mems tecnology

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Welcome to Paper Presentation on MEMS TECHNOLOGY By Chavan Mayuri Sanjay Department of Electronics and Telecommunication Engineering Annasaheb Dange College of Engineering and Technology, Ashta

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Page 1: Mems tecnology

Welcome to

Paper Presentation on

MEMS TECHNOLOGYBy

Chavan Mayuri Sanjay

Department of Electronics and Telecommunication EngineeringAnnasaheb Dange College of Engineering and Technology, Ashta

Page 2: Mems tecnology

OUTLINE• MEMS Introduction• Sensor• Fabrication• MEMS manufacturing technology• Packaging• Advantages• Disadvantages• Application• Conclusion• Reference

Page 3: Mems tecnology

INTRODUCTION

• MEMS is a acronym for micro-electro-mechanical system

• It is used to create tiny integrated devices

• Ability to scence, control and actuate

• MEMS is the promising technology in 21th century

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WHY MEMS SENSOR?

• It measures physical quantity and convert into it into electronic signal

• Used to scence changing parameter

• Small in size

• Have lower power consumption

• More sensitivity to input variation

• Less invasive due to mass production

Page 5: Mems tecnology

FABRICATION

Material used are: • Silicon

• Polymer • Metal

• Ceramic

Basic Process

Deposition Patterning Etching

Page 6: Mems tecnology

MEMS MANUFACTURING TECHNOLOGY

• Bulk Micromachining

• Surface Micromachining

• LIGA

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BULK MICROMACHINING• This technique involves removal of substrate material

• Bulk micromachining techniques are:

Wet etching

Dry etching

Page 8: Mems tecnology

SURFACE MICROMACHINING• It enables fabrication of complex integrated structure

• Widely used technique is Polysilicon surface micromachining

• Structure thickness is smaller than 10 μm

Page 9: Mems tecnology

LIGA• LIGA is a German acronym standing for lithographie,

galvanoformung (plating), and abformung (molding).

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PACKAGING • Protect the sensor from external influences and

environmental effect

• Protect the environment from presence of the sensor

• Provide controlled interface between sensors

• Standard IC Packages: Ceramic Packages, Plastic Package, Metal Packages

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ADVANTAGES

• Smaller package size

• Less power consumption

• Easy to integrate into system or modify

• Lighter weight

• Higher output signal

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LIMITATIONS

• It is very small to trace out

• Expensive and Complex Packaging

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APPLICATIONS

In medical science

• Pressure sensor

• Inertial sensor

• Sight for the blind

In marine science

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CONTINUE….

Applications in marine military operation

Industrial Market

Communication

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FUTURE SCOPE• Access to Foundries

• Design, Simulation and Modeling

• Packaging and Testing

• Standardization

• Education and Training

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CONCLUSION• MEMS promises to be an effective technique of

producing sensors of high quality, at lower costs.

• Thus I can conclude that the MEMS can create a proactive computing world, connected computing nodes automatically, acquire and act on real-time data about a physical environment, helping to improve lives, promoting a better understanding of the world and enabling people to become more productive.

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REFERENCE1. Microsensors , Muller, R.S., Howe, R.T., Senturia , S.D., Smith, R.L., and White, R.M. [Eds.], IEEE Press, New York, NY, 1991.

2. Micromechanics and MEMS: Classic and Seminal Paper to 1990, Trimmer, W.S., IEEE Press, New York, NY, 1997.

3. Journal of Micro-electro-mechanical-Systems(http://www.ieee.org/pub_preview/mems_toc.html)

4. Journal of Micromechanics and Microengineering(http://www.iop.org/Journals/jm)