laser cutting of flex circuits - lpkf laser & electronics · laser cutting of flex circuits . 2...
TRANSCRIPT
1 © 2011
Completed Circuits, Cover Layer and Rework on Flex
Laser Cutting of Flex Circuits
2
1. Technological Requirements
Josh Brown Market Development
Representative
3
Questions 1. Technological Requirements
4
Topics
© 2009
Systems
Other Capabilities Cover Layer Rigid-Flex Decap Skiving & SMT Etching
Depaneling Accuracy Materials Speeds
Laser Processing Overview
5
Laser
© 2009
355 nm
± 4 µm X/Y, Repetition Accuracy
6
Depaneling Flex Boards
© 2009
7
Materials
Flex Materials • Polyimide – Kapton & Akaflex • PET • Pyralux (Teflon/Polyimide combo)
© 2009
Other Materials • FR4 and epoxy laminates • Rogers • Ceramics • PTFE • Aluminum, Copper
Etching • Copper, brass, aluminum
8
- - - - o
o o o + o/+
- o o + -
+ + + o ++
+ o/+ o/+ ++ +
Overview Sales Arguments, Advantages
Stress Accuracy & Precision Yield Speed Versatility
Hand Cut
Routing
Die Cut
UV Laser
CO2 Laser
9
What is you primary depaneling concern?
© 2009
10
1. Technological Requirements Mechanical Stress
Mechanical depaneling methods
• Die punching, routing and hand cutting
• Introduce mechanical stress
• Stress can cause
• burring and deformation
Laser Cutting
11
Thermal Stress Pulsed CO2 UV (3x Nd:YAG)
•Passes: 4
• Effective cutting speed: 860 mm/s
• Cut width: 120 μm
•Passes: 1
• Effective cutting speed: 95 mm/s
• Cut width: 30 μm
CO2 vs UV - Cutting of Polyimide (Kapton®) 125 micron
12
1. Technological Requirements
Accuracy & Precision
Method Cut Widths
Hand Cut Not good!
Routing 1 mm
Die Cut 1 mm
Dicing Saw 0.5 mm
UV 25 μm
CO2 120 μm
13
1. Technological Requirements
Finer Features
5.5 cm
1 mm
14
Arbitrary Shapes
© 2009
15
Fiducial Recognition Camera
16
Yield (Mounting Density)
© 2009
• Tool width + allotted zone for
stress = cut width
Smaller Cut Width:
• More boards per panel
• Components closer together
17
1. Technological Requirements
Cutting Speed
5.5 cm
18
0
50
100
150
200
250
300
0 25 50 75 100 125 150 175 200
Pote
ntia
l Cut
Spe
ed (m
m/s
ec)
Polyimide Thickness ( µm)
Polyimide Cutting Speeds
© 2009
19
Rigid-Flex Cutting
20
1. Technological Requirements
Versatility: Design Freedom
21
Application: Drilling of FPC Multilayer
Polyimide-multilayer (350 micron thick, Cu + PI + adhesive)
• 50 micron -> 85 holes / sec
• 75 micron -> 50 holes / sec
• 100 micron -> 40 holes / sec
Benefits of Laser Drilling
• No delamination
• High positional accuracy
• Ideal drilling geometry
22
Trends
© 2009
Board Trends
• Smaller/miniaturization
• Higher component densities
• Arbitrary cut contours
23
Other Capabilities
© 2009
Other Capabilities Other Capabilities
Cover Layer Rigid-Flex Decap
Skiving & SMT Etching
24
Cover Layer Cutting
© 2009
25
Application: Cover Layer Cutting
• Cover layer: 12 µm PI, 15 µm Adhesive
• Total length of cutting contour: 9760 mm (384``)
• Layout size: 246 mm x 236 mm
• Total count of pads: 646
• Time : 29,7 s/sheet
26
Skiving
© 2009
67 μm
27
Application: Opening of Solder Resist and Cover Foil
150 µm 75 µm
100 µm 200 µm
28
Application: Flying Leads
29
1. Technological Requirements
Skiving & Depaneling, Single Step
Rigid
Flex Connector
Methods
30
Rigid-Flex Decap
© 2009
Laser Decap Mechanical Decap
31
Laser Etching
© 2009
• Successful structuring on polyimide
• Previously only possible on rigid substrates
• New development, but an important step in the evolution of laser processing of flex circuits
32
Equipment and Tooling Costs
+ +
o o
o -
- +
- +
© 2009
Equipment Cost Tooling Cost
Hand Cut
Routing
Die Cut
UV Laser
CO2 Laser
33
1. Technological Requirements
Tooling Costs
Tool Tool Cost Lead Time
Hand Cut Scissors/ Pizza Cutter + Days
Routing Bits - Days/weeks
Die Cut Custom Die - Weeks
UV n/a + n/a
CO2 n/a + n/a
34
What is your annual production level?
© 2009
35
System in Action
© 2009
36
MicroLine Family
ML 6120 P ML 6120 S
ML 1120 S ML 1120 P
37
Automation Options
38
Service Work
© 2009
• Routing
• Skiving
• Drilling
• Depaneling
www.a-laser.com
39
Q&A
For more information after the presentation, please contact: Mirela Orlowski – Sales Engineer (503) 454-4249 ǀ [email protected]
40 © 2010
MicroLine 6000P Features
Material handling • Vacuum table • Constant vacuum during complete process • Different underlayer material (e.g. sinter, honeycomb) • Areas to fix stopper and pins • Loading / unloading speed 1m / sec