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Infineon RF Power LDMOS Product Roadmap June, 2012
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 2 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 2
The Infineon Advantage
Leading-edge RF
Performance
Highest power density
Excellent efficiency
Excellent linearity
Enhanced DPD
performance at high IB
Robust transistors
Thin die technology
Low thermal resistance
High RF consistency
High reliability
Lowers the amplitude
of the gain spike.
Space efficient
Lowers BB parasitics
Enables high VBW
Available for these
package styles:
275 (PP)
288 (SE, PP)
Outstanding DPD
performance due to
improved impedance
characteristics at
baseband
Very high IBW
Rugged
State-of-the-art
Infineon LDMOS Fab,
Regensburg, Germany
Fully automated
assembly and test
production facility in
Morgan Hill, CA, USA
100% DC and RF
power tested
Overmold assembly in
multiple AP facilities
Advance LDMOS Technology
Smart Discrete Package
Rugged, Wideband Performance Manufacturing
xBT
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 3 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 3
LD9LF Technology Generation Updated Portfolio 700MHz to 1000 MHz
Best in Class Ruggedness & RF Performance
High Power Density + Innovative Pkg Technology Enable Compact Doherty Designs
Doherty applications
700 – 1000 MHz
Up to 360 Watts
Industry Leading Performance
Gain ~19dB (class AB, at “optimum” tuning point)
Product level PAE ~60%
Enhanced IBW (xBT)
Smart Discrete Package
Increased peak power
>250W in Single Ended package
>400W in Push-Pull Package
Further Improved Thermal Performance
Enhanced ruggedness and IBW (xBT) >400W
For Compact Doherty
>270W
LDMOS Gen LD9 provides 2% better efficiency
and 2dB gain improvements
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 4 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 4
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Available 1H „12
ES PR
2H „12 Future
700 MHz Output Transistors
P1dB ~ 2x75 W
725-768 MHz
H-37248-4
PTFB071502FC
P1dB ~ 360 W 725-768 MHz H-34275-6/2
PTFB073608FV xBT
P1dB ~ 270 W 725-768 MHz H-34288-4/2
PTFB072707FH
P1dB ~ 210 W
725-768 MHz
H-37248-4
PTFA072401FL (xBT)
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 5 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 5
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Available 1H „12
ES PR
2H „12 Future
800-1000 MHz Output Transistors
P1dB ~ 270 W
920–960 MHz
H-34288-4/2
PTFB092707FH
P1dB ~ 360 W
920–960 MHz
H-37275-6/2
PTFB093608FV
P1dB ~ 90 W
920–960 MHz
H-3x265-2
PTFB090901EA/FA
P1dB ~ 270 W
791–821 MHz
H-34288-4/2
PTFB082817FH
P1dB ~ 360 W
920–960 MHz
H-37275-6/2
PTFB093608FV xBT
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 6 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 6
Introducing LD10 LDMOS Portfolio 1.8 GHz to 2.6 GHz
Complete Lineup for Doherty Amplifiers
Strong Development Pipeline
Full Next Generation Platform
2% higher Doherty efficiency
>1.5 dB higher gain than LD9
Improved robustness under fast pulse condition
First Products at 2.6 GHz
Power Levels up to 280 W
Asymmetric 10W + 20W for small cells
Enhanced IBW
Smart Discrete Package
Increased peak power
>300W in Single Ended package
>400W in Push-Pull Package
Enhanced xBT technologies for wider
signal bandwidth
Further Improved Thermals
>400W >270W >300W
PTFC261402FC Broadband Sweep
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 7 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 7
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Available 1H „12
ES PR
2H „12 Future
1800-1900 MHz Output Transistors
P1dB ~ 140W
1930–1990 MHz
H-3x248-2
PTFB191501E/F
P1dB ~ 320 W
1930–1990 MHz
H-37275-6/2
PTFB193404F
P1dB ~ 200W
Asymmetric
(80+120W)
1805–1880 MHz
H-34248-4
PTAB182002FC
P1dB ~ 210 W
1930–1990 MHz
H-3x288-4/2
PTFB192503EL/FL
P1dB ~ 210 W
1805–1880 MHz
H-3x288-4/2
PTFB182503EL/FL
P1dB ~ 320 W
1805–1880 MHz
H-37275-6/2
PTFB183404F P1dB ~ 320 W
1805–1880 MHz
H-34275G-6/2
PTFB183408SV xBT
P1dB ~ 320 W
1910–1990 MHz
H-37275G-6/2
PTFB193408SV xBT
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 8 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 8
Asymmetric Transistors Transistors for Doherty Configuration
Peak : ~ 120 W
Main : ~ 80 W
1805-1880 MHz
Typ. Doherty
Gain : 16 dB
Efficiency : 44%
Pout: 45 dBm Avg.
PTAB182002FC
H-34248-4
24
27
30
33
36
39
42
45
48
51
54
15.0
15.2
15.4
15.6
15.8
16.0
16.2
16.4
16.6
16.8
17.0
38 39 40 41 42 43 44 45 46 47 48
Eff
icie
ncy
Gain
[d
B]
Po [dBm avg]
Gain Eff
Doherty Performance 1C WCDMA, 1842 MHz, 28V, Idq=0.5A, 10dB PAR
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 9 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 9
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Available 1H „12
ES PR
2H „12 Future
2000-2200 MHz Output Transistors
P1dB ~ 140 W
2110–2170 MHz
H-3x248-2
PTFB211501E/F
P1dB ~ 80W
2110–2170 MHz
H-37265-2
PTFB210801FA
P1dB ~ 140 W
2110–2170 MHz
H-3x288-6
PTFB211503EL/FL
P1dB ~ 160 W 2110–2170 MHz H-3x288-6
PTFB211803EL/FL
P1dB ~ 210 W 2110–2170 MHz H-3x288-6
PTFB212503EL/FL
P1dB ~ 280 W 2110–2170 MHz H-37275-8
PTFB213004F P1dB ~ 320 W 2110–2170 MHz H-34275-6/2
PTFB213208FV xBT
P1dB ~ 2x70 W 1880–2025 MHz H-34248-4
PTFB201402FC
P1dB ~ 210 W 2110–2170 MHz H-34288G-4/2
PTFB212507SH xBT
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 10 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 10
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Available 1H „12
ES PR
2H „12 Future
2.3–2.7 GHz Output Transistors
P1dB ~ 2x20 W
2.6 GHz
H-34248-4
PTFC260402FC
P1dB ~ 4x70 W
2.6 GHz
H-34275-6/2
PTFC262808FV xBT
P1dB ~ 2x70 W 2.3-2.4 GHz H-37248-4
PTF241402FC
P1dB ~ 10W/20 W
2.6 GHz
H-34248-4
PTAC260302FC
P1dB ~ 2x10 W
2.6 GHz
H-34248-4
PTFC260202FC
P1dB ~ 2x70 W
2.6 GHz
H-37248-4
PTFC261402FC
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 11 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 11
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Available 1H „12
ES PR
2H „12 Future
Non-Cellular 50V Output Transistors
P1 dB~450 W
390-450 MHz
H-36275-4
Unmatched
PTVA035002EV 50V
P1 dB~12 W
390-450 MHz
H-36265-2
Unmatched
PTVA030121EA 50V
P1 dB~350 W
1.2-1.4 GHz
H-36248-2
Matched I/O
PTVA123501EV 50V
P1 dB~25 W
1.2-1.4 GHz
H-36265-2
Unmatched
PTVA120251EA 50V
P1 dB~1000 W
960-1215MHz
H-36275-2
Matched I/O
PTVA101K02EV 50V
P1 dB~500 W
960-1215MHz
H-36248-2
Matched I/O
PTVA106001EC 50V
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 12 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 12
Innovative 30W Asymmetric Doherty Device for LTE 2.6GHz 5W Pico/Micro Base Station
High efficiency, high performance solution for LTE @ 2.6GHz
Compact 2-in-1 solution for 5W Pave Doherty final stage in pico/micro base station
Smallest heatsink requirement and CTE matched to copper coin, due to pure copper flange
Long-term reliability through LD10M’s very high ruggedness
Asymmetric Doherty configuration Main : 14-15W (P-1dB) @ Zopt
Peak : 18-19W (P-1dB) @ Zopt
Operating Frequency 2.62 – 2.69GHz
Linear Gain 19dB Efficiency (Main) 62% @ P-3dB CW VBW >300MHz (LF gain peak)
Package 248 T2PAC (pure copper flange)
Based on latest LD10M technology
Superior performance at high frequency Very high ruggedness
Best-in-class performance @ 2.6GHz
Exceeds competing devices by ~5% efficiency and ~2dB gain
Product Features
248 Push-Pull Package 20.6 x 9.8 mm
Key Benefits
10
12
14
16
18
20
2500 2600 2700 2800
Gain
[d
B]
Freq [MHz]
26030 Gain at Po=41.0dBm
Meas
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 13 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 13
LDMOS RF Power 2-Stage Amplifiers 700 MHz to 2200 MHz
Product Frequency
MHz
POUT Watts
Gain dB
Eff. %
Test Signal
VDD Volts
Package
PTMA080152M 700 1000 20 29 49 CW 28 PG-DSO-20
PTMA210152M 1800 2200 20 28 48 CW 28 PG-DSO-20
PTMA080302M 700 1000 30 31 46 CW 28 PG-DSO-20
PTMA080304M 700 1000 2x15 31 50 CW 28 PG-DSO-20
PTMA180402EL 1800 2000 40 30 14 CDMA 28 H-33265-8
PTMA180402FL 1800 2000 40 30 14 CDMA 28 H-34265-8
PTMA180402M 1800 2200 40 30 45 CW 28 PG-DSO-20
PTMA210452EL 1900 2200 45 28 10.5 WCDMA 28 H-33265-8
PTMA210452FL 1900 2200 45 28 10.5 WCDMA 28 H-34265-8
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 14 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 14
Unmatched General Purpose Transistors 700 MHz to 2200 MHz
Product Frequency
(MHz) P1dB (W)
Gain (dB)
Eff (%)
Pout PEP (W)
Test Signal
Θjc (°C/W)
VDD
(V) Package
PTFA220041M V4 7002200 5 19 37 4 2T 5.5 28
PTFA220081M V4 7002200 9 18 37 8 2T 4.5 28
PTFA220121M V4 7002200 14 16 37 9 2T 3.4 28
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 15 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 15
Doherty Reference Designs 1800-1900 MHz
Assymetric Doherty - LTA1800-600
• Main: PTFB182503FL V1 Peak: PTFB183404F V1
• 58dBm P3dB
• 44% Efficiency at 8.5dB back off
Assymetric Doherty - LTA1900-600
• Main: PTFB192503FL V1 Peak: PTFB193404F V1
• 58dBm P3dB
• 44% efficiency at 8.5dB back off
Symmetric Doherty - LTD1800-500
• Target 1.8 GHz W-CDMA, GSM, and CDMA systems
• Smart Discrete design offers ultra-compact layout (500W) demo circuit
• Main & Peak: PTFB182503FL V1
• P3dB >56dBm
• 44% efficiency at 6dB back off
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 16 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 16
Four new high power transistors for RADAR markets
PTFB035002EV 390-450 MHz 400W 74% 19dB 275-4 type 10:1 VSWR Pulse 12 microsec 10% duty cycle
PTFB030121EA 390-450 MHz 12W 70% 24dB 265-2 type 10:1 VSWR Pulse 12 microsec 10% duty cycle
PTFB120251EA 1.2-1.4 GHz 30W 54% 16.5dB 265-2 type 10:1 VSWR Pulse 100 microsec 10% duty cycle
PTFB123501EC 1.2-1.4 GHz 350W 53% 15dB 248-2 type 10:1 VSWR Pulse 100microsec 10% duty cycle
Freq Oper. Pout @ 1dB Efficiency Gain Pkg Type Ruggedness Test Cond.
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 17 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 17
PTVA035002EV 500W, 50V, UHF Band
Features:
Designed for pulse applications; high voltage 50V Vdd
Typical performance Class AB (Vdd=50V, 12microsec pulse width, 10% duty cycle, Pout = 500W, 450MHz)
¬ Gain: 18 dB
¬ Drain Efficiency: 64%
Typical performance Class B (Vdd = 50V, 12microsec pulse width, 10% duty cycle, Pout = 500W, 450MHz, Vg=2.9V)
¬ Gain = 15.5 dB
¬ Drain Efficiency: 70%
Capable of CW operation
Capable of withstanding 13:1 load missmatch at 56dBm, 50V
Excellent thermal performance
Rth – 0.2 degC/W
Appendix
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 19 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 19
Frequency: 26 2620 ~ 2680 MHz 24 2420 ~ 2480 MHz 22 700 ~ 2200 MHz 21 2110 ~ 2170 MHz 19 1930 ~ 1990 MHz 18 1805 ~ 1880 MHz 16 1620 ~ 1670 MHz 14 1450 ~ 1500 MHz 09 925 ~ 960 MHz 08 860 ~ 894 MHz 07 725 ~ 770 MHz 04 450 ~ 860 MHz
PT X Y FF PPP C T O Vx (Ryyy)
PTFB091607FH/1 V1 R250
Die Generation: No letter – GM7 A – GM8/LD8/LDH1 B – LD9 C – LD10
Power Rating: 010 – 10 watts 130 – 130 watts 300 – 300 watts etc.
Package Technology: A – Ceramic standard eared flange (obsolete) C – Ceramic earless flange (obsolete) E – Ceramic CPC eared flange (TEPAC) F – Ceramic CPC earless flange (TEPAC) G – Plastic open cavity eared (EPOC) H – Plastic open cavity earless flange (EPOC) M – Plastic over molded – surface mount S – Ceramic open cavity surface mount (TEPAC)
Device Type: F – Discrete 28V M – 2-stage RFIC V – Discrete 50V
RF Power Product Identification System
Package Configuration/Auto-bias Discrete Transistors: 1 – Single-Ended 2 – Push-Pull 3 – Four leads Smart Discrete SE 4 – Four leads Smart Discrete PP 5 – Four leads Smart Discrete + Autobias SE 6 – Four leads Smart Discrete + Autobias PP 7 – Two leads Smart Discrete SE 8 – Two leads Smart Discrete PP For Hybrids/Modules - # of stages For ICs – # of stages
Product Revision
Optional Packing Type R250 - Tape & Reel 250pcs S250 – Tape & Reel 250pcs Txxx – Box with xxx parts
Optional: Customer Specific Product
Open-Cavity Outlines A- 265 C- 248 H-288 V- 275
Overmolded
None – SON10 R - SON 12
June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 20 June 7, 2012 Copyright © Infineon Technologies 2011. All rights reserved. Page 20