michael shur and asif khan - ecse @ rensselaer technology michael shur 1 and asif khan 2 ......
TRANSCRIPT
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GaN Technology
Michael Shur 1 and Asif Khan 21 Rensselaer Polytechnic Institute, Troy, USA
http://nina.ecse.rpi.edu/shur/2 Department of EE, USC, SC 12110, USA
UV LED growth, Courtesy of SET, Inc.
2http://nina.ecse.rpi.edu/shur/
Outline• Nitride materials system• Materials growth• Device fabrication• Nitride based electronics• Nitride-based LEDs• To explore further
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AlInGaN Materials System
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
1
2
3
4
5
6
7
o
InN
GaN
AlN
6H- S
iC
ZnO
sapp
hir e
(O s
u bla
tt ice
)
Ban
d G
ap E
nerg
y (e
V)
Lattice Constant a (A)
Old valuefor InN
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Nitride Advantages for Electronic Devices
Properties Advantages•High mobility•High saturation velocity•High sheet carrier concentration•High breakdown field
High power
Heat handling capability•Decent thermal conductivity•Growth on SiC substrate
•Chemical inertness•Good ohmic contacts•No micropipes
Reliability
InsulatedGate
•SiO2/AlGaN and SiO2/GaN good quality interfaces
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Figure of Meritfor high frequency/high power
CFOM =χε oµvsEB
2
χε oµvs EB2( )silicon
0
200
400
Si GaAs 6H-SiC
4H-SiC GaN
Com
bine
d Fi
gure
of M
erit
χ is thermal conductivityEB is breakdown fieldµ is low field mobilityvs is saturation velocityεo is dielectric constant
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SEMICONDUCTOR MATERIALS SYSTEMS FOR LIGHT EMITTERS
InSbInAsGeGaSbSiInPGaAsCdTeAlSbCdSeInNAlAsZnTeGaPSiC(3C)CdOAlPCdSZnSeSiC(6H)SiC(4H)ZnOGaNZnSCAlN
0 1 2 3 4 5 6 7
Wavelength (nm)2000 800 600 500 400 300 200
Band Gap Energy (eV)
1E-5
1E-4
1E-3
0.01
0.1
1
Rel
ativ
e E
y e S
e nsi
tivity
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Energy gaps of nitrides compared with spectral sensitivity
of human eye
InN
GaN
AlN
0 1 2 3 4 5 6 7Energy Gap (eV)
Wavelength (?m)12 0.20.5 0.30.40.8
Rel
ativ
e ey
e re
spon
se
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Problems to Solve
• Aging• Substrates• Current slump• Cost• Yield• Manufacturability
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Basic parameters of InN, GaN, and AlN at 300 K
Parameter Units GaN AlN InN Lattice constant, c Ǻ 5.186 4.982 5.693 Lattice constant, a Ǻ 3.189 3.112 3.533
Band gap energy, gE eV 3.339a 6.2 1.97
Effective electron mass, em 0m 0.19b (||) 0.17b (⊥ )
0.33c (||) 0.25c (⊥ )
0.11b (||) 0.10b (⊥ )
Effective heavy hole mass, hhm 0m 1.76c (||) 1.61c (⊥ )
3.53 c (||) 10.42 c (⊥ )
1.56b (||) 1.68b (⊥ )
Effective light hole mass, lhm 0m 1.76c (||) 0.14c (⊥ )
3.53 c (||) 0.24c (⊥ )
1.56b (||) 0.11b (⊥ )
Piezoelectric constant, e31 C/m2 -0.33 -0.48 -0.57 Piezoelectric constant, e33 C/m2 0.65 1.55 0.97
Spontaneous polarization, ||P d C/m2 -0.029 -0.081 -0.032
Radiative recombination coefficiente
cm3/s 4.7×10-11 1.8×10-11 5.2×10-11
Refraction index at 555 nm 2.4 2.1 2.8 Absorption coefficient at the
photon energy gEh ≈ν 105 cm-1 1 3 0.4
From M. E. Levinshtein, S. L. Rumyantsev, and M. S. Shur, Editors, “Properties of Advanced Semiconductor Materials: GaN, AlN, InN, BN, and SiGe“, John Wiley and Sons, ISBN 0-471-35827-4, New York (2001)
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Nitrides: Hetero epitaxy and homoepitaxy
• Substrates• MOCVD• MBE• PALE• HVPE • Strain energy band engineering
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Substrates for III-Nitride Epi
Substrate Lattice constant (Angstroms)
Thermal Conductivity W/cm-K
Thermal expansion coefficient (10-6 1/K)
GaN a = 3.189 c = 5.185
1.3 5.59 3.17
AlN a = 3.112 c = 4.982
3.2 4.2 5.3
6H SiC a = 3.08 c = 15.12
3.6 - 4.9 4.2 4.68
4H-SiC a = 3.073 c = 10.053
3.7
Sapphire a = 3.252 c = 5.213
0.5 7.5 8.5
Si a = 5.4301 1.5 3.59 GaAs a = 5.6533 0.5 6
LiGaO2, ZnO
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Substrate ComparisonSubstrate Comparison
Sapphire: poor crystal structure match, large thermal expansion mismatch, poor thermal conductivity.SiC has high thermal conductivity and close lattice match in the c-plane.
But, also has: a different c-axis, relatively large thermal expansion mismatch and chemical mismatch at the interface.
GaN and AlN bulk crystals have the same crystal structure, the same crystal structure, excellent chemical match, high thermal conductivity, and the excellent chemical match, high thermal conductivity, and the same thermal expansionsame thermal expansion but are difficult to produce presently(will this change?).LEO and HVPE GaN films allow fabrication of “quasi-bulk” substrates. Temporary solution until bulk substrates become available?
From MRS Fall 2000 tutorial by M. S. Shur and L. J. Schowalter
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Bulk GaN and AlN substrates have become available!
• North Coast Crystals, Inc.: Commercial Scale Production of Bulk, Polycrystalline Group III Nitrides
• Sanders, bulk nitrides (ATP)• High Pressure Research Center in Warsaw• Bulk GaN and AlN at TDI, Inc.• Sakai: Combining the ELO technology on MOVPE templates, thick GaN layers (up
to 500µm ) Samsung• Sumimoto (GaN)• Crystal IS (AlN)• NCSU (AlN)• Kansas State: sublimation (AlN)
When large area high quality AlN and GaN will become available?Which devices will emerge to take advantages of bulk substrates?
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1x104
2x104
3x104
4x104
5x104
6x104
1 10 1000
2
4
6
8
10
12
14
16
18
20
22
24
Al0.13Ga0.87N : 20 nm
n-type GaN : 1 µm
Mg-doped GaN crystal
150 µm
(a)
Hal
l mob
ility
µH(c
m2 /V
s)
630 µm
10 µm
110 µm
150 µm
(b)
This work GaN/saphir [4] GaN/6H-SiC [3]
carr
ier
dens
ity n
H*1
012 (
cm-2
)
Temperature (K)
E. Frayssinet, W. Knap, P. Lorenzini, N. Grandjean, J. Massies, C. Skierbiszewski, T. Suski, I. Grzegory, S. Porowski, G. Simin, X. Hu, M.Asif Khap, M. Shur, R. Gaska, and D. Maude, Applied Physics Letters, October 16, 2000; R. Gaska, J. W. Yang, A. Osinsky, Q. Chen,M. Asif Khan, A. O. Orlov, G. L. Snider, M. S. Shur, Appl. Phys. Lett., Feb. 1999
> 60,000 cm2/V-s at low T
High 2DEG mobility for homoepitaxial GaN
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GaN-based HFETs on bulk GaN substrates
Vds= +10V
0
20
40
60
80
100
120
140
160
-10 -8 -6 -4 -2 0 2
Vgs(V)
g m(m
S/m
m)
SiCbulk GaNSapphire
From M. Asif Khan and J. W. Yang, W. Knap, E. Frayssinet, X. Hu and G. Simin, P. Prystawko, M. Leszczynski, I. Grzegory, S. Porowski, R. Gaska, M. S. Shur, B. Beaumont, M. Teisseire, and G. Neu, GaN-AlGaN Heterostructure Field Effect Transistors Over Bulk GaN Substrates, Appl. Phys. Lett. 76, No. 25, pp. 3807, 3809, 19 June (2000)
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GaN-based HFETs on bulk AlN substrates
0 2 4 6 8 10 120.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
-14.0
-12.0
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
VG=-4, -5V
VG=-2VVG=-3V
VG=0V, 1V
VG=-4VVG=-3V
VG=-2V
VG=-1V
VG=0V
Dra
in C
urre
nt
I D
(A/m
m)
Drain Bias VDS
(V)
Gat
e Le
akag
e C
urre
nt (µA
/mm
)
X. Hu, J. Deng, N. Pala, R. Gaska, M. S. Shur, C. Q. Chen, J. Yang, S. Simin, and A. Khan, C. Rojo, L. Schowalter, AlGaN/GaN Heterostructure Field Effect Transistor on Single Crystal Bulk AlN, submitted to APL
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LEO (Lateral Epitaxial Overgrowth) material
Defect free GaN
SiO2(for defect blocking)
Dislocated material
Dislocation density 109 - 1010 cm-2 for regular material104 - 107 for the LEO material
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Nitrides, SiC, SiO2
• Solid-state solutions and hetero-structures based on AlN/SiC/-InN/GaN have been demonstrated.
• GaN devices on SiC substrates demonstrated superior performance
• GaN devices on Si have been demonstrated• SiO2 forms excellent interface with AlGaN*
*M. A. Khan, X. Hu, G. Simin, A. Lunev, R. Gaska and M. S. Shur, Novel AlGaN/GaN Metal-Oxide-Semiconductor Field Effect Transistor, IEEE Electron Device Letters, vo. 21, No. 2, pp. 63-65, February, 2000
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Epitaxial films
• MOCVD– Lateral Epitaxial Overgrowth
• MBE• Hydride VPE
Gallium transport by chloride formation2HCl(g) + 2Ga(l)->2GaCl(g) +H2(g) T = 800 oCReaction with chloride formationGaCl(g) + NH3(g)->GaN(s) + HCl(g)+ H2(g) T = 700 oC
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Nichia Two-Flow MOCVD Process for High Quality Epitaxial GaN
N2 + H2
Heater
Conical Quartz Tube IR radiation thermometer
StainlessSteel Chamber
N2 + NH3 + TMG
Substrate
Vacuum exhaust
After NakamuraRotating Susceptor
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MOCVD
MOCVD reactor
Process exhaust
N2
H2
TMGa TMAl TMIn Cp2Mg
PH3 DETe/H2
3-way valve
Mass flow controller
Pressure controller
Bubbler bypass valve
Run/Vent valve
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Molecular Beam Epitaxy
RHEED screenMagnets
Electron Cyclotron Resonance Cracker
Solid source
Pyrometer
N2
After Morkoc et al., J. Appl. Phys. 76 (3), p. 1363 (1991)
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Pulsed Atomic Layer Epitaxy
0 1 0 2 0 3 0 4 0 5 0 6 0 7 0
- 3 . 0
- 2 . 5
- 2 . 0
- 1 . 5
- 1 . 0
- 0 . 5
0 . 0
0 . 5
1 . 0
1 . 5
2 . 0
2 . 5
T M G
T M I
N H 3
T M A
T i m e ( s e c o n d ) 0 1 0 2 0 3 0 4 0 5 0 6 0 7 0
- 3 . 0
- 2 . 5
- 2 . 0
- 1 . 5
- 1 . 0
- 0 . 5
0 . 0
0 . 5
1 . 0
1 . 5
2 . 0
2 . 5
T M G
T M I
N H 3
T M A
T i m e ( s e c o n d )
150 repeats
GaN
Al2O3
AlInGaN (2,2,1)150
GaN
Al2O3
AlInGaN (2,2,1)150
Khan et. al. “Lattice and Energy Band Engineering in AlInGaN/GaN Heterostructure “ Appl. Phys. Lett 76, (2000) 1161.
Zhang et. al. “Pulsed atomic Layer Epitaxy of Quaternary AlInGaN Layers”Appl. Phys. Lett. 79, (2001) 925.
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MOCVD AlN vs PALE AlN
sapphire
HT-Al0.2Ga0.8 N 0.2 µm
n+-Al0.2Ga0.8 N 2 µm
AlN/AlGaN SL
sapphire
PALE-AlN 0.3 µm
n+-Al0.2Ga0.8 N 2 µm
AlN/AlGaN SL
NH3
TMA
t
Conventional MOCVD
on
on
MOCVD AlN
t
TMA
NH3
PALE
on
offonoff
PALE AlN
J. P. Zhang, et.al, accepted for publication in Appl. Phys. Lett,
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XRD study of MOCVD & PALE AlN
-1000 -500 0 500 1000
102
103
104
105
PALE
MOCVD
FWHM=60 arcsec=824 arcsec
Cou
nts
ω (arcsec)
experiment
simulation
PALE AlN
J. P. Zhang, et.al, accepted for publication in Appl. Phys. Lett,
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STRAIN ENERGY BAND ENGINEERING QUATERNARY ALLOYS
In = 0%In = 2%
In = 4%
In = 8%∆a/a
%
Al fraction, %-1.5
-1
-0.5
0
0.5
1
0 20 40 60∆a/
a %
∆Eg = 0.25 eV∆Eg = 0.45 eV∆Eg = 0.86 eV
In=0%
In=8%
In=4%In=2%
In = 0%In = 2%
In = 4%
In = 8%∆a/a
%
Al fraction, %-1.5
-1
-0.5
0
0.5
1
0 20 40 60∆a/
a %
∆Eg = 0.25 eV∆Eg = 0.45 eV∆Eg = 0.86 eV
Al fraction, %-1.5
-1
-0.5
0
0.5
1
0 20 40 60∆a/
a %
∆Eg = 0.25 eV∆Eg = 0.45 eV∆Eg = 0.86 eV
In=0%
In=8%
In=4%In=2%
• Independent control of band- offset and Lattice Mismatch• Quantification of bulk, piezo, spontaneous polarization doping contributions
i-GaN
AlxInyGa 1-x-y N
AlN
SiC
n-GaN
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SIMS and X-ray(Al- alloy composition 12%)
i-GaN
AlInxGaN
AlNSiC
n-GaN
125 126 127 128 1292 θ
In fl
ow =
75
ccm
125 126 127 128 129
(d)
(c)
In fl
ow =
50
ccm
125 126 127 128 129
(b)
In fl
ow =
25
ccm
125 126 127 128 129
(a)
In fl
ow =
0
GaN AlInGaN
X-ray (0006) peaks
In=0%
In=2%
In=1.5%
In=0.75%
Al0.10 In0.06Ga 0.84N
Electron microprobe analysis agrees with SIMS
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PL and lattice constant• Lattice mismatch and band-offset vs. In- composition
ROOM TEMPERATURE PHOTOLUMINESCENCE
3.2 3.4 3.6 3.8
0.0
0.2
0.4
0.6
0.8
1.0
4
3
2
1
GaN
hνexc = 4.66 eVT = 300 K
Nor
mal
ized
PL
Inte
nsity
Photon Energy (eV)
0
.75
1.5
2
In%
0.0 0.5 1.0 1.5 2.00.10
0.15
0.20
0.25
0.30
Al - 9 %
∆Eg (
eV)
∆c (A
ngst
rom
s)
In Molar Fraction (%)
0.00
0.01
0.02
0.03
Al=12%
calculated
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SURFACE AND INTERFACE QUALITYRMS versus IN
TEM AFM
0
1
2
3
4
5
6
7
8
0 0.5 1 1.5 2 2.5
In composition, %
RM
roug
hnes
s, A
(Al- alloy composition 12%)
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Epitaxial Wafer
Wafer Cleaning
Typical Process Flow in GaN device fabrication
Lithography
AnnealingDielectric Deposition
Probe Contact Metallization
Mesa Etching
LithographyMetallization
multiple
Lithography
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UNCLEANEDSAMPLE
CLEANEDSAMPLE
Process Flow
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Etching
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Metallization
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Surface passivation
To dicing /packaging or on-wafer testing
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Ti/Al/Ti/Au Ohmic Contacts to n-AlInGaN
0
10
20
30
40
50
-10 0 10 20 30d(µm)
R(o
hm)
AlGaN 1x10-5 ohm-cm2
AlInGaN 5x10-6 ohm-cm2
After M. Asif Khan, M. S. Shur, and R. Gaska, Strain Energy Band Engineering in AlGaInN/GaN Heterostructure Field Effect Transistors, presented at GaAs-99 Proceedings, October 4, 1999
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Pd/Au Ohmic Contacts top-type GaN
•Pd (5 nm)/Au (10 nm) pads deposited with e-beam. •This thickness results in nearly 70% transparency for visible wavelengths•A 30 second RTA anneal at 400° C in an oxygen ambient •Contact resistance 1 x 10-4 Ωcm-2 at 300 K • 1.5 x 10-6Ωcm2 (at 550 K).
After A. Lunev, Vinamra Chaturvedi, Ashay Chitnis, Grigory Simin, Jinwei Yang and M. Asif KhanR. Gaska, and M. S. Shur, Low-Resistivity Pd/Au Ohmic Contacts to p-GaN for Heterostructure Bipolar Transistors and Light
Emitting Diodes, ICSRM-99, October 10-15, 1999
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GaN-based Schottky Barriers
0.5
1
1.5
Bar
rier
heig
ht (
eV)
-2 -1 0 1
Xm – XGaN (eV)
After T. U. Kampen and W. Mönch, Metal Contacts on GaN, MIJ-NRS, Vol. 1, Article 4, 12/20 (1997)
Gallium Nitride Schottky Barrier Diode Operated to 500°C( Furukawa Electric )
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GaN-based p-n junctions
Ohmic contacts
Light
n G a N
p - G a N
-
Ohmic contacts
Light
p
n - G a N
-
Sapphire Sapphire
G a N
After Q. Chen, M. A. Khan, C. G. Sun, and J. W. Yang, Electronics Letters, 31, p. 1781 (1995)
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GaN p-n junctions on SiC substratesPt contact
p-type GaNAl contact
N-type GaNBuffer layerSiC substrate
See V. Dmitriev, MRS Internet J. Nitride Semicond. Res. 1, 29(1996).
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GaN p-n junctions on LEO material
P = 1018 cm-3 N = 5x1016 cm-3
S=2x20 µm
Reverse leakage current 9x 10-7 A/cm-2 in the LEO GaNReverse leakage current 9x 10-4 A/cm-2 in the non-LEO GaN(After P. Kozodoy et al. Appl. Phys. Lett. 73(7), 975 (1998)
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Band diagrams of FETs below threshold
Source Drain
Distance
Con
duct
ion
band
edg
e
Source Drain
Distance
Con
duct
ion
band
edg
e
Source Drain
Distance
Con
duct
ion
band
edg
e
Source Drain
Distance
Con
duct
ion
band
edg
e
Si GaAs
SiC GaN
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Doped Channel GaN-based FET Operation at 750 oC
50 1 0
D ra in -s o u rc e vo l t a g e (V)
Dra
in C
urr
en
t (m
A/m
m)
1 0 0
20 0
0
W = 5 0 µ m L = 0 . 2 5 µ m
T = 7 5 0 o C
- 2 V- 3 V
2 V
1 V
0 V
- 1 V
After M. Kamp, GaN workshop continues the substrate search, III-Vs Review, Vol. 11, No 6, pp. 42-44 (1998)
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Device Applications. Reported state-of-art performance
of III-N HFETsRF-power levels : 5...11 W/mm
Peak drain current : 1...1.5 A/mm
I-SiC/Sapphire
Pd/Ag/Au
GaN
AlN
Pd/Ag/AuAlGaN
S G D
Critical issues with III-N HFETs
Gate leakage current: 10-3-10-5 A/mm
Current collapse (RF performance degradation)
Long term stability and parameter drift
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Current collapse in AlGaN/GaN HFETs:Pulsed measurements of “return current”
0
10
20
30
40
50
60
-10 -8 -6 -4 -2
Idc(VG= 0)
VG(t)
Id (return @ VG= 0)
VG= 0
Id (VG)
Current collapse
VG
A. Tarakji, G. Simin, N. Ilinskaya, X. Hu, A. Kumar, A. Koudymov, J. Zhang, and M. Asif Khan, M.S. Shur and R. Gaska, Appl. Phys. Lett., 78, N 15, pp. 2169-2171 (2001)
G. Simin, A. Koudymov, A. Tarakji , X. Hu, J. Yang and M. Asif Khan, M. S. Shur and R. Gaska APL October 15 2001
“Return” current
Current collapse
TimeVT
IDS
Time
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HFET, MOSHFET, and MISHFET
-14 -12 -10 -8 -6 -4 -2 0 21x10-16
1x10-14
1x10-12
1x10-10
1x10-8
1x10-6
1x10-4
HFET
MOSHFET
MISHFET
Gat
e cu
rrent
, A
Gate voltage, V
MOSHFET - SiO2 (ε = 3.9, 100 A) MISHFET - Si3N4 (ε = 7.5,100 A)
-15 -10 -5 0
0
100
200
300
400
500
600
HFET
MISHFE
T
MOSHFET
Dra
in c
urre
nt, m
A/m
m
Gate voltage, V
I-SiC
Pd/Ag/Au
GaN
AlN
Pd/Ag/Au
AlInGaN S G D
Si3N4
X. Hu, A. Koudymov, G. Simin, J. Yang, M. Asif Khan, A. Tarakji, M. S. Shur and R. GaskaAppl. Phys. Lett, v.79, p.2832-2834 (2001)
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MOSHFET (SiO2 )
I-SiC
Pd/Ag/AuGaN AlN
Pd/Ag/AuAlInGaN
S G D
SiO2
MISHFET Si3N4I-SiC
Pd/Ag/AuGaN AlN
Pd/Ag/AuAlInGaN
S G D
Si3N4
Resolving the issues: AlGaInN, gate dielectrics, InGaN channel
Reducing the gate leakage current (104 - 106 times)
AlGaN/ InGaN GaN DHFET
I-SiC
Pd/Ag/AuGaN AlN
InGaN AlInGaN
S G DSi3N4 /SiO2
I-SiC
Pd/Ag/AuGaN AlN
InGaN AlInGaN
S G D
Combining the advantagesReducing current collapse, Improving carrier confinement
MISDHFET
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AlInGaN/InGaN/GaN DHFET concept: improved carrier confinement
and strain management
0 100 200 300 400-1
0
1
2
3
4
5
Ec
n
AlGaN/InGaN/GaN DHFET
Ec,
eV
Distance, A
VG:
0 -2.5 -5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
10-2
0 n, c
m -3
0 100 200 300 400-1
0
1
2
3
4
5
Ec
n
AlGaN/GaN HFET
E c, eV
Distance, A
VG: 0 -2.5 -5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
10-2
0 n, c
m -3
I-SiC
Pd/Ag/Au
GaN
AlN
InGaN (x=0.1, 50 A) AlInGaN (x=0.25, 250 A)
S G D
• Better 2DEG confinement• Constant field in the QW region• Strain compensation
G. Simin et.al. AlGaN/InGaN/GaN Double Heterostructure Field-Effect TransistorJpn. J. Appl. Phys. Vol.40 No.11A pp.L1142 - L1144 (2001)
49http://nina.ecse.rpi.edu/shur/
0 2 4 6 8 10 12 140.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
VG=-8 V
VG=-6 V
VG=-4 V
VG=-2 V
VG=0 V
Cur
rent
, A/m
m
Drain Voltage, V
-16 -14 -12 -10 -8 -6 -4 -2 0 21E-3
0.01
0.1
1
Id(A
/mm
)
vg(V)
HFET DHFET
1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 00 .0 1
0 .1
1
Inte
nsity
, a.u
.
G a
1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 00 .0 1
0 .1
1
Inte
nsity
, a.u
.
N
1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 00 .0 1
0 .1
1
Inte
nsity
, a.u
.
D i A
A l
1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 00 .0 1
0 .1
1
Inte
nsity
, a.u
.
D is ta n c e , A
In
AlInGaN-InGaN-GaN DHFET characteristics
SIMS profiles
50http://nina.ecse.rpi.edu/shur/
AlGaN-InGaN-GaN DHFET: Carrier confinement and current collapse reduction
-7 -6 -5 -4 -3 -2 -1 0 1 2
0.0
0.2
0.4
0.6
0.8
1.0
200OC150OC100OC
50OC25OC
200OC150OC100OC50OC25OC
Pulsed tra
nsfer c
urves
Pulsed "return" currents
Pul
sed
drai
n cu
rrent
, A/m
m
Gate pulse amplitude, V
> 1018cm-3
> 1016cm-3
> 1014cm-3
< 1014cm-3
> 1018cm-3
> 1016cm-3
> 1014cm-3
< 1014cm-3
> 1018cm-3
> 1016cm-3
> 1014cm-3
< 1014cm-3
HFE
T
> 1018cm-3
> 1016cm-3
> 1014cm-3
< 1014cm-3
> 1018cm-3
> 1016cm-3
> 1014cm-3
< 1014cm-3
> 1018cm-3
> 1016cm-3
> 1014cm-3
< 1014cm-3
DH
FET
-10 -5 0 5 10 15 20 25 300
5
10
15
20
25
30
35
~ 4
dB
G ain
Pulsed (VD S = 30 V)
CW (VD S = 25 V) Pout
6.3 W /m m
Pou
t, dbm
; Gai
n, d
B
P in, dbm
51http://nina.ecse.rpi.edu/shur/
Si3N4 /AlGaN/InGaN/GaN MISDHFETDC & RF characteristics
I-SiC
Pd/Ag/AuGaN AlN
InGaN AlInGaN
S G DSi3N4
0 2 4 6 8 10 12 14 16 180.0
0.2
0.4
0.6
0.8
1.0
-14-12-10
-8-6-4
-2
VG= 0 V
I D, A
/mm
VDS, V-14 -12 -10 -8 -6 -4 -2 0 2 4
10-13
10-11
1x10-9
1x10-7
1x10-5
1x10-3
MISDHFET
DHFET
I G, A
VG, V• Low Gate leakage
current (as in MOS/MIS
HFETs)
• No current collapse (as
in DHFET)
• Stable DC and RF
performance (7.5 W/mm)
-5 0 5 10 15 20 25
10
15
20
25
30 7.5 W/mm(Pulsed, 2 GHz)
6.1 W/mm(CW, 2 GHz)
P out, d
Bm
Pin, dBm
0 2 4 6 8 10 12 14 160.00.51.01.52.02.53.03.54.04.55.0
MISDHFETCW @ 2GHz
Pou
t, W
/mm
TIME, hours
52http://nina.ecse.rpi.edu/shur/
Breakdown voltage and offset gate
0.80.4 1.2 1.6 2.0
200
150
100
50
0
Gate-drain distance (A)
Bre
akdo
wn
volta
ge (V
)
From R. Gaska, Q. Chen, J. Yang, A. Osinsky, M. Asif Khan, and Michael S. Shur,AlGaN/GaN Heterostructure FETs with Offset Gate Design, Electronics Letters, 33, No. 14, pp. 1255-1257, 3 July (1997)
53http://nina.ecse.rpi.edu/shur/
MOSHFET Switch
0 100 200 300 400 500 6000
5
10
15
20
- 6 V
- 3 V
0 V
+ 3 V
Vg = + 6 V
PON/OFF = 7.5 kW/mm2
R ON = 75 mOhm-mm2
Cur
rent
, A/m
m2
Drain Voltage, V
15 µm source-drain spacing
After G. Simin, X. Hu, N. Ilinskaya, A. Kumar, A. Koudymov, J. Zhang, M. Asif Khan, R. Gaska and M. S. Shur, A 7.5 kW/mm2 current switch using AlGaN/GaN Metal-Oxide-Semiconductor Heterostructure Field Effect Transistors on SiC Substrates, Electronics Letters. Vol. 36, pp. 2043 –2044, Nov. 2000
54http://nina.ecse.rpi.edu/shur/
Comparison with SiC and GaN Diodes
GaN-UF
SiC-ABBGaN-UF
SiC-Purdue
GaN-UF
SiC-NCSU
SiC-RPI
GaN-Caltech
6H-SiC
4H-SiC
GaN
AlGaN-UF
AlGaN
B r e a k d o w n V o l ta g e ( V )
Sp
ec
ific
Re
sis
tan
ce
(o
hm
-cm
2)
101 102 103 10410-4
10-3
10-2
10-1
100
MG-MOSHFET
From S. J. Pearton et al.GaN Electronics for High Power, High Temperature Applications,Interface, Vol. 9, No. 2,pp. 34-39 (2,000)
MG-MOSHFET point is from G. Simin, X. Hu, N. Ilinskaya, A. Kumar, A. Koudymov, J. Zhang, M.Asif Khan, R. Gaska and M. S. Shur, A 7.5 kW/mm2 current switch using AlGaN/GaN Metal-Oxide-Semiconductor Heterostructure Field Effect Transistors on SiC Substrates (EL-2000).
55http://nina.ecse.rpi.edu/shur/
Power devices –applications and ratings
10 100 10, 0001,0 0010 -2
10 0
10 2
10 3
10 1
10 -1D is p layd ri ve s
T e le c o m m u -ni c a tio ns
F a c to ryA u to m at io n
Mo to rCo n t ro l
L a m pB a l la s t
T ra c tio nHD V C
B lo c k in g vo l ta g e ( V )
PowerSupplies
Automotive
GaNregion
Cur
rent
(A)
MOSHFET
Data from B. J. Baliga, IEEE Trans., ED-43, p. 1717 (1996)
56http://nina.ecse.rpi.edu/shur/
GaN Microwave Detector
From J. Lu, M. S. Shur, R. Weikle, and M. I. Dyakonov, Detection of Microwave Radiation by Electronic Fluid in AlGaN/GaN High Electron Mobility Transistors, in Proceedings of Sixteenth Biennial Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits, Ithaca, New York, Aug. 4-6 (1997), pp. 211-217
57http://nina.ecse.rpi.edu/shur/
Measured Detector Responsivity
0 5 10 15 20
0
5
10
15
20(a)GaN HFET
f ( GHz )
R
( V/W
)
Measured DataCalculated (x0.25)
0.0 0.5 1.0 1.5 2.0
0
100
200
300(b)
From J. Lu, M. S. Shur, R. Weikle, and M. I. Dyakonov, Detection of Microwave Radiation by Electronic Fluid in AlGaN/GaN High Electron Mobility Transistors, in Proceedings of Sixteenth Biennial Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits, Ithaca, New York, Aug. 4-6 (1997), pp. 211-217
58http://nina.ecse.rpi.edu/shur/
Photonic Nitride Devices• Solid State Lighting• UV LEDs
59http://nina.ecse.rpi.edu/shur/
Importance of Solid State Lighting
• 21% of electric energy use in lighting• Half of this energy can be saved by
switching to solid-state lighting Projected savings from solid-state lighting $115 billion by year 2020
• Solid-state lighting expected to reach lifetimes exceeding 100,000 hours
• LEDs are the most efficient sources of colored light in visible spectral range.
• White phosphor-conversion LEDs surpassed incandescent lamps in performance
60http://nina.ecse.rpi.edu/shur/
Benefits of LED Lighting
Data from R. Haitz, F. Kish, J. Tsao, and J. NelsonInnovation in Semiconductor Illumination: Opportunities for National Impact (2000)
0
2
4
6
8
10
12
2000 2005 2010 2015 2020 2025 2030
LED Penetration(%)
Energy Savings100TWh/yrCost Savings $10B/yr
“Low Investment Model”
An improvement of luminous efficiency by 1% may save 2 billions dollars per year.
61http://nina.ecse.rpi.edu/shur/
Solid State Lighting Efficiency (lm/W)FlickersCannot be dimmedLosses in ballastNoisy
0
20
40
60
80
100
Incandescent Halogen Fluorescent White LED(2000)
White LED(2010)
2002
62http://nina.ecse.rpi.edu/shur/
Cool LED Light – saving cooling costsLight and heat percentages for lighting sources
0102030405060708090
Incandescent Fluorescent LED
LightHeat
63http://nina.ecse.rpi.edu/shur/
Schematic of band gap alignment in AlInGaN LEDs.
In0.23Ga0.77N
n-A
l 0.15
Ga 0.
85N
p-GaN
p-A
l 0.15
Ga 0.
85N
0.05 µm
n-GaN
p-GaN
o
In0.45Ga0.55N
p-Al
0.2G
a 0.8N
30 A
n-GaN
(a) (b)
(a) DH-based structure with two wide-band-gap cladding layers; radiative transitions occur between donor-acceptor pairs (after S.Nakamura et al., J. Appl. Phys. 76, 8189, 1994); (b) SQW structure with asymmetric confining layers; radiative transitions occur between quantum-confined levels of electrons and holes (after S.Nakamura et al., Jpn. J. Appl. Phys. 34, L1332, 1995)
64http://nina.ecse.rpi.edu/shur/
Nitrides for Blue, White and UV emitters
65http://nina.ecse.rpi.edu/shur/
First LED (1907)
66http://nina.ecse.rpi.edu/shur/
Emissive and Electrical Characteristics
350 400 450 500 550 600 650 700
AlInGaN SQWgreen (517nm)
AlGaAs DHred (649nm)
AlGaInP DHyellow (594nm)
AlInGaN SQW blue (465nm)
AlInGaN DHblue (427nm)
Nor
mal
ized
Inte
nsity
(arb
. uni
ts)
Wavelength (nm)From A. Zukauskas, M. S. Shur and R. Gaska, Introduction to Solid State Lighting, Wiley (2002)
67http://nina.ecse.rpi.edu/shur/
Current-voltage characteristics of AlGaAs, AlGaInP, and AlInGaN-based
high brightness LEDs
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.51E-9
1E-8
1E-7
1E-6
1E-5
1E-4
1E-3
0.01
0.1
γ =2
AlGaAs DH AlInGaP DH AlInGaN DH AlInGaN SQW
Fo
rwar
d C
urre
nt (A
)
Forward Voltage (V)From A. Zukauskas, M. S. Shur and R. Gaska, Introduction to Solid State Lighting, Wiley (2002)
68http://nina.ecse.rpi.edu/shur/
Chip structure of AlInGaN/Al2O3 LED(after S.Nakamura and G. Fasol, The Blue Laser Diode: GaN Based Light Emitters and Lasers, Springer, Berlin, 1997).
Sapphire Transparent Substrate
Ti/Al n-Electrode
n-GaN Contact Layer
Ni/Au p-Electrode
p-GaN Contact Layer
~100 µm
4 µm
0.15 µm
0.5 µm InGaN/AlGaN DH, SQW or MQW Structure
Transparent Metal (Au/Ni)
Buffer Layer
69http://nina.ecse.rpi.edu/shur/
AlInGaN/SiC LED
n-GaN Contact Layer
Ni Back Electrode
InGaN/AlGaN DH
Au Top Electrode
p-GaN Contact Layer
n-SiC Transparent Substrate
Shorting Ring
Insulating Buffer Layer
(after J.A.Edmond et al., Proc. SPIE 3002, 2, 1997).
70http://nina.ecse.rpi.edu/shur/
High power AlInGaN Flip-Chip LED
InGaN/GaN Multiple Quantum Well
Sapphire
p-GaN Contact Layer
n-GaN Contact Layer
Submount
Solder
After J. J. Wieret et al., Appl. Phys. Lett. 78, 3379, 2001.
71http://nina.ecse.rpi.edu/shur/
Shaped Chips: semi-spherical
Electroluminescent Structure
Au Coating
Antireflection Coating
Hemispherical Chip
Electroluminescent StructureElectrodes
a)
b)
From A. Zukauskas, M. S. Shur and R. Gaska, Introduction to Solid State Lighting, Wiley (2002)
72http://nina.ecse.rpi.edu/shur/
Light Extraction : TIP-LEDs from LumiLeDs
T o p c o n t a c t
h ig h p r e s s u re s o d iu m1 k WT I P - L E D
S t a n d a r dA lG a I n P / G a P
1
100
10
1000
P e a k w a v e le n g t h (n m )
Lu
me
n/w
att
550 600 650 700 750
m e r c u ry v a p o r 1 k Wf lu o r e s c e n t 1 W
tu n g s te n 6 0 Wh a lo g e n 3 0 W
re d f i l t e r e dtu n g s te n 6 0 W
After M.O. HOLCOMB et al. (2001), Compound Semiconductor 7, 59, 2001).
73http://nina.ecse.rpi.edu/shur/
WHITE SOLID-STATE LAMP
74http://nina.ecse.rpi.edu/shur/
CRI for White Light( ) ( ) ( ) ,λdλSλdλSλVK ∫∫
∞
×=0
780
380
Wlm683
Spectral Range Temperature (K) Efficacy (lm/W) General CRI
2856 17 100 4870 79 100
Full (Planckian)
6504 95 100 2856 154 100 4870 196 100
380 nm-780 nm (trimmed-Planckian) 6504 193 100
2856 334 95 4870 320 95
430 nm-660 nm (trimmed-Planckian) 6504 305 95
From A. Zukauskas, M. S. Shur and R. Gaska, Introduction to Solid State Lighting, Wiley (2002)
75http://nina.ecse.rpi.edu/shur/
Optimization of White Polychromatic Semiconductor
Lamp Approach: Find the global maxima of the objective
function for different values of σ.
( ) ( ) ann RKIIF σσλλσ −+= 1,...,,,..., 11
From A. Zukauskas, M. S. Shur and R. Gaska, Introduction to Solid State Lighting, Wiley (2002)
76http://nina.ecse.rpi.edu/shur/
Phase distribution for a dichromatic white lamp with the 30-nm line width of the primary sources and 4870 K color temperature
0 100 200 300 400
-60
-40
-20
0
20
380/569 nm
489/591 nm
496/635 nm
481/580 nm
450/571 nmRa
K (lm/W)(after Žukauskas et al., Appl. Phys. Lett. 80, 2002).
77http://nina.ecse.rpi.edu/shur/
Optimal boundaries of the phase distribution for 4870-K white-light sources containing 2, 3, 4, and 5 primary
sources with the 30-nm line widths
320 340 360 380 400 420 440
5
10
20
304050607080
90
95
9899
99.5R
a5
4
3
2
Systems: quintichromatic quadrichromatic trichromatic dichromatic
K (lm/W)(after Žukauskas et al., Appl. Phys. Lett. 80, 2002). Crosses mark the points that are suggested for highest reasonable CRI for each number of the primary sources.
78http://nina.ecse.rpi.edu/shur/
InGaN based luminescence conversion white LED
InGaN chip
Phosphor layer
(after S.Nakamura and G.Fasol, The Blue Laser Diode: GaN Based Light Emitters and Lasers, Springer, Berlin, 1997)
79http://nina.ecse.rpi.edu/shur/
White light from blue emission of AlInGaN LED (465 nm) and yellow emission of cerium-doped garnet
with different peak wavelength positions
0.0 0.2 0.4 0.6 0.8 1.00.0
0.2
0.4
0.6
0.8
1.0
YAG:Ce3+
InGaN
10,000
6,0004,000
3,000
2,000
460
640700
620600
580
560
540
530520
510
500
490
480
400
y C
hrom
atic
ity C
oord
inat
e
x Chromaticity CoordinateFrom A. Zukauskas, M. S. Shur and R. Gaska, Introduction to Solid State Lighting, Wiley (2002)
80http://nina.ecse.rpi.edu/shur/
MULTICHIP LED: 2 chip LEDs
Wavelength (nm)/Intensity Color Temperature
(K) 1λ /I1 2λ /I2
K (lm/W) Ra
2856 450/0.157 580/0.843 492 -13 4870 450/0.325 572/0.675 430 3.0 6504 450/0.399 569/0.601 393 9.5
From A. Zukauskas, M. S. Shur and R. Gaska, Introduction to Solid State Lighting, Wiley (2002)
81http://nina.ecse.rpi.edu/shur/
Optimized spectral power distributions
400 450 500 550 600 650
K=430 lm/WRa=3
Pow
er (a
rb. u
nits
)
Wavelength (nm)
K=366 lm/WRa=85
K=332 lm/WRa=98
K=324 lm/WRa=99
2 LEDs
3 LEDs
4 LEDs
5 LEDsAfter A.Žukauskas et al., Appl. Phys. Lett. 80, 2002.
From A. Zukauskas, M. S. Shur and R. Gaska, Introduction to Solid State Lighting, Wiley (2002)
82http://nina.ecse.rpi.edu/shur/
Variation of the peak wavelength with general CRI for solid-state lamps composed of 2, 3, 4, and 5
primary LEDs with the 30-nm line widths
2 5 10 20 30 40 50 60 70 80 90 95 98 99 99.5
450
500
550
600
650 2 LEDs 3 LEDs 4 LEDs 5 LEDs
Pea
k w
avel
engt
h (n
m)
Ra
(after A.Žukauskas et al., Proc. SPIE 4425, 2001)
83http://nina.ecse.rpi.edu/shur/
Nichia UV LEDs
Type Product Peak Optical Forward(mm) Number Wavelength Power Output Voltage
(nm) (µW) Vf (V)Typ.
Φ5 NSHU550 375 700 3.5Φ5 NSHU590 375 700 3.5
After http://www.nichia.co.jp/product/led.html
84http://nina.ecse.rpi.edu/shur/
Nichia White LEDsType Produc t Luminous Forward Direc tivity(mm) Number Intensity Voltage 2θ ½
(c d) Vf (V) (degree)Typ.
Φ3 NSPW300BS 3.2 3.6 25°Φ3 NSPW310BS 1.5 3.6 60°Φ3 NSPW312BS 2.2 3.6 35°Φ3 NSPW315BS 0.78 3.6 70°Φ5 NSPW500BS 6.4 3.6 20°Φ5 NSPW510BS 1.8 3.6 50°Φ5 NSPW515BS 0.48 3.6 70°4.6 NSPWF50BS 0.3 3.6 140/120°
85http://nina.ecse.rpi.edu/shur/
Nichia Blue LEDsProduct Luminous Forward DirectivityNumber Intensity Voltage 2θ ½
(cd) Vf (V) (degree)Typ. Max.
NSPB300A 2.3 3.6 4 15°NSPB310A 1.2 3.6 4 30°NSPB320BS 0.7 3.6 4 45°NSPB500S 3.5 3.6 4 15°NSPB510S 1.5 3.6 4 30°NSPB520S 0.8 3.6 4 45°NSPB636AS 0.55 3.6 4 70°/30
86http://nina.ecse.rpi.edu/shur/
Applications (for 250 nm – 340 nm)Sensing and beyond
• Environmental protection• Homeland security• Biology• Medicine• Medical sterilization• Bio-agent detection • Water and air purification• Solid-state white lighting• Short-range secure
communications• Dense data storage• Ballistic missile defense• To be emerged
Applications of U of V/RPI/SET quadrichromatic Versatile Solid-State Lamp: Phototherapy of seasonal affective disorder at Psychiatric Clinic of Vilnius University
UV-LED Based Fluorimeter with IntegratedLock-in Amplifier (after Prof. Zukauskas, U of V,Lithuania)
87http://nina.ecse.rpi.edu/shur/
Existing and proposed UV LED based bio detection systems
UV-LED Based Fluorimeter with IntegratedLock-in Amplifier (after Prof. Zukauskas, U of V,Lithuania)
AnthraxBacteria
From Introduction to Biological Agent Detection Equipment for Emergency First Responders,U.S. Department of Justice Office of Justice Programs National Institute of Justice.
88http://nina.ecse.rpi.edu/shur/
Medical Applications: Example• Seasonal affective disorder
affects many people (up to 10%)in the northern latitudes
• Bright white light is known to treat SAD
• The exact mechanism of treatment is not known
• Optimization of Spectral Power Distribution might help treatment
Applications of U of V/RPI/SET quadrichromatic Versatile Solid-State Lamp: Phototherapy of seasonal affective disorder at Psychiatric Clinic of Vilnius University
89http://nina.ecse.rpi.edu/shur/
Multiple Quantum Well (50% Al Molar Fraction) Photoluminescence on SiC and Bulk AlN
ArF excimer laser (pulse duration 8 ns) emitting at 193 nm (6.42 eV) was used for the generation of carriers above the band gap of AlN (6.2 eV) so that both the wells and the barriers have been photoexcited. The structures were also excited selectively by 4-ns-long pulses of the fifth harmonic of Nd:YAG laser radiation at 213 nm (5.82 eV), which generates carriers only in the quantum well material.
From R. Gaska, C. Chen, J. Yang, E. Kuokstis, A. Khan, G. Tamulaitis, I. Yilmaz, M. S. Shur, J. C. Rojo, L. Schowalter, . Deep-ultraviolet emission of AlGaN/AlN quantum wells on bulk AlN, accepted at APL
90http://nina.ecse.rpi.edu/shur/
AlN/AlGaN Room Temperature Photoluminescence
PL signal from MQWs on bulk AlN is approximately 28 times stronger compared to the structure grown over SiC.
PL signal from MQWs on bulk AlN forAlN/Al0.5Ga0.5N QWs with 20 nm barriers and:5 nm QWs; 2 nm QWs
1028 1029 1030 1031106
107
108
109
1010
T = 300 K
Al0.5Ga0.5N/AlN QWson bulk AlN
high-quality sample low-quality sample
Pump intensity (cm-3s-1)
Pho
tolu
min
esce
nce
Inte
nsity
(arb
. uni
ts)
240 260 280 300 320
20 nm AlN5 nm Al0.5Ga0.5N
substrate
AlN epilayerBulk AlNsubstrate
SiC substratePL In
tens
ity (a
rb. u
nits
)
Wavelength (nm)
From R. Gaska, C. Chen, J. Yang, E. Kuokstis, A. Khan, G. Tamulaitis, I. Yilmaz, M. S. Shur, J. C. Rojo, L. Schowalter, . Deep-ultraviolet emission of AlGaN/AlN quantum wells on bulk AlN, accepted at APL
91http://nina.ecse.rpi.edu/shur/
Stimulated Emission
240 260 280 300
PL from edge @ L = 400 µm PL from edge @ L = 440 µm spontaneous PL
Lum
ines
cenc
e in
tens
ity (a
rb. u
nits
)
Wavelength (nm)
Photoluminescence spectra of Al0.5Ga0.5N/AlN MQWs deposited on bulk AlN. Solid curve represents the spectrum of spontaneous emission detected in the direction perpendicular to the sample surface; dotted and dashed curves correspond to the spectra measured from the sample edge along the direction of a 30 µm wide stripe, which length was 400 µm and 440 µm, respectively. The excitation wavelength was 213 nm.
From R. Gaska, C. Chen, J. Yang, E. Kuokstis, A. Khan, G. Tamulaitis, I. Yilmaz, M. S. Shur, J. C. Rojo, L. Schowalter, . Deep-ultraviolet emission of AlGaN/AlN quantum wells on bulk AlN, accepted at APL
92http://nina.ecse.rpi.edu/shur/
AlInGaN-based UV LEDs on Sapphire Substrates
280 300 320 340 360 380 400 420
0 5 100
10
20ELEL
PL
EL
PLN
orm
aliz
ed in
tens
ity, a
.u.
Wavelength, nm
320nm340nm
Cur
rent
, mA
Voltage, V
305 nm
Pd/Ag/Au
Al2O3
n+-AlGaN
n-AlGaN/AlGaN (SL)
AlInGaN MQW
p-AlGaN/AlGaN (SL)
p-GaN
Ni/Au
Ti/Au
Ti/Al/Ti/Au
M. Asif Khan, Vinod Adivarahan, Jian Ping Zhang, Changqing Chen, Edmundas Kuokstis, Ashay Chitnis, Maxim Shatalov, Jin Wei Yang, Grigory Simin Stripe Geometry Ultraviolet Light Emitting Diodes at 305 nanometers using quaternary AlInGaN multiple quantum wells, Jpn. J. Appl. Phys. Vol. 40 (2001) pp. L 1308-L 1310
93http://nina.ecse.rpi.edu/shur/
AlInGaN-based UV LEDs on Sapphire Substrates
Pump Current 400 mA pulsed
280 300 320 340 360 380 400 420 44010-4
10-3
10-2
10-1
100
101
102
USC square Sep 2001USC stripe Dec 2001USC square Jan 2002NTT square Sep 2001
Out
put p
ower
, mW
Wavelength, nm
square
stripeSquare+thick buffer
Improve light extraction Control current crowding
M. Shatalov, G. Simin, V. Adivarahan, A. Chitnis, S. Wu, R. Pachipulusu, K. Simin, J. P. Zhang, J. W. Yang, and M. Asif Khan . Lateral Current Crowding in Deep UV Light Emitting Diodes over Sapphire Substrates. Jpn. J. Appl. Phys. Vol. 41 (2002) pp. 5083-5087 Part 1, No. 8, August 2002
94http://nina.ecse.rpi.edu/shur/
10 mW 325 nm UV LED on Sapphire
0 2 4 6 80
10
20
30
40
50
RD = 24 Ω
200 µm x 200 µm
Cu
rrent
, mA
Voltage, V
260 280 300 320 340 360 380 400 420
200 mA pulsed pumping500 ns, 10 kHz
Inte
nsity
, a.
u.
Wavelength, nm
325 nm
0 200 400 600 800 1000 12000
2
4
6
8
10
dc
pulse 500 ns, 10 kHz
Pow
er, m
WCurrent, mA
A. Chitnis, J. P. Zhang, V. Adivarahan, M. Shatalov, S. Wu, R. Pachipulusu, V. Mandavilli, and M. Asif KhanImproved performance of 325-nm emission AlGaN ultraviolet light-emitting diodes. Appl. Phys. Lett., 82, pp. 2565-2567 (2003)
95http://nina.ecse.rpi.edu/shur/
260 280 300 320 340 360 380 400 420
200 mA pulsed pumping500 ns, 10 kHzIn
tens
ity, a
.u.
Wavelength, nm
285.5 nm
0 2 4 6 80
5
10
15
20
25
30
Cur
rent
, mA
Voltage, V0 20 40 60 80 100
0
2
4
6
8
10
12
14RTdc
Pow
er, µ
W
Current, mA
0 100 200 300 400 5000.00
0.05
0.10
0.15
0.20
RTpulse500 ns, 0.5%
Pow
er, m
WCurrent, mA
Rs~70-80 Ω
LT-AlN
Sapphire
n+-AlGaN buffer
SQW
p-AlGaN p+-GaN
SL
Sub-milliwatt power 285 nm Emission UV LED on Sapphire.
V. Adivarahan et al., Jpn. J. Appl. Phys. Lett., 41, L435 (2002)
96http://nina.ecse.rpi.edu/shur/
285 nm Emission UV LEDLow temperature performance
0 2 4 6 80
5
10
15
20
25
30
Cur
rent
, A
Voltage, V
300 K250 K200 K150 K100 K50 K10 K
0 20 40 60 80 100 1201
10
100
200 mA
100 mA
PL
Nor
mal
ized
inte
nsity
, a.u
.
1000/T, K-1
20 mA
260 280 300 320 340 360 380
200mA500ns, 10kHz
Inte
nsity
, a.u
.
Wavelength, nm
10 K50 K100 K150 K200 K250 K300 K
A. Chitnis, R. Pachipulusu, V. Mandavilli, M. Shatalov, E. Kuokstis, J. P. Zhang, V. Adivarahan, S. Wu, G. Simin, and M. Asif Khan. Low-temperature operation of AlGaN single-quantum-well light-emitting diodes with deep ultraviolet emission at 285 nm. APL, 81, 2938-2940 (2002)
97http://nina.ecse.rpi.edu/shur/
250300
350400
0200
400600
Time, ns
Inte
nsity
, a.u
.
Wavelength, nm
0 200 400 600 800 10000
1x106
2x106
3x106
4x106
5x106
I0 + ∆I exp (-t/τ), τ ~ 25 ns
285 nm peak
Inte
nsity
, a.u
.
Time, ns
0 200 400 600 800 10000
1x107
2x107
3x107
4x107
5x107
I0 - ∆I exp (-t/τ)), τ ~ 75 ns
330 nm peak
Inte
nsity
, a.u
.
Time, ns
0 10 ns100 ns300 ns600 ns
70 mA current pulse1000 ns, 20 kHz
285 nm Emission UV LEDTime resolved electroluminescence
M. Shatalov, A. Chitnis, V. Mandavilli, R. Pachipulusu, J. P. Zhang, V. Adivarahan, S. Wu, G. Simin, M. Asif Khan, G. Tamulaitis, A. Sereika, I. Yilmaz, M. S. Shur and R. Gaska, Time-resolved electroluminescence of AlGaN-based light-emitting diodes with emission at 285 nm, Appl. Phys. Lett. 82, Issue 2, pp. 167-169 (2003)
98http://nina.ecse.rpi.edu/shur/
0 2 4 6 80
10
20
30
40
50
RD = 28 Ω
278 nm LED200 µm x 200 µm
Cur
rent
, mA
Voltage, V
260 280 300 320 340 360 380 400 420
200 mA pulsed pumping500 ns, 10 kHz
Inte
nsity
,a.u
Wavelength, nm
278 nm
0 200 400 600 800 10000
1
2
3
4
5
pulse500 ns, 10 kHz
dc RT
Pow
er, m
W
Current, mA
0 100 200 3000.0
0.2
0.4
Pow
er, m
W
Current, mA
Milliwatt power 278 nm UV LED on Sapphire. Modified design
J. P. Zhang, A. Chitnis, V. Adivarahan, S. Wu, V. Mandavilli, R. Pachipulusu, M. Shatalov, G. Simin, J. W. Yang, and M. Asif Khan, Milliwatt power deep ultraviolet light-emitting diodes over sapphire with emission at 278 nm, Appl. Phys. Lett. 81, 4910-4912 (2002)
99http://nina.ecse.rpi.edu/shur/
Thermal and current crowding management
Square geometry Inter-digitated fingers LED arrays
0 2 4 6 8 10 12 140
10
20
30
40
50Multifinger LED
Square LEDCur
rent
, mA
Voltage, V
A. Chitnis et al., Jpn. J. Appl. Phys. Lett., 41, L320 (2002)
0 2 4 6 8 100
10
20
30
40
50
Single chip
4 x 1 array
Cur
rent
, mA
Voltage, V
100http://nina.ecse.rpi.edu/shur/
278 nm / 325 nm LED comparison325 nm Emitting LED
10 mW1 A pulsed
278 nm Emitting LED
3 mW1 A pulsed
0 200 400 600 800 10000
2
4
6
8
10
12
RT
dc
pulse 500 ns, 10 kHz
Pow
er, m
W
Current, mA0 200 400 600 800 1000
0
1
2
3
pulse500 ns, 10 kHz
dc
RT
Pow
er, m
W
Current, mA
J. P. Zhang, A. Chitnis, V. Adivarahan, S. Wu, V. Mandavilli, R. Pachipulusu, M. Shatalov, G. Simin, J. W. Yang, M. Asif Khan, Milliwatt Power Deep Ultraviolet Light Emitting Diodes over Sapphire with Emission at 278 nm. APL vol. 81, No. 26, pp. 4910-4912 (2002) ; A. Chitnis, J. P. Zhang, V. Adivarahan, M. Shatalov, S. Wu, R. Pachipulusu, V. Mandavilli, M. Asif Khan. Improved performance of 325-nm emission AlGaN ultraviolet light-emitting diodes. APL vol. 82, No. 16, pp. 2565-2567 (2003)
101http://nina.ecse.rpi.edu/shur/
SAW Oscillator/Photodetector
SAW
Amplifier
BASICS OF SURFACE ACOUSTIC WAVE DELAY-LINE OSCILLATOR
Phase condition
Amplitude conditionGain > Loss
πφπ mV
Lf 22=+
m - 1 m + 1m
Frequency
=
LL
VV
ff UV∆∆
Velocity change
102http://nina.ecse.rpi.edu/shur/
Response to Artificial Light Sources and Sunlight
221.08 221.10 221.12 221.14 221.16-100
-80
-60
-40
-20 UV lamp Sun light Dark
Sign
al p
ower
(dB
m)
Frequency (MHz)
-5 -4 -3 -2 -1 0 1 2 3 4 5-120
-100
-80
-60
-40
-20
0
Sun and UV lamp
Sun only
Sign
al a
mpl
itude
(dB
m)
Frequency deviation (kHz)
D. Ciplys, R. Rimeika, M.S. Shur, R. Gaska, A. Sereika, J. Yang, M. Asif Khan, "Radio frequency response of GaN-based SAWoscillator to UV illumination by the Sun and man-made source", Electronics Letters, vol. 38, no. 3, pp. 134-135, 2002
103http://nina.ecse.rpi.edu/shur/
SOME of LED WEB SITES
• http://www.misty.com/people/don/led.html• http://www.luxeon.com/index.html• http://ledmuseum.home.att.net/• http://www.nichia.com/• http://www.cree.com/• http://www.s-et.com• http://www.oida.org/• http://safeco2.home.att.net/laser.htm
104http://nina.ecse.rpi.edu/shur/
Conclusions• Materials properties of wide band semiconductors
are superior for applications in for high power, high temperature electronics
• All device building blocks demonstrated• Record breaking microwave power performance
achieved• Strain Energy Band Engineering – Strain and Band
Offset Control using quaternary and ternary heterostructures augmented using SiO2 and Si3N4 allow us to obtain superior HFET performance
• Nitrides hold promise of solid state lighting• Nitride deep UV emitters and detectors have
been demonstrated