low-band carrier aggregation solution - emw€¦ · mobile device antennas for low frequency...

5
RND Center, EMW / 2014-03-14 Note : All specifications are subject to change without notice. 1/5 * Specified VSWR values are measured in +25°C. Where, the port 2 is terminated with 50Ω and WBMC is connected L1(12nH) and L2(15nH). 40 to +85 Storage temperature [°C] 40 to +125 Low-Band Carrier Aggregation Solution (Preliminary Datasheet-Ver. 1.5) Applications Mobile device antennas for low frequency Inter-band carrier aggregation(B5&B12/B5&B17/B8&B20/B18&B28) Wideband matching for antennas (Bandwidth enhancement up to 300%) Port 2 is connected to an antenna. L1 and L2 are external matching components. 650~1000 (Low Band) / 1700~3000 (MID/HIGH Band) *VSWR (:1) @port1 < 3 (Low Band) / < 2 (MID/HIGH Band) Operating temperature [°C] Features Block Diagram No DC power supply and software control required Applicable to primary and secondary antennas Simplified circuit design than that of switchable antenna Capable of antenna sharing for variation handset models Dimensions [mm] 2.5 X 3.0 X 0.7 Port 1 is connected to RF signal. Specifications Applicable frequency range [MHz] 1 2 3 4 5 6 7 8 9 10 11 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000 VSWR_S11 Freq. [MHz] VSWR (@Z0_p2=50 Ω) Port2 Port1 L2 L1 FEED LOW Band MID/HIGH Band

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Page 1: Low-Band Carrier Aggregation Solution - EMW€¦ · Mobile device antennas for low frequency Inter-band carrier aggregation(B5&B12/B5&B17/B8&B20/B18&B28)

RND Center, EMW / 2014-03-14

Note : All specifications are subject to change without notice. 1/5

* Specified VSWR values are measured in +25°C. Where, the port 2 is terminated with 50Ω and WBMC is connected L1(12nH) and

L2(15nH).

­40 to +85

Storage temperature [°C] ­40 to +125

Low-Band Carrier Aggregation Solution(Preliminary Datasheet-Ver. 1.5)

ApplicationsMobile device antennas for low frequency Inter-band

carrier aggregation(B5&B12/B5&B17/B8&B20/B18&B28)

Wideband matching for antennas

(Bandwidth enhancement up to 300%)

Port 2 is connected to an antenna.

L1 and L2 are external matching components.

650~1000 (Low Band) / 1700~3000 (MID/HIGH Band)

*VSWR (:1) @port1 < 3 (Low Band) / < 2 (MID/HIGH Band)

Operating temperature [°C]

Features

Block Diagram

No DC power supply and software control required

Applicable to primary and secondary antennas

Simplified circuit design than that of switchable antenna

Capable of antenna sharing for variation handset models

Dimensions [mm] 2.5 X 3.0 X 0.7

Port 1 is connected to RF signal.

Specifications

Applicable frequency range [MHz]

1

2

3

4

5

6

7

8

9

10

11

500

600

700

800

900

1000

1100

1200

1300

1400

1500

1600

1700

1800

1900

2000

2100

2200

2300

2400

2500

2600

2700

2800

2900

3000

VSW

R_S

11

Freq. [MHz]

VSWR (@Z0_p2=50 Ω)

Port2

Port1

L2

L1FEED

LOW

Band

MID/HIGH

Band

Page 2: Low-Band Carrier Aggregation Solution - EMW€¦ · Mobile device antennas for low frequency Inter-band carrier aggregation(B5&B12/B5&B17/B8&B20/B18&B28)

Wideband Impedance Matching Component Datasheet_Ver.1.4

RND Center, EMW / 2014-03-14Note : All specifications are subject to change without notice. 2/5

Land pattern

5 Dummy pad

[Unit : mm]

[Unit : mm]

Package outline

Pin No.1234

DescriptionPort2 (Ant.)

L2 connected portPort1 (Feed)

L1 connected port

TOP VIEW SIDE VIEW BOTTOM VIEW

1 2

3 4

2 1

4 3

5

Page 3: Low-Band Carrier Aggregation Solution - EMW€¦ · Mobile device antennas for low frequency Inter-band carrier aggregation(B5&B12/B5&B17/B8&B20/B18&B28)

Wideband Impedance Matching Component Datasheet_Ver.1.4

RND Center, EMW / 2014-03-14Note : All specifications are subject to change without notice. 3/5

Evaluation board Ⅰ (2-Port)

Substrate Parts list

FR4 (εr=4.4)

Thickness=0.8mm

Metal thickness=25um

Outline size = 24 X 24 mm

Typical data on EVBⅠ

[Unit : mm]

No. Value

L1 10nH

L2 10nH

Type

1005

-30

-25

-20

-15

-10

-5

0

500

600

700

800

900

1000

1100

1200

1300

1400

1500

1600

1700

1800

1900

2000

2100

2200

2300

2400

2500

2600

2700

2800

2900

3000

S-pa

ram

eter

s [dB

]

Freq. [MHz]

S11 S21

S12 s22

Port

1

L1

L2

Port

2

-200

-150

-100

-50

0

50

100

150

200

500

600

700

800

900

1000

1100

1200

1300

1400

1500

1600

1700

1800

1900

2000

2100

2200

2300

2400

2500

2600

2700

2800

2900

3000

S-pa

ram

eter

s [D

eg.]

Freq. [MHz]

S11 S21

S12 s22

Page 4: Low-Band Carrier Aggregation Solution - EMW€¦ · Mobile device antennas for low frequency Inter-band carrier aggregation(B5&B12/B5&B17/B8&B20/B18&B28)

Wideband Impedance Matching Component Datasheet_Ver.1.4

RND Center, EMW / 2014-03-14Note : All specifications are subject to change without notice. 4/5

Evaluation board Ⅱ (with ANT)

Antenna

Type : Inverted-F

Non-ground size = 65 X 17 mm

Substrate Parts list

FR4 (εr=4.4)

Thickness=0.8mm

Metal thickness=25um

Outline size = 65 X 135 mm

Typical data on EVBⅡ

Value

L11005

10nH

L2 10nH

No. Type

[Unit : mm]

L1

L2 0Ω

1

2

3

4

5

6

7

8

9

10

11

500

600

700

800

900

1000

1100

1200

1300

1400

1500

1600

1700

1800

1900

2000

2100

2200

2300

2400

2500

2600

2700

2800

2900

3000

VSW

R_S

11

Freq. [MHz]

VSWR (@without WBMC)

VSWR (@with WBMC)

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

500

600

700

800

900

1000

1100

1200

1300

1400

1500

1600

1700

1800

1900

2000

2100

2200

2300

2400

2500

2600

2700

2800

2900

3000

Avg.

Gai

n [d

B]

Freq. [MHz]

Avg. Gain (@without WBMC)

Avg. Gain (@with WBMC)

Page 5: Low-Band Carrier Aggregation Solution - EMW€¦ · Mobile device antennas for low frequency Inter-band carrier aggregation(B5&B12/B5&B17/B8&B20/B18&B28)

Wideband Impedance Matching Component Datasheet_Ver.1.4

RND Center, EMW / 2014-03-14Note : All specifications are subject to change without notice. 5/5

Application note

Part No (EMW)

Part No (EMW) EWM-3025-F0630EA0 

     E  WM    -   3025  -   F0630         E     A     0 

    (1)  (2)           (3)        (4)           (5)   (6)    (7)

(1) EMW   

(2) series : Wideband impedance  Matching component

(3) Dimensions    First two disits :  length(mm)

                      Last two disits : Width(mm)

(4) Matching band frequency       F : Fequency

                                  First two disita  : 0.6GHz

                                 Last two disits :  3 GHz   

(5) Packaging      P : Embossed   paper tape

                    E : Embossed  plastc tape

(6) termination   N : nickel barrier

                    A : Au plating

(7) Version Nomber 

As L2 decreases, the resonant frequency near 700 MHz increases.

Available values of L1 and L2 are 4.7 nH up to 15 nH .

Metal ground under the area of chip, L1 and L2 must be removed.

As the value of the antenna GND inductor increases, the radius of the impedance locus

increases and the resonant frequency at BandⅠ shifts toward the higher frequency side.

As the value of L1 decreases, the resonant frequency near 900 MHz shifts toward the higher

frequency side.

[Unit : mm]

TOP VIEW

Chip

L2

L1

Ant feed and GND PAD

Ant GND inductor (or 0ohm)