institute for material analysis...pcb pad copper conventional preparation of microsection ß mixed...
TRANSCRIPT
Institute for material analysis
Comprehensive analytical services for quality assurance and failure analysis
To ensure perfect functionality and quality the
analysis of electronic components becomes more
and more important for component manufacturers
and those who apply them.
It is essential to find together with the customer the
appropriate analysis plan out of the wide range of
the offered analytical services. Thus, a specific and
reliable examination of electronic components and
assemblies can be performed at a highly detailed
test level as well as a comprehensive analysis of the
occurred errors.
A modern, constantly expanding machinery park
-adapted to the increasing test and analysis
requirements- and a team of more than 220 engineers,
doctors, technicians and skilled workers provide
insight into all details and aspects of electronic
components into the lowest structure levels.
This evaluation is of significant importance especially
for electronic components of uncertain origin to
HTV offers a variety of analyses, for example:
• In-processqualitycontrolandfailureanalyses
• Analysesofproductsofuncertainorigin,processerrors,printedcircuitboarddefectsandcomponentfailures
• Materialidentification
• Determinationwithregardstocomponentmanipulationaswellasevaluationofthe
authenticity/counterfeit screening
• Determinationofthecurrentagingsituationandprocessability
• Prospectsintermsofstorability
• EvaluationofbareprintedcircuitboardsandassembliesaccordingtoIPC-A-600andIPC-A-610
• Assemblyandcomponentqualifications
• Measurementofioniccontaminationaccordingtocurrentstandards
maintain the quality of the particular products. A sin-
gle component of poor quality or a bad solder joint
can compromise the function and the quality of the
entire electronic assembly.
Therefore, it is important to secure the component
quality and availability in advance: various strategies
and analysis procedures as well as HTV’s experience
over many years enable the identification of poten-
tial weak points and errors, on time. Hence, as part
of an anticipatory company policy the risk of huge
production issues, contractual penalties when deli-
vering not just in time and potential recourse claims
are minimized.
Already existing errors can quickly and entirely be
identified, located and analysed in detail.
Additionally, the comprehensive test laboratory pro-
vides the inspection of the electrical function as well
as of the data sheet values.
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HTV Conservation GmbHRobert-Bosch-Str.28•D-64625BensheimPhone:+49(0)6251/84800-0•Fax:+49(0)6251/84800-30E-Mail:[email protected]•Internet:www.HTV-Conservation.com© HTV® All rights reserved
Visual evaluation for the determination of component manipulation
Possible applications:
• Documentationofgoodsuponreceipt(DryPack,indicator,packing,possibleimpurity)
• Visualinspectionofthecontactpinsforexampleinviewofdeformationsandsolderresidues
• Lightmicroscopicexaminations
• Verificationofthepackagedimensionsaccordingtodatasheet
• X-rayinspection
• Inspectionofpackageinscriptionandsurfacebywipetest
• Chemicalcomponentdecapsulationforchipidentification
The number of manipulated electronic components is
steadilyincreasingonthefreemarket.
Next to already desoldered components, failure parts
thatdonotmeettherequiredparametersorevencom-
ponents with an incorrect respectively no die inside,
aboveallrelabeledcomponentsareproclaimedandsold
asoriginalproducts.
The ultramodern HTV analysis laboratory offers nu-
merousextensiveopportunitiestoperformevaluations
inviewoforiginalityandqualityofsuppliedpartssothat
possiblecomponentmanipulationscanbedetected.
Theoriginalityofthepurchasedpartsisensuredbyva-
riousdetailedexaminationsoftheexternalappearance
(e.g.incominginspection,lightmicroscopy)aswellasof
theinternalstructureafterchemicalcomponentdecap-
sulation(e.g.chipidentification).
Thisevaluation isofessential importanceespecially for
electroniccomponentsofuncertainorigin,thusthequa-
lityofownproductscanbemaintained.
Forexample,bymeansofawipetest,inwhichthesur-
faceofthecomponentistreatedwithspecialchemicals,
itispossibletodeterminewhetherthecomponentwas
relabeledormanipulated.
Additionally, further analyses like solderability test or
data sheet tests canbeperformed to complement the
visualevaluationofgoods.
Specially composed analysis packages allow the indi-
vidual evaluation of goods for each application, de-
pending on the required extent:
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Visual evaluation of goods
Light microscopy
Wipe test
Inspection of the component pins
Incoming inspection
LIGHT1
Light microscopy
Wipe test
Inspection of the component pins
Incoming inspection
Chemical component decapsulation
BASIC2
Light microscopy
Wipe test
Inspection of the component pins
Incoming inspection
Chemical component decapsulation
X-Ray inspection
ADVANCED3
HTV Conservation GmbHRobert-Bosch-Str.28•D-64625BensheimPhone:+49(0)6251/84800-0•Fax:+49(0)6251/84800-30E-Mail:[email protected]•Internet:www.HTV-Conservation.com©HTV®Allrightsreserved
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Light microscopy
HTV Conservation GmbHRobert-Bosch-Str. 28 • D-64625 Bensheim Phone: +49 (0) 62 51 / 8 48 00-0 • Fax: +49 (0) 62 51 / 8 48 00-30E-Mail: [email protected] • Internet: www.HTV-Conservation.com© HTV® All rights reserved
Light microscopy as analysis and documentation method
Possible applications:
• Analysis of printed circuit boards and assemblies
• Surface examination of contact pins of electronic components
• Investigation regarding occurrence of oxidation and diffusion effects
• Measurement of layer thicknesses and layer structures
• Documentation of deformation, damages and cracks at electronic components
• Examination of solder joints
For the documentation of damaged components and
for the examination of solder joints or already prepared
samples, e.g. microsections, the light microscopy is an
essential and important analysis method.
Depending on the problem and the size of the samples a
variety of modern high-resolution microscopes with se-
veral configuration options are available to achieve opti-
mum analysis results, e.g. reflected and transmitted light
as well as dark field inspection methods.
Images are digitized by use of high-resolution cameras
and are standardly provided in a complete examination
report.
Due to special image processing tools identified prob-
lem areas can be clearly highlighted and marked.
The light microscopy is an essential method, for example,
to inspect printed circuit boards according to IPC-A-610.
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MicrosectioningIon beam etching
Applied standards:- DIN EN ISO 1463- IPC-TM-650 Method 2.1.1
BGA-ball SMD-pin
HTV Conservation GmbHRobert-Bosch-Str. 28 • D-64625 Bensheim Phone: +49 (0) 62 51 / 8 48 00-0 • Fax: +49 (0) 62 51 / 8 48 00-30E-Mail: [email protected] • Internet: www.HTV-Conservation.com© HTV® All rights reserved
Microsectioning and ion beam etching for visualizing finest details on sample surface
Possible applications:
• Visualization of surface structures down to the nanometer scale
• Investigation of microstructures
• Determination of layer thicknesses on component pins
• Analysis and evaluation of solder joints, plated through holes and bonding areas
• Determination of failure mechanisms of electronic components
• Determination of inclusions, cracks and other damages, e.g. resulting from the soldering process
or mechanical stress
• Detection of delamination effects at printed circuit boards
• Analysis of aging processes
For a more detailed analysis of electronic components and printed circuit boards as well as assemblies, the microsectioning provides a useful extension of the light microscopic examination.
The specimen is divided by a high-precision cut along a defined line at the required position. After embedding the sample in special resin, it is prepared for further analy-ses via grinding and polishing steps according to sample-specific recipes.
In addition, the material of a polished sample can be stripped off at atomic level by performing the ion beam etching process. Thus, possible blurrings are removed and smallest details can be revealed.
Subsequently, the prepared samples can be further ana-lysed, for example, by scanning electron microscopy (SEM) even at nanometer scale.
Detail: Bond-connection
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MetaFinePrep®
HTV Conservation GmbHRobert-Bosch-Str. 28 • D-64625 Bensheim Phone: +49 (0) 62 51 / 8 48 00-0 • Fax: +49 (0) 62 51 / 8 48 00-30E-Mail: [email protected] • Internet: www.HTV-Conservation.com© HTV® All rights reserved
MetaFinePrep® for qualitative and quantitative analysis of the microstructure of metallic materials
Possible applications:
• Conclusion as to hardness, toughness, brittleness, solderability and chemical structure of the microstructure
• Identification of irregularities in the area of the intermetallic compound transition
(weakening of solder joint adhesion)
Metallographic-microstructure-preparation
The increasing availability of various composite materials and of new or enhanced materials requires more and more ad-
vanced and in-depth analysis methods in order to carry out appropriate inspections with the required quality standards.
Via the metallographic-microstructure-preparation MetaFinePrep® developed by HTV additional detailed conclusions
about the inner structure of the materials used are gained, which conventional testing methods do not provide.
Highly selective preparation of microsection with
HTV-MetaFinePrep®
Samples prepared with the highly-selective MetaFinePrep® method
show in contrast to conventionally processed samples the inner metallic
microstructure.
In combination with analyses in the scanning electron microscope
(SEM) metallic materials can be comprehensively assessed to compe-
tently evaluate microstructures and compound transitions in terms of
their quality and reliability.
SMD-pin copper
Tin/lead solder
PCB pad copper
Conventional preparation of microsection
ß mixed crystal tin grains with max. 1 % dissolved lead
Eutectic tin/lead (63/37) within the interstices of tin grains
SMD pin with dendritic copper structureafter high-selective MetaFinePrep® preparation.
Porous intermetallic phase transition
Hypereutectic tin/leadCrystal mixture structure (95/5)
PCB pad with grainy copper structure
Conventional preparation of microsection without
HTV-MetaFinePrep®
Using the example of SMD pins the solder connection of a conventional
preparation of microsection appears inconspicuous and with a perfect
adhesion.
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X-ray inspection
HTV Conservation GmbHRobert-Bosch-Str. 28 • D-64625 Bensheim Phone: +49 (0) 62 51 / 8 48 00-0 • Fax: +49 (0) 62 51 / 8 48 00-30E-Mail: [email protected] • Internet: www.HTV-Conservation.com© HTV® All rights reserved
X-ray inspection for non-destructive examination of components and assemblies
Possible applications:2D X-ray:• Inspection of hidden solder joints (e.g. BGA inspection of solder ball shape and voids)• Inspection of bonding areas (e.g. broken bonds) and lead frames• Inspection of contacts and solder joints (anomaly, crack formation)• Analysis of bonding wires and of chip orientation in the component• Inspection of the die-attach with the lead-frame (e.g. on voids)• Inspection of the PCB via regarding CAF (Conductive Anodic Filament)• Inspection in view of ESD and EOS damage
3D X-ray / computed tomography (CT):• Color-highlighting of different materials to localize and analyze material defect and processing error within components and assemblies• Inspection of bond areas and lead-frames (3D model)• Determination of contact area of spring loaded press-fit pins• Investigation of crimp contacts• Analysis of moulded components such as of wire connections within transformers• Determination of section planes within the scope of the sample preparation for detailed analyses, e.g. micrograph
Applied standards:- DIN EN 61191-6- MIL-STD-883 Method 2012
The necessity of a non-destructive examination of com-ponents or assemblies oftentimes requires an inspection via X-ray technology. In the analysis for instance lead frames, bond wires and chip orientations of the compo-nent can be inspected. In case of printed circuit boards an examination of the inner conductive path layers is possible.
In the event of components whose origin is doubtful an X-ray inspection can show if a chip is generally integra-ted in the component, if there is no deviation in the bond sequence or if improper bond wire junctions can be recognized.
With the three-dimensional presentation of X-ray images via computed tomography (CT), for the plastic represen-tation of hidden details, different materials can be high-lighted with colors, localized and analyzed. This offers an additional option for an examination of components as well as for assemblies in view of possibly existing material defects or processing errors.
SEM for investigating structures and gradients in the nanometer range
Possible applications:
• Surfaceinspectionofelectroniccomponents• Determinationofthelayercomposition,e.g.ofcomponentpinsandprintedcircuitboards• Analysisofpoorlyconductingsamplesandsurfacesinlow-vacuumoperation• Detectionofmicro-cracks• Whiskerdetection
Applied standards:
-DINENISO9220
Duetomoreandmorecomplexandfinestcomponentstructuresthe
scanningelectronmicroscopyisofincreasingimportanceforquality
controlofcomponents.Theareastobeexaminedaresystematically
scannedbyanelectronbeam.Thus,theresultinginteractionsofthe
electronswiththesampleareusedtogenerateimageswithamagni-
ficationfactorofupto100000.
Bymeansofthesehighqualityimageswithahighresolution,even
criticalsamplescanbeclearlyanalyzedanddocumentedintermsof
agingprocessesandweakpointsrespectivelycomponentfailuresor
production-relateddeficiencies.
EDX for determining the elemental composition of samples
Possible applications:
• Materialidentification(e.g.fornon-permittedsubstancessuchaslead)anddeterminationofconcentration
• Analysisofthediffusionprogressatthetransitionareasofdifferentmaterials,i.e.measurementofthe
intermetalliccompounds
• Determinationoftheagingofthecomponentsandtheirprocessabilityaswellasstorability
• Investigationofthematerialshomogeneity
• 2Dvisualizationoftheelementalcompositionviamappings
IncombinationwiththeSEMtheemittedspecificradiationallowsa
detailedstatementaboutthepresentelementsinthesample,their
localizationaswellastheageofthecomponentsortheirprocessabi-
lityandstorability.
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Scanning Electron Microscopy (SEM)Energy Dispersive X-ray Spectroscopy (EDX)
HTV Conservation GmbHRobert-Bosch-Str.28•D-64625BensheimPhone:+49(0)6251/84800-0•Fax:+49(0)6251/84800-30E-Mail:[email protected]•Internet:www.HTV-Conservation.com©HTV®Allrightsreserved
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X-ray fluorescence analysis (XRF)
Applied standards:- DIN EN ISO 3497- ASTM B 568- DIN EN/IEC 62321
HTV Conservation GmbHRobert-Bosch-Str. 28 • D-64625 Bensheim Phone: +49 (0) 62 51 / 8 48 00-0 • Fax: +49 (0) 62 51 / 8 48 00-30E-Mail: [email protected] • Internet: www.HTV-Conservation.com© HTV® All rights reserved
X-ray fluorescence analysis (XRF) for non-destructive measurement of layer thicknesses and trace analysis
Possible applications:
• Analysis of composition (i.a. „lead-free„ substances) and coating thicknesses of solder contacts
of electronic components
• Identification respectively determination of the elemental composition of unknown substances
• RoHS screening in view of mercury, chromium, cadmium, lead and bromine
• Non-destructive measurement of surface finishes of bare printed circuit boards
• Hotspot mapping for identification of solder joints containing lead on assembled printed circuit boards
The non-destructive measurement XRF is the most
frequently used method for qualitative and quantita-
tive determination of layer thicknesses of a sample in
the nanometer and micrometer scale.
For the qualification or quality control of coatings in series
production, e.g. the hard gold plating on plug connectors
or layer thicknesses of printed circuit board finishes can be
examined quickly and non-destructively. Also the identi-
fication or determination of the elemental composition
of unknown substances, such as inorganic impurities on
printed circuit boards, is possible by using XRF.
Due to low limits of detection the XRF is in many cases
suited for performing a screening of RoHS restricted sub-
stances.
Differences between XRF and energy dispersive X-ray
spectroscopy (EDX/EDS) in the scanning electron
microscope (SEM)
• The XRF does not use an electron beam for excitation
but an X-ray tube. This enables, in addition to signifi-
cantly deeper insights into the area to be inspected,
especially also the examination of moist or liquid
samples since vacuum is not necessary.
• Considerably simplified sample preparation since the
sample to be analyzed does not need electrical conduc-
tivity, so that even insulators such as FR4 PCBs or cera-
mics can be examined without any additional effort.
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Fourier Transform Infrared Spectroscopy (FTIR)
HTV Conservation GmbHRobert-Bosch-Str. 28 • D-64625 Bensheim Phone: +49 (0) 62 51 / 8 48 00-0 • Fax: +49 (0) 62 51 / 8 48 00-30E-Mail: [email protected] • Internet: www.HTV-Conservation.com© HTV® All rights reserved
Fourier transform infrared spectroscopy (FTIR) for analysis and evaluation of organic materials and substances
Possible applications:
• Identification of plastics
• Measurement of solid or liquid organic materials
• Determination of the composition of plastic materials, e.g. of assembly housings and mold material
• Determination of volatile components and substances
• Determination, evaluation and monitoring of the aging condition of organic materials
During FTIR spectroscopy, a special variant of IR spect-
roscopy, the sample to be examined is illuminated with
infrared radiation and the resulting excitation of the mo-
lecule-specific vibration states is examined.
Depending on the structure of the molecules different
energies of the exciting radiation are absorbed.
Thus, material characteristic peaks and spectra are recor-
ded. The infrared spectroscopy is applicable for both the
quantitative determination of known organic substances
as well as the identification of unknown organic substan-
ces by spectra libraries.
During the long-term conservation of electronic compo-
nents the FTIR spectra database of HTV was expanded
by the know-how gained from intensive cooperation
with universities. This enables the evaluation of organic
materials of electronic components and assemblies with
regard to material changes and aging resistance within a
short timescale.
When comparing the spectra in a specified period, of
one year for instance, an indicator for the progression of
aging processes in the material is obtained.
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Fully automated solderability test
HTV Conservation GmbHRobert-Bosch-Str. 28 • D-64625 Bensheim Phone: +49 (0) 62 51 / 8 48 00-0 • Fax: +49 (0) 62 51 / 8 48 00-30E-Mail: [email protected] • Internet: www.HTV-Conservation.com© HTV® All rights reserved
Fully automated solderability test for evaluation of the processability of electronic components
Possible applications:
• Solderability tests on components, printed circuit boards, SMD pads and plated through holes
• Measurement of wetting forces
• Determination of the processability of components during the soldering process
• Documentation of wetting problems
• Determination of deviations in solderability behavior of diverse batches of components / components of different age
• Monitoring of processability by cyclic performance of solderability tests
In the particular case of aged components the issue arises to deter-mine the solderability objectively and quantitatively.
Highly precise and fully automated solderability test systems enable the determination and documentation of the exact wetting force – i.e. that force that keeps the sample in the solder – for each com-ponent pin by immersing and extracting the sample into molten solder material.
From the progression of the wetting forces and the reached maxi-mum force values, the expected processability of the component in the real soldering process can be estimated.
Alternatively, a dip & look test is performed depending on the pa-ckage of the component.
Abb. 1: T = 0: Kontaktierung des Prüflings mit dem Lot Tb: Benetzungskraft > 0 T2/3: 2/3 der max. Benetzungskraft (Fmax) erreicht T1: Definierte Zeit (Messung F1) TFmax: Zeitpunkt max. Benetzungskraft (Fmax) erreicht T2: Testende (Messung F2)
Schematische Benetzungskurve
Zeit
Kra
ft
TFmax 0
0
Fmax
Tb T2/3 T1 T2
F2/3 F1 F2
+
- Time
Wettability graph diagramForce
Further advantages of the fully automated solderability test:• Colored, graphical presentation of test results • Quantitative statement regarding the wetting forces• Video documentation• High reproducibility
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Chemical component decapsulation
Applied standards:- MIL-STD-883 Method 2010- MIL-STD-883 Method 2013
HTV Conservation GmbHRobert-Bosch-Str. 28 • D-64625 Bensheim Phone: +49 (0) 62 51 / 8 48 00-0 • Fax: +49 (0) 62 51 / 8 48 00-30E-Mail: [email protected] • Internet: www.HTV-Conservation.com© HTV® All rights reserved
Chemical component decapsulation for direct examination of the chip surface
Possible applications:
• Detection of overloads (ESD, EOS)
• Determination of manufacturers (authenticity)
• Investigation of bonding areas, micro cracks, structural defects
• Bonding, pull and shear tests
In cases where a direct examination of the chip surface is
necessary, e.g. to determine the exact version of the used
chip or its manufacturer, the chemical decapsulation of
electronic components is of great importance.
The semi-automatic chemical opening process, develo-
ped at HTV, requires special expertise and component
specific formulations to prevent unintentional, internal
damages.
By subsequent investigations via light or scanning elect-
ron microscopy the chip surface can be inspected. Thus,
any functional impairment, possibly resulting from an
overstress of the component via ESD and EOS events,
mechanical stress or similar effects, can be determined.
Precise pull and shear testers enable the high-speed veri-
fication of the quality of wire bonding.
Nanoindentation (instrumented indentation test)
HTV Conservation GmbHRobert-Bosch-Str. 28 • D-64625 Bensheim Phone: +49 (0) 62 51 / 8 48 00-0 • Fax: +49 (0) 62 51 / 8 48 00-30E-Mail: [email protected] • Internet: www.HTV-Conservation.com© HTV® All rights reserved W
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Applied standards:- DIN EN ISO 4516- DIN EN ISO 14577-1- ASTM E 2546
Nanoindentation as hardness tests with additional gained mechanical and elastic parameters
During nanoindentation, a pyramidal test tip, only a few
micrometers large, is pressed into the sample surface to
be examined. Both, the penetration force applied as well
as the penetration distance of the probe tip into the sam-
ple surface are measured simultaneously.
Distance0,1 µm
Indenter tip
Sample
Force
Distance0,1 µm
Possible applications:
• Determination of the material homogeneity of polymers, metals or ceramics (elastic and plastic parameters)
• Analysis of thin layers (less than 1 µm thickness) without being affected by the substrate material
• Examination of changes with regards to elasticity and plasticity to analyze the aging behavior of polymers
(evaluation of brittleness)
• Hardness determination of separated layers such as gold pads and nickel coatings
• Examination of welds or soldering areas in view of their material homogeneity based on microsections
By means of the data obtained from nanoindentation
numerous classical hardness parameters, such as Mar-
tens hardness, can be determined.
In addition, the very precise, nearly non-destructive
nanoindentation enables, contrary to conventional de-
structive hardness tests, also the determination of a vari-
ety of further material properties and parameters within
smallest sample volumes (nano- and micrometer range).
Further benefits of nanoindentation at a glance:
• Objective and error-free parameter determination
even within smallest sample volumes
• Fast and simple sample preparation
• Variable sample geometry
• Temperature-dependent measurements up to 200 °C
Sample
Sample