Kingtron Electronics Co.,Ltd.晶強電子股份有限公司

COF Presentation (I)COF Presentation (I)

1.Address: No.32,Kuang Fu North 1.Address: No.32,Kuang Fu North Road,HuRoad,Hu Kou,Kou,ShinShin--ChuChu Industrial Industrial Park,ShinPark,Shin--Chu,TaiwanChu,Taiwan R.O.C.R.O.C.新竹工業區光復北路新竹工業區光復北路3232號號

2.Phone: 032.Phone: 03--597080859708083.FAX: 033.FAX: 03--59719195971919

Prepared by Andy Andy JongJong (2002.NOV.20)

ContentsContents

Topic 1: Topic 1: COF Tape advantagesCOF Tape advantages

Topic 2: Topic 2: LCD Module trendLCD Module trend

Topic 3: Topic 3: Low Cost SolutionsLow Cost Solutions

Topic 4: Topic 4: ILB and OLB for COF tapeILB and OLB for COF tape

Topic 5: Topic 5: COF tape Capability in COF tape Capability in

KingtronKingtron

Topic 1 : COF tape AdvantagesTopic 1 : COF tape Advantages

比較比較COGCOG、、COFCOF及及TCPTCP的結構差異的結構差異性，並介紹性，並介紹COFCOF的的LCDLCD模組優點。模組優點。

The Driver IC Package Trend of LCD ModuleThe Driver IC Package Trend of LCD Module

No bending slit

Future: COFAdvantages:(1) Fine line capability(2) Light&Thin (3) Simplify assembly

procedure(4) Low cost

Bending slit

STN-LCD Now: COG

Driving force: Color/Larger Panel/High resolution/Light&Thin/Low cost

Driving force: Low cost/Fine pitch

TFT-LCDNow: Flex-TAB

COF tape Structure

Eutectic bonding

ACF bonding

連接PCB或連接器(Input side)

被動元件(Passive)

二層Tape (2-layer : PI 38um, Cu 8um)

連接LCD面板(Output side)

驅動IC (LSI)

片狀

捲帶

STN LCDTFT LCD

Advantages of COF (Structure and Properties)Advantages of COF (Structure and Properties)

Flex-TCP COF

Adhesive (12 um)PI (75 um)

Leads are floating in the air.1. No device hole

↓No custom tooling needed

Short development cycle timeThinner & Finer patterning pitch

（Patterning under die & stagger connection）

Cu (8 um)

PI (38 um)

Leads are supported by PI

No flex slit needed.

Die

Cu (18um)

1. Device hole & Fingered leads

2. 18 um copper & 75 um polyimide

3. Laminated structure with adhesive

2. Flexible by thin film

↓

8 um Copper, 38 um Polyimide

↓

Fine pitch patterning No need of flex slit

Film

3. Adhesive free

↓

Higher dimensional stability

due to no stress by lamination

COF Tape Design ApplicationCOF Tape Design Application

No limit for COF tape pattern design and easy to make fine pitch connection

No limit for COF tape pattern design and easy to make fine pitch connection

TCPTCPFlying Flying LeadLead

Min. pitch = 45um

COF COF Stagger Stagger bondingbonding

Min. pitch = 30um

COF COF Patterning Patterning under dieunder die

COF Technology (COF Advantages) COF Technology (COF Advantages) TCP COF

Tape Structure 3 layer tape G 2 layer tape EFlex structure Flex slit required Flexible by itself. No flex slit required. Patterning under die with flying lead G No flying lead and no pattern shape limit for design E

Fine patterningup to45 um min.Limit at 40 um with 15 um copper

GUp to 30 um. (8 um copper)Limit at 25 um.

E

Chip shrink up to 45 um pad pitch G Less than 30 um pad pitch is possible E

Tape shrink Tends to become larger as parallelpattern run at flex slit.

GFlexible patterning allowed as SEC's gate driver.Fanning out of pattern throughout the tape face isallowed. These will results saving tape size.

E

Tolerance+-0.09% due to residual stress inlamination.

G +-0.05% for stress-free process for non-lamination. E

Lead breaking at flexSn-void and/ir attack to copper for platingafter SR coating. (Preplating is available.)

G No worry for preplating process. E

Bending strength 50 times (S-C-Flex) G 80 or more times; can be bend at 180o small angel EOverall realibility Field proven for years. E Equal or more to TCP. E

Package design being standard in the industry. GLighter, thinner, smaller design than of TCP ispossible.

E

Mother board connection ACF or soldering connection. E ACF connection. Soldering will be difficult. G

Singluation (stamping) 75 um (PI) + 18 (15) um (Cu) E New stamping technology can be implemented byuser for 38 um (PI) with 8 um (Cu) tape.

G

Tape feed 75 um (PI) + 18 (15) um (Cu) EA new feeding technology required for 38 um (PI)with 8 um (Cu) tape. It can be implemented easlily.

G

Tape TAT 2 Wks G 1 Wk E

Tooling charge Device hole tooling is required. G No device hole tooling. (samples, photo mask and SR setup.) No alignment hole required. E

Application Matured products E Big growth up in Japan and Korea ECost impact for fine pitch Fine pitch tape is more expensive. F There will be no big impact to price for finer pitch. E

Design/Specifications

Quality/Properties

LCM packaging

Others

Topic 2 : LCD Module TrendTopic 2 : LCD Module Trend

從日本、韓國對從日本、韓國對LCD ModuleLCD Module的觀點的觀點來探討來探討STNSTN及及TFTTFT模組的發展趨勢。模組的發展趨勢。

STN Color LCD Current

Replace rigid board → Thinner and Lighter

Latest Needs forLatest Needs for STNSTN color LCD Modulecolor LCD Module

200um pitch → COF 80um pitch → COF 40um pitch

Design rule Main color LCD

Back light

Sub B/W LCD

Control IC

Control IC•Finer pitch•CSP → Flip Chip

Rigid board (4 layer)

•Unification of main and sub LCD’s → Common back light•Reducing SMT area

2001 3Q~•Thinner and Lighter•Rigid board → COF 2002 2Q~

Double side COF

Driver IC(2chips) with TAB 1 chip

Driver IC with TAB

>200um pitch>200um pitch 80um pitch80um pitch 40um pitch40um pitch

Latest Needs for Latest Needs for TFTTFT color LCD Modulecolor LCD Module

COG → COF

* Narrower flame → Increasing indication area* More complicated pattern on glass → Lower yield

TFT color LCD Current 2002 2Q~

Power supply IC

Driver IC

•Finer pitch•CSP → Flip Chip

•Multicolored 256→65,000 colors•Needs controller IC

Driver IC

Control IC

Power supply IC

•Narrower flame•Driver IC on Flex board COG → COF

Design rule

Control IC

>150um pitch>150um pitch 80um pitch80um pitch 40um pitch40um pitch

Color TFT LCD Module Color TFT LCD Module -- COF sample spec.COF sample spec.

5.COF ILB之後需測試 (probe card)

6.Component SMT: 印錫膏 (Stencil)

7.成型模具:將捲帶衝成片狀 (punch tool)

以上為可能發生的Tooling charge

1.Tape: 48SW,10孔,單面,鍍錫

2.ILB pitch: 38/40/45/50/55 um (COG+COF)38/40/45/50/55 um (COG+COF)

3.SMT component: 有24個及10個兩種

4.Stiffener貼付:需要

2002.APR.1

36mm

29mm

10mm

20mm

Topic 3 : Low Cost SolutionsTopic 3 : Low Cost Solutions

根據根據LCD ModuleLCD Module的發展趨勢所衍的發展趨勢所衍生出的製程問題，尋找新的低成本生出的製程問題，尋找新的低成本解決方案。解決方案。

LCD Module LCD Module –– 降低成本的對策降低成本的對策

(1)

1. 設計: 採用高良率及穩定的通用製程(減少修補)；減少材料耗用

2. 元件: SoC及fine line/fine pitch

3. 材料: 減少面積及多利用細線能力

4. 組裝: 減少ACF使用面積及組裝次數

5. 模具: 整合上下游製程，減少開模

(2)

Cost down SolutionsCost down Solutions

1. Gate IC與Source IC同側、COG+COF 面板窄框化、省Tape成本(節省一塊FPCB)

2. 晶片製程微縮 : [1] Slim Square : 增加IC產出數量(5%)

[2] Peripheral pad Array pad : 減少tape面積

晶片功能整合 : [1] 整合Power IC,RAM,Control IC,Capacitor等周邊元件(節省總體IC的總成本)---晶片變大,

I/O變多

3. Tape : [1] 以COF取代TCP,FPC,PCB : 細線路節省Tape使用面積及分段組裝的費用

[2] 使用便宜的材料及尋找便宜的Source

4. Assembly : [1] ILB : (1) Sn/Au Eutectic 取代 ACF (2) Reel 取代 Piece

[2] OLB : (1) 保持soldering , 減少ACF的使用量 : 使用Hot bar assembly

[3] SMT component : 將SMT component加入於COF tape中

COG COG 優缺點比較優缺點比較

缺點:

1. 1. Fine pitch (<40um)Fine pitch (<40um)無法達到無法達到→ 晶片需微縮以降低成本，無法跟上IC趨勢。→ RSDS設計可達省電目的，但需細線製程。

2. 2. ReliabilityReliability問題問題→ 只能使用ACF，無法使用Eutectic bonding。→ fine pitch時，接觸的導電粒子數目少且微細的

導電粒子製程能力受限，成本高。→ ITO導電層電阻大及ACF接點導電性差。

3. 3. 晶片尺寸佔用面板面積晶片尺寸佔用面板面積→ 因應整合晶片趨勢，達到降低成本目 的，晶片

尺寸會變大，若使用fine line製程縮小晶片尺寸，則又面臨fine pitch及reliability問題。

4. 4. KnownKnown Good DieGood Die問題問題→ 若應用在大尺寸面板，KGD問題變大。

5. 5. 線路變更設計問題線路變更設計問題→ 牽涉到面板光罩變更，減少面板設計的彈性。

6.6. 玻璃平坦性問題玻璃平坦性問題→ 當玻璃厚度逐漸降低時，維持玻璃在高溫高壓

下組裝的平坦性困難。

優點:

1. 1. ICIC底下可自由設計線路及底下可自由設計線路及array bumparray bump型式型式→ 相較於TAB具有更高的設計彈性。

2. 使用使用FPCFPC，，tapetape成本較低廉成本較低廉

3. 與面板一起測試，可省與面板一起測試，可省IC/Tape/AssemblyIC/Tape/Assembly分開分開測試的成本測試的成本

4. ILBILB及及OLBOLB的部份均可自行組裝，技術來源相的部份均可自行組裝，技術來源相同同，，可節省製造成本。可節省製造成本。

5. 較較TABTAB具有細線路能力及具有細線路能力及tapetape不易變形，但細不易變形，但細線能力則較線能力則較COFCOF低低

6. 節省節省TapeTape及封裝的及封裝的lead timelead time

SMT元件

驅動ICFPC軟性電路板

The Properties Comparison of various SubstratesThe Properties Comparison of various Substrates

Substrate : TAB COF FPC PCB _ Finish Plating : Tin Tin or Ni/Au Solder or Ni/Au Solder or Ni/Au

ILB : Eutectic Eutectic or ACF --- ---OLB : soldering ACF (soldering) Soldering (ACF) Soldering (ACF)

SMT assembly : --- Solder paste printing Solder paste printing Solder paste printing

Flexibility : Need slit hole Bending no limit Curve bending ---Multi-layers : One layer One or Two layer 2~4 layer Multi-layersFlying Lead : OK --- OK ---Fine pitch : 45um 30um 150~200um 150~200umFormat : Reel Reel or Piece Piece Piece

Substrate : Substrate : TAB TAB COF COF FPC FPC PCB PCB _ _ Finish Plating : Finish Plating : Tin Tin TinTin or Ni/Au Solder or Ni/Au Solder or or Ni/Au Solder or Ni/Au Solder or Ni/AuNi/Au

ILB ILB : Eutectic : Eutectic EutecticEutectic or ACF or ACF ------ ------OLB : soldering ACF (soldering) OLB : soldering ACF (soldering) Soldering (ACF) Soldering (ACF)Soldering (ACF) Soldering (ACF)

SMT assembly : SMT assembly : ------ Solder paste printing Solder paste printing Solder paste printing Solder paste printing Solder paste printingSolder paste printing

Flexibility Flexibility : Need slit hole Bending no limit Curve bending : Need slit hole Bending no limit Curve bending ------MultiMulti--layers : One layer One or Two layer 2~4 layers : One layer One or Two layer 2~4 layer Multilayer Multi--layerslayersFlying Lead : OK Flying Lead : OK ------ OK OK ------Fine pitchFine pitch : 45um 30um : 45um 30um 150~200um 150~200um 150~200um150~200umFormat : Reel Format : Reel ReelReel or Piece or Piece PiecePiece PiecePiece

TAB Eutectic bonding

TAB Eutectic bonding

TAB ACF bondingbonding

TAB + FPC soldering

TAB + FPC soldering

TAB ACF

COF SMT assembly

COF SMT assemblyFPC SMT

assemblyFPC SMT assembly FPC + COF

solderingsolderingFPC + COF

COF Eutectic (or ACF) bonding

COF Eutectic (or ACF) bonding

COF ACF bonding

COF ACF bonding

COG ACF bonding

COG ACF bonding

COF + PCB soldering (or

ACF bonding)

COF + PCB soldering (or

ACF bonding)

Power IC

Memory IC

Passive

Driver IC

Driver IC

COG

COF

COF (30um)

TCP (45um)

Low Cost solutions for LCD driver IC Low Cost solutions for LCD driver IC

SoC solutionsolutionSoCSoC solution整合數顆周邊IC,降低IC總成本 IC 變大

Driver ICDriver IC

Fine line solutionFine line solutionFine line solution使用細線路製造,增加每片晶圓的IC產生量,降低每顆IC成本

IC 變小線路變密

Low Cost and Short Lead timeLow Cost and Short Lead time

Alignment hole

Flexible to 2-layer COF

設計重點:

1. 1. No alignment holeNo alignment hole→ 能夠不設計alignment hole最佳(利用Tape透光的

特性，設計無實孔的孔環)，可省模具費(~NT20萬)及縮短交期(10~14天)

2. 2. Tin Plating instead of Gold platingTin Plating instead of Gold plating→ 鍍錫為化學錫，不需拉導線及切導線，易於線

路設計縮小tape面積，可省鍍金成本及二次衝孔的模具費用並可縮短交期。

→ 若考慮面板及PCB端需鍍金及信賴性考量而無法避免二次衝孔，建議使用選擇性鍍金鍍錫板

3. 3. Eutectic bonding for ILBEutectic bonding for ILB→ 採用錫金共晶的方式，產品信賴度高且省去使

用昂貴的ACF材料成本，尤其對於大面積的SoC 晶片，效果驚人。

4. 4. Fine line/Fine pitch/Flexible designFine line/Fine pitch/Flexible design→ 多利用COF的製程能力特性，將線路設計於

40~60um pitch之間以節省tape面積。→ 除非必要，否則避免使用雙面的COF tape或將

COF的Input端開天窗，將大幅增加tape成本，儘量利用可撓的特性將tape局部反折成類似雙面COF使用。

5. 5. SoCSoC SolutionSolution→ SoC不僅可節省元件的總成本、因元件個數減

少，也可節省 tape面積及組裝費用。* 一般tape是以面積(或孔數)計價，組裝則以顆數

計價，測試則依時間計。

6. 6. No complicate assembly designNo complicate assembly design→ 目前的產業結構及能力尚無法做複雜的組裝(如

兩顆COF eutectic ILB、Reel SMT assembly、Chip的兩側做SMT assembly等)

→ 適當地利用COG及COF組合

How to cost down TFT driver IC ?How to cost down TFT driver IC ?

Source IC

Gate IC

設計重點:

1. 1. 減少減少fan outfan out的寬度的寬度→ 使用fine line/fine pitch，將目前的50um改成

38um，寬度減少24% (Tape可由48SW改成35SW)，可省下25%的Tape成本。

→ 使用COF tape才能達到<40um pitch而不增加成本

2. 2. 使用使用COF tapeCOF tape取代取代flexibleflexible--TCPTCP→ 利用COF tape的可撓性取代TCP tape的兩個

slit，使原來的Tape長度(5~6孔)縮短(4~5孔)，可省下20%的Tape成本。

3. 3. IC Pad IC Pad 使用使用 fine pitch fine pitch 設計設計→ 不管是core limited或pad limited，使用fine pitch

可增加線路layout的彈性，避免fan out過大而增加Tape成本。

→ 使用RSDS設計可簡化線路layout並且達到降低EMI及省電的功能。

4. 4. Source ICSource IC可採用可採用0.25um 80.25um 8吋晶圓設計吋晶圓設計→ Source IC使用5~15V的低壓製程，可利用較高

效率的0.25um 8吋晶圓微縮以降低IC成本，Gate IC需高壓高電流需求，較困難。

5. 5. SoCSoC SolutionSolution→ 儘可能合併其它IC元件、因元件個數減少，也

可節省 tape面積及組裝費用。* 一般tape是以面積(或孔數)計價，組裝則以顆數

計價，測試則依時間計。

Topic 4 : ILB and OLB for COFTopic 4 : ILB and OLB for COF

ILB ILB 及及 OLB OLB 的組裝方式及製程優的組裝方式及製程優缺點介紹，並提出合適的建議方案缺點介紹，並提出合適的建議方案

ACF connection & ACF connection & SnSn--Au joint for ILBAu joint for ILB

Die

Substrate

~180oC

Pressure

1. Particle size& reliability2. Fine pitch capability

1.ACF connection:

Bond tool ~500oC

Stage 100~200oC

Bond tool ~250oC

Stage ~450oC

TCP COF

2.Sn-Au joint: 3. Tape 熱脹縮問題(PI之CTE、Tg 物性?)

1. Tape 熱脹縮問題(PI之CTE、Tg 物性?)

2. ILB Eutectic bonding問題(Sn/Au共熔點? bond tool&Stage溫度、時間、outgasing?)

鍍層型態與高密度模組的應用

接點: 鍍鎳金

接點: 鍍鎳金

內腳: 鍍錫

SMT Pad 鍍錫

選擇性鍍金、鍍錫板鍍錫板

插卡或焊接

鍍金板

1. 鍍金板的優點: 導電性好及不易氧化； 缺點: 無法進行Eutectic bonding及成本高(厚金及二次衝孔)

2. 鍍錫板的優點: 可進行fine pitch的Eutectic bonding及成本較便宜；缺點: 易氧化、錫鬚及不易保存問題

3. 選擇性鍍金鍍錫板的優點: 兼顧fine pitch製程能力及信賴度、保存問題，價格低於鍍金板但高於鍍錫板

1. 鍍金板的優點: 導電性好及不易氧化； 缺點: 無法進行Eutectic bonding及成本高(厚金及二次衝孔)

2. 鍍錫板的優點: 可進行fine pitch的Eutectic bonding及成本較便宜；缺點: 易氧化、錫鬚及不易保存問題

3. 選擇性鍍金鍍錫板的優點: 兼顧fine pitch製程能力及信賴度、保存問題，價格低於鍍金板但高於鍍錫板

Topic 5 : COF tape Capability in Topic 5 : COF tape Capability in KingtronKingtron

1. C1. COF tape OF tape 的檢視重點的檢視重點

2. 2. 晶強的製程能力晶強的製程能力

3. 3. 晶強可以提供的優勢及合作模式晶強可以提供的優勢及合作模式

市場競爭力重點

OLB

1.Pattern - (1) Min. Pitch (2) Etching Factor (3) Dimension Tolerance Control

2.Finish - Solderability: (1) ILB (2) OLB - Solder Resist: (1) Position Tolerance

3.Cost- (1) Unit price (2) Tooling (3) ECN

4.Lead Time- Much Shorter Much Better

5.Customer Relationship & Service

Fine line

S/R

The Key Items of COF Capability

5.Solder resist bleeding and Concave

1.Roughness(Front/Side)2.Tin whisker/Abnormal

crystallization(side wall)3.Lead tip shape4.Peeling force

1.Min. pitch/Min. width2.Position accuracy3.Linearity4.Surface impedance

6.SR printing accuracy

Min. Pitch:Min. Pitch: Line Width/Line SpaceLine Width/Line Space/Etch Factor/Etch Factor

T

H

B

Line Space (L/S )

Line Width (L/W)

Cu

PI film

Etch Factor = 2H/(B-T)

H

T

B

1. Min. Pitch = 30 μm (for copper = 8 μm)(Line Width = 15 μm，Line Space = 15 μm)

2. Min. Line Width = 5 μm (Line Top)

3. Min. Line Space = 15 μm (On PI film)

4. Etching Factor > 2.5

1. Min. Pitch = 30 μm (for copper = 8 μm)(Line Width = 15 μm，Line Space = 15 μm)

2. Min. Line Width = 5 μm (Line Top)

3. Min. Line Space = 15 μm (On PI film)

4. Etching Factor > 2.5

COF tape for Car TV COF tape for Car TV –– 38um pitch38um pitch

2

1

34,5,6

7

Key Items:[1] Total Pitch Tolerance (1,2,3) [2] Inner lead pitch capability (4) [3] Solder Resist position and bleeding control (5) [4] Tin plating – tie coat treatment (6) [5] Sprocket hole pitch and deformation (7) [6] Yield rate improvement

Key Items:Key Items:[1] Total Pitch Tolerance (1,2,3) [2] Inner lead pitch capability (4) [3] Solder Resist position and bleeding control (5) [4] Tin plating – tie coat treatment (6) [5] Sprocket hole pitch and deformation (7) [6] Yield rate improvement

Inner Lead and Solder ResistInner Lead and Solder Resist----(38um pitch)(38um pitch)

Inner lead (Front side) SR bleeding

Inner lead (Back side)

Product Product OverviewOverview

台灣驅動IC的產業結構

IC TestingIC Testing

IC ProcessIC Process

IC DesignIC Design

TCP tapeTCP tape

BumpingBumping

捲帶 ILB 封裝

南茂、飛信、頎邦、日月光

LCD Panel Assembly

(OLB Process)

LCD Panel Assembly

(OLB Process)

LCD 面板組裝

大尺寸: 友達、華映、奇美、瀚宇彩晶、廣輝

小尺寸: 南亞、華映、勝華、碧悠、元太、光聯、訊倉、凌巨、 晶采、錸寶、統寶、久正、悠景、昌益、久立、華生、勁佳….

COG tapeCOG tape

COF tapeCOF tape

ILB Process & Product TestingILB Process &

Product Testing

片狀 ILB 封裝

面板廠自行組裝

Tape

IC chipILB

OLB

LCD

流程圖解

IC 設計

聯詠、華邦、奇景、天鈺、世紀民生、凌越、所羅門(晶門)、敦茂、凌陽、盛群、矽創、義隆、聯合聚晶 …

IC 製造

聯電、台積電、華邦、茂矽、漢陽…

IC bumping (長凸塊)

頎邦、福葆、慎立、米其

COG 軟板 (FPC連接帶)

嘉聯益、毅嘉、台郡、百稼、華虹….

TCP 捲帶 (驅動IC基板)

台灣: 亞洲微電、好邦、晶強

日本: Sumitomo Kinzoku、Hitachi Cable、Casio…

TAB/COF/FPC 業者能力比較

TAB COF FPC

70/96mm

模具共用

70/96mmCost依 pin 數

3.製程能力

5“(有效4”)

Cost依 pin 數

[1] Pitch 45um 30um

[2] ILB Eutectic

[3] 出貨 捲帶 捲帶/片狀

Eutectic/ACF

將產能最大利用，不大幅增加成本

不具產能成本優勢節省開發費用及交期

1.寬度 35/48mm 250mm不衝孔無法進入TFT市場2.模治具

[1] 衝孔 不衝孔(也無法衝孔)模具不共用

細線能力及尺寸脹縮控制能力不足

[2] 光罩 5“玻璃光罩 膠片光罩

[3] 印刷 35/48mm 250mm[4] 測試 Cost依 pin 數

細線路能力不足，2003年市場趨勢將 <50um<50um60umFine pitch時，信賴性問題ACF

TFT 或Eutectic bonding需捲帶片狀

How to choose COF tape maker ?台灣TAB廠: 晶強、好邦、亞洲微電

日本TAB廠: Sumitomo、Hitachi Cable、Shindo 、Casio …

台灣FPC廠: 毅嘉、嘉聯益、百稼…

日本FPC廠: Sony Chemicals、丸和3M…

COF tape 供應商產品需求 理由

1. Pitch > 50 um 台灣FPC廠 日本FPC廠

日本FPC廠

日本FPC廠

光阻解析能力不足脹縮能力控制不足

ACF於細線路有信賴度問題；FPC業者無法整捲出貨軟板業者先天上的瓶頸

台灣TAB廠 日本TAB廠

< 50 um 台灣TAB廠 日本TAB廠

2. ILB ACF bonding 台灣TAB廠 日本TAB廠

Eutectic bonding 台灣TAB廠 日本TAB廠

3. 交期 < 4 weeks 本土廠商具有交期及價格的優勢

台灣TAB廠

4. Cost Competitive 台灣TAB廠

Your best choice and alliance partner

設計/打樣/速度 晶強5. Service 晶強具有豐富的製程及設計經驗,可協助客戶擴展客源及快速打樣取得競爭優勢

Your best choice and alliance partner

產業結構—合作的模式

TFT LCD Panel 組裝 (大尺寸)

台灣: 友達、華映、奇美、瀚宇彩晶、廣輝

TFT LCD Panel 組裝 (大尺寸)

台灣: 友達、華映、奇美、瀚宇彩晶、廣輝

TFT/STN LCD & OLED Panel 組裝 (小尺寸)

南亞、華映、勝華、碧悠、元太、光聯、訊倉、凌巨、 晶采、錸寶、統寶、久正、悠景、昌益、久立、華生、勁佳….

TFT / STN IC 設計

台灣: 聯詠、華邦、奇景、天鈺、世紀民生、凌越、所羅門(晶門)、敦茂、凌陽、盛群、矽創、義隆、聯合聚晶 …

: 聯詠、華邦、奇景、

1. Tape (設計與製造)

2. 共同拜訪客戶、專題報告COF Tape (驅動IC基板)

晶強

COF Tape (驅動IC基板)

晶強晶強

TFT/STN LCD & OLED Panel 組裝 (小尺寸)

南亞、華映、勝華、碧悠、元太、光聯、訊倉、凌巨、 晶采、錸寶、統寶、久正、悠景、昌益、久立、華生、勁佳….

TFT / STN IC 設計

台灣 天鈺、世紀民生、凌越、所羅門(晶門)、敦茂、凌陽、盛群、矽創、義隆、聯合聚晶 …

3. Tape module (Turn key service)—粘貼晶片、測試、成型…

4. 新專案共同開發

IC 封裝 (ILB)

南茂、飛信、頎邦、日月光

IC 封裝 (ILB)

南茂、飛信、頎邦、日月光

Thank You !Thank You !

Hope to have the chance to Hope to have the chance to cooperate with you in the cooperate with you in the soon later.soon later.