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Industry trends are boosting Jet Printing
Nico Coenen – Global Sales Director Jet Printing
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• What is Jet Printing
• Market Overview
• Industry Trends
• Typical Applications
Agenda
What is Jet Printing
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What is Jet Printing?
• Jet Printing at high frequency while moving over the board at high speed
• Solder paste and SMA (Surface Mount Adhesive)
• Dot volumes 5-20 nl
• Unique in the industry
Jet Print Head
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Jet Printing solder paste
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Software control
MY600 Jet printer
Print head
Jet printing3 basic elements
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Cassette has ID chip and barcode on the cartridge• The right paste for the right job• Paste/glue within due date• Low paste level warning
Temperature control• Maintains local paste temperature at 30oC
Closed system• Low solder paste waste• Environmentally friendly
Cassette Holder Ejector CartridgeFilter box
The print head in detailsThe MY600 Cassette
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The print head
paste
Market overview
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The electronics industry segments
Source and copyright: Prismark April 2014
Computer490 BUSD 2.7%
Communications482 BUSD 3.1%
Consumer147 BUSD 3.5%
Automotive178 BUSD 6.5%
Industrial/Medical253 BUSD 5.8%
Military/Aerospace128 BUSD 2.8%
CAGR 2013-2018 Geographic distribution
66%
16%Americas
Asia/ROW
4%JapanEurope
14%
71%
5%7%
Asia/ROW17%
Japan
AmericasEurope
16%AmericasAsia/ROW
19%
57%
EuropeJapan 9%
Americas28%
50%Europe
5%Japan
Asia/ROW 17%
Japan
Americas19%
3%
11%Asia/ROW
Europe67%
Asia/ROW
29%Europe20%
34%18%Americas
Japan
Total: 1,678 BUSD
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PCB assembly market
China 45%
Asia/ROW
19%Japan
7%
Europe12%
Americas
17%
China 45%
Asia/ROW
20%
Japan7%
Europe12%
Americas
16%
2012 2017
Total: 86 BUSD
-of which equipment: 5 BUSDTotal: 112 BUSD
Region CAGR 2012-2017 Segments
Americas 4.2% Industrial/Medical, Military/Aerospace, Infrastructure
Europe 5.4% Industrial/Medical, Automotive, Infrastructure
Japan 5.4% Automotive, Consumer
Asia/ROW 6.5% Mobile, Consumer, Automotive
China 5.4% Computer, Mobile, Consumer, Automotive
Source and copyright: Prismark April 2014
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Market dynamics and trendsElectronics products and effect on PCB assembly
Decreasing cost for electronics
• Cost per placement • Higher speed lines • Higher utilization, quality & yield (DPMO, reject rates, etc.)
Build to order• Higher mix and shorter batches• NPI turn around time• Logistics and material handling
Functionality increases and miniaturization
• More complex boards ‘broad band’ PCBs• Semicon assembly – new packaging needs• Higher accuracy
Increasing safety and reliability requirements
• Higher quality & yield (DPMO, reject rates, etc.)• Higher accuracy
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Electronics ComponentsTo be mounted in PCB assembly
252325
54
6534
43
2018
433
2013
340
270202756
2018
10,401
1,007
9,124
2013
7,314
6,355
Value, BUSD Billion Units
2013-2018 CAGR Value Units
Passives +5.0% +7.5%
Discretes +3.8% +5.9%
ICs +5.2% +5.9%
ICsDiscretesPassives
Source and copyright: Prismark April 2014
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Array package pitch trendsExcludes Small Die DCA, Display Driver and RF Modules
Kc314.088bp-pitch trends
(Excludes Small Die DCA, Display Drivers, and RF Modules)
1.27mm02008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018
10
20
30
40
50
60
70Bn Units
1.0mm
0.5mm
0.65-0.8mm
0.4-0.45mm
0.3-0.35mm
DCA in Module
Note: Sub 0.5mm was 2% of overall volume in 2008. By 2018 this will increase to 28% or 19Bn unitsSource and copyright: Prismark April 2014
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Passive component size reduction
1.2 TrnUnits
2.2 TrnUnits
4.5 TrnUnits
8 TrnUnits
60%Market Share
50%
40%
30%
20%
10%
0%20001996 2005 2010 2015
0805 and larger
0603
0402
0201
01005
Kc0311.080bp-passive
Source and copyright: Prismark April 2014
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PCBA & SCA slowly merging
Accuracy / Quality
Traditional SMT
High-end SMT
Die packaging<1 µm
5µm
15µm
35µm
SCA PCBA
Speed5000 cph
System packaging
Technology Trends
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Strong technology trendsdrive need for new capabilities on equipment
Stencil printers
Dispensers
• difficult to doeverything on the board
• very slow, notcost effective
• accuracy ischallenging
Technology drivers• miniaturization
• mixing large and small components
• higher density boards
• 3D electronics and boards
• new semiconductor packaging
• new LED technology
• hybrid packaging/devices• flexible boards
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Opportunity for jet printingreplacing both stencil printers and dispensers
Stencil printer
1. high-end electronics low to mid volume
2. high volume SMT smart phone board
3. semiconductor LED technology
Stencil printer Stencil printer Dispensing Dispensing
DispensingDispensingDispensingDispensing
Examples
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Which stencil to use?Do I need to compromise?
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perfect volume controlperfect volume control
mix small and large partsmix small and large parts
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3D print examples
Each solder joint can be optimized for: solder paste volume, position, height, shape, pad coverage
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Flexible & thin boards - Panels
Board stretch and alignment• Boards are aligned and any stretch is
compensated for by using board fiducials
Board warpage• Laser height sensor maps board surface• Control software ensures the the print head travels with constant jet
height over the board
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Jet printing challenging boards
With jet printing, you can easily handle multi-level PCB’s
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Pin-in-paste
• Enough solder to cover the pins
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Jet print on mounted boards
Excellent position accuracy even at larger jet printing heights.Result depends on dot size and distance to board.
Typical applications shielding and repair.
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MY500 in high volume production (add-on)
Use the jet printer after the screen printer to add volume or add solder paste to challenging board designs. No need for stepped stencils, special coating, preforms etc.
Step 1. Screen print full board Step 2. Add volume with MY500
Step 1. Screen print all padsexcept cavities. Step 2. Jet print in the board cavities
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Alpha confirms solder joint quality withadd-on
JP-500 jettedbefore and afterRe-flow.
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Industry trends
4the Industrial Revolution
Lights out
factory
Industry 4.0
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Definition Industry 4.0
Industry 1.0
Industry 3.0
Industry 2.0
Industry 4.0
End of 18the century Beg. Of 20the century Beginning of 1970 Today
Deg
ree
of c
ompl
exity
1st Industrial revolution trough introduction of mechanical production facilities with the help of water and steam power
2nd Industrial revolution trough introduction of mass production with the help of electrical energy
3rd Industrial revolution trough application of electronics and IT to further automate production
4th Industrial revolution On the basis of cyber-physical production systems (CPPS), merging of real and virtual worlds
First programmable logic control system 1969
First assembly line 1870
First mechanical weaving loom 1784
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Smart Factory – Cyber Physical Production Systems (CPPS)
Internet of :
People
Service
Things Data
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How does Jet printing serve Industry 4.0Electronics products and effect on PCB assembly
Automation • Automatic changeover possible without human intervention for lot size 1
Software driven • Easy to communicate with other devices, programs received from engineers desk
Closed Loop • Integrated 2D inspection and repair
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• Exciting times with 4the
industrial revolution
• Industry trends pushes PCBA
further
• Jet Printing will be part of this
Conclusions
Thank [email protected]