intensive electronics manufacturing training

Overview

This course is a modularized IPC-certified training program that allows specialization at the applicationlevel. It provides hands-on application of the standard for industry technology segments such as through-hole and surface mount technology (SMT). The highly detailed training program is conducted by our certified IPC Trainers or Master Instructors and can be customized to fit your company’s needs. Call for quotes to conduct training at your site or come to our facility in Philadelphia, PA.

Who Should Attend

Technical and manufacturing personnel who are responsible for the assembly and/or inspection to the requirements of IPC/EIA J-STD-001D.

ContentThe training is divided into the following eight hour modules:

• Module 1: General requirements, materials, components, cleanliness, assembly and soldering process.

• Module 2: Wrapping, soldering, and inspection of stranded wire connection to various terminals and installation of jumper wires. This module includes hands-on training.

• Module 3: Installation, soldering and inspection of components in plated through-holes. This module includes hands-on-training.

• Module 4: Mounting, soldering and inspection requirements for surface mount components. This module includes hands-on-training.

• Module 5: Inspection criteria of the IPC/EIA J-STD-001D as it relates to all of the subjects.

Benefits

• Learn the technical requirements of the IPC/EIA J-STD-001D.• Save money by training your staff for specific requirements.• Graduates receive a CIS Certificate from an industry expert certified by IPC.• Certification is valid for two years.

Duration, Registration and Pricing

Contact the training center via any of the methods provided below for schedules and pricing.

• Certification...............................................1-5 days (dependent upon modules selected)• Recertification..............................................2 days• Challenge Test................................................1 day

IPC J-STD-001 CIS/Operator Certification, Recertification and Challenge Test

ACI Technologies, Inc. • phone: 610.362.1200 • web: www.aciusa.org

Training Center • phone: 610.362.1295 • email: [email protected]

Helpline • phone: 610.362.1320 • email: [email protected] LD0030

Overview

As an authorized training provider, ACI offers IPC certification to our IPC J-STD-001D customers. It includes an in-depth study, hands-on application of the National Standard for Soldering, and all the materials necessary for the successful student candidate. All of the advantages of an accredited certification program apply to this industry association program such as: industry communication links to the experts, customer recognition and credibility.

Who Should Attend

Technical trainers, solder training instructors, process engineers, manufacturing supervisors or lead technicians who are responsible for the assembly of equipment built to the requirements of IPC J-STD-001D.

Content• Applicable Documents • Printed Circuit Board Requirements• Cleaning Process Requirements • Product Assurance• Coating and Encapsulation • Rework and Repair Requirements• General Soldering and Assembly Requirements • Safety and Electronics• Instructor Skills • Scope and General Requirements• IPC Policies and Procedures • Surface Mounting of Components• Lead-Free Acceptance Criteria • Through-Hole Mounting and Terminations• Material, Component and Equipment Requirements • Wire and Terminal Connections

Benefits• Learn the technical requirements of the IPC J-STD-001D.

• Understand the guidelines prescribed by IPC J-STD-001D for tools, equipment, SMD placement,PTH component mounting, material and process compatibility and SPC.

• Learn the differences in workmanship and inspection criteria for the three equipment classes covered by IPC standards.

• Receive a CIT Instructor Student Manual, IPC J-STD-001D Instructor Guide, CD-Rom, 12 open/closed book Certified IPC Specialist exams, IPC J-STD-002, IPC J-STD-003, IPC J-STD-004, IPC J-STD-005, IPC J-STD-006, IPC 9191, IPC HDBK-001.

• Graduates receive a CIT certificate from an IPC Certified Master Instructor.


Contact the training center via any of the methods provided below for schedules and pricing.

• Certification..................................................5 days• Recertification..............................................2 days• Challenge Test................................................1 day

IPC J-STD-001 CIT/Instructor Certification, Recertification and Challenge Test




Overview

The IPC A-610D Standard is an industry-recognized consensus document, which clearly defines theacceptance criteria for electronic assemblies. It is a pictorial guide displaying conditions and processresults commonly found during the manufacturing of electronics. The current course is modular, allowingcompanies to select key areas for training their workforce. Students attending will receive detailed, paragraph by paragraph instructional guidance from Certified IPC Trainers. Completion of this course will enable students to fully understand and correctly identify the acceptability criteria of electronic assemblies as defined by the IPC-A-610D Standard.

Who Should Attend

This training program provides comprehensive data and information, which is directly applicable to work performed by assembly technicians, inspectors, assembly supervisors, rework technicians, and all personnel involved in the validation of quality processing of electronic assemblies.

ContentModules 1 and 2 are prerequisites for all other modules in the course. Modules 3-9 are optional and are to be selected based on specific company requirements.

• Module 1: Introduction to the IPC Professional Policies and Procedures

• Module 2: Foreword, Applicable Documents and Handling of Electronic Assemblies

• Module 3: Hardware Installation

• Module 4: Soldering (including High Voltage)

• Module 5: Terminal Connections (prerequisite: Modules 4 and 8)

• Module 6: Through-Hole Technology (prerequisite: Modules 4 and 8)

• Module 7: Surface Mount Assemblies (prerequisite: Modules 4 and 8)

• Module 8: Component Damage and Printed Circuit Boards and Assemblies

• Module 9: Solderless Wire Wrap

Benefits• Students who successfully complete the CIS Certification Training Program and have demonstrated

their ability to navigate and understand the IPC A-610D document will be issued a CIS Certificationwhich is valid for two years.

• Upon completion, candidates demonstrate proficiency and understanding of the IPC A-610D.


Contact the training center via any of the methods provided below for pricing.

• Certification...............................................1-4 days• Recertification ..........................................1-2 days• Challenge Test................................................1 day

IPC A-610 CIS/Operator Certification, Recertification and Challenge Test




Overview

This course was developed to help electronics manufacturers achieve the highest quality and most cost-effective productivity by ensuring their workers can correctly apply the acceptability criteria of IPC A-610. The program provides industry recognized credentials that represent the student’s understanding of IPC A-610.Upon completion of this course, the student will be able to make correct accept/reject decisions for the appropriate class/classes of production based on the acceptability requirement of IPC A-610. Additionally, students will receive the materials necessary to conduct Application Specialist training.

Who Should Attend

Trainers and quality supervisors versed in electronics assembly and manufacturing, engineering and quality supervisors with electronic assembly responsibilities should attend this course.

Content• Applicable Documents • Instructor Skills/Presentations• Component Damage • Printed Circuit Boards and Assemblies• Discrete Wiring Acceptability Requirements • Soldering Acceptability Requirements• Forward, Scope and Purpose of the IPC A-610D • Surface Mount Assemblies• Handling Electronic Assemblies • Terminal Connections• Hardware Installation • Through-Hole Technology• High-Voltage Soldering

Benefits

Upon successful completion, students will receive the two-year Certified IPC Trainer Certification necessaryto conduct the Certified IPC Specialist Training Program. The following materials are also provided:

• Application Specialist Instructor Guide • Exam answer sheets/keys with instructor copies• Application Specialist Test Sets • IPC A-610 Revision D• CD Rom with course visuals • IPC T-50• Evaluation and report forms • Printable files with student handouts



• Certification..................................................4 days• Recertification..............................................2 days• Challenge Test................................................1 day

IPC A-610 CIT/Instructor Certification, Recertification and Challenge Test




Overview

The IPC A-600 program follows a train-the-trainer model. Companies involved in printed wiring board(PWB) fabrication, assembly or original equipment manufacturers, will benefit by enrolling a representativein this course. Knowledge of acceptance criteria is essential in tracing nonconforming conditions to their origins in the manufacturing process. The IPC A-600 Training and Certification Program establishesthe important relationship between the IPC A-600 and the IPC-6012 “Qualification and PerformanceSpecification for Rigid Printed Boards.” IPC A-600 Training and Certification gives the assembler the skillsand information to improve job performance. Knowledge of acceptable conditions means that boards arenot needlessly scrapped; knowledge of nonconforming conditions saves the assembler from an expensivecomponent mounting operation. Certified Instructors/Inspectors working in electronics assembly canimprove their understanding of printed board quality issues and forge a more productive relationship with their PWB suppliers.

Who Should Attend

Manufacturing, process and quality engineers; lead technicians and trainers. Anyone directly involved in PWB fabrication, quality assurance, training or inspection is an excellent candidate.

Content• Acceptance criteria for flexible, rigid-flex and metal core printed boards• Base material surface and subsurface conditions, such as measling/crazing• Conductor width and spacing and annular ring requirements• Dielectric material criteria for etchback, voids and resin recession• Plated through-hole requirements for copper plating thickness, voids, nodules and cracks• Printed board product classifications and acceptance criteria• Skills for teaching the lesson plan effectively• Solder resist coverage over conductors and registration to lands

Benefits• A printed board sample showing critical external characteristics, such as conductor

width and spacing, annular ring and solder resist registration

• An instructor guide that gives detailed information for every module of the Worker Proficiency Training

• Over 250 full-color, 35mm slides illustrating every aspect of the IPC A-600 document

• Student handbook and open/closed book examinations for IPC A-600 Worker Proficiency Training

• The IPC A-600 Acceptability of Printed Boards and the IPC-6012 Qualification and Performance



• Certification..................................................3 days• Recertification................................................1 day• Challenge Test ...............................................1 day

IPC A-600 CIT/Instructor Certification, Recertification and Challenge Test




Overview

This program helps electronics manufacturers ensure high-quality, productivity and efficiency by guaranteeing their workers can correctly apply the acceptability criteria of IPC/WHMA-A-620. The objective of the course is to teach correct application of the standard, which defines acceptability criteria for crimped, mechanically secured and soldered interconnection and the correspondinglacing/restraining criteria associated with cable and harness assemblies. Students that complete the program by demonstrating the ability to correctly apply the accept/reject criteria in the standard will be issued IPC Application Specialist Certificates.

Who Should Attend

Supervisors, technicians, operators, inspectors and manufacturing personnel who are responsible for the assembly and inspection of wire and cable harness assemblies.

Content• Cable/wire dimensioning, tolerances • Molding and potting

and preparation • Shielding• Co-ax and twin-ax assembly • Soldered terminations• Connectorization • Splices• Crimp terminations • Stamped and formed contacts• Installation • Ultrasonic welding• Marking and labeling • Wire wrap (solderless)

Benefits

Certification demonstrates commitment to customer requirements and facilitates quality assurance initiatives.


Contact the training center via any of the methods provided below for pricing. Ask about a modular program that can be adjusted to fit your needs.

• Certification..................................................3 days• Challenge Test................................................1 day

IPC/WHMA A-620 CIS/Operator Certification and Challenge Test




Overview

Reliable functionality of life-critical electronic hardware is mandated by the Department of Defense and other commercial industries. Historically, to achieve this state of readiness, the Defense Department,in concert with industry, developed a series of standards applicable to each electronic manufacturing procedure and process in the building of product to assure high reliability. To meet the needs of clientscontracted to build high-reliable products, ACI is offers a high reliability training course to supplement the current J-STD-001. This training provides specific process control documents for hand and machinesoldering. When followed, these standards will support the manufacturing workforce to build high reliabilityelectronic hardware. In addition, this training course defines specific methodologies in soldering processesand procedures; methodologies not found in other industry standards.

Who Should Attend

Engineers, trainers and technicians that are involved in manufacturing high reliability assemblies and are interested in J-STD-001 training/certification will benefit from this course.

ContentAttending students will receive a comprehensive understanding of NASA WS-6536, Mil-Std 2000, NASA-STD 8739.2 workmanship standard for surface mount technology and NASA-STD 8739.3 soldered electrical connections. Upon successful completion of this course, students will achieve an understanding of the application of each standard and subsequent value of quality, between J-STD-001C and NASA Specifications.

Benefits

Students will be able to apply the knowledge gained from this course to properly select and integrate the appropriate standards into their manufacturing process to achieve high reliability electronic assemblies and systems.


Contact the training center via any of the methods provided below for pricing of this one-day course.

IPC J-STD-001 DSHigh Reliability Addendum




Overview

Participants experience an intense, hands-on printed circuit board rework and repair lab coupled with a review of all the applicable procedures outlined in the IPC 7711/7721A specification. Utilizing theindustry’s latest tools, materials and technology, students will perform a variety of IPC 7711 through-holeand surface mount component rework and inspection processes. Additionally, students will demonstrateadvanced proficiency in the repair and restoration of damaged printed circuit board assemblies. An industry recognized IPC certificate which is valid for two years, is issued upon successful completion of the course.

Content

Students will demonstrate a variety of rework techniques, use various tips and tools as well as solderinghand pieces using lead-free solder. Companies can select training in the following modules:

• Module 1: General Requirements (prerequisite for all other courses)• Module 2: Wire Splicing• Module 3: Through-Hole Components Rework• Module 4: Chip and MELF Rework• Module 5: SOIC and SOT Rework• Module 6: J-Lead and Gull Wing Rework• Module 7: PWB Circuit Repair• Module 8: Laminate Repair• Module 9: Conformal Coating

IPC 7711/7721 CIS SMT Rework and Circuit Repair Modules 1, 4-7 .........................................................5 daysThis combination of modules will teach students surface mount rework and circuit repair.

IPC 7711/7721 CIS Rework of Electronic Assemblies Modules 1, 3-6.......................................................5 daysThis course is ideal for companies using mixed technologies. Operators will learn how to perform rework techniques on through-hole and surface mount devices.

IPC 7711/7721 CIS Repair and Modification of PCBs Modules 1, 7-9.......................................................4 daysOperators will learn how to perform the tedious tasks of replacing circuitry and through-holes, repairing laminate damage and removal of conformal coating of assemblies.

IPC 7711/7721 CIS SMT Rework Modules 1, 4-6..........................................................................................3 daysOperators will be taught the most commonly used SMD rework. The focus of this course is chip, gull and J-leaded devices.

IPC 7711/7721 CIS Circuit Repair Modules 1 and 7.....................................................................................2 daysThis course teaches the art of replacing and adding of circuitry to PWBs. Operators will learn how to replace or add traces and through-hole circuitry.


Durations for various configurations are listed above. Contact the training center via any of the methodsprovided below for pricing.

IPC 7711/7721 CIS/Operator Certification, Recertification and Challenge Test




Overview

Participants experience an intense, hands-on printed circuit board rework and repair lab coupled with a review of all the applicable procedures outlined in the IPC 7711/7721A specification. Utilizing theindustry’s latest tools, materials and technology, students will perform a variety of IPC 7711 through-holeand surface mount component rework and inspection processes. Additionally, students will demonstrateadvanced proficiency in the repair and restoration of damaged printed circuit board assemblies.

Who Should Attend

Candidates include technical trainers, soldering technicians, QA and manufacturing personnel whoprocess and/or instruct on the rework, repair and modification of electronic assemblies. The ideal candidate should possess above average soldering, rework/repair skills and sound reasoning abilities.

ContentStudents will learn and demonstrate in a lab setting, the procedures and processes for rework, repair and restoration techniques for the following:

• Chip and MELF • PWB Circuit Repair• Conformal Coating • SOIC/SOT• J-Lead and QFP • Through-Hole• Laminate Repair • Wire Splicing

Students will be required to perform workmanship inspection of PCB assemblies to the acceptance criteria of IPC A-610, Acceptability of Electronic Assemblies. Students must score a minimum average of 80% on a two-part written exam.

Benefits

Upon successful completion, students will receive the following materials:

• CD Rom containing course visuals for each module and all printable forms required for CIS certification training

• Certified IPC Specialist Training Instructor Guide• Certified IPC Trainer Certificate, valid for two years• IPC 7711/7721 Certified IPC Trainer Student Handbook• Latest revision of IPC 7711/7721 Rework of Electronic Assemblies Specification/Repair

and Modification of Printed Boards and Electronic Assemblies• Set of 12 Certified IPC Specialist Open Book Exams



• Certification..................................................5 days• Recertification..............................................2 days• Challenge Test ...............................................1 day

IPC 7711/7721 CIT/Instructor Certification, Recertification and Challenge Test




Overview

Boot Camp is not just theory and lecture. Receive hands-on experience setting up screen printers, programming and placing components using automated equipment, profiling reflow ovens and wave soldering machines using the latest technology profiling systems, and setting up various types of cleaning processes. Engage in decision-making exercises regarding process options such as flux considerations, cover process control tools, troubleshooting and cause and effect.

Who Should Attend

Engineers, technicians, electronic specialists, sales representatives and managers. Boot Camp isdesigned to provide electronics manufacturing personnel with two weeks of intense, hands-on training in every aspect of the electronics manufacturing process.

Content• Bare Board Fabrication • Materials• Cleaning • No-Clean• Cleanliness Testing • Process Control Tools• Component Identification • Reflow• Component Insertion and Placement • Reliability• Conformal Coating • Rework• Design for Manufacturability • SPC and DOE• Dispensing • Solder Paste Application• ESD Concerns • Thermal Profiling• Hand Soldering • Wave Soldering• Inspection

Benefits

Participants will acquire an increased knowledge of the various processes, analytical tools, materials, and common test methods used in electronics manufacturing. Industry recognized processes and procedures will be introduced and discussed at Boot Camp. When applied, these processes may assistwith decision-making when designing for manufacturability. This course is ideal for design, process andquality engineers, supervisors and senior technicians desiring to increase their knowledge of electronicsmanufacturing through both classroom discussion and hands-on experience. Design engineers willenhance their ability to design for manufacturing in a real world environment while process engineers will significantly enhance their process and manufacturing skills.


Contact the training center via any of the methods provided below for this ten-day course.

Boot Camp Intensive Electronics Manufacturing Training




Overview

Manufacturing with Ball Grid Array (BGA) packages generally offers high, first-pass process yields.However, process errors do occur and there is the likelihood of a solder joint defect (insufficient solder,bridging, solder balling, etc.) under the BGA that will require the removal and replacement of the BGAcomponent. If BGA rework requires the removal of the component, special considerations must be takeninto account. For instance, excessive heat or improper removal techniques has the potential to causedamage to surrounding lands, other components, or the PCB itself. Rework requires sound practices, proper tools and quality training.

Who Should Attend

This course is geared towards manufacturing, process and quality engineers responsible for implementingand/or controlling the BGA application and inspection process. Those personnel responsible for trainingoperators and technicians to perform BGA assembly inspection or control the manufacturing processwould also benefit from this course.

ContentIntroduction to BGAs: Upon successful completion of the course, the student will be able to correctly identify the different types of BGA components and the different assembly considerations that must be taken into account when using a specific type of BGA component.

BGA Rework Practices: Upon successful completion of the course, the student will be able to correctlyperform rework procedures on assemblies with BGA components. Proper rework techniques covered will include the development of a removal and replacement profile, component removal, PWB site preparation, solder paste application, component placement and reattachment.

Benefits

Gain experience developing removal/replacement profiles and learn to perform individual BGA reworktechniques in the ACI demonstration factory.


Contact the training center via any of the methods provided below for pricing of this two-day course.

BGA Manufacturing, Inspection, Rework Electronics Manufacturing Skills Training




Overview

To meet the demand for smaller footprints, improved electrical performance and/or higher input/output in a given space, manufacturers are investigating advanced packaging technologies. This course will allow students to make informed decisions about advanced packaging technologies (flip chips, chip scale packages, wire bonding, micro BGAs and BGAs) based upon companies’ needs.

Who Should Attend

Engineering and manufacturing managers, process engineers, technicians, machine operators and trainers responsible for making next-generation manufacturing decisions in the company.

Content• Basic overview of die fabrication and chip scale packages• Inspection technologies• Production implementation of flip chip and chip scale processes, including BGA

and micro BGA• Rework processes• Underfill/encapsulation• Uses of advanced packages and manufacturing assemblies in today’s market• Wire bonding and die placement techniques

Benefits

Receive hands-on training on advanced packaging equipment located at the ACI demonstration factory. Identify and perform critical process steps when manufacturing BGAs, micro BGAs, flip chips and chip scale packages. Learn to identify and implement process control methods and practices when manufacturing assemblies with advanced packages


Contact the training center via any of the methods provided below for pricing of this three-day course.

Chip Scale ManufacturingElectronics Manufacturing Skills Training




Overview

The Design for Manufacturability (DFM) program helps companies respond to a simple fact: the opportunity toinfluence the cost of new product is greatest early in the life cycle of a product. ACI, as the National Centerof Excellence in Electronics Manufacturing, has developed a program that provides a combination of lectureand factory experience, all housed in the same facility. The objective is to enable companies to setupeffective DFM programs within their own facilities. The first day of the two-day program provides studentswith classroom sessions and templates for use in their own facilities. Day two provides hands-on factoryexperience, assembling and processing a demonstration printed wire assembly (PWA), which is intendedto show the benefits and consequences of decisions made at the design level.

Who Should Attend

Program managers, design engineers, quality managers, engineering managers and engineers responsiblefor taking a design concept through inception to market will benefit from this course.

ContentAssembly Process: The automated assembly line sequence, equipment limitations and considerations.

Component Selection: Preferred components, non-preferred components and assembly sensitivities.

DFA: Introduction to Boothroyd-Dewhurst DFA method. A discussion of assembly, circuit board assembly,printed wire board fabrication and interconnects.

DFM Overview: What is DFA, DFM, production improvements and risk assessment.

Future Design Issues

Industry Standards: A quick look at IPC 2220 series of documents and IPC J-STD-001D.

PWA Considerations: Land design, board fabrication processes, component clearances and check list.Printed wire board panel usage including strategies for harmonizing usage and assembly performance.Fiducial marks as tooling and vision aids for automation.

Solder Mask and Conformal Coatings

Benefits

Participants will learn to reduce design to market cycle time, parts costs, production cycle time whileimproving product quality.



Design for ManufacturabilityContinuing Professional Advancement in Electronics Manufacturing




Overview

The objective of this course is to prepare the participant to make informed decisions when troubleshootinga manufacturing problem or collaborating with an analytical laboratory. Case studies provide a forum forproblem formulation, investigation and resolution. The program is based on IPC, ANSI, ASM, ISTFA, EDFASand IEEE test methods and specifications.

Who Should Attend

Both the novice and experienced participants can benefit from a failure analysis course, even those that do not deal with failure analysis directly: reliability engineers, product engineers, design engineers,quality assurance, manufacturing engineers, procurement managers and production line supervisors.

ContentThe course is divided into lab and lecture sessions. Students are introduced to a broad range of failureanalysis and reliability issues through hands-on instruction. In addition to exposure to common electronicfailure mechanisms, participants learn the most effective analytical methods. The course contains the latest information on lead-free solder, x-ray fluorescence, RF plasma etching, and micro-probing of integrated circuits. Also included are:

• Decapsulation of Integrated Circuits • Scanning Acoustic Microscopy (SAM)• Differential Scanning Calorimetry (DSC) • Scanning Electron Microscopy (SEM)• Fourier Transform Infrared Spectroscopy (FTIR) • Shear/Pull Testing• Optical Microscopy • Solderability Testing• Probe Station and Micro-Probing of Circuits • Transmission X-Ray• RF Plasma Etching • X-Ray Fluorescence (XRF)

Benefits

Students learn sample preparation, microstructure and evaluation techniques specific to lead-free solders, components and surface finishes. The three-day course layout provides the proper format for comprehensive understanding of topics covered. Coupled with the lab exercises, the class includesscheduled time to address specific problems encountered by the students at their workplace. Each student walks away from the course with a better understanding of manufacturing related issues, as well as text that will aid in resolving any further failure analysis issues.


Contact the training center via any of the methods provided below for pricing of this three-day course.

Failure Analysis and Reliability TestingContinuing Professional Advancement in Electronics Manufacturing




Overview

New lead free electronic manufacturing processes must be developed and implemented to eliminate lead from the electronics assembly process. Approved legislation, coupled with new commercial marketpressure from Asia and Europe is forcing electronic manufacturers to consider new processes, materialsand techniques to meet this challenge. ACI, a National Electronics Manufacturing Center of Excellence,has developed a comprehensive training program to provide lecture and hands-on factory experiences to support this endeavor. The course objective is to introduce participants to the technical challenges of developing and implementing lead free soldering into an electronic manufacturing production environment and provide application specific solutions to address each issue.

Who Should Attend

Everyone responsible for the development and implementation of lead free solder into their manufacturing production and rework/repair processes.

ContentLegislative Status: Europe, Asia, United States

Materials Issues: Solder Alloys, Board Finishes, Component Finishes, Tin Whiskers

Reliability Topics: Components, Boards, Solder Joints, Microsectioning, Failure Analysis

State of the Market Concerns: Commercial Market Issues, Military/Aerospace/Defense, Market Issues

Manufacturing Processes: Screen Printing, Component Placement, Hand Soldering, Wave Soldering,Reflow Soldering, Rework and Repair

Additional Considerations: Environmental Issues, Configuration Management, Legacy Hardware,Sustainment Hardware

Benefits

Participants will gain an understanding of the technical issues surrounding the lead free solderingprocess. Through hands-on experience in ACI’s demonstration factory and fully equipped classrooms, students will learn how to manufacture lead free hardware using production quality equipment. Attendees are encouraged to bring their own hardware samples to determine how it will respond when lead free solders are used.



Lead Free ManufacturingContinuing Professional Advancement in Electronics Manufacturing




Overview

The intent of this course is to provide the knowledge and hands-on training necessary to master the basic techniques of soldering for electronic assemblies. Individuals will learn the necessary skills to hand solder reliable electronic assemblies. This course combines classroom lecture with a practical lab to gain hands-on training in basic soldering techniques. An ACI Technologies Certificate will be awarded to all students at the end of the course.

Who Should Attend

This course is geared toward engineers, technicians, and electronic assemblers with limited hand soldering experience or those who want to improve their knowledge and raise their standard of skill.

Content

This course is designed to give the students hands-on soldering experience to enhance and emphasizethe lecture material. Topics that will be covered in the course include:

• Safe working procedures in hand soldering

• Solder and the soldering process including lead (Pb) and Pb-free soldering

• Purpose of flux and how to select the proper flux for your application

• Hand soldering equipment: soldering irons, tip selection, and tool maintenance

• Basic soldering techniques

• Solder joint inspection

• Cleaning processes

Benefits

Individuals will learn and practice basic hand soldering techniques that are used in the manufacture of electronic assemblies.


Contact the training center via any of the methods provided below for this one-day course.

Solder Techniques for Electronic AssembliesElectronics Manufacturing Skills Training


