internship-based degrees in applied physics with microelectronics emphasis
DESCRIPTION
Lubbock. Internship-based degrees in applied physics with microelectronics emphasis. Charley Myles , Mark Holtz, Roger Lichti Department of Physics Texas Tech University Lubbock, Texas 79409-1051. Background and Motivation Methods Comparison with other related programs Results - PowerPoint PPT PresentationTRANSCRIPT
1. Background and Motivation2. Methods3. Comparison with other related programs4. Results5. Recent developments
Charley Myles, Mark Holtz, Roger LichtiDepartment of PhysicsTexas Tech University
Lubbock, Texas 79409-1051
Lubbock
Internship-based degrees in applied physics with microelectronics
emphasis
• Provide excellent education and training for Texas Tech students in microelectronics.
• Emphasize fundamental, analytical, and practical degree work. Interdisciplinary.
• Produce strong programs, alternative to traditional M.S. and Ph.D. programs, which offer advanced training.
• Serve as national prototype for university-industry educational programs.
Motivation
Norton, S. D., Hammer, P. W., and Czujko, R. “Mastering Physics for Non-Academic Careers”
American Institute of Physics, 2001.
NHC Assessment Criteria 1. External Advisory Committee 2. Negotiated Partnerships with
Industry (Internships, Projects, etc.) 3. Hands-on Experience 4. Emphasis on Developing
Interpersonal and Team Skills 5. Research Ties with Industry 6. Networking, Promoting Interaction
with Industry (Colloquia, etc.) 7. Multidisciplinary Emphasis
8. Class Schedule Flexibility 9. Exploitation of Faculty
Specialization
• Prior to internship (two semesters)– Quantum Mechanics
– Semiconductor Processing
– Processing and Characterization Laboratory Device Physics
– Semiconductor Physics
– Computational Physics
• Electives base (one semester following internship)– Electromagnetic Theory
– Statistical Mechanics
– Solid State Physics
– Advanced Semiconductor Processing Laboratory
– VLSI Design
Summer & FallInternship
Year 1
Year 2
1: Curriculum
• Visit prospective sponsors.– Understand needs.
– Understand existing internship selection and support structure.
• Distribute applicant resumes.– To technical contacts.
– To Human Resources.
• Follow up.
2: Arranging Internships
Support of interns is directly from company to students.a) University does not manage
additional bureaucracy.b) Students eligible for health ins., etc.
• STUDENT SUPPORT
– National Science Foundation DMR9705498
– Texas Tech University
• Teaching Assistantships
• Departmental Scholarships
– Texas Instruments
– Applied Materials
3: Program Support On Campus
• Brochure.• Phoning followed by
letters.• Visits to regional
universities.• Articulation
agreements.
4. Recruitment
HOUSTON
DALLAS
AUSTIN
SHSU
XFABTexas
Texas Tech Results
• NSF funding in 1998.• Merged efforts with Electrical Engineering 2000 (
www.ee.ttu.edu/pspe)• Program became fully funded by industrial sponsors Texas
Instruments and Applied Materials in 2001.• Students graduated …
Program Graduates by Year
• 80% accepted positions working in microelectronics.
• Major employers– Intel– Texas Instruments
Industrial program contacts yielding research contracts.
• Texas Instruments (numerous).
• Applied Materials.• Tokyo Electron Corp.• BOC Edwards.
Internal Internships for Interdisciplinary ResearchT. Dallas, H. Temkin, and R. Gale – Electrical Eng.J. Berg – Mechanical Eng. L. Gollahon – Biology
M. Holtz - Physics
• Research directions more interdisciplinary.– Sensors and nanoscience.– EE, ME, ChemE, Biology, Chem., Physics.
• NSF Combined Curriculum and Research Development Grant.– Developed Graduate MEMS 1, 2, & 3
courses which are laboratory intensive.
• From this the notion of an internal internship evolved.
a-FC
Silicon
Teflon
Surface
Fluorescent Molecule
Telomerase Molecule
QuencherMolecule
0.0 0.2 0.4 0.6 0.8 1.03.0
3.5
4.0
4.5
5.0
5.5
6.0 AlxGa
1-xN
T = 292 K
En
erg
y (e
V)
x in AlxGa
1-xN
MEMS (Micro-Electro-Mechanical Systems)
Sequence
• MEMS 1 – Basics of MEMS fabrication and modeling.
• MEMS 2 & 3 – Laboratory emphasizing team, leadership, and communication.– “Client–Leader–Team”– Significant overlap between
disciplines.
• The Internal Internship– Exchange of students
between research groups for mutual benefit.
Major innovation:Structured approach tointerdisciplinary research and education.