internship-based degrees in applied physics with microelectronics emphasis

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1. Background and Motivation 2. Methods 3. Comparison with other related programs 4. Results 5. Recent developments Charley Myles , Mark Holtz, Roger Lichti Department of Physics Texas Tech University Lubbock, Texas 79409-1051 Lubbock Internship-based degrees in applied physics with microelectronics emphasis

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Lubbock. Internship-based degrees in applied physics with microelectronics emphasis. Charley Myles , Mark Holtz, Roger Lichti Department of Physics Texas Tech University Lubbock, Texas 79409-1051. Background and Motivation Methods Comparison with other related programs Results - PowerPoint PPT Presentation

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1. Background and Motivation2. Methods3. Comparison with other related programs4. Results5. Recent developments

Charley Myles, Mark Holtz, Roger LichtiDepartment of PhysicsTexas Tech University

Lubbock, Texas 79409-1051

Lubbock

Internship-based degrees in applied physics with microelectronics

emphasis

• Provide excellent education and training for Texas Tech students in microelectronics.

• Emphasize fundamental, analytical, and practical degree work. Interdisciplinary.

• Produce strong programs, alternative to traditional M.S. and Ph.D. programs, which offer advanced training.

• Serve as national prototype for university-industry educational programs.

Motivation

Norton, S. D., Hammer, P. W., and Czujko, R. “Mastering Physics for Non-Academic Careers”

American Institute of Physics, 2001.

NHC Assessment Criteria 1. External Advisory Committee 2. Negotiated Partnerships with

Industry (Internships, Projects, etc.) 3. Hands-on Experience 4. Emphasis on Developing

Interpersonal and Team Skills 5. Research Ties with Industry 6. Networking, Promoting Interaction

with Industry (Colloquia, etc.) 7. Multidisciplinary Emphasis

8. Class Schedule Flexibility 9. Exploitation of Faculty

Specialization

• Prior to internship (two semesters)– Quantum Mechanics

– Semiconductor Processing

– Processing and Characterization Laboratory Device Physics

– Semiconductor Physics

– Computational Physics

• Electives base (one semester following internship)– Electromagnetic Theory

– Statistical Mechanics

– Solid State Physics

– Advanced Semiconductor Processing Laboratory

– VLSI Design

Summer & FallInternship

Year 1

Year 2

1: Curriculum

• Visit prospective sponsors.– Understand needs.

– Understand existing internship selection and support structure.

• Distribute applicant resumes.– To technical contacts.

– To Human Resources.

• Follow up.

2: Arranging Internships

Support of interns is directly from company to students.a) University does not manage

additional bureaucracy.b) Students eligible for health ins., etc.

• STUDENT SUPPORT

– National Science Foundation DMR9705498

– Texas Tech University

• Teaching Assistantships

• Departmental Scholarships

– Texas Instruments

– Applied Materials

3: Program Support On Campus

• Brochure.• Phoning followed by

letters.• Visits to regional

universities.• Articulation

agreements.

4. Recruitment

HOUSTON

DALLAS

AUSTIN

SHSU

XFABTexas

Texas Tech Results

• NSF funding in 1998.• Merged efforts with Electrical Engineering 2000 (

www.ee.ttu.edu/pspe)• Program became fully funded by industrial sponsors Texas

Instruments and Applied Materials in 2001.• Students graduated …

Program Graduates by Year

• 80% accepted positions working in microelectronics.

• Major employers– Intel– Texas Instruments

Industrial program contacts yielding research contracts.

• Texas Instruments (numerous).

• Applied Materials.• Tokyo Electron Corp.• BOC Edwards.

Internal Internships for Interdisciplinary ResearchT. Dallas, H. Temkin, and R. Gale – Electrical Eng.J. Berg – Mechanical Eng. L. Gollahon – Biology

M. Holtz - Physics

• Research directions more interdisciplinary.– Sensors and nanoscience.– EE, ME, ChemE, Biology, Chem., Physics.

• NSF Combined Curriculum and Research Development Grant.– Developed Graduate MEMS 1, 2, & 3

courses which are laboratory intensive.

• From this the notion of an internal internship evolved.

a-FC

Silicon

Teflon

Surface

Fluorescent Molecule

Telomerase Molecule

QuencherMolecule

0.0 0.2 0.4 0.6 0.8 1.03.0

3.5

4.0

4.5

5.0

5.5

6.0 AlxGa

1-xN

T = 292 K

En

erg

y (e

V)

x in AlxGa

1-xN

MEMS (Micro-Electro-Mechanical Systems)

Sequence

• MEMS 1 – Basics of MEMS fabrication and modeling.

• MEMS 2 & 3 – Laboratory emphasizing team, leadership, and communication.– “Client–Leader–Team”– Significant overlap between

disciplines.

• The Internal Internship– Exchange of students

between research groups for mutual benefit.

Major innovation:Structured approach tointerdisciplinary research and education.