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  • iPhone5andiPhone7(April14and17,2017) iPhone5 WiFi module

    iPhone7 battery applicationprocessors waferlevelpackaging 3DNAND

    1

  • iPhone5

    2

  • WiFi FrontEndiniPhone5

    3

  • BroadcomBCM4334insidetheMurata331S0171MCM

    4

  • 5

  • SmartphoneFrontEnd

    6

  • WellclosethedetailedportionofthisblogwithalookattheAntennaTuningModulessuppliedbyRFMicro.TheRF1101isahighpowerSPDTSwitchandtheRF1102helpsbyoptimizingtheiPhonesantennasforthespecificbandsinuse. Thislowersthepowerconsumptionofthephonewhilstalsoallowingthecarrierstheabilitytoaddmorecustomerstothenetwork.

    7

  • iPhone5andiPhone7(April14and17,2017) iPhone5 WiFi module

    iPhone7 battery applicationprocessors waferlevelpackaging 3DNAND

    8

  • iPhone7:Battery

    Actually,it'sarelativelybenignLithiumionbattery.This3.8V,1960mAh batteryisratedforacapacityof7.45Whanotableincreasefromthe6.55Wh batteryinlastyear'smodel.

    138.3 x 67.1 x 7.1 mm

    iPhone4:115.2mmx58.6mmx9.3mm;1400mAh Nomajorimprovementinstoragedensity.

    9

  • Blacksheetcoveringthelogicboard

    10

  • LogicBoard A

    11

  • NumberofTransistors

    12

    iPhone73.3Billions

    iPhone62Billions

    iPhone51 Billion

    iPhone4

  • ApplicationProcessors

    13

  • ApplicationProcessors

    14

  • ApplicationProcessors

    15

  • iPhone6sA8Processor

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  • 17

  • A10vs.A9 TheA10isthefirstAppleproducedquadcoreSoC,withtwohighperformancecoresandtwoenergyefficientcores.Appleclaimsthatthehighperformancecoresare40%fasterthanApple'spreviousA9processorandthatthetwohighefficiencycoresconsume20%ofthepowerofthehighperformanceHurricanecores.

    Applestatesthatithas40%greaterCPUperformanceand50%greatergraphicsperformancecomparedtoitspredecessor,the AppleA9.

    Thenew6coreGPUbuiltintotheA10chipis50%fasterwhileconsuming66%ofthepowerofitsA9predecessor. 18

  • iPhone5andiPhone7(April14and17,2017) iPhone5 WiFi module

    iPhone7 battery applicationprocessors waferlevelpackaging 3DNAND

    19

  • FanOutWLPandOtherPackagingSolutions

    20

  • DifferentPackagingSolutions

    Now that it appears the 40 to 50 percent improvement in performance in the newest Apple A10 processor is largely from its wafer-level fan out packaging from TSMC, demand for the packaging approach is ramping fast. This is one of the fastest ramps weve seem for a package in a long time, said TechSearch International president Jan Vardaman. Its a very disruptive technology that will have a big impact on the industry. The thinner, lower-cost packaging approach is also showing up in RF and audio codec chips in mobile phones, with ~2 billion units just in Samsung and Apple phones, potentially bringing big changes to the packaging materials market. Laminate substrate suppliers will see demand plunge, copper post suppliers will see little change, and makers of wafer-level dielectrics could potentially see 3X growth in volume. But dont think youll see that in revenue, since customers will really beat the prices down.

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  • 22

  • TSMCInFO (IntegratedFanOut)

    23

  • InFO WLPforA10

    A10Memory

    24

  • InFO WLPtheVerticalInterconnectPillarsintheinFOWLPareabout250umdia atanaspectratioof1:1andareatapitchof350um,nod

    25

  • AppleA10

    A1026

  • iPhone5andiPhone7(April14and17,2017) iPhone5 WiFi module

    iPhone7 battery applicationprocessors waferlevelpackaging 3DNAND

    27

    QualcommSnapdragon

  • QualcommSnapdragonSnapdragonisasuiteofsystemonachip(SoC)semiconductorproductsdesignedandmarketedbyQualcommformobiledevices.TheSnapdragoncentralprocessingunit(CPU)usestheARMRISCinstructionset,andasingleSoC mayincludemultipleCPUcores,agraphicsprocessingunit(GPU),awirelessmodem,andothersoftwareandhardwaretosupportasmartphone'sglobalpositioningsystem(GPS),camera,gesturerecognitionandvideo.

    28

  • Snapdragon835

    29

  • LogicBoard BUpdate!TheToshiba3DNANDwasinfactfoundinthe256GBversionofthesmartphonewetoredown.

    30

  • 3DNAND

    31

  • ToshibaBiCSforBitCostScaling

    32

  • NAND

    33

  • 3DNAND

    https://www.extremetech.com/computing/211812planarnandflashisdeadallhailournew3dnandoverlords

    34

  • 3DNAND

    35

  • 3DNAND

    36

  • 3DNAND

    Diephotograph

    VerticalNANDcellstructure

    37

  • iPhone5andiPhone7(April14and17,2017) iPhone5 WiFi module

    iPhone7 battery applicationprocessors waferlevelpackaging 3DNAND

    38