LPNHE activities Contribution in the development of an assembly line for highly granular calorimeters with semiconductor readout

Gluing robot systemMetrology of the PCBQuality InsuranceIndustrialisation of the gluing process

Didier Lacour – LPNHE – June 2015 1

Physicists: 1FTEJ-E. AugustinS. De Cecco D. Lacour

Technical staff: 2 FTEJ. David : electronicP. Ghislain : mechanicJ-F. Huppert : computingL. Lavergne : instrumentationJ-M. Parraud : electronicD. Vincent : mechanic

Electromagnetic Si-W Calorimeter structure

Description of one layer

Detector module assembly

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First step : one wafer glued per PCB

• The parameters of the gluing robot have been optimized to glue a silicon sensor (18x18 pads) on a PCB

• The constraints on the PCB geometry have been identified:– Flatness – Parallelism of the

edges– Uniform height of the

ASIC soldered on the board

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Second step : 4 wafers per PCB

• Move the plate with the 4 wafers over the glue dots

• The alignment is fundamental : – PCB = 180.3 mm maximum– Wafer = 90 mm

• Deposit glue on the PCB

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Gluing and positioning automated process

• a software (Labview) for the gluing robot has been implemented.• the second robot for positioning, alignment, and handling has

been assembled and its software developed.• The leakage current after gluing has been checked on each

wafer and compared to previous measurements (before gluing)

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Electrical tests bench• Development of an electrical test system to check the short cuts

immediately after gluing and later to measure the I(V) curves of each wafer and all 4 wafers.

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PCB Metrology

• Before cabling :

- Squaring - Parallel edges - Dimensions - Thickness (flatness in depression) - Flatness• After cabling : flatness and thickness

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PCB Metrology• Development of an automatic process using a coordinate measuring

machine in one step.

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Quality insurance

• Task flow has been completed

• Reception and gluing procedures for 1 and 4 silicon sensors are written

• each operation on PCB is monitored (follow up)

• Each gluing test is registered

Industrialisation

• First contact with EOLANE, company able to propose an industrial gluing process for mass production (LLR/LPNHE).

• EOLANE says the company has capabilities to dedicate one of its production lines to our gluing process.

• EOLANE is studying the compatibility of its know-how to the material (glass then silicon), to the large dimension of PCB, to the repeatability of the alignment, to the quality of the glue and its heat treatment.

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Forthcoming

• Assemble 7 ASU and check the individual leakage currents.• Improve the traceability of each data (data sheet for metrology of

PCB, for I-V measurements) and each operation, then create a data base

• Merge and complete the labview software for a fully automated operation.

• Move both robots into the clean room

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My involvements in ATLAS LArg EM Barrel calorimeter

• In the 20th century (LPNHE-Paris)

Design and R&D of the electrodes / electrical tests / industrialization / convener of the “electrodes working group” with Luis Hervas

Construction of the module zero – test beam (data taking, analysis)

• 2001 – 2003 at CERN and from 2004 in LPNHE Paris (L. Hervas, P. Fassnacht, etc)• Construction, cabling and tests of the modules built at CERN• Tests beam• Construction and tests of the two wheels before and after insertion in the

cryostat• Tests of the barrel in the situ, at cold

• Run 1 and Run 2: Electronic calibration with Pavol Strizenec

All partitions: EMB EMEC HEC FCAL - pedestal, noise, ramps, pulse shape

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