key benefits of the carbon fiberkey benefits of the carbon fiber composite … · 2011-02-04 ·...
TRANSCRIPT
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KEY BENEFITS OF THE CARBON FIBERKEY BENEFITS OF THE CARBON FIBERCOMPOSITE IN A PRINTED CIRCUITCOMPOSITE IN A PRINTED CIRCUIT
BOARD AND A SUBSTRATEBOARD AND A SUBSTRATE
PRESENTED BY:
KRIS VASOYA, VP Engineering (THERMALWORKS)
ON BEHAF OF HUNTER TECHNOLOGY
NASA/JPL Science Forum, August-06
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Outline
Electronics Challenges
What is Carbon Fiber Composite Material
Test data of the Carbon Fiber Composite
How to use Carbon Fiber Composite in PCBs
Benefits of the Carbon Fiber Composite in PCBs
Conclusion
NASA/JPL Science Forum, August-06
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Challenges of the Electronics
The electronics Industry is facing challenges such asHOT SPOT
CTE mismatch,solder joint stress,
thermal fatigue failureshock and vibration issues,
“SMALLER, FASTER, LIGHTER”
NASA/JPL Science Forum, August-06
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Thermal & Thermo-mechanical material
Carbon Fiber Composite is used today in PrintedCircuit Boards and Substrate to address these issues.
Carbon Fiber Composite is also known asSTABLCOR® Laminates
NASA/JPL Science Forum, August-06
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What is Carbon Fiber Composite?
Made of Continuous Carbon Fiber reinforced with resin matrix
It is a thermally & Electrically Conductive Composite Material
It has very good In-plane Thermal Conductivity
It has low In-plane CTE (1-5 ppm/C)
It can be used as a plane layer, Preferably GND plane
Carbon Composite core
Copper
Copper
CCL
NASA/JPL Science Forum, August-06
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CTE – Carbon Composite
In-Plane CTE
CTE vs TemperatureMaterial: ST325-EP450 Unclad
-4-202468
1012141618
-60 -40 -20 0 20 40 60 80 100 120 140
Temperature (C)
CT
E(p
pm/C
)
X1 Direction X2 Direction Linear (X2 Direction) Linear (X1 Direction)
Composite CTE (0-3 ppm) overTemp. range of -50C to +130C
12 to 16Non-PTFE Ceramic(RO4000)
17.00PTFE Ceramic (RO3000)
9 to 12Non Woven Aramid/Epoxy
15 to 19Polyimide/E-glass
16 to 20FR-4 / E-glass
In Plane CTE(ppm/C)DIELECTRIC MATERIAL
NASA/JPL Science Forum, August-06
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CTE – Carbon Composite
209.57°C145.35°C
Alpha=42.1µm/(m·°C)
254.48°CAlpha=102µm/(m·°C)
Tg
-0.002
0.000
0.002
0.004
0.006
0.008
0.010
Dim
ens
ion
Ch
ange
(mm
)
0 50 100 150 200 250 300
Temperature (°C)
Sample: Tg and CTE test for CCLSize: 0.7159 mmMethod: Ramp TMA
File: C:\TA\Data\TMA\Stablcor substrate.008Operator: BPRun Date: 12-Sep-2005 17:38Instrument: TMA Q400 V7.1 Build 89
Universal V4.2E TA Instruments
P/N: ST325-EP450
Through Plane CTE
201.8734.82
209.5742.11
Tg (°C)Z-CTE before Tg(ppm/oC)
Runnumber
Z-axis CTE measurement by TMA method50 to 55
Non-PTFE Ceramic(RO4000)
25 to 40PTFE Ceramic (RO3000)
110 to 120Non Woven Aramid/Epoxy
50 to 55Polyimide/E-glass
55 to 60FR-4/E-glass
ThroughPlane CTE
(ppm/C)DIELECTRIC MATERIAL
NASA/JPL Science Forum, August-06
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Thermal Management, CTE, Stiffener Material Comparisons
2.73.7525150Aluminum 6061 T6
1.65 to1.711 to 401 to 5
X,Y:75 to 250,Z:3/5
Copper Clad CarbonComposite (STABLCOR®)
8.906.4017.00385 to 400Copper C11000 full hard
2.703.7625150Aluminum 5052
1.7 to 1.830 to 35-0.418 to 12Low Modulus Carbon Fiber*
2.1 to 2.2100 to 130-1.5300-620High Modulus Carbon Fiber*
1.25 to 1.32 to 2.19 to 120.2 to 0.3Non Woven Aramidcomposite
9.8 to 10N/A6 to 8180 to 220Copper-Molybdenum-Copper (CMC)
9.9018 to 195 to 620 to 30Copper-Invar-Copper (CIC)
8.9012 to 1617 to 19385 to 400Heavy Copper
Density(g/cc)
TensileModulus (Msi)
IN-PLANE CTE(ppm/C)
Thermal Conductivity(W/m.K)MATERIAL
Thermal Management, CTE Control, Stiffener Materials Comparison
NASA/JPL Science Forum, August-06
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Carbon Composite Material Availability
RAWMATERIAL
THERMALCO NDUCTIVITY
(W/m*K)
CTE(ppm/C)
DENSITY(g/cm3)
TENSILEMO DULUS
(msi)
Standard CoreThicknesses
(Inch)
ST 600* 620.0 -1.15 2.20 130.0 .010"
ST 325* 325.0 -1.15 2.17 114.0 .008", .010"
ST 10* 8.0 -1.10 1.76 34.0 .0045 .006 .009"
FR4 0.3 16-20 1.80 3.5 to 4.5
PO LYIMIDE 0.3 15-19 1.70 3.5 to 4.5
CO PPER 385.0 17.00 8.92 12 to 16
ALUMINUM 240.0 24-25 2.70 10.2
CIC 108.0 5 to 6 9.90 18-19* values represents data of raw fibers
Carbon Fiber Property Comparisons
NASA/JPL Science Forum, August-06
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How is carbon composite used in PCB stack-up?
FR-4
FR-4
CCL
FR-4
FR-4
L2/3
Prepreg
Prepreg
Prepreg
Prepreg
Prepreg
Prepreg
L4/5
GND
L6/7
L8/9
L1
L10
FR-4
FR-4
FR-4
L2*
Prepreg
Prepreg
Prepreg
Prepreg
L3/4
L5/6
L7/8
L9*
L1
L10
FR-4
FR-4
FR-4
Prepreg
Prepreg
L4/5
NF
L6/7
L9/10
Prepreg
Prepreg
L8*
Prepreg
Prepreg
1-CORE 2-CORE 3-CORE
(<0.035”) PCB/Substrate (<0.093”) PCB (>0.093”) PCB
L3*
FR-4 L1/2Prepreg
Prepreg
CCL
CCL
CCL
CCL
CCL
NASA/JPL Science Forum, August-06
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CROSS SECTIONS
1-CORE 2-CORE 4-CORE
6-layer PCB 12-layer PCB3-layer PCB
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Thermal
CTE (Co-efficient of Thermal Expansion)
Rigidity / Stiffness
Density / Weight
The Benefits Of Carbon in a PCB / Substrate
NASA/JPL Science Forum, August-06
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Thermal / HEAT
CARBON IN A PCB
NASA/JPL Science Forum, August-06
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PCB Thermal Path
Heat source
ThermalVia
GroundVia
Isolated via onGround layer
Chassis
PCBMountingScrew
PCBMountingScrew
CarbonComposite
NASA/JPL Science Forum, August-06
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ThermalVia
GroundVia
Isolated via onGround layer
Wedge Lock
Wedge Lock
Ground Pin
ThermalVia
EdgePlating
Hea
tsourc
e
MILLING STEP
HIGH LAYER VME CARD
VMEVME -- Wedge LockWedge Lock
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THERMAL PATH
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PCB acts as HEAT SPREADER
FR4 PCBComposite PCBComposite PCB FR4 PCB
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THERMAL – PRODUCT LEVEL
*>124.9°F
*<68.0°F
70.0
80.0
90.0
100.0
110.0
120.0
Composite PCB – 1G module
FR4 PCB – 1G module
NASA/JPL Science Forum, August-06
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Co-efficient of Thermal Expansion
CARBON IN A PCB
NASA/JPL Science Forum, August-06
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CTE Associated with Package Type
IC PACKAGE TYPE
Organic Packages (CTE: 16-19ppm/C)
Ceramic Packages (CTE: 6-8ppm/C)
Flip Chip, DDA, WLP (2-4ppm/C)
NASA/JPL Science Forum, August-06
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CTE – Flip Chip Substrate
0.9990.993Correlation
1.852.29CTE Overall
1.622032.05218144.7
1.851652.06170121.3
1.871192.3011996.5
1.82752.376573
1.29320.36949.4
2.5204.33024.5
1.88-602.59-1030.7
1.95-1052.68-165-23.2
-153-231-47.8
CTEStrain YCTEStrain XTemp( C ) - J1.0
FC 400
CTE Test
NASA/JPL Science Forum, August-06
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CTE – Flip Chip Substrate
CTE vs Temperature
02468
101214161820
-60 -40 -20 0 20 40 60 80 100 120 140 160
Temperature (C)
CTE
(pp
m/C
)
STABLCOR X1 STABLCOR X2 FR4 X1 FR4 X2
> 80%ReductionusingSTABLCOR®
BoardTemp(C) CTEX1 CTEX2
BoardTemp(C) CTEX1 CTEX2
-57.79 2.05 2.27 -40.84 16.6 16.66-44.12 2.2 2.45 -29.21 16.9 17.01-28.97 2.29 2.63 -16.95 17.55 17.68-14.24 2.61 3.11 18.68 16.54 16.8415.73 2.38 2.22 30.56 16.94 17.2830.66 2.68 2.65 42.41 17.21 17.5745.61 2.87 2.97 54.26 17.43 17.960.46 2.96 3.18 66.08 17.61 18.1375.37 2.98 3.33 77.95 17.79 18.3190.39 2.92 3.36 89.77 17.95 18.49120.2 2.87 3.53 101.49 18.08 18.62
135.11 2.86 3.66 113.35 18.2 18.77150.01 2.75 3.65 125.03 18.3 18.85
Average= 2.65 3.00 17.47 17.85
STABLCOR/FR4 FR406
CTE over Temperature Range
NASA/JPL Science Forum, August-06
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CTE – 8-layer 50mil Thick PCB
150.3112.32
155.6912.01
Tg (°C)CTE before Tg (ppm)Run Number
81.73°CAlpha=12.0µm/(m·°C)
155.69°C 197.24°C
-0.001
0.000
0.001
0.002
0.003
0.004
0.005
Dim
en
sio
nC
han
ge
(mm
)0 50 100 150 200 250
Temperature (°C)
Sample: 3C Memory X-axisSize: 3.3008 mmMethod: RampComment: Tg and CTE test
TMAFile: C:\TA\Data\TMA\3C Memory X-axis.004Operator: BPRun Date: 10-Aug-2005 16:25Instrument: TMA Q400 V7.1 Build 89
Universal V4.2E TA Instruments
In-Plane CTE
X-TMA Setup
NASA/JPL Science Forum, August-06
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Solder Joint Reliability – Flip Chip
For no underfill test, theFor no underfill test, thechips on Carbon Compositechips on Carbon Compositesubstrate remain attached atsubstrate remain attached at353 cycles. Most of the chips353 cycles. Most of the chipsdetached from the other testdetached from the other testboards at 353 cyclesboards at 353 cycles
With no underfill, theWith no underfill, thecharacteristic (63.2%) life ofcharacteristic (63.2%) life ofthe FRthe FR--4/NELCO is about 204/NELCO is about 20cycles . The carboncycles . The carboncomposite board is aboutcomposite board is about173 cycles173 cycles
Carbon Core
Liquid to Liquid Thermal Shock Reliability
NASA/JPL Science Forum, August-06
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RIGIDITY / STIFFNESS
CARBON IN A PCB
NASA/JPL Science Forum, August-06
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Rigidity / Stiffness
Rigidity at Room Temp
Printed Wiring Board Bend Data
0.0
2.0
4.0
6.0
8.010.0
12.014.0
16.0
18.0
20.0
22.0
24.0
26.0
28.0
30.0
32.0
0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0
Displacement (mm)
Ap
plie
dfo
rce
(N)
Sample 1 (FR4)
Sample 2 (FR4)
Sample 3 (FR4 +STABLCOR)
Sample 4 (FR4 +STABLCOR)
Sample 5 (FR4 +STABLCOR)
Sample 6 (FR4 +STABLCOR)
Sample 7 (FR4 +STABLCOR)
Maximum Force at 15mm Deflection
14.00
16.00
18.00
20.00
22.00
24.00
26.00
28.00
30.00
Sample 1 (FR4) Sample 2 (FR4) Sample 3 (FR4 +STABLCOR)
Sample 4 (FR4 +STABLCOR)
Sample 5 (FR4 +STABLCOR)
Sample 6 (FR4 +STABLCOR)
Sample 7 (FR4 +STABLCOR)
Sample Identification
Max
imu
mA
ppl
ied
Forc
e(N
)This result shows the Carbon Composite samples is ~ 66.6% stronger than the FR4 test samples
NASA/JPL Science Forum, August-06
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Rigidity / Stiffness
Rigidity of thick PCB (0.093” – 0.125”)
Bend Data
0.0
20.0
40.0
60.0
80.0
100.0
120.0
140.0
160.0
180.0
200.0
220.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Displacement (mm)
Ap
plie
dF
orc
e(N
)
ST10 board 1
ST10 board 2
ST325 board 1
ST325 board 2
Polyimide board
Bend Data
0.0
20.0
40.0
60.0
80.0
100.0
120.0
140.0
160.0
180.0
200.0
220.0
240.0
ST10 board 1 ST10 board 2 ST325 board 1 ST325 board 2 Polyimideboard
Sample Identification
Ma
xim
um
Fo
rce
@6
mm
De
flec
tion
-47.2Polyimideboard
5
452.1%213.4ST325 board 24
423.5%199.9ST325 board 13
265.7%125.4ST10 board 22
277.3%130.9ST10 board 11
StrengthImproveme
nt overSample 5
Maximumforce at
6mm (N)
SampleIdentification
Sample
Number
ST10 -Composite samples are ~ 275% stiffer than the Polyimide test samples
ST325-Composite samples are ~ 450% stiffer than the Polyimide test samples
NASA/JPL Science Forum, August-06
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WEIGHT
9.9CIC
8.92Copper
2.7Aluminum
1.65Carbon Composite
1.70Polyimide
1.80FR4
Densitygm/cm3
Material(Laminate)
NASA/JPL Science Forum, August-06
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CONCLUSION
Operates CoolerReduces Hot SpotPCB acts as a Heat SinkReduces Thermal Stress on Components
Matches CTEAttach Ceramic packages more reliablyAttach Flip Chip more reliably
All above benefits at almost no weight premium
StiffnessPrevents Warpage Increased Yields for Component Placement
NASA/JPL Science Forum, August-06
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For more infowww.hunterpcb.com
orwww.thermalworks.com
NASA/JPL Science Forum, August-06