Innovative Material Solutions for Communications and Consumer Electronics

More performance, reliability and style. Less compromise.

IMAGINE

Electronics

2

Table of Contents

4-5 Introduction to Dow Corning’s solutions for communications and consumer electronics

6-7 Solutions for hand-held devices

8-9 Solutions for computers

10-11 Solutions for displays

12-13 Solutions for telecommunications equipment

14-15 Solutions for home appliances

16-17 Solutions for wearable/portable devices

18-20 Typical properties: Adhesives/sealants

21-23 Typical properties: Thermally conductive materials

24-25 Typical properties: Conformal coatings

3

26 Features and characteristics of silicones

27 Glossary and common properties

28 Contact information

ABOUT THIS GUIDEProduct recommendations in this guide are based on test results and successful applications under certain conditions. Due to the many variable influences, we cannot guarantee a positive result with our products in every case. Performance and compatibility tests should be carried out prior to final use. For specific application needs, contact your Dow Corning representative.

Specification writers: Values presented in this guide are not intended for use in preparing specifications. Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on these products.

D O W C O R N I N G ’ S

SOLUTIONSIn just two decades, communications and consumer electronics have rapidly evolved from devices that fit on the desktop to the backpack to the back pocket. That evolution is only accelerating with each new generation of sleek, wearable devices that integrate seamlessly with our ever more productive and connected lifestyles. These emerging devices present new challenges for designers – over and above the challenges they already face in other applications, from displays to data servers to intelligent kitchen appliances.

Dow Corning, a wholly owned subsidiary of The Dow Chemical Company, offers proven material solutions in bonding, sealing, thermal management and other applications where we can help address challenges across the industry’s supply chain. Furthermore, many of our electronics-grade materials have been UL recognized. Contact us today to learn how we can help you optimize the reliability, protection, safety and aesthetics of your next generation of communications and consumer devices.

for Communications and Consumer Electronics

4

DOW CORNING CORPORATION FAST FACTS*

• 7,000 products and services• 25,000 customers worldwide• 11,000 employees worldwide• 60 offices and manufacturinglocations worldwide

• 3-4 percent investment ofsales into R&D

• 3,059 active patents worldwide*Approximate numbers as of Dec. 31, 2015

5

IMAGINE: More performance, reliability and style. Less compromise.

We rely on our electronics to help us be more productive, smarter and increasingly connected to each other as well as to the Internet of Things (IoT). So, we expect these products – from smartwatches to tablets todishwashers – to be more functional,user-friendly, stylish and dependable.

For more than 70 years, Dow Corning’s versatile materials and expert collab-oration have helped designers of consumer, computing and telecommu-nications electronics bridge the gap between cutting-edge innovation and proven performance.

In addition to simplifying manufacturing and assembly, our versatile silicone adhesives, encapsulants and coatings protect against moisture, vibration and shock to enable more reliable, high-functioning portable electronics and computers and more durable home appliances. Thermal interface materials from Dow Corning deliver further protection against damaging heat to enhance reliability for these products, as well as even higher-performing telecommunications components.

touch-screen displays, while our colorable TPSiV® thermoplastic elastomer materials deliver tough yet silky options for wearable electronics that demand proven performance for safe contact with skin.

As an established global leader in silicone materials and expertise, Dow Corning delivers reliable and consistent supply and support along the entire value chain and for its electronics customers worldwide.

Contact us to learn how we can help your next design raise the standard for consumer electronics, computing and telecommunication electronics.

Our silicone-based solutions can help make device designs look and feel as smart on the outside as they are on the inside. Our easy-to-apply functional surface coatings enable easy-to-clean

Innovative Solutions for Consumer, Computer and Telecommunications Electronics

The new hot-melt adhesiveIMAGINE: Slimmer smart devices manufactured more effectively and efficiently.

Better reliability, protection, aestheticsSilicone solutions for communications and consumer electronics.

Ask an expertHave a question about how Dow Corning can help with your specific business needs or materials for electronics applications? Email us at electronics@dowcorning.com.

Hand-Held DevicesMOBILE PHONES, TABLET PCs

Applications: Display module assembly bonding, home key bonding, earphone and speaker bonding

Product: Dow Corning® EA-4600 Hot Melt Adhesive

Benefits: • Instant green strength (high initial strength

instantly after joining the parts)• Good reworkability• Primerless bonding to glass, plastics and metals• Long open time and pot life • Allows for precision micro-beading• Provides environmental sealing, such as

waterproofing – IP67 ingress protection

Application: Electronic device accessories (earbuds, etc.)

Product:TPSiV® thermoplastic elastomer materials

Benefits: • Soft touch and comfort• UV and chemical resistance • Proven skin safety• Bonding to ABS and polycarbonate (PC),

colorability, over-molding capability

Application:Durable and easy-to-clean cover glass coating

Product:Dow Corning® 2634 Coating

Benefits: • Excellent oil and water repellency • Durable surface and reduced-staining properties• Easy-to-clean surface

Application: Printed circuit board (PCB) protection coating

Products: Dow Corning® 1-2577 Conformal Coating Dow Corning® 3-1953 Conformal Coating Dow Corning® 3-1965 Conformal Coating

Benefits: • Ease of application by spraying, dipping

or brushing• Room temperature cure or can be

accelerated with mild heat• Reworkability• Stable and flexible at high temperature• Protection from environmental particulates,

moisture (corrosion) and contaminants• Stress buffer with insulation resistance

6

Application: Waterproof and dustproof sealing

Product:Dow Corning® EA-4600 Hot Melt Adhesive

Benefits: • Allows for precision micro-beading• Instant green strength (high initial strength

instantly after joining the parts)• Good reworkability• Primerless bonding to glass, plastics and

metals• Long open time and pot life• Provides environmental sealing, such as

waterproofing – IP67 ingress protection

Product:Dow Corning® SE-9100 Black Adhesive

Benefits: • More flowable than Dow Corning® EA-4600 Hot

Melt Adhesive• Fast tack-free (fast surface drying)• Good reworkability• Primerless bonding to glass, plastics and

metals• Long open time and pot life• Provides environmental sealing, such as

waterproofing – IP68 ingress protection

Application: Power connector potting

Products:Dow Corning® 3-6876 Adhesive Dow Corning® Q3-6611 Adhesive

Benefits: • Good flowing, filling or self-leveling after

dispensing• Good adhesion to metals by one-part heat cure• Waterproof and dustproof sealing• Stress buffer against shock and drop test• High heat stability against reflow process

Application:Phone bumper

Product:TPSiV® thermoplastic elastomer materials

Benefits: • Soft, silky touch • Excellent sealing • Excellent colorability• Superior UV resistance and chemical resistance;

outstanding durability• Proven skin safety• Bonding to plastic substrates such as PC, ABS;

over-molding capability

Application:Panel gap sealing

Products:Dow Corning® SE-9100 Black Adhesive (reworkable)Dow Corning® SE 9186 Clear or White Adhesive

Benefits: • Room temperature cure; no mixing or oven required• Good flowing, filling or self-leveling after dispensing• Stress buffer against shock and drop test

Application:Speaker module bonding and sealing (sound leakage prevention)

Products:Dow Corning® SE-9100 Black AdhesiveDow Corning® EA-4600 Hot Melt Adhesive

Benefits: • Reworkability• Sound leakage prevention• No mixing or oven required

Product:Dow Corning® SE 9186 Clear or White Adhesive

Benefits: • Sound leakage prevention• Excellent adhesion on plastics (PC housing)• Excellent reliability performance

Application: Mobile phone vibration motor damping (potting)

Product:Dow Corning® SE 9186 Clear or White Adhesive

Benefits: • Room temperature cure; no ovens required• Good flowing, filling or self-leveling after dispensing• Stress buffer against shock and drop test• Excellent adhesion on plastics (PC housing)• Excellent reliability performance

7

ComputersDESKTOP PCs, LAPTOPS, AIO PCs

Application: Thermal management of central processing unit (CPU)

Products: Dow Corning® TC-5121C Thermally Conductive CompoundDow Corning® TC-5622 Thermally Conductive CompoundDow Corning® TC-5026 Thermally Conductive CompoundDow Corning® TC-5022 Thermally Conductive Compound

Benefits: • Noncurable (paste type); no oven required

for curing• Easy control of thin bond line thickness (BLT)

for optimum performance• Very low thermal resistivity• Excellent wettability

Application: Thermal management for heat sink module

Products:Dow Corning® 1-4173 Thermally Conductive AdhesiveDow Corning® SE 4450 Thermally Conductive Adhesive

Benefits: • No mixing required• Versatile cure processing controlled by temperature• Able to flow, fill or self-level after dispensing

Application:PCB protection coating

Products:Dow Corning® 1-2577 Conformal Coating Dow Corning® 3-1953 Conformal Coating Dow Corning® 3-1965 Conformal Coating

Benefits: • Ease of application by spraying, dipping

or brushing• Room temperature cure or can be accelerated

with mild heat• Protection from environmental particulates,

moisture (corrosion) and contaminants• Stress buffer with insulation resistance• Repairable• Stable and flexible at high temperature

8

Application: Durable and easy-to-clean cover glass coating

Product: Dow Corning® 2634 Coating

Benefits: • Fingerprint reduction• Easy to clean• Oil and water repellency• Less staining from contaminants

Application: Laptop structural bonding

Product:Dow Corning® EA-4600 Hot Melt Adhesive

Benefits: • Instant green strength (high initial strength

instantly after joining the parts)• Good reworkability• Primerless bonding to glass, plastics and metals• Long open time and pot life• Allows for precision micro-beading• Can provide environmental sealing, such as

waterproofing

9

Displays

Application:ITO protection for mid-size display (tablet PC)

Products:Dow Corning® SE 9187 L AdhesiveDow Corning® EA-3000 RTV Black or WhiteDow Corning® EA-2000 Silicone Adhesive

Benefits: • Fast tack-free (fast surface drying)• Low viscosity (flowable for narrow gap or low

thickness)• Noncorrosive cure (alcohol type)• Excellent primerless adhesion to many substrates• Low volatility

Application: ITO protection for small-size display (smartphone)

Products: Dow Corning® EA-3342 Terminal SealantDow Corning® EA-3342HV Terminal SealantDow Corning® EA-3342LV Terminal Sealant1

Benefits: • Low viscosity with controlled flowability• Ultrathin film achievable for electrode and

IC protection• Partially reworkable

Application: Bezel-less TV/monitor frame bonding

Products:Dow Corning® SE 9186 Clear or White AdhesiveDow Corning® SE 9186 L Silicone Adhesive Clear Dow Corning® EA-4600 Hot Melt Adhesive

Benefits: • Room temperature cure; no ovens required• Good flowing, filling or self-leveling after dispensing

10

1Dow Corning® EA-3342LV Terminal Sealant cannot be shipped by air.

Application:Bezel-less TV/monitor frame sealing

Product:Dow Corning® SE 9001L Black Adhesive

Benefits: • Good dispensability• Good gap filling after dispensing• Good visual appearance to the naked eye• Improves module reliability

Application:Part fixing

Products:Dow Corning® SE 9186 Clear or White AdhesiveDow Corning® SE 9186 L Silicone Adhesive Clear Dow Corning® EA-4600 Hot Melt Adhesive

Benefits: • Room temperature cure; no ovens required• Good adhesion to many substrates

Application: Gap filler

Products: Dow Corning® SE 9189 L Gray or White RTV AdhesiveDow Corning® SE 9186L Coating

Benefits: • Good flowability/wetting• Adequate adhesion to many substrates• Good appearance after cure• Tack-free time (fast surface drying): 5-8 minutes

Application: Light diffuser for backlight module

Product:Dow Corning Toray EP-2720 Powder

Benefit: • Provides good balance of transmittance and

haze as well as diffusion effect

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Telecommunications

Application:Thermal management for amplifier model

Products:Dow Corning® TC-5121C Thermally Conductive CompoundDow Corning® TC-5021 Thermally Conductive Compound

Benefits: • Low thermal resistance• High thermal conductivity• Thin bond line thickness (BLT)

Application: Thermal management for PCBs

Products: Dow Corning® 3-6652 Thermally Conductive Elastomer Dow Corning® TC-4025 Dispensable Thermal Pad Dow Corning® TC-4015 Dispensable Thermal Pad

Benefits: • Low thermal resistance• High thermal conductivity• Conform to variable level components

Application: Protection for outdoor power units

Products:Dow Corning® 1-2577 Conformal CoatingDow Corning® 3140 RTV Coating

Benefits: • High reliability• Good adhesion• Stable in harsh environments• Very low stress to components

12

Application: Thermal management for servers (power units)

Products: Dow Corning® TC-5622 Thermally ConductiveCompoundDow Corning® TC-5026 Thermally ConductiveCompound

Benefits: • Low thermal resistance• High thermal conductivity• Thin bond line thickness (BLT)• Excellent wettability

Application:Thermal management for MOS-SET

Product:Dow Corning® 1-4173 Thermally Conductive Adhesive

Benefits: • Low thermal resistance• High thermal conductivity• High bonding strength

13

Home Appliances

Application: Washing machine control unit PCB protection

Products: Dow Corning® 1-2577 Low VOC Conformal CoatingDow Corning® 3-1953 Conformal CoatingDow Corning® 3-1965 Conformal Coating

Benefits: • Excellent dielectric performance• Ease of application by spraying, dipping

or brushing• Protection from environmental particulates,

moisture (corrosion) and contaminants• Stress buffer with insulation resistance• Room temperature cure or can be accelerated

with mild heat• Good adhesion to many substrates• Repairable• Stable and flexible at high temperature

Application: Air conditioner PCB protection

Product: Dow Corning® SE 9187 L Adhesive

Benefits: • Room temperature cure with optional heat

acceleration after solvent flash-off• UV indicator allows for automated inspection• Offers some post-cure abrasion resistance

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Application: Various frequency motor thermal bonding

Product:Dow Corning® TC-1500 Thermally Conductive Adhesive

Benefits: • Short tack-free time• High thermal conductivity• Easy to use without mixing• Room temperature cure without heating

Application: Home appliance housing/surface cover

Product:TPSiV® 4000 Series thermoplastic elastomer materials

Benefits: • Soft and silky-touch feel with slip prevention• Colorful and matte look• Excellent UV resistance• Outstanding scratch resistance

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Wearable & Portable Devices

TPSiV ® in wearable devices Application: Wristbands, watchbands, earbuds, other wearable smart devices

Product: TPSiV ® thermoplastic elastomer materials

Benefits: • Unique silky, soft touch• Excellent colorability and UV stability• Proven skin safety• Excellent bonding to polycarbonate, ABS

and similar polar substrates

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TPSiV® in portable devices, appliances & accessoriesApplication: Enclosure parts and protective covers for portable devices, appliances and accessories to enable aesthetics and hand feel (e.g., smartphones, tablets, laptops, speakers, computer mice, home appliances, robotics)

Product: TPSiV ® thermoplastic elastomer materials

Benefits: • Unique silky, soft touch• Excellent colorability• Matte, patterned or glossy finish• Superior durability• Proven skin safety• Excellent bonding to polycarbonate, ABS

and similar polar substrates

TPSiV® in harsh environmentsApplication: Water-resistant sealing on portable devices

Product: TPSiV® thermoplastic elastomer materials

Benefits: • Superior compression set and mechanical

properties to provide excellent sealing• Excellent bonding to polycarbonate, ABS

and similar polar substrates

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Adhesives/SealantsCategory One part; moisture cure RTV

Product nameDow Corning®

3140 RTV Coating

Dow Corning® 3145 RTV

MIL-A-46146 Adhesive Sealant

Dow Corning® SE 9100 Black

Adhesive

Dow Corning® SE 9120 Clear

Sealant

Dow Corning® SE 9186

Clear or White Adhesive

Dow Corning® SE 9186 L

Silicone Adhesive Clear

Dow Corning® EA-3342 Terminal Sealant

Dow Corning® EA-3342HV

Terminal Sealant

Dow Corning® EA-3342LV

Terminal Sealant

Features MIL-A-46146; noncorrosive Reworkable; fast tack-free

Noncorrosive; fast tack-free Controlled flowability; reworkable within one dayReworkable

Flame retardance UL 94 V-1Low molecular weight of siloxane control grade

• • • •

Potential uses

Rigid andflexible

circuit boards; improved

pin/solder joint coverage

Sealing openings in

modules andhousings;

assembly ofcomponents

on PWB

Assembly of mo-bile modules and display modules; coating of hybrid ICs and PCBs;

encapsulation of electrical devices

LCDmodules

Parts fixing on printed circuit boards

Terminal sealing for ITO protection in small-size displays

Sealing of electronic

equipment and modules

LCD modules

Mixing ratio NA NA NA NA NA NA NA

Appearance

Clear to slightly

hazy; smooth, viscous liquid

Translucent/gray

Black

Translucent(Dow Corning® SE 9120 Clear Sealant)/white (Dow Corning®

SE 9120S White Adhesive)

Translucent,white

Translucent,black Black Blue Black

Viscosity @ 25°C, mPa•S 31,000 Nonflowing 50,000 8,000 64,000 27,000 700 750 370Tack-free time @ 25°C, min 70 55 9 9 8 8 9 8 10

Pot life @ 25°C, hr NA NA NA NA NA NA NA NA NARoom temperature cure time

72 hr @ 25°C/50% RH(1)

48 hr @ 25°C/50% RH(1)

24 hr @ 25°C/50% RH(1) – 24 hr @

25°C/50% RH(1)24 hr @

25°C/50% RH(1) – – –

Physical Properties After CureDensity @ 25°C, g/cm3 1.03 1.10 1.02 1.03 1.03 1.02 1.12 (cured) 1.12 (cured) 1.13 (cured)Durometer – JIS Type A 31 (Shore A) 45 (Shore A) 23 24 20 25 – – 37Tensile strength, MPa 3.0 6.5 2.31 1.5 2.5 1.6 7.4 7.1 6.9Elongation, % 419 660 391 375/400 550 340 400 490 477Linear coefficient of thermal expansion, micron/m °C or ppm

315 370 308 – – – – – –

Thermal conductivity, W/m•K – – – – – – – – –Low-molecular-weight siloxane content, % – – 0.006/0.004 0.0055/0.004 0.0035/0.0045 0.0023/0.0029 – – –

Adhesion Properties After CureLap shear adhesion, N/cm2 – – 30-40/GL 29-40/GL 130/GL 92/GL

Electrical Properties After CureDielectric strength, kV/mm 18 20 23 23 23 23 26 34 28.6Volume resistivity, Ω•cm 2E+14 4E+14 9E+15 7E+15 6E+15 6E+15 5E+15 1E+15 3E+15Dielectric constant @ 1 MHz

2.52 @ 100 kHz

2.83 @ 100 kHz 4.01 2.7 2.7 2.7 2.18

@ 100 kHz2.1

@ 100 kHz2.81

@ 100 kHzDielectric tangent @ 1 MHz

1E-03 @ 100 kHz

<2E-04 @ 100 kHz 1E-03 4E-04 1E-03 1E-03 – – –

(1)3 mm thickness.NA = Not applicable (not measured due to inappropriate test method).– = Not available.

ADHESIVES/SEALANTS

18

Dow Corning® SE 9186 Clear or White Adhesive

Temperature, °C

Tack

-free

tim

e, m

in

Cure time, days

Cure

thick

ness

, mm

Dow Corning® SE 9186 Clear or White Adhesive

Temperature, °C

Tack

-free

tim

e, m

in

Cure time, days

Cure

thick

ness

, mm

Adhesives/Sealants

Category One part; moisture cure RTV One part; heat cureTwo part; addition reaction

Product nameDow Corning® SE 9168 RTV

Adhesive

Dow Corning® SE 9001L

Black Adhesive

Dow Corning® SE 9189 L

Gray orWhite RTV Adhesive

Dow Corning® EA-9189

White RTV

Dow Corning® EA-9189 H White RTV Adhesive

Dow Corning® EA-4900

White RTV Adhesive

Dow Corning® SE 1714 Beige or

Black

Dow Corning® Q3-6611 Adhesive

Dow Corning® 3-6876 Gray

Adhesive

Sylgard® 577 Primerless

Silicone Adhesive

Features Noncorrosive; fast tack-free

Adequately flowable; fast

tack-freeNoncorrosive; fast tack-free Noncorrosive; fast tack-free

High tensile strength; high

adhesion strength

High adhesion

Flowable; heat cure; high

tensile strength

Flame retardance UL94 V-0 UL94 V-0 UL94 V-0 UL 94 V-0Low molecular weight of siloxane control grade

• • • •

Potential usesParts fixing on printed

circuit boards

Assembly of mo-bile modules and display modules; coating of hybrid ICs and PCBs; encapsulation

of electrical devices

Parts fixing on printed

circuit boards of power supply

modules; PDP modules

Parts fixing on printed circuit boards of power supplies and CRT, LCD/LED/PDP

ECU; power modules ECU

Sealing lids and housings;

attaching baseplates; sealing for connectors

Sealing for connectors

Mixing ratio NA NA NA NA NA NA NA NA NA 10:1Appearance Gray Black White, gray White White White Beige, black Black, gray Gray GrayViscosity @ 25°C, mPa•S Nonflowing 12,000 22,000 Paste Paste Paste 59,000 92,400 39,900 98,000Tack-free time @ 25°C, min 6.5 8 8 3 2 6 NA NA NA NAPot life @ 25°C, hr NA NA NA NA NA NA NA NA NA 22

Cure time – 24 hr @ 25°C/50% RH(1)

24 hr @ 25°C/50%

RH(1)– – – 0.5 hr

@ 150°C0.5 hr

@ 150°C1 hr @ 125°C;

30 min @ 150°C

1 hr @ 125°C

Physical Properties After CureDensity @ 25°C, g/cm3 1.32 1.03 1.19 1.78 1.68 1.66 1.30 1.32 1.31 1.29Durometer – JIS Type A 44 23 33 – 80 81 66 60 54 (Shore A) 60Tensile strength, MPa 3.69 1.38 2 – 3.9 3.7 7.1 – 3.71 6.8Elongation, % 363 280 220 – 32 30 230 – 207 224Linear coefficient of thermal expansion, micron/m °C or ppm

– 346 – – – – – 250 238 300

Thermal conductivity, W/m•K – – – – 0.88 – 0.3 – –Low-molecular- weight siloxane content, %

0.0035 0.0035/0.004 0.002 0.019 – <0.003 – – –

Adhesion Properties After CureLap shear adhesion, N/cm2 189/GL 46/GL 123/GL 150/GL 225/AL 110/AL 548/AL 586/AL 384/GL 678/AL

Electrical Properties After CureDielectric strength, kV/mm 26 22 25 28 28 25 30 13/14 30 19Volume resistivity, Ω•cm 8E+15 3E+15 9E+14 1E+15 3.3E+15 1.03E+15 5E+15 1.62E+14 9E+14 1E+15Dielectric constant @ 1 MHz 3.2 3.67 3.1 – 2.59

@ 100 kHz3.71

@ 100 kHz 3.1 3 @ 100 kHz 4.4 2.8 @ 100 kHz

Dielectric tangent @ 1 MHz 2E-03 1.5E-03 4E-03 – 9E-03

@ 100 kHz12E-03

@ 100 kHz 3E-03 3.1E-03 @ 100 kHz 1.6E-03 <4E-04

@ 100 kHz(1)3 mm thickness. NA = Not applicable (not measured due to inappropriate test method).– = Not available.

19

Adhesives/Sealants Thermal Potting/EncapsulantsCategory Two part; heat cure elastomer Two part; heat cure elastomer

Product nameDow Corning®

EE-1840 A&B Kit

Sylgard® 160 Silicone

Elastomer

Sylgard® 170 Silicone

ElastomerDow Corning®

SE 1816 CV KitSylgard®

184 Silicone Elastomer

Dow Corning® SE 1740

Sylgard® 567 Primerless

Silicone Encapsulant

Dow Corning® CN 8760 Thermally

Conductive Encapsulant

Dow Corning® CN 8760 G Thermally

Conductive Encapsulant

Features Self-priming adhesion

Room temperature

cure

MIL-PRF-23586F; room temperature

cure

Moderate- temperature

cureTransparent

Moderate- temperature

cure; transparent

Flowable; self-priming adhesion; heat cure

Thermally conductive;

low cost; reworkable

Thermally con-ductive; low cost;

reworkable; higher UL grade than

Dow Corning® CN 8760 Thermally

Conductive Encapsulant

Flame retardance UL 94 V-1 UL 94 V-0 UL 94 V-0 UL 94 V-0Low molecular weight of siloxane control grade

• NA NA

Potential uses LED modules

General potting applications; power supplies; connectors; sensors; industrial controls;

transformers; amplifiers; high-voltage register packs; relays

Flyback transformers; power supply

modules

Sensor potting; PDMS

moldsLED modules LED drivers; parking systems

Mixing ratio 1:1 1:1 1:1 1:1 10:1 1:1 1:1 1:1 1:1Appearance Black Dark gray to

black Black Black Transparent Transparent Black Black BlackViscosity @ 25°C, mPa•S(1) 1,125 Part A: 6,000;

Part B: 3,730 2,135 2,600 3,500 925 Part A: 2,060; Part B: 570 2,850 3,200

Pot life @ 25°C, hr(2) 0.2 0.33 0.25 >24 1.5 >24 – 2 1.67

Cure time 168 hr @ 25°C 24 hr @ 25°C; 4 min @ 100°C

24 hr @ 25°C; 10 min

@ 100°C1 hr @ 100°C 0.33 hr

@ 125°C 0.5 hr @ 80°C 0.25 hr @ 150°C

40 min @ 50°C

24 hr @ 25°C; 30 min @ 60°C

Physical Properties After CureDensity @ 25°C, g/cm3 1.01 Part A: 1.61;

Part B: 1.60Part A: 1.37; Part B: 1.37 1.35 1.03 1.00 1.24 1.6 1.58

Durometer – JIS Type A 22 56 47 35 43 35 (Shore 00) 40 52 45Penetration – JIS K2220, mm/10 – – – – – – – – –Tensile strength, MPa 0.6 4.2 – 2.9 – – – 1.83 1.8Elongation, % 185 104 – 230 – – – 95 85Linear coefficient of thermal expan-sion, micron/m °C or ppm

– 200 275 – 340 – – 300 –

Thermal conductivity, W/m•K – 0.62 – 0.42 – – 0.29 0.66 0.67Low-molecular- weight siloxane content, %

– – – 0.05 – – – – –

Adhesion Properties After CureLap shear adhesion, N/cm2 35/AL NA NA 150/AL – 20/GL 100/AL NA NA

Electrical Properties After CureDielectric strength, kV/mm 17 19 18 26 19 17 21 32 24Volume resistivity, Ω•cm 3.2E+15 6E+14 3E+15 2E+15 3E+14 1E+15 2.1E+15 1E+17 1E+17Dielectric constant @ 1 MHz 3.1 3.45 @ 100

kHz3.16 @ 100

kHz 4.3 2.7 @ 100 kHz 2.8 2.8 @ 100 kHz 2.69 2.66Dielectric tangent @ 1 MHz 2.7E-03 1E-03 @ 100

kHz8E-04 @ 100

kHz 1E-03 1E-03 @ 100 kHz 1E-05 2E-03 @ 100

kHz 3E-03 6E-02(1)Mixed viscosity.(2)Pot life after mixing.NA = Not applicable (not measured due to inappropriate test method).– = Not available.

ADHESIVES/SEALANTS

20

THERMALLY CONDUCTIVE MATERIALS

21

Thermal Interface Materials Thermally Conductive MaterialsCategory Thermal grease compound Thermal grease compound

Product name

Dow Corning® SE 4490 CV

Thermally Conductive Compound

Dow Corning® TC-5022 Thermally

Conductive Compound

Dow Corning® TC-5026 Thermally

Conductive

Dow Corning® TC-5121C Thermally

Conductive Compound

Dow Corning®

TC-5622 Thermally

ConductiveCompound

Dow Corning® CN-8880 Thermal Grease

Dow Corning® SC 102

Compound

Dow Corning® 340 Heat Sink

Compound

Features High thermal conductivity Low thermal resistance; high thermal conductivity

Medium thermal conductivity; low oil penetration

Low oil penetration

Flame retardance UL 94 V-0

Low molecular weight of siloxane control grade

•

Potential usesThermistors;

power IC; power modules; CPU

peripherals

Thermal management

of CPUsThermal interface material for CPUs

Thermal coupling of medium-voltage electrical/electronic

devices to heat sinks

Thermal interface material for CPUs

Transistors; diodes; rectifiers

Thermal coupling of electrical/

electronic devices to heat sinks

Mixing ratio NA NA NA NA NA NA NA NAAppearance White Gray Gray Greenish yellow Gray White White WhiteViscosity @ 25°C, mPa•S 520 77 102 85.7 95 836 29,000 542,000Oil separation – JIS K2220, % 0.00 – – – – <0.01 0.144(1) 0.35(1)

Volatile contents, % 0.04 0.05 0.05 0.30 – 0.14 0.3 0.27Tack-free time, min NA NA NA NA NA NA NA –Pot life @ 25°C, hr NA NA NA NA NA NA NA –Cure time NA NA NA NA NA NA NA NA

Physical Properties After CureDensity @ 25°C, g/cm3 2.63 3.23 3.53 4.00 2.53 2.15 2.45 2.13Durometer – JIS Type A NA NA NA NA NA NA NA NAPenetration – JIS K2207, mm/10 NA NA NA NA NA NA NA –Tensile strength, MPa NA NA NA NA NA NA NA NAElongation, % NA NA NA NA NA NA NA NALinear coefficient of thermal expansion,micron/m °C or ppm

– – – – – – – –

Thermal conductivity, W/m•K 1.91 4.4 2.87 2.9 4.3 1 0.9 0.68Low-molecular-weight siloxane content, % 0.025 – – – – – NA –

Adhesion Properties After CureLap shear adhesion, N/cm2 NA NA NA NA NA NA NA NA

Electrical Properties After CureThermal resistance @ 40 psi, °C*cm2/W 0.77 0.061 0.03 0.09 0.06 – 0.62 –Dielectric strength, kV/mm – 3 8.94 5 – 8.7 2 –Volume resistivity, Ω•cm 2E+14 5E+10 5.9E+11 – – 3E+15 2E+16 –Dielectric constant @ 1 MHz 4.8 @ 50 Hz 18 @ 1 kHz 7.4 @ 1 kHz – – – 4.0 @ 50 Hz –Dielectric tangent @ 1 MHz 1E-03 @ 50 Hz 0.562 @ 1 kHz 0.0003 @ 1 kHz – – – 2E-02 @ 50 Hz –

(1)24 hr @ 120°C. NA = Not applicable (not measured due to inappropriate test method).– = Not available.

Thermally Conductive MaterialsCategory One part; moisture cure thermally conductive adhesive

Product nameDow Corning® SE 4420 Thermally Conductive

Adhesive

Dow Corning® SE 4486 Thermally Conductive

Adhesive

Dow Corning® SE 4485 Thermally Conductive

AdhesiveDow Corning® SE 9184

White RTVDow Corning® TC-1500 Thermally Conductive

AdhesiveFeatures High thermal conductivity High thermal conductivity;

short tack-free timeFlame retardance UL 94 V-0Low molecular weight of siloxane control grade • • •

Potential uses Power supply parts; inkjets; dot printer heads; ECU; adhesion to heat sink of driver IC PDP modules

Parts fixing on printed circuit board power supply

modules

AC variable-frequency motors; adhesion between motor driver modules and

motor shellsMixing ratio NA NA NA NA NAAppearance White White White White WhiteViscosity @ 25°C, mPa•S 108,000 19,600 230,000 Nonflowing NonflowingPenetration – JIS K2220, mm/10 (worked 60 times) NA NA NA NA NAOil separation – JIS K2220, % NA NA NA NA NAVolatile contents, % NA NA NA NA NATack-free time, min 8.11 4 9.78 3 2Pot life @ 25°C, hr NA NA NA NA NACure time – – – – –

Physical Properties After CureDensity @ 25°C, g/cm3 2.26 2.59 2.90 2.22 2.32Durometer – JIS Type A 76 81 90.4 74 82Penetration – JIS K2207, mm/10 NA NA NA NA NATensile strength, MPa 4.14 3.94 3.39 3.17 2.7Elongation, % 77.5 43 – 60 –Linear coefficient of thermal expansion, micron/m °C or ppm

– – – – –

Thermal conductivity, W/m•K 0.92 1.59 2.8 0.84 1.55Low-molecular-weight siloxane content, % – 0.0008 0.0007 0.0022 –

Adhesion Properties After CureLap shear adhesion, N/cm2 267/AL 165/GL 116/GL 170/GL 140/AL

Electrical Properties After CureDielectric strength, kV/mm 28 20 19 20 18Volume resistivity, Ω•cm 1E+15 2E+14 8E+14 2E+15 5E+15Dielectric constant @ 1 MHz 4.1 4.8 5.6 3.9 3.5 @ 100 kHzDielectric tangent @ 1 MHz 2E-03 3E-03 5E-03 2E-03 –

NA = Not applicable (not measured due to inappropriate test method).– = Not available.

THERMAL CONDUCTIVITY UNIT CONVERSION CHARTW/m•K cal/cm•sec•°C kcal/m•h•k Btu/ft•h•°F Btu/in•h•°F

1 W/m•K 1.0 2.388x10-3 0.8598 0.5778 6.9331 cal/cm•sec•°C 418.7 1.0x10-3 60.0 241.9 2,9031 kcal/m•h•k 1.163 2.778x10-3 1.0 0.6720 8.0641 Btu/ft•h•°F 1.731 4.134x10-3 1.448 1.0 12.001 Btu/in•h•°F 0.1442 3.445x10-4 0.124 8.333x10-2 1.0

THERMALLY CONDUCTIVE MATERIALS

22

Thermally Conductive MaterialsCategory One part; heat cure thermally conductive adhesive Two part; moisture cure/heat

cure printable or dispensable pad

Product nameDow Corning® SE 4450 Thermally Conductive

Adhesive

Dow Corning® 1-4173 Thermally Conductive

Adhesive

Dow Corning® 3-1818 Thermally Conductive

Adhesive

Dow Corning® 3-6752 Thermally Conductive

AdhesiveDow Corning® TC-4025

Dispensable Thermal Pad

Features High thermal conductivity Primerless adhesion, includ-ing 0.178 mm glass bead

Primerless adhesion; fast cure

High thermal conductivity; low stress;

reworkableFlame retardance UL 94 V-0 UL 94 V-0Low molecular weight of siloxane control grade

Potential uses Power supply parts; inkjets; dot printer heads; ECU; adhesion to heat sink of driver IC

LED lamps and luminaires; automotive and

consumer applications

Mixing ratio NA NA NA NA 1:1Appearance Gray Gray Gray Gray BlueViscosity @ 25°C, mPa•S 66,400 61,372 75,854 83,300 Part A: 72,667; Part B: 73,600Penetration – JIS K2220, mm/10 (worked 60 times)

NA NA NA NA NA

Oil separation – JIS K2220, % (24 hr @ 120°C)

NA NA NA NA NA

Volatile contents, % NA NA NA NA NATack-free time, min NA NA NA NA NAPot life @ 25°C, hr NA NA NA NA 4

Cure time 0.5 hr @ 150°C 20 min @ 150°C 10 min @ 150°C 3 min @ 150°C24 hr @ 25°C; 145 min @

40°C; 42 min @ 75°C; 15 min @ 100°C; 11 min @ 125°C

Physical Properties After CureDensity @ 25°C, g/cm3 2.73 2.70 2.63 2.61 2.83Durometer – JIS Type A 95 92 88 87 49 (Shore 00)Penetration – JIS K2207, mm/10 NA – – – NATensile strength, MPa 6.65 6.2 4.3 3.76 0.16Elongation, % 45.6 22 20 15 209Linear coefficient of thermal expansion, micron/m °C or ppm

– – – – –

Thermal conductivity, W/m•K 1.92 1.81 1.68 1.69 2.5Low-molecular-weight siloxane content, % – – – – NA

Adhesion Properties After CureLap shear adhesion, N/cm2 345/AL 448/AL 386 357 NA

Electrical Properties After CureDielectric strength, kV/mm 22.2 18 16 15.59 18Volume resistivity, Ω•cm 7E+15 2E+14 6.85E+13 7.10E+13 3.90E+12Dielectric constant @ 1 MHz 5.9 4.9 @ 100 kHz 5.5 @ 100 kHz 5.5 @ 100 kHz 6.4Dielectric tangent @ 1 MHz 3E-03 <3E-03 @ 100 kHz <2.2E-04 @ 100 kHz <1E-04 @ 100 kHz 5E-03

NA = Not applicable (not measured due to inappropriate test method).– = Not available.

Material Thermal Conductivity, W/m•K

Alumina (RT) 21Soda glass (RT) 0.55-0.75Nylon (RT) 0.27Polyethylene (RT) 0.25-0.34Polystyrene (RT) 0.08-0.12

Material Thermal Conductivity, W/m•K

Silicon (0°C) 168Aluminum (0°C) 236Gold (0°C) 319Silver (0°C) 428Iron (0°C) 84Copper (0°C) 403

23

Conformal CoatingsCategory One part; resin One part; modified resin One part; resin One part; elastomer

Product nameDow Corning®

1-2577 Conformal

Coating

Dow Corning® 1-2620

Dispersion RTV Elastoplastic Conformal

Coating

Dow Corning® 1-2577

Conformal Coating Low

VOC

Dow Corning® 1-2620 Low

VOC Conformal Coating

Dow Corning® LDC 2577 D

Silicone Conformal

Coating

Dow Corning® SE 9186L Coating

Dow Corning® EA-2000 Silicone

Adhesive

Dow Corning® EA-3000 RTV Black or White

Dow Corning® EA-9187LH

Features MIL-I-46058C; UL746E; fast TFT; solventborne; low viscosity

MIL-I-46058C; UL746E; fast TFT; solventborne; low viscosity

Fast tack-free; low viscosity

Noncorrosive; fast tack-free Noncorrosive; fast TFT; low

viscosity; UL746E

High viscosity Low viscosity Low viscosity

Flame retardance UL 94 V-0 UL 94 V-0 UL 94 V-0Low molecular weight of siloxane control grade

• • •

Potential uses Coatings for circuit boards and electronic printed wiring boards (PWB)

Coatings for circuit boards and electronic printed wiring boards (PWB)

Coatings for connectors, electronic parts, circuit boards

Coatings for circuit boards and electronic printed wiring boards (PWB)

Appearance Transparent Transparent Transparent Transparent Transparent Translucent, black Black White/black Colorless

Viscosity @ 25°C, mPa•S 950 150 1,094 350 104 27,000 890 1,200 400-700Tack-free time, min 7 5 6 5 5 8 8 8 6-7

Cure timeRTC: 60 min(1); HC: >2 min @ 60°C/15% RH

RTC: 60 min(1); HC: >2 min @ 60°C/15% RH

RTC: 60 min(1); HC: >2 min @ 60°C/15% RH

RTC: 60 min(1); HC: >2 min @ 60°C/15% RH

RTC: 10 min(2); HC: >2 min @ 60°C/15% RH

RTC: 24 hr @ 25°C/50% RH(3)

RTC: 24 hr @ 25°C/50% RH(3)

RTC: 24 hr @ 25°C/50% RH(3)

RTC: 24 hr @ 25°C/50% RH(3)

Physical Properties After CureDensity @ 25°C, g/cm3 1.11 1.11 1.12 1.12 1 1.02 – 1.01 0.977Durometer – JIS Type A 20 (Shore D) 25 (Shore D) 25 (Shore D) 25 (Shore D) 23 (Shore D) 25 24 18 21Low-molecular- weight siloxane content, %

– – – – – 0.0023/0.0029 – 0.0026 –

Electrical Properties After CureDielectric strength, kV/mm 16 22 13 16 26 23 31 19 34Volume resistivity, Ω•cm 5E+13 4.6E+13 2E+14 1E+15 6E+13 6E+15 4E+16 1E+15 1.60E+15Dielectric constant @ 1 MHz

2.7 @ 100 kHz 2.7 @ 100 kHz 2.3 @ 100 kHz 2.5 @ 100 kHz 2.8 @ 100 kHz 2.7 – 2.8 1.73 @ 100 kHz

Dielectric tangent @ 1 MHz

<2E-04 @ 100 kHz

3E-04 @ 100 kHz

3E-04 @ 100 kHz

4E-03 @ 100 kHz

2E-03 @ 100 kHz 1E-03 – 9E-04 1E-03

(1)1 mm thickness.(2)75 μm thickness.(3)3 mm thickness. RTC = Room temperature cure.HC = Heat cure.– = Not available.

CONFORMAL COATINGS

24

Conformal CoatingsCategory One part; elastomer One part; heat cure

Product nameDow Corning®

3-1953 Conformal Coating

Dow Corning® 3-1965 Conformal

Coating

Dow Corning® 3-1944 RTV

Coating

Dow Corning® HC2000 Controlled

Volatility CV Conformal Coating

Dow Corning® SE 9189 L Gray or White RTV

Adhesive

Dow Corning® HC1000

Dow Corning®

1-4105 Conformal Coating

Dow Corning®

Q1-4010 Conformal

Coating

Features Low viscosity; MIL-I-46058C High viscosity Noncorrosive; low viscosity

Noncorrosive; fast tack-free; high viscosity Noncorrosive; low viscosityFast tack-free

Flame retardance UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-1Low molecular weight of siloxane control grade

• • •

Potential usesRigid and flexible circuit boards; electronic printed wiring boards

(PWB); sensitive components and fine-pitch designs

Coatings for connectors,

electronic parts, circuit boards

Coatings for connectors, electronic parts, circuit boardsRigid and flexible circuit boards; electronic printed wiring boards

(PWB); sensitive components and fine-pitch designs

Appearance Translucent Translucent Translucent Translucent White, gray Gray Clear ClearViscosity @ 25°C, mPa•S 353 115 63,775 150 22,000 12,000 450 825Tack-free time, min 8 6 14 18 8 11 – –

Cure timeRTC: 30 min;

HC: 1.5 min @ 60°C/15% RH

RTC: 30 min; HC: 2 min @

60°C/15% RH

RTC: 60 min; HC: 5 min @

60°C/15% RHRTC: 90 min @ 25°C/50% RH(1)

RTC: 24 hr @ 25°C/50% RH(2)

RTC: 300 min @ 25°C/50% RH(3) 5 min @ 100°C 10 min @ 100°C

Physical Properties After CureDensity @ 25°C, g/cm3 0.98 0.99 1.03 1.01 1.19 1.07 0.97 1.00Durometer – JIS Type A 34 33 36 25 33 24 64 (Shore 00) 33Low-molecular- weight siloxane content, %

– – – 0.0025 0.0015 0.005 – –

Electrical Properties After CureDielectric strength, kV/mm 17 17 21 33 25 21 20 23Volume resistivity, Ω•cm 5.5E+15 9E+14 1.6E+15 1E+17 9E+14 2E+15 2.7E+13 2E+14Dielectric con-stant @ 1 MHz – – 2.73 @ 100 kHz 2.7 3.1 3.2 2.6 @ 100 kHz 2.6 @ 100 kHzDielectric tangent @ 1 MHz

<2E-04 @ 100 kHz

<2E-04 @ 100 kHz

<2E-04 @ 100 kHz 5E-03 4E-03 3E-03 <2E-04 @ 100

kHz 3E-4 @ 100 kHz(1)1 mm thickness.(2)3 mm thickness.(3)0.3 mm thickness.RTC = Room temperature cure.HC = Heat cure.– = Not available.

25

Features and Characteristics of Silicone

Chemical features of silicone

Characteristics of silicone

A1.54

Si-Obond

High bondenergy

106kcal/mol

Long bonddistance1.64A

110˚

82.6 kcal/mol

130˚-134˚ wide bond angle

A1.54

Si-Obond

High bondenergy

106kcal/mol

Long bonddistance1.64A

110˚

82.6 kcal/mol

130˚-134˚ wide bond angle

Low modulus

Low moisture absorption

Vapor permeability

Good workability

Cold resistance

Heat resistance

Long Si-O bond distance; wide bond angle

High bond energy

Weak van der Waals force

Covered with CH3 group

Easy rotationof polymer chain

Hydrophobicity

Low viscosity

Less temperature-dependent

Stable bond

26

COMPARED WITH ORGANIC COMPOUND MADE OF CARBON SKELETON

• Long Si-O bond distance• Large bond angle • High bond energy• Weak van der Waals force• Covered with CH3 group

CH3

Si

O

Glossary and Common Properties

About room temperature cure The most common cure type is one-part moisture cure. There are several types, depending on reactive by-products (e.g., deoxime type and dealcohol type). There also are two-part condensation cure types in which curing starts from the surface exposed to air towards the deep section, and its cure speed depends on the absolute moisture. There-fore, although it depends on the size of the substrate, this cure type is not appropriate for bonding larger surfaces.

Pattern diagram of condensation reaction (an example of dealcohol type)

Storage recommendations Storage requirements differ for each product.• Products to store in a cool, dark place: We recom-mend storing products in a cool, dark place, except forthose that require cold storage or refrigeration.

• Products requiring cold storage or refrigeration: As arule, for one-part addition-cure products requiring coldstorage, store between 0 and 5°C; for one-part addition- cure products requiring refrigeration, store between -25and -15°C.

About low-molecular-weight siloxaneWhen a micro-relay, micro-switch or similar micro-elementis in airtight or semi-airtight conditions, ingredients emitted from silicone materials can insulate contact points fromelectric energy, which may cause continuity or contactfailure. These emitted ingredients, called low-molecular- weight siloxane, are shown below. Low-molecular-weightsiloxane reduction grades contain reduced amounts oflow-molecular-weight siloxane.

Structure of low-molecular siloxane

About heat cure To cure addition-cure products by heating, place them in an oven or on a hot plate set at a specified temperature for a certain duration. The duration must be determined based on the heat capacity of the materials used.

Pattern diagram of addition reaction

About cure inhibition Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition-cure adhesives. Most nota-ble of these include organotin and other organometallic compounds; silicone rubber containing organotin catalyst; sulfur, polysulfides, polysulfones or other sulfur-containing materials; unsaturated hydrocarbon plasticizers; and some solder flux residues (e.g., flux, amines, vinyl chloride and sulfur vulcanization rubber).

Conversion factors of SI units and traditional unitProperty Traditional Unit Conversion Factor

and SI UnitViscosity cSt 1.00 mm2/sViscosity cP 1.00 Pa.sViscosity P 0.100 Pa.sTensile strength, modulus kgf/cm2 0.0981 MPaLap shear adhesion kgf/cm2 9.81 N/cm2

Thermal conductivity cal/cm.s.ºC 419 W/m.kComplex elastic modulus dyne/cm2 0.100 Pa.sTorque kgf.cm 0.0981 N.mTear strength, peel kgf/cm 0.981 N/mm

About UL recognition For further information on UL recognition of each product, please see the online certification directory at ul.com. File numbers of the products listed in this brochure are E55519, E229242, E92494, E177248 and E40195.

About correlation between hardness after cure and complex modulus

Guidelines on viscosity before cure

Correlation between penetration and complex modulus for gel

Correlation between hardness and complex modulus for elastomer

Compound

Conformal coatings

Gel potting materials

Adhesives/sealantsMayonnaise

FlowableEngine oil

Honey

0.01100.1

0.11000.1

11,000

10

100Pa•s (cP)

1,000

10

100

1,000 Pa•s

10,000 PPenetration, mm/10

Com

plex

mod

ulus

, Pa

Com

plex

mod

ulus

, Pa

Hardness

Catalyst(e.g.Pt)

Moislurein the air

27

How Can We Help You Today?Tell us about your performance, design and manufacturing challenges. Let us put our silicon-based materials expertise, application knowledge and processing experience to work for you.For more information about our materials and capabilities, visit dowcorning.com.To discuss how we could work together to meet your specific needs, email electronics@dowcorning.com or go to dowcorning.com/ContactUs for a contact close to your location. Dow Corning has customer service teams, science and technology centers, application support teams, sales offices, and manufacturing sites around the globe.

Cover – AV25549, AV25106, AV21745, AV25108, AV23777, AV23124; Page 1 – AV25555, AV25563, AV25566; Page 2 – AV20649, AV25565, AV21870; Page 4 – AV25553, AV25550, AV25561, AV25556; Page 5 – AV25554, AV21862, AV23760; Page 6 – AV23798, AV25571, AV23798, AV23791, AV23262, AV22828; Page 7 – AV23709, AV23792, AV23772, AV25522; Page 8 – AV05999, AV06068, AV23803, AV25552; Page 9 – AV23496, AV23802; Page 10 – AV23800, AV23096, AV25559; Page 11 – AV25558, AV22155, AV23764, AV23802; Page 12 – AV23430; Page 13 – AV20984, AV16291, AV23429; Page 14 – AV22408, AV23776, AV23773, AV25557, AV23435, AV25031; Page 15 – AV23761, AV23774; Page 16 – AV23523, AV25551, AV23518, AV25560, AV25564; Page 17 – AV23708, AV23515, AV23709, AV25562; Page 18 – AV13227; Page 25 – AV12724, AV03117; Page 26 – AV12518; Page 28 – AV218699

HANDLING PRECAUTIONSPRODUCT SAFETY INFORMATION REQUIRED FOR SAFE USE IS NOT INCLUDED IN THIS DOCUMENT. BEFORE HANDLING, READ PRODUCT AND MATERIAL SAFETY DATA SHEETS AND CONTAINER LABELS FOR SAFE USE, PHYSICAL AND HEALTH HAZARD INFORMATION. THE MATERIAL SAFETY DATA SHEET IS AVAILABLE ON THE DOW CORNING WEBSITE AT DOWCORNING.COM, OR FROM YOUR DOW CORNING SALES APPLICATION ENGINEER, OR DISTRIBUTOR, OR BY CALLING DOW CORNING CUSTOMER SERVICE.

LIMITED WARRANTY INFORMATION – PLEASE READ CAREFULLYThe information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution for customers’ tests to ensure that our products are safe, effective and fully satisfactory for the intended end use. Suggestions of use shall not be taken as induce-ments to infringe any patent.

Dow Corning’s sole warranty is that our products will meet the sales specifications in effect at the time of shipment.

Your exclusive remedy for breach of such warranty is limited to refund of purchase price or replacement of any product shown to be other than as warranted.

TO THE FULLEST EXTENT PERMITTED BY APPLICABLE LAW, DOW CORNING SPECIFICALLY DISCLAIMS ANY OTHER EXPRESS OR IMPLIED WARRANTY OF FITNESS FOR A PARTIC-ULAR PURPOSE OR MERCHANTABILITY.

DOW CORNING DISCLAIMS LIABILITY FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES. Dow is a registered trademark of The Dow Chemical Company.Dow Corning is a registered trademark of Dow Corning Corporation. The Corning portion of theDow Corning trademark is a trademark of Corning Incorporated, used under license.TPSiV is a registered trademark of Dow Corning Corporation.Sylgard is a registered trademark of Dow Corning Corporation.©2016 Dow Corning Corporation, a wholly owned subsidiary of The Dow Chemical Company.All rights reserved.AGP14633 Form No. 11-3672-01

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