iep07basicblocks
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BASIC BLOCKS :
PASSIVE COMPONENTS
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PASSIVE COMPONENTS:
Capacitors Junction Capacitors
Inversion Capacitors Parallel Plate Capacitors
Resistors Poly Resistors
Diffused Resistors Switched capacitors as resistors Active Load
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CAPACITORS
The desired characteristics for capacitorsused are given below:· Good matching accuracy· Low voltage-coefficient· High ratio of desired capacitance to
Parasitic capacitance
· High capacitance per unit area
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This structure uses the Gate to Source and gate to
Drain Capacitances to realise the required
Capacitances. This capacitance achieves a large
capacitance per unit area and good matching but
suffers from high voltage dependent parasitic
capacitance to ground.
Poly- SiO2 ² Channel Capacitance
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Poly ² SiO2 ² Poly Capacitor
This is one of the best configurations forhigh performance capacitors.
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MOS Accumulation Capacitor
This has a high capacitance per unit areaand used where grounded capacitors re required.
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Capacitors realized using various inter connect layers
This gives the method to obtain capacitors by
appropriate choice of plates and connection betweenvarious metal and Poly Si layers available. It shouldbe mentioned that each interconnect layer isinsulated from the others by a SiO2 layer. Of thevarious structure shown, the four layer structure
has the least parasitic capacitance. 7
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As processes migrate toward finer line widths and higherspeed performance, the oxide between metals increases whilethe allowed space between metals decreases. For such
processes, samelayer, horizontal, capacitors can be moreefficient than different-layer vertical capacitors. This is dueto the fact that the allowed space between two M1 lines, forexample, is less than the vertical space between M1 and M2.
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The capacitor plate with the smallest parasitic
associated with it is referred to as the top plate.It is not necessarily physically the top platealthough quite often it is. In contrast, the bottomplate is that plate having the larger parasiticcapacitance associated with it. Schematically, the
top plate is represented by the flat plate in thecapacitor symbol while the curved platerepresents the bottom plate.
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While designing for matched capcitors or ratioedcapacitors, a technique of common centroid lay out is
used. The concept is best illustrated with an example.
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VICINITY EFFECTS
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RESISTORS
The diffused resistor is normally formed with
source/drain diffusion. The sheet resistance of suchresistors are normally in the range of 50 to 100;/ for non salicide process and about 5-15;/ forsallicide processes. These resistance have a voltagedependence in the range of 100-500 ppm/V range and
also a high parasitic capacitance to ground. 14
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The poly Si resistor has a sheet resistance in therange of 30-200 ;/ depending on the doping of
the poly Si layer. For a polysilicide process theresistance is about 10;/ .
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The n-well resistance has a resistance of 1-10K;/
along with a high voltage sensitivity. In cases where accuracy is of no concern this structure is veryuseful.
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ACTIVE (ac) RESISTORS
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SWITCHED CAPACITOR RESISTOR
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DSn2
THGSDS V1VVLW
2kI Pd!
BS
DSmb
DS
DSds
GS
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Igand,
V
Ig,
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x
x!
x
x!
x
x!!
dsDSnn
2
THGSDS
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r
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2
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'kV
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mmbs
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gg
J
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SMALL SIGNAL PARAMETERS
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COMMON SOURCE AMPLIFIERS
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gm = gm1 and RL = R ||l rds1 for Resistance load amplifier
gm = gm1 and RL = rds1 ||l rds2 ||l 1/gm2 for Active load
amplifiergm = gm1 and RL = rds1 ||l rds2 for Current source load amplifier and
gm = gm1 + gm2 and RL = rds1 ||l rds2 for Push PullAmplifier.
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Ain = gm1 (R ||l rds1) for Resistance load amplifierAin = gm1 (rds1 ||l rds2 ||l 1/gm2) = for Active load
amplifier.A
in= g
m1(r
ds1||l r
ds2) = for Current source load
amplifierAin = (gm1 + gm2) (rds1 ||l rds2) = for Push Pull amplifier.
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The capacitor at the input CIN = CGS1 for Active Loadand Current Source Load Amplifier and CIN = CGS1 +CGS2 for the Push Pull amplifier. The bridging capacitorC = CGD1 for Active Load and Current Source Load
Amplifier and C = CGD1 + CGD2 for the Push Pullamplifier. The capacitor at the output CL = CLoad + CGS2
+ CBD1 + CBD2 for the Active Load amplifier and is CL =CLoad + CBD1 + CBD2 for the Current Source Load and
Push Pull Amplifiers. 28
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1
1Lm
in
outin s
z/s1Rg
v
vA
[
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MS
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LL1
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s
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CR
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C
gz
CR
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ss
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v
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[[[[!!
CM is the Miller Capacitance seen at the input.
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COMMON DRAIN AMPLIFIER
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loadsourcecurrentforgggg
1r
2ds1ds1mbs1mout
!
loadactiveforggggg
1
2ds2m1ds1mbs1m !
ionconfiguratpullpushforgggggg
1
2ds2mbs2m1ds1mbs1m !
loadsourcecurrentforgggg
g
v
vA
2ds1ds1mbs1m
1m
in
out
!!
loadactiveforggggg
g
2ds2m1ds1mbs1m
1m
!
ionconfiguratpullpushforgggggg
g
2ds2mbs2m1ds1mbs1m
1m
!
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COMMON GATE AMPLIFIER
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LSS1ds1mb1m1ds
L1ds1mb1m
s
out
1ds1mmb1mL1ds
L1ds1m
L1ds
L1ds1mb1m
in
outin
RRRrggr
R1rgg
v
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1rg&ggforRr
Rrg
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!!
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!
1ds
L
1mbs1mSin r
R1
gg1
Rr
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CASCODE AMPLIFIER
C1 = Cgd1, C2 = Cdb1 + Csb2 + Cgs1, C3 = Cgd2
+ Cdb3 + Cdb2 + Cgd3 and L2 = gmbs2/gm2. 35
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1gd3ds
2ds
2m1m1gd
2ds2L2m1m1gd2in1m1gdin
1
1gdM
C3g
g1
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1
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Since in the presence of a signal source with a sourceimpedance RS, the pole contributed by the MillerCapacitance seen by the Cascode amplifier will befarther than the Common Source Amplifier with nearly
the same gain and input and output impedances.
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In cascode amplifier we have used a simple currentsource load. However, to obtain a larger gain we can use a cascade of current mirror load. It should be mentioned here that a single current source isrepresented as a single transistor with a bias while we have represented a cascade current source withtwo transistors in series with appropriate gate bias.
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¹¹ º ¸
©©ª¨ !
2ds
2 3ds3m
2m2in r
rg1g1r
ds
1m
1
1ds2in
1min
11 g2
gg
r
1g
v
vA }¹¹
º
¸©©ª
¨!!
gm2 § gm3, gds2 = gds3 = gds1 = gds5
2m
1ds2ds
3m
4ds3dsL g
gg
g
ggG !
L
ds
L'2in1
out2 G
gG1
r1
vvA }!!
L
1m21
1
out
in
1
in
out
G1
2
gAA
v
v
v
v
v
vA !!!!
TELESCOPIC CASCODE AMPLIFIER
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¹
¹
º
¸
©
©
ª
¨!
2ds
23ds3m
2m2in
r
rg1
g
1r ||l 1/g
ds5
ds
1m
1
1ds2in
1min
11 g2
gg
r
1g
v
vA }¹¹
º
¸©©ª
¨!!
2m
5ds1ds2ds
3m
4ds3dsL g
ggg
g
ggG
!
L
ds
Lin
out
G
g
Gr v
v
A }}!
11
'
21
2
L
1m21
1
out
in
1
in
out
G1
2
gAA
v
v
v
v
v
vA !!!!
FOLDED CASCODE AMPLIFIER
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