issues in electronic component marking permanency testing

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Experience & Issues From Solvent Testing Joseph Federico Director of Operations NJ Micro Electronic Testing Inc. [email protected] 1240 Main Avenue, Clifton, NJ 07011 (973)-546-5393 Ext. 218 Website: www.njmetmtl.com

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Page 1: Issues in Electronic Component Marking Permanency Testing

Experience & Issues FromSolvent Testing

Joseph FedericoDirector of Operations

NJ Micro Electronic Testing [email protected]

1240 Main Avenue, Clifton, NJ 07011 (973)-546-5393 Ext. 218Website: www.njmetmtl.com

Page 2: Issues in Electronic Component Marking Permanency Testing

Issue: One Solvent Test ApproachDoes Not Fit All Components

Over the past years, new techniques of black top, remark and resurface marking tests have been implemented to discover non authentic marking and coating processes on electronic component devices. These tests can be highly effective at discovering counterfeit plastic components, however the same tests can result in false positives when used on ceramic packages that have not been blacktopped / coated or on can package devices that have not been resurfaced.

The objective of this presentation is to illustrate the proper groups associated with solvent testing.

Background

1.

Page 3: Issues in Electronic Component Marking Permanency Testing

Industry Alert and Experiences

Improper Exercises and Applications of Solvent

Testing

2.

Page 4: Issues in Electronic Component Marking Permanency Testing

The following example will demonstrate a Texas Instruments SNJ54HC4040J which failed Dynasolve testing that should have never been exercised.

EXPERIENCE - IMPROPER REQUEST OF A HERMETICALLY SEALED

(Non-Resurfaced) PACKAGE FAILING DYNASOLVE TEST

3.

Page 5: Issues in Electronic Component Marking Permanency Testing

Example – Wrong Exercise of SNJ54HC4040J Failing Dynasolve Test on a Non-Resurfaced Package

Hermetically Sealed Ceramic Package

4.

Page 6: Issues in Electronic Component Marking Permanency Testing

The following example will demonstrate a National LM158H that failed Mineral Spirits testing which should have never been exercised on a Can (Non-Resurfaced) Package.

EXPERIENCE - IMPROPER REQUEST OF A CAN (Non-Resurfaced) PACKAGE FAILING MINERAL SPIRITS TESTING

5.

Page 7: Issues in Electronic Component Marking Permanency Testing

Example - Wrong Exercise of Can (Non-Resurfaced) PartFailing Mineral Spirits Testing

TO-Can Device LM158H

6.

Page 8: Issues in Electronic Component Marking Permanency Testing

7.

Group OneNon Military Non PCB Assembly

Solvent Test for Remarking and ResurfacingSAE AS6081 Para 4.2.6.4.3

Page 9: Issues in Electronic Component Marking Permanency Testing

Industry ObservationScrape Test

Experiences in Scrape Testing Have Been Helpful in Early Stage Detection of Resurfaced Electronic Components

8.

Page 10: Issues in Electronic Component Marking Permanency Testing

Single Use 6" in Length Sterile Applicator Cotton tip and Wood Shaft Specimen Data Collection Applicator

9.

Industry Recommendation

Page 11: Issues in Electronic Component Marking Permanency Testing

MINERAL SPIRITS TEST FAILURES ONJM3851-00801BCA

10.

Page 12: Issues in Electronic Component Marking Permanency Testing

ACETONE TEST FAILURES ON ATMEL AT49BV642D-70TU

11.

Page 13: Issues in Electronic Component Marking Permanency Testing

1-METHYL 2-PYRROLIDONE TEST FAILURES ON ATMEL AT17C256-10JI

12.

Page 14: Issues in Electronic Component Marking Permanency Testing

DYNASOLVE TEST FAILURES ON CYPRESS CY7057V-15AI

13.

Page 15: Issues in Electronic Component Marking Permanency Testing

• Marking Permanency TestingMil Standard 883 (Microcircuits) and 750 (Semiconductors)

Recommended for Hermetically Sealed Ceramic and Can Packages which show no evidence of resurfacing as well as Aerospace and Military Marking Tests.

Proper Exercises and Experiences:Group Two

Military and Industrial Non Resurfaced PCB Assemblies

14.

Page 16: Issues in Electronic Component Marking Permanency Testing

Test Marking Permanency Per MIL STD 883, MIL STD 750

Application of Resistanceto Solvents Test

Step A15.

Page 17: Issues in Electronic Component Marking Permanency Testing

Marking Permanency Per MIL STD 883, MIL STD 750 Step B

Application of Resistanceto Solvents Test

16.

Page 18: Issues in Electronic Component Marking Permanency Testing

Marking Permanency Per MIL STD 883, MIL STD 750 Step C / D

Application of Resistanceto Solvents Test

17.

Page 19: Issues in Electronic Component Marking Permanency Testing

18.

Recommended

• 3 Long Rows of Hard Bristle• Non Reactive Material

Page 20: Issues in Electronic Component Marking Permanency Testing

Example: Parts Passing MIL STD Marking Permanency Test

Hermetically Sealed Ceramic Package

19.

Page 21: Issues in Electronic Component Marking Permanency Testing

Conclusion: Industry Recommendation

While Mineral Spirits testing, Acetone testing, 1- Methyl 2- Pyrrolidone testing and Dynasolve testing has been vital in uncovering many anomalies associated with parts that have been remarked or resurfaced, we have shown that using these techniques improperly on hermetically sealed ceramic devices or can packages that have not been resurfaced can result in false positives.

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Proper Exercises and Applications• Group 1: Marking Permanency Testing - Mil Standard 883 and 750

• Group 2: Solvent Test for Remarking - SAE AS6081 Para 4.2.6.4.3

• Group 2: Solvent Test for Resurfacing - SAE AS6081 4.2.6.4.3