melexis time of flight imager for automotive applications 2017 teardown reverse costing report...

©2017 by System Plus Consulting | Melexis MLX75023 Automotive 3D ToF 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Melexis MLX75023Automotive 3D ToFImaging report by Stéphane ELISABETHJuly 2017


SOMMAIRE

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 6

o Melexis

o Business Model

o Softkinetic PortFolio

o Melexis ToF Solution

o 3D Imaging & Sensing Market

Physical Analysis 13

o Synthesis of the Physical Analysis

o Package 15

Package Views: Dimensions, Marking, Block Diagram

Package Opening: RDL, Line/Space Width, Optical Filter

Package Cross-Section : RDL, Bumps, Optical Filter

o Die 28

Die View & Dimensions

Delayering & main Blocs

Die Process: Transistor, Pixels technology

Die Cross-Section: Transistor, Metal Layers, Pixels

Die Process Characteristic

Physical Comparison 45

Infineon 3D ToF Image Sensor

STMicroelectronics SPAD technology

Texas Instruments OPT8241

Manufacturing Process 51

o Synthesis of the main parts

o Image Sensor Die Front-End Process & Fabrication Unit

o Glass BGA Packaging Process Flow

Cost Analysis 58

o Synthesis of the cost analysis

o Yields Explanation & Hypotheses 61

o Image Sensor die 63

Die Front-End Cost

Die Wafer Cost

Die Cost

o Packaging 66

Packaging Cost

Packaging Cost per steps

o Component Cost 69

Estimated Manufactured Price 71

Company services 75


Overview / Introductiono Executive Summaryo Reverse Costing

Methodology

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Melexis MLX75023.

The MLX75023 is an automotive 3D ToF Sensor already integrated in gesture recognition system from OEMs like BMW.

The 3D ToF sensor is packaged using Glass BGA. The device is an integrated sub-system comprising the die sensor and the glass filter in the same component in a thin packaging (0.7 mm). The sensor is based on CPAD technology from Softkinetic.

In this report, the complete subsystem is analyzed from the glass filter which is a NIR band pass filter to the collector based on the CPAD developed by Softkinetic and improved by Melexis. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF detector.

It also features a complete technology comparison with the Infineon ToF Image sensor, STMicroelectronics ToF technology and the Texas Instrument Industrial ToF image sensor also based on CPAD technology.


Overview / Introduction


Physical Analysis o Synthesiso Packageo Package Openingo Package Cross-Sectiono Image Sensor Dieo Image Sensor Cross-Section

Physical Comparison


Cost Analysis


About System Plus

ToF Process Flow





Physical Comparison


Cost Analysis


About System Plus

Package View & Dimensions





Physical Comparison


Cost Analysis


About System Plus

Package Cross-Section





Physical Comparison


Cost Analysis


About System Plus

Image Sensor Die Dimensions





Physical Comparison


Cost Analysis


About System Plus

Image Sensor Die – Pixels





Physical Comparison


Cost Analysis


About System Plus

Image sensor Die Cross-Section – Pixels




Physical Analysis

Physical Comparison o Infineon CISo STMicro. SPADo TI OPT8241


Cost Analysis


About System Plus

Comparison with Infineon CIS




Physical Analysis

Physical Comparison

Manufacturing Process Flowo Synthesiso Front-End Process &

Fabrication Unito Packaging Process Flow

Cost Analysis


About System Plus

Global Overview




Physical Analysis

Physical Comparison


Cost Analysiso Synthesiso Supply Chaino Yield Hypotheseso Front-End Cost &

Wafer/Die Costo Packaging Costo Component Cost


About System Plus

3D ToF Imager Front-End Cost




Physical Analysis

Physical Comparison





About System Plus

Packaging Cost




Physical Analysis

Physical Comparison





About System Plus

Component Cost




Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financial o Manufacturer Price

About System Plus

Estimated Manufacturer Price




Physical Analysis

Physical Comparison


Cost Analysis


About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal

MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT

IMAGING• 3D Imaging and Sensing 2017• Status of the CMOS Image Sensor Industry 2017• Imaging Technologies for Automotive 2016• IR LEDS and Lasers - Technology, Applications and Industry Trends

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

Related Reports

IMAGING• Lenovo Phab2Pro – Google Tango project – Time of Flight• STMicroelectronics ToF Sensor• Texas Instruments Industrial 3D ToF Imager

https://www.i-micronews.com/led-report/product/p3d-imaging-and-sensing-2017.html

https://www.i-micronews.com/category-listing/product/status-of-the-cmos-image-sensor-industry-2017.html

https://www.i-micronews.com/category-listing/product/imaging-technologies-for-automotive-2016.html

https://www.i-micronews.com/led-report/product/ir-leds-and-lasers-technology-applications-and-industry-trends.html

http://www.systemplus.fr/reverse-costing-reports/lenovo-phab2pro-3d-tof-camera/

http://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-time-of-flight-proximity-sensor-in-the-apple-iphone-7-plus/

http://www.systemplus.fr/reverse-costing-reports/texas-instruments-time-of-flight-image-sensor-for-industrial-applications/

COMPLETE TEARDOWN

WITH:

• Detailed photos

• Precise measurements

• Materials analysis

• Manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Estimated sales price

• ToF pixel comparison with devices from Infineon, STMicroelectronics, and Texas Instruments’ OPT8241

Melexis Time of Flight Imager for Automotive Applications

Title: Melexis Automotive ToF Imager

Pages: 80

Date: July 2017

Format: PDF & Excel file

Price: Full report: EUR 3,490

A cutting-edge ToF imager technology from Sony/Softkinetic, adapted by Melexis for automotive in-cabin applications

deeply, providing a unique pixel technology to several image sensormanufacturers in three application areas: consumer, automotive andindustrial. For automotive applications, Sony/Softkinetic has licensed itstechnology to Melexis, which has worked on the pixel design to provide aToF imager for gesture recognition.

The MLX75023 is an automotive 3D ToF Imager already integrated intogesture recognition systems from car makers like BMW. The 3D ToF Imager ispackaged using Glass Ball Grid Array technology. The device comprises thedie sensor and the glass filter in the same component in thin, 0.7 mm-thick,packaging.

This report analyzes the complete component, from the glass near-infraredband pass filter to the collector, based on the ToF pixel technology licensesdeveloped by Softkinetic and improved by Melexis. The report includes acomplete cost analysis and price estimation of the device based on a detaileddescription of the package, and the ToF imager.

It also features a complete ToF pixel technology comparison with Infineon,STMicroelectronics and Texas Instrument ToF imagers, which are also basedon Sony/Softkinetic technology, with details on the companies’ choices.

Today, Time-of-Flight (ToF) systemsare among the most innovativetechnologies offering imagingcompanies an opportunity to leadthe market. Every major playerwants to integrate these devices toprovide functions such as 3Dimaging, proximity sensing, ambientl i g h t s e n s i n g a n d g e s t u r erecognition. Sony/Softkinetic hasbeen investigating this technology

TABLE OF CONTENTS


• Overview• CIS Front-End Process• CIS Wafer Fabrication Unit• Packaging Process Flow• Final Assembly Unit

Cost Analysis• Cost Analysis Overview• The Main Steps Used in the

Economic Analysis• Yield Hypotheses• CIS Die Cost Front-end cost Back-end: tests and dicing Wafer and die cost

• Component Packaging cost Packaging cost by process

step Component cost

Estimated Price Analysis

Performed byPerformed by

AUTHORS:

3D Package CoSim+

IC Price +

ANALYSIS PERFORMED WITH OUR COSTING TOOLS 3D PACKAGE COSIM+ AND IC PRICE+

System Plus Consulting offerspowerful costing tools toevaluate the production cost &selling price from single chip tocomplex structures.

IC Price+

The tool performs the necessarycost simulation of any IntegratedCircuit: ASICs, microcontrollers,memories, DSP, smartpower…

3D Package Cosim+

Cost simulation tool to evaluatethe cost of any Packagingprocess: Wafer-level packaging,TSV, 3D integration…


Melexis Company Profile and Time of Flight Technology

Physical Analysis• Physical analysis methodology

• Package

View and dimensions

Package opening

Package cross-section: optical filter, RDL, bumps

• Image Sensor Die

View, dimensions and marking

Die overview: active area, CPAD technology

Die delayering, main block ID and process

Cross-section: metal layers, pixel

Process characteristics

Physical Comparison with Infineon’s ToF Image Sensor, STMicroelectronics’ SPAD technology and Texas Instruments’ Industrial ToF Image Sensor

• Package, Pixels, Filters

StéphaneElisabeth

Stéphane has adeep knowledge

of materials characterizationsand electronics systems. Heholds an Engineering Degree inElectronics and NumericalTechnology, and a PhD inMaterials for Microelectronics.

analysis. He has a deepknowledge in chemical andphysical analyses. He previouslyworked in microelectronics R&Dfor CEA/LETI in Grenoble and forSTMicroelectronics in Crolles.

NicolasRadufe (Lab)

N i c o l a s i s i n

charge of physical

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• MEMS & Sensors:

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Performed by

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Texas Instruments’ Time of Flight Image Sensor

for Industrial Applications

STMicroelectronics Time of Flight Proximity Sensor in the Apple iPhone 7 Plus

Lenovo Phab2Pro 3D Time of Flight (ToF) Camera Google Tango Ready

A look into Texas Instruments’system-on-chip, including Sony/Softkinetic’s time-of-flight pixeltechnology, for industrial appli-cations.

A look inside the Single PhotonAvalanche Diode (SPAD) fromSTMicroelectronics entering the high-end Apple handset.

World’s first 3D tri-camera bundleincluding Infineon/pmd REAL3TMToF image sensor integrated into aconsumer smartphone.

Pages: 79Date: July 2017Full report: EUR 3,490*

Pages: 113Date: March 2017Full report: EUR 3,490*

Pages: 170Date: January 2017Full report: EUR 3,990*

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