Master’s of Science in Applied PhysicsInternship in Semiconductor Industry

Charley Myles, Mark Holtz, and Roger LichtiDepartment of PhysicsTexas Tech University

Lubbock, Texas 79409-1051

• 24,000 students

• Physics Department: 19 faculty.

• M.S. and Ph.D. programs:– Solid State1,2

– AMO1,2

– Biophysics1,2

– Physics Education1

– Particle Physics1

• 1 Experiment, 2 Theory

Lubbock

Research & Education Initiatives

• Maddox Laboratory for Semiconductor Research

– www.ee.ttu.edu/MaddoxLab

• M.S in Applied Physics. Program in Semiconductor Product Engineering.

– www.phys.ttu.edu/MSi

– www.ee.ttu.edu/PSPE

• Sensor Technology Center

– Funding from various individual and group grants

– Three-course graduate series in MEMS

– www.ee.ttu.edu/MEMS

• Stefan Estreicher– Theory of Defects in Silicon

• Shubhra Gangopadhyay– Low and High k dielectrics

• Mark Holtz– Optical Properties

• David Lamp– Defect Levels

• Roger Lichti– Muon Spin Rotation

• Charley Myles– Bandstructure Theory

• Tim Dallas– Nanofluidics

• Sergey Nikishin– III-Nitrides

• Henryk Temkin– Optoelectronics

Physics EE

• Provide excellent education and training for Texas Tech students in microelectronics.• Emphasize fundamental, analytical, and practical degree work. Interdisciplinary.• Produce strong programs, alternative to traditional M.S. and Ph.D. programs, which offer advanced training.

Not competitive with our existing M.S. and Ph.D.

• Serve as national prototype for university-industry educational programs.

First group of students in 1996.

• Prior to internship (two semesters)– Quantum Mechanics

– Semiconductor Processing

– Processing and Characterization Laboratory

– Device Physics

– Semiconductor Physics

– Computational Physics

• Electives base (one semester following internship)– Electromagnetic Theory– Statistical Mechanics– Solid State Physics– Advanced Semiconductor

Processing Laboratory– VLSI Design– Failure Analysis– Parametric Testing– …

Summer & FallInternship

Year 1

Year 2

• Departmental alumni.• Discussions with scientists

and engineers in the microelectronics industry.

• Established track record for educating physics students for careers in microelectronics.

Departmental strengths emphasized!

“STRATEGY FOR IMPROVING LITHOGRAPHY LAYERS”Duke Phasirakul (1999)

“MOS GATE PATTERNING USING DEEP UV STEP-AND-SCAN LITHOGRAPHY” and “PATTERN FIDELITY OPTIMIZATION IN 0.35 m OPTICAL LITHOGRAPHY”

Jerome deGuzman (1998)“INLINE USE OF IN-FAB AMRAY SEM” and

“THE USE OF OPTICAL PROXIMITY CORRECTION (OPC) IN RESOLVING METAL LINE PULLBACK ISSUES OF SIMICONDUCTOR LITHOGRPHY”

Marvin Partin (1998)“AIRBORNE CONTAMINATION OF CHEMICALLY AMPLIFIED PHOTORESIST”

Brian Weber (1998) “INTEGRATAION AND ELECTRICAL TEST”

Yvonne Emil (1998)“GATE OXIDE CHARACTERIZATION FOR MOS DEVICES”

Ric Justus (1997)“DEVICE MODLING OF DRAM CAPACITORS WITH TCAD SOFTWARE” and

“INTERFACE EFFECTS AND IONIC CONDITION OF BARIUM TITANATE CAPACITORS”Dan Janson (1999)

“INTEGRATION AND SPC IN DRAM PRODUCTION”William A. Turmel (1999)

“FAILURE ANALYSIS OF MICROCONTROLLER INTEGRATED CIRCUITS”Arjang Fartash (1999)

“DIAGNOSTIC MEASUREMENT BATTERY IN FA”Paul D. Gamble (2000)

“THE HV5 PROCESS AND PROPERTIES OF POWER BIPOLAR TRANSISTORS”Chad E. Cox (2000)

“YIELD AND INTEGRATION IN NEXT-GENERATION INTEGRATED CIRCUITS”Kari Copeland (2001)

“POLYCRYSTALLINE PEEL-BACK IN DUV LITHOGRAPHY”Jon Vanbuskirk (2001)

“FAILURE ANALYSIS IN AIR-BAG SENSORS”Nasmul Ahsan (2001)

“CHALLENGES IN RESOLUTION FOR MICROELECTRONICS FAILURE ANALYSIS”Nick A. Martinez (1999)

“FAILURE ANYLYSIS AND MECHANICS IN INTEGRATED CIRCUITS”Jianbai Zhu (1999)

“FLIP CHIP FAILURE ANALYSIS”Chris Carty (1998)

“FAILURE ANALYSIS TECHNIQUE DEVELOPMENTS:LOCALIZED DELAYING AND FOCUSSED ION BEAM MICRO-MACHINING” and

“INVESTIGATIONS INTO DEEP SILICON TRENCH ETCHING FOR FLIPCHIP PACKAGE FAILURE ANALYSIS”

Preston Scott (1998)“PHOTOMETRIC EVALUATION OF THIN FILM OPTICAL CONSTANTS” and

“MEASUREMENT OF COMPLEX REFRACTIVE INDICES”David Bessire(1997)

“EFFECT OF ARRAY IMPLANT DOSE ON FLASH MEMORY PROGRAMMABILITY”Richard Lawrence (1997)

“HIGH FREQUENCY MODELING OF BIPOLAR TANSISTORS”Michel Baker (1998)

“INVESTIGATION OF DEFECTS FROM PLASMA OXIDE ETCHES AND PLASMA PHOTORESIST ASHERS AND CHARACTERISTIC X-RAY ANALYSIS”

Jeremy O’Dell (1997)

• INFRASTRUCTURE– National Science

Foundation

– Texas Instruments

– Applied Materials

– Texas Tech University

• STUDENT SUPPORT– National Science

Foundation

– Texas Tech University

– Texas Instruments

– Applied Materials

– Intel

– AMD

– Motorola

• LINKS WITH EE ...

A “Category 1” Professional M.S. according to the Nov. 2000 AIP report

“Mastering Physics for Non-Academic Careers”

by Stephen Norton, Philip Hammer, and Roman Czujko.

• Make the most of our strong relationship with EE Department and Companies:– Student support– Course offerings– Laboratories

• Continue to offer students excellent career opportunities.

• Attract more excellent students.

• Continued research relationships with industry.

• Sensor Systems Center started in 1999.

• New curriculum initiatives:– NSF CRCD on MEMS and

microsensors.

– Ph.D. bridge programs with non-Ph.D. granting universities in Texas … Internship based.

Dr. Kwong ChaoDepartment of Electrical Engineering

Texas Tech UniversityLubbock, TX 79409-3103

Phone: 806-742-3451email: Kwong Chao@coe.ttu.edu

Dr. Mark HoltzDepartment of PhysicsTexas Tech University

Lubbock, TX 79409-1051Phone: 806-742-3782

email: Mark.Holtz@ttu.edu