

In-vivo

Include sensing for blood pH, CO2, O2, glucose, acceleration, mechanical stress, drug delivery, cochlear implants, retinal implants, and neural implants

Protein detection on paper substrate (KAIST, 2015)

Biostamps body monitors (UIUC, MC10, 2015)

Professor William C. Tang 22

DNA Testing

Fastest growing in vitro market segment Far more sensitive than immunoassays or culture

Cancer research Characterization of tumors on a genomic scale

Reliable diagnosis and effective treatment of cancer

Immunology Study of host genomic responses to infections

Individualized therapy Identify genetic predisposition, individual immune

responses, SNP mapping –> personalized drug therapy

Professor William C. Tang 23

POC Blood Analyses: Abbott i-STAT

Chem/electrolytes: Na, K, Cl, TCO2, Anion Gap, iCa, glucose, Urea nitrogen, Crea, Lactate;

Hematology: Hematocrit, Hemoglobin;

Blood gases: pH, pCO2, HCO3, sO2,

Coagulation: ACT Kaolin, ACT Celite, PT/INR

Endocrinology: β-hCG,

Cardiac Markers: cTnl, CK-MB, BNP

Source: abbottpointofcare.com

Source: turbosquid.com

Professor William C. Tang 24

Polymer BioMEMS Fabrication

Source: Physics Today, June 2001.

Photomask = transparency film with pattern printed at high resolution (5000 DPI or better)

Photoresist or Su-8 can be used to create “master” or “mold.”

PDMS = poly(dimethylsiloxane), poured over mold.

Fluid inlets/reservoirs drilled into the PDMS.

Flat surface = glass, silicon, PDMS, or plastic.

Printed Circuit Board Microfluidics

Professor William C. Tang 25

PCB microfluidics for lysing and isotachophoresis

[M. Bachman, GP Li, Integrated Nanosystems Research Facility, UC Irvine]

Nucleic Acid Detection in Droplets

Professor William C. Tang 26

• Use super-paramagnetic particles (SSP) as substrate for DNA attachment.

• Provide force to move droplets. • Chips primed with buffer droplets for

• Cell lysis • DNA extraction • Purification • Amplification

[J. Wang, Johns Hopkins University, Micro/Nano Fluidics Fundamental Focus Center, UC Irvine]

Paper-Based Microfluidics

Professor William C. Tang 27

• Less than 1c per assay; sample-to-answer in minutes; truly disposable.

• Light weight, multifunction, easy to manufacture, low power.

• Fundamental: thermodynamics of biochemical reactions in different paper types.

[G. Whitesides, Harvard University, Micro/Nano Fluidics Fundamental Focus Center, UC Irvine]

0 ppb

100 ppb

500 ppb

10 ppm

20 ppm

50 ppm

Reagent “printed” at the tip

Functions of Neural Implants

Extract motor intentions For controlling prosthetic arms, hands, legs

For controlling machines

For controlling computers

Elicit sensations Touch from prosthetic fingerstactile sensors

Vision from camera

Sound from microphone

Suppress unwanted movements E.g., essential tremor, Parkinson, high blood pressure

Suppress unwanted sensations E.g., hunger, pain

Professor William C. Tang 28

Source: goshenschoolny.org

Professor William C. Tang 29

Cochlear Implants

Battery Compartment

Processor Module

Headpiece

In-the-ear microphone

28 mm x 56 mm flexible silicone x 5.5 mm

Receiver/transmitter coil: 3-turn gold wire with platinum

helix shielding

Spinal Cord Stimulation

Professor William C. Tang 30

Source: St. Jude Medical

Deep Brain Stimulation

For example: Medtronic DBS Therapy: Essential tremor

Parkinson’s disease

Dystonia (not demonstrated yet)

Obsessive-compulsive disorder (not demonstrated yet)

Professor William C. Tang 31

Source: Medtronic

Conclusions

MEMS sensor technology development driven by

Low-cost, high-volume needs for consumer products

Mid- to-low-cost, medium-to-high-volume applications for healthcare industries

Relevance to megatrends (EY Global 2015)

Digital future

IoT sensor nodes

Health reimagined

POC

Wearable sensors

Micro-implants

Professor William C. Tang 32