integrated circuits dr. esam yosry lec. #9. npn transistor fabrication introduction npn...
TRANSCRIPT
INTEGRATED CIRCUITSDr. Esam Yosry
Lec. #9
NPN
Tra
nsi
stor
Fab
rica
tion
Introduction
NPN Fabrication-Simple Flow
AMI Bipolar Transistor Process
Bipolar Fabrication –Masking Layers
Typical Bipolar Resistor Technology
Intr
od
uct
ion
(Chip
Fabri
cati
on C
ycl
e)
NPN Transistor (BJT) Fabrication Example
Emitter Base Collector
Bipolar Transistor
Bip
ola
r Tr
an
sist
or
Fab
rica
tion
– S
imp
le
AMI Bipolar Transistor Process
Oxide
P+substrate
P-Epi Layer
The beginning wafer is a P-epitaxial layerOn a P+ substrate that is oxidized.
AMI Bipolar Transistor Process
N-Tub Collector
Oxide
P-Epi Layer
N-Tub
Field Oxide
Collector
Field Oxide
Field Oxide
P-Epi Layer
N-Tub
Field Oxidation
AMI Bipolar Transistor Process
N-Tub
Field Oxide
P-base
Collector
Field Oxide
P-Epi Layer
P-Base Formation
P+
N-Tub
Field Oxide
P-base
Collector
Field Oxide
P-Epi Layer
P+ Contact Formation
AMI Bipolar Transistor Process
N+P+
N-Tub
Field Oxide
P-base
Collector
N+N+Field Oxide
P-Epi Layer
N+ Emitter and Collector Contact Formation
N+P+
N-Tub
Field Oxide
P-base
Collector
N+N+Field Oxide
P-Epi Layer
Oxide
Contact Apertures
Oxide
Bipolar Fabrication –Masking Layers
Mask No. Physical Layer AMI Name GDS Level No.
1 N-type Well N_WELL 1
2 Field Oxide ACTIVE 3
3 P-type Base PBASE 2
4 P+ S-D Ion Implant P_PLUS_SELECT 11
5 N+ S-D Ion Implant N_PLUS_SELECT 12
6 Contact Openings CONTACT 14
7 First Metal METAL 1 15
8 Vias between Metal VIA 16
9 Second Metal METAL 2 17
10 Bond Pad Openings GLASS 18
Typical Bipolar Resistor Technology
N-Tub
Field OxideP-base
Field Oxide
P-Epi Layer
P-Base Resistor Formation
N+P+ P+
Top view of The resistor
P+ N+
Thanks
Many thanks to Prof. Hany Fikry and Prof Wael Fikry for their useful materials that help me to prepare this presentation.