M. Letheren, EAB 3 July 2001; MIC group activities 1

EP-Microelectronics group

Overview of activities & Project Summaries

(more info at: http://web-micfe.web.cern.ch/web-micfe )

M. Letheren, EAB 3 July 2001; MIC group activities2

Overview

Design Projects Infrastructure and Services R&D Other Responsibilities

M. Letheren, EAB 3 July 2001; MIC group activities3

Overview (1) – Design

MIC group collaborates (mainly) with LHC teams and other HEP electronics groups to:

Develop mixed-signal, (rad-hard) electronics for front-ends and data acquisition systems:

System design & partitioning into ASICs. Prototype ASIC development.

(spec., design, fab., evaluation) Proto ASIC integration.

(hybrids, modules, beam tests)

M. Letheren, EAB 3 July 2001; MIC group activities4

Overview (2) – Support HEP-wide support for rad-tolerant design:

Rad-tol digital library & design kit for 0.25um process.(responsibility shared with RAL)

Multi-Project Wafer service for 0.25um process. Packaging and mounting of chips on hybrids.

(assembly, glueing, wire bonding, etc.) Mixed-signal IC test lab.

(verification of prototypes and small production volumes) X-ray irradiation. COTS assistance (advice, SEU testing, database) Wafer storage.

(Controlled environment: N2-flow, antistatic, temp., humidity, access)

Organization of ASIC volume production & test. Participation in volume testing for some projects.

M. Letheren, EAB 3 July 2001; MIC group activities5

Overview (3) – R&D Completed R&Ds:

RD9 – Rad-hard SOI (Thomson). (RD29) – Rad-hard SOI (DMILL). RD19 – Hybrid pixel detector systems. RD31 – Event Building with ATM switches. RD48 – Hardening of Si detectors.

R&Ds continuing as common projects: RD49 – Rad-tolerant design in deep submicron. COTS – Understanding COTS issues at LHC.

R&D for future experiments? Ultra-hard electronics (cryogenics, < 0.1um). Monolithic systems.

M. Letheren, EAB 3 July 2001; MIC group activities6

Overview (4) – other responsibilities

Integration of CMS Tracker electronics(A. Marchioro)

Electronics coordination for LHCb(J. Christiansen)

M. Letheren, EAB 3 July 2001; MIC group activities7

MIC Group Structure

B. van KoningsveldM. Letheren

Staff:F. AnghinolfiG. AnelliP. AspellJ.-P. Avondo-BedoneM. CampbellF. Cossey-Puget (0.5)F. FaccioJ. KaplonJ.-C. Santiard

Staff:G. CervelliJ. ChristiansenC. LjuslinP. MoreiraE. MurerC. Paillard

VisitorsM. DespeisseN. PellouxS. SaramadR. Szczygiel

Visitors:

P. Vazquez

Staff:M. Glaser

Visitors:M. Moll

R. Eggert

A. Marchioro

Digital designs (DG)

M. Letheren

Semiconductor detectors (SD)

P. Jarron

Front-ends (FE)

CAE support

Moved to TA1-SD(01/01/2001)

K. Haensler

M. Letheren, EAB 3 July 2001; MIC group activities8

DESIGN PROJECTS

M. Letheren, EAB 3 July 2001; MIC group activities9

MIC design projects (1)ATLAS

SCT (CERN, Cracow, Geneva, RAL)

ABCD baseline DMILL

ABCD 0.25um backup

SCTA analog (DMILL)

Chip & module test TRT (CERN, Cracow, Geneva, U-Penn)

DTMROC in DMILL DTMROC 0.25um

CMS Tracker (CERN, RAL, IC,…)

Fast controls, FEC ASICs for opto-links Electronics

integration Preshower (CERN, Lyon)

Delta+PACE (DMILL) Fast controls + GOL

ECAL 1 Gbit/s opto-link

(GOL) Muons

0.75ns TDC (0.25um)

M. Letheren, EAB 3 July 2001; MIC group activities10

MIC design projects (2)ALICE

ITS - Pixels (MIC, ED)

Pixel readout chip Pilot-chip, GOL Bump-bonding Testing

ITS - Si-drift (RD49 -> Torino)

PASCAL front-end HMPID & DiMuon

Spect Gassiplex, DiLogic &

hybrids (MWPC readout).

TOF Hi-res TDC (<50ps)

LHCb RICH (MIC, ED, TA2)

Pixel readout chip Bumping & testing

VELO (MIC -> ED)

Adapted SCTA (DMILL)

Muons (CERN, Rio de Janeiro)

Carioca fast FE amp & discriminator(readout of MWPCs for L0 trigger)

M. Letheren, EAB 3 July 2001; MIC group activities11

Common developmentsRad-hard chips:

TTC receiver (TTCrx) All

Gigabit Optical Link -----

G-link & Gigabit ethernet 800 and 1600 Mbit/s CMS + Alice

Programmable delay All

Voltage Regulators(ST Microelectronics)

All

M. Letheren, EAB 3 July 2001; MIC group activities12

INFRASTRUCTURE & SERVICES

M. Letheren, EAB 3 July 2001; MIC group activities13

Rad-tolerant design support

Rad-tol design support: Library

Core cells, pads, memory, etc. CAE customisation

Cadence, Synopsys, Hercules, etc.

0.25um NRE runs & MPWs: Demand-driven MPWs

(~3-4 per year, 20 designs each)

Services: Forecasting & billing, DRC, reticle assembly, polygon filling, fab submission, dicing & shipping, Fab interface for problems &

“specials”.

M. Letheren, EAB 3 July 2001; MIC group activities14

Packaging & module assembly

M. Letheren, EAB 3 July 2001; MIC group activities15

IC Test Lab Mixed-signal test system

Automatic wafer prober ->

* 112 digital channels @ 200 MHz

* VXI analog instrumentation (synchronized)

* Labview environment for DAQ & analysis

* Test vector down-load from CAE

* Step and Repeat with pattern recognition

* Stand alone or interfaced to IMS

M. Letheren, EAB 3 July 2001; MIC group activities16

X-ray irradiation facility

X-ray energy: 20 – 60 keV

Beam diameter: 100 um – 1 cm

Dose rate: 20 – 800 rad/s

8-inch wafer probe equipped with CCD camera

Thermal chuck: -25 0C – 200 0C

M. Letheren, EAB 3 July 2001; MIC group activities17

R&D PROJECTS

M. Letheren, EAB 3 July 2001; MIC group activities18

Low-key R&D activities RD49+

Prepare for next-generation technology: IBM 0.25um frame contract valid thru Q4 2003.

Extension possible until which date? Prepare rad-tol design support for next-generation.

Choose & characterize a technology. Develop design method & tools (CAE, test). Develop low-voltage analog circuit design

techniques. Develop LHC Demonstrators.

Ultra rad-hard systems (NA60 beamscope, LHC luminosity upgrade) Cryogenic detectors => cryogenic electronics. Characterization of 0.25um CMOS at cryogenic

temps.(device model and parameters)

Readout ASIC for NA60 cryogenic beamscope.

M. Letheren, EAB 3 July 2001; MIC group activities19

Future R&D activities? Monolithic Systems?

Integration of sensor on electronics wafer.

Integrated APDs (EPFL). Integrated pixels.

CERN/Berne patent pending (with ETT) Assisting LEPSI (Strasbourg) with 0.25um

What else? LHC upgrade study groups being set

up.

M. Letheren, EAB 3 July 2001; MIC group activities20

OTHER RESPONSIBILITIE

S

M. Letheren, EAB 3 July 2001; MIC group activities21

APVs

CLK - T1

CCU

DCU

Det

PLL

A/DMemory

TTCrx

I2C

FED

FEC

IV

TTCrx

PCIIntfc

CLK

& T

1

A/D

Temp

FE Hybrid

CCU Module

FEC ctrl

DataPath

ControlPath

toDAQ

LD

Integration of CMS tracker electronics.(A. Marchioro)

M. Letheren, EAB 3 July 2001; MIC group activities22

CMS Tracker IntegrationTracker electronics:

FE chip (APV25) RAL + IC

FED RAL FEC CERN Opto links CERN Fast controls CERN

(rad-hard ASICs) CCU – Communication & Control

Unit PLL - Phased Locked Loop

DCU – Detector Control Unit

LD - Laser Driver

RX40 – 40 Mbit/s receiver

TTCrx – TTC receiver

etc.

Tracker system tests: 1. CERN 25ns structured beam: * Confirm functionality * Synchronization of front-ends

2. Milestone -> 2 working Rods

M. Letheren, EAB 3 July 2001; MIC group activities23

LHCb electronics coordination(J. Christiansen ~ 50%)

Common LHCb front-end architecture Modeling and simulation studies

Organizing LHCb electronics meetings.

Organizing Reviews etc.

M. Letheren, EAB 3 July 2001; MIC group activities24

Summary of MIC activities

ASIC developments for all LHC experiments

Infrastructure & support for design, test, packaging, module assembly, radiation studies, etc.

Technology R&D for future experiments. Direct involvement in LHC collaborations

(CMS tracker integration, LHCb electronics coordination)