Interview Session

Self Introduction

Khoo Chun Yong

Malaysian D.O.B: February 6, 1983 Age: 31 years old Horoscope: Aquarius

Born in Klang The Royal City, Selangor, Malaysia

Raised up in Banting, a small town

Biography

Universiti Teknologi Malaysia (UTM) Bachelor of Engineering (Hons) (Mechanical -

Materials) Optimization of Duplex Black Chromium Coating

for Solar Applications

Master of Engineering (M.Eng.) by Research (Mechanical)

Fabrication of Laser Crystal for Electro-Optics Application

National Taipei University of Technology (NTUT), Taipei, Taiwan Ph.D., Department of Energy and Refrigerating Air-

Conditioning Engineering Experimental Study on the Moisture Removal of

Wafer Carrier

Educational Background2001

|2006

2006|

2009

2009|

2014

Languages + Dialects

Employment History1. Company Name : Center for Cleaning Technology (CCTR), National Taipei University of Technology Position Title : Field Certifier / Third Party Verification Examiner Specialization : Field certification - Biological safety cabinet / Third party verification - Biological safety

laboratory, Hospital, Pharmaceutical, Clean spaces, etc. Industry : Building Services Duration : September 2009 Present Work Description Responsibilities : Perform various performance tests identified in the NSF/ANSI Standard 49

Perform various performance tests identified in the ISO 14644 Standards, Standards/Guidelines published by CDC TW, etc.

Employment History2. Company Name : Shimano Components (M) Sdn. Bhd. Position Title : Industrial Interns & Junior Engineer Assistant Specialization : Value Engineering (Heat Treatment Low Carbon Steel) Industry : Manufacturing Duration : January 2005 June 2005 Work Description Responsibilities : Perform product failure testing and analysis.

Monitor product quality improvement project. Initiate course information and materials for internal employees job training. Develop work instructions for heat treatment processes of various steel parts.

Employment History

3. Company Name : Airgate (M) Sdn. Bhd. a. Position Title : Site Supervisor Specialization : Clean Space Industry : Consultation and Construction Duration : March June 2004 Work Description Project Involved : Construction of Spray Paint Production Line (in Ipoh) Responsibilities : Supervise the progress of clean space construction including various performance

testing, rectification of structure defects or uneven finishes checking based on engineering drawing, approval rules and clients notification.

Prepare handover documents for main contractor and client. Involve in the testing and commissioning of at-rest clean space

Part of My Thesis

EXPERIMENTAL STUDY ON THE MOISTURE CONTROL IN WAFER CARRIER

PRESENTED BY: KHOO CHUN YONG

GUIDING PROFESSOR: PROF. HU SHIH-CHENGDATE: JULY 31, 2014

Introduction

Front Opening Unified Pods (FOUPs), the polymeric-based wafer carrier, have three (3) critical performance functions:

1. The FOUP must exhibit precise wafer access for reliable, high throughput wafer transfer.

2. The FOUP must provide secure wafer protection, keeping the wafer isolated from contamination and damage due to mechanical or electrical effects.

3. The FOUP must enable reliable interoperability with process tools and automated material handling systems (AMHS)

(Niebeling, 2000)

10

Introduction

Moisture inside a FOUP is also a problematic contaminant : More difficult to be expelled than oxygen - ingress of moisture through the wall

surfaces of the polymeric based FOUP. Polarity - moisture adsorbs onto metallic surfaces strongly relative to other

gases, cannot be effectively removed with inert gas purging. Strong hydrogen bonding ability - moisture can attract polar contaminants to the

surface.(Rana et al, 2003 ; Verghese et al.,1999)

11

Introduction

FEOL Process Impurities

Oxygen Moisture Organic Acid Dopant

Copper seed to plate

interface

X X X

Exposed copper corrosion X X X X

Gate oxide X X X

Hemispherical grained

(HSG) poly-Si

X X X

Ultra shallow junction X X X X

SiGe epitaxy (EPI) X X X

EPI / Pre-EPI X X X

Salicide / contact formation X X X X

Table: Advanced processes (below 45 nm node) with high sensitivity to impurities.

12

Introduction

Transition of 300 mm towards 450 mm wafer manufacturing, thestringent cleanliness requirement of a 450 mm wafer FOUP includes:

AMC, Oxygen ( 100 ppm), and moisture contents (relative humidity, RH 5%) (ITRS, 2013)

Studies and investigations reported on 450 mm FOUP and other correlated mechanical devices are considered scarce.

Hence, it is believed to be beneficial in studying and developing the state-of-the-art for the associated hardware.

13

Objectives

The objectives of the study are as follows:

450 mm PC FOUP To investigate the effect of CDA purging rates on purging efficiency.

300 mm FOUP To investigate the effect of different base materials on purging

efficiency.

14

Experimental parameters

* Only one Logger was drawn due to the simplification of schematic diagram.

* (5 pieces)

Parameter 300 mm FOUP 450 mm FOUP

Material base PC (alpha version)LCP (alpha version)

Barrier (Commercial)

PC (alpha version)

CDA Flow rate 15 to 105 LPM 30 to 180 LPM

No. of inlets/ outlets

2inlets-2outlets, 2inlets-2outlets,

Purging time 30 minutes 30 minutes

Recovery time 90 minutes 90 minutes*Alpha version: a preview version or an early version of aproduct that under the development status, most likely unstable,but is useful to show what the product will do to a selectedgroup. [Wikipedia]

Moisture Transmitter

WaferDiameter 300 mm 450 mm

Thickness 775 m 925 m

Area 706 cm2 1,589 cm2

Volume 32 L 73.5 L

Weight 125 g 342 g

10 mm Die /Wafer

640 1490

15

Results and Discussion

16

1. Moisture Depletion in 450 mm PC FOUP

TCRI

TCRI =FOUP Volume (L)

Flow Rate (LPM) X 60 (sec)

17

2. Moisture Depletion in 300mm PC FOUP (based on testing conditions)

18

19

20

Conclusions

For a 450 mm PC FOUP, Higher purging rates of CDA demonstrate favorable moisture

depletion rate within the spaces between wafers in a fully loaded FOUP. - Convection of purging gas : dominant mode of mass transfer in early stage, and - Diffusion of purging gas into the tiny spaces between wafer slots later

21

Conclusions

For 300 mm FOUPs, Base materials show significant effects on purging efficiency.

Moisture decay trend: PC

Thank you for your attention.

Q & A

kcybiz@gmail.com

Khoo Chun YongBiography Educational BackgroundLanguages + DialectsEmployment HistoryEmployment HistoryEmployment HistoryPart of My ThesisExperimental Study on the Moisture Control in Wafer CarrierIntroductionIntroduction Introduction Introduction ObjectivesExperimental parametersResults and Discussion1. Moisture Depletion in 450 mm PC FOUP2. Moisture Depletion in 300mm PC FOUP (based on testing conditions) Slide Number 19Slide Number 20ConclusionsConclusionsThank you for your attention.Q & A