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IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. XXX , NO. XXX , 2011 1 Time–Domain Green’s Function–Based Parametric Sensitivity Analysis of Multiconductor Transmission Lines Domenico Spina, Francesco Ferranti, Member, IEEE, Giulio Antonini, Senior Member, IEEE, Tom Dhaene, Senior Member, IEEE, Luc Knockaert, Senior Member, IEEE, Dries Vande Ginste, Member, IEEE, Abstract—We present a new parametric macromodeling tech- nique for lossy and dispersive multiconductor transmission lines (MTLs). This technique can handle multiple design parameters, such as substrate or geometrical layout features, and provides time–domain sensitivity information for voltages and currents at the ports of the lines. It is derived from the dyadic Green’s function of the 1–D wave propagation problem. The rational nature of the Green’s function permits the generation of a time– domain macromodel for the computation of transient voltage and current sensitivities with respect to both electrical and physical parameters, completely avoiding similarity transformation and it is suited to generate state–space models and synthesize equivalent circuits, which can be easily embedded into conventional SPICE– like solvers. Parametric macromodels which provide sensitivity information are well suited for design space exploration, design optimization and crosstalk analysis. Two numerical examples validates the proposed approach in both frequency and time domain. Index Terms—Interconnects, parametric macromodeling, ra- tional approximation, sensitivity analysis. I. I NTRODUCTION The increasing demand for performance of integrated cir- cuits (ICs) pushes operation to higher signal bandwidths, while rapid advances in manufacturing capabilities have significantly reduced the feature size and increased the density of these devices. To assist microwave designers, accurate modeling of previously neglected second order effects, such as crosstalk, reflection, delay and coupling, becomes increasingly important during circuit and system simulations. The accurate prediction of these interconnect effects is fundamental for a successful design and involves the solution of large systems of equations which are often prohibitively CPU expensive to solve [1], [2]. Furthermore, microwave designers have to make the proper trade–offs between conflicting design requirements using op- timization techniques, to obtain the best possible performance considering physical effects such as reflection, crosstalk and Domenico Spina, Francesco Ferranti, Tom Dhaene and Luc Knockaert are with the Department of Information Technology, Internet Based Communi- cation Networks and Services (IBCN), Ghent University – IBBT, Gaston Crommenlaan 8 Bus 201, B-9050 Gent, Belgium, email: {domenico.spina, francesco.ferranti, tom.dhaene, luc.knockaert}@intec.ugent.be; Dries Vande Ginste is with the Department of of Information Technology, Electromagnetics Group, Ghent University, Sint-Pietersnieuwstraat 41, B-9000 Gent, Belgium, email: [email protected]; Giulio Antonini is with the UAq EMC Laboratory, Dipartimento di In- gegneria Elettrica e dell’Informazione, Universit` a degli Studi dell’Aquila, Via G. Gronchi 18, 67100, L’Aquila, Italy, phone: +390862434462, email: [email protected]. propagation delays. For example, once the fabrication technol- ogy is decided, an optimization step is required at the early design stages to select the geometrical and material features of the structure, such as length and width of conductors, dielectric permittivity and metal conductivity, yielding the optimum elec- trical performance, often under stringent signal integrity and electromagnetic compatibility constraints. To perform these design activities using full electromagnetic simulations on the entire parameter space is often computationally expensive, therefore parametric macromodeling techniques that take into account design parameters in addition to frequency (or time) are needed [3], [4]. Recently, a spectral approach has been presented for the analysis of lossy and dispersive MTLs [5] and in [6] it is ex- tended to provide a closed–form sensitivity analysis for MTLs in the frequency–domain. It is based on the computation of the closed–form dyadic Green’s function of the 1–D wave prop- agation problem. The major advantage of such an approach over existing techniques [7], [8] is the rational nature of the dyadic Green’s function which is appropriate for time–domain macromodeling and is suitable to generate a finite state– space representation and an equivalent SPICE circuit by using standard realization [9] and circuit synthesis techniques [10]. In [3], [4] a parametric macromodeling technique for lossy and dispersive MTLs is proposed, based on the spectral approach [5]. It provides time–domain information for voltage and current at the ports of the lines, starting from the knowledge of the multiconductor transmission line (MTL) per–unit–length (p.u.l.) parameters. In the present paper, the cited method is modified to perform the parametric sensitivity analysis of MTLs with respect to either geometric or physical parameters directly in the time–domain, leading to a macromodel that can be used with both linear and non linear terminations. This paper is structured as follows. First, an overview of the spectral approach is given in Sections II. The parametric macromodeling strategy in the frequency–domain is shown in Section III, while the time–domain parametric sensitivity analysis is described in Section IV. Finally, two numerical examples are presented in Section V, validating the proposed technique. Conclusions are summed up in Section VI. II. SPECTRAL MODELING OF MULTICONDUCTOR TRANSMISSION LINES Consider a MTL of length d, with N +1 conductors and N × N p.u.l. impedance matrix Z pul (s, g) and N × N

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Page 1: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND … · Sensitivity Analysis of Multiconductor Transmission Lines Domenico Spina, Francesco Ferranti, Member, IEEE, Giulio Antonini,

IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. XXX , NO. XXX , 2011 1

Time–Domain Green’s Function–Based ParametricSensitivity Analysis of Multiconductor Transmission

LinesDomenico Spina, Francesco Ferranti, Member, IEEE, Giulio Antonini, Senior Member, IEEE,

Tom Dhaene, Senior Member, IEEE, Luc Knockaert, Senior Member, IEEE, Dries Vande Ginste, Member, IEEE,

Abstract—We present a new parametric macromodeling tech-nique for lossy and dispersive multiconductor transmission lines(MTLs). This technique can handle multiple design parameters,such as substrate or geometrical layout features, and providestime–domain sensitivity information for voltages and currentsat the ports of the lines. It is derived from the dyadic Green’sfunction of the 1–D wave propagation problem. The rationalnature of the Green’s function permits the generation of a time–domain macromodel for the computation of transient voltage andcurrent sensitivities with respect to both electrical and physicalparameters, completely avoiding similarity transformation and itis suited to generate state–space models and synthesize equivalentcircuits, which can be easily embedded into conventional SPICE–like solvers. Parametric macromodels which provide sensitivityinformation are well suited for design space exploration, designoptimization and crosstalk analysis. Two numerical examplesvalidates the proposed approach in both frequency and timedomain.

Index Terms—Interconnects, parametric macromodeling, ra-tional approximation, sensitivity analysis.

I. INTRODUCTION

The increasing demand for performance of integrated cir-cuits (ICs) pushes operation to higher signal bandwidths, whilerapid advances in manufacturing capabilities have significantlyreduced the feature size and increased the density of thesedevices. To assist microwave designers, accurate modeling ofpreviously neglected second order effects, such as crosstalk,reflection, delay and coupling, becomes increasingly importantduring circuit and system simulations. The accurate predictionof these interconnect effects is fundamental for a successfuldesign and involves the solution of large systems of equationswhich are often prohibitively CPU expensive to solve [1], [2].Furthermore, microwave designers have to make the propertrade–offs between conflicting design requirements using op-timization techniques, to obtain the best possible performanceconsidering physical effects such as reflection, crosstalk and

Domenico Spina, Francesco Ferranti, Tom Dhaene and Luc Knockaert arewith the Department of Information Technology, Internet Based Communi-cation Networks and Services (IBCN), Ghent University – IBBT, GastonCrommenlaan 8 Bus 201, B-9050 Gent, Belgium, email: domenico.spina,francesco.ferranti, tom.dhaene, [email protected];

Dries Vande Ginste is with the Department of of Information Technology,Electromagnetics Group, Ghent University, Sint-Pietersnieuwstraat 41, B-9000Gent, Belgium, email: [email protected];

Giulio Antonini is with the UAq EMC Laboratory, Dipartimento di In-gegneria Elettrica e dell’Informazione, Universita degli Studi dell’Aquila,Via G. Gronchi 18, 67100, L’Aquila, Italy, phone: +390862434462, email:[email protected].

propagation delays. For example, once the fabrication technol-ogy is decided, an optimization step is required at the earlydesign stages to select the geometrical and material features ofthe structure, such as length and width of conductors, dielectricpermittivity and metal conductivity, yielding the optimum elec-trical performance, often under stringent signal integrity andelectromagnetic compatibility constraints. To perform thesedesign activities using full electromagnetic simulations on theentire parameter space is often computationally expensive,therefore parametric macromodeling techniques that take intoaccount design parameters in addition to frequency (or time)are needed [3], [4].

Recently, a spectral approach has been presented for theanalysis of lossy and dispersive MTLs [5] and in [6] it is ex-tended to provide a closed–form sensitivity analysis for MTLsin the frequency–domain. It is based on the computation of theclosed–form dyadic Green’s function of the 1–D wave prop-agation problem. The major advantage of such an approachover existing techniques [7], [8] is the rational nature of thedyadic Green’s function which is appropriate for time–domainmacromodeling and is suitable to generate a finite state–space representation and an equivalent SPICE circuit by usingstandard realization [9] and circuit synthesis techniques [10].In [3], [4] a parametric macromodeling technique for lossy anddispersive MTLs is proposed, based on the spectral approach[5]. It provides time–domain information for voltage andcurrent at the ports of the lines, starting from the knowledge ofthe multiconductor transmission line (MTL) per–unit–length(p.u.l.) parameters. In the present paper, the cited methodis modified to perform the parametric sensitivity analysis ofMTLs with respect to either geometric or physical parametersdirectly in the time–domain, leading to a macromodel that canbe used with both linear and non linear terminations.

This paper is structured as follows. First, an overview ofthe spectral approach is given in Sections II. The parametricmacromodeling strategy in the frequency–domain is shownin Section III, while the time–domain parametric sensitivityanalysis is described in Section IV. Finally, two numericalexamples are presented in Section V, validating the proposedtechnique. Conclusions are summed up in Section VI.

II. SPECTRAL MODELING OF MULTICONDUCTORTRANSMISSION LINES

Consider a MTL of length d, with N + 1 conductorsand N × N p.u.l. impedance matrix Zpul(s, g) and N × N

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2 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. XXX , NO. XXX , 2011

p.u.l. admittance matrix Y pul(s, g) [11]. Assuming the quasi–transverse electromagnetic (TEM) hypothesis, the propagationof voltages and currents along the line is described by theTelegrapher’s equations [11]. Using the dyadic Green’s func-tion method proposed in [5], the voltage along the uniformMTL with length d can be evaluated as

V (z, s, g) = G(z, 0, s, g) (−Zpul(s, g)I(0, s, g))+ G(z, d, s, g) (−Zpul(s, g)I(d, s, g)) (1)

where s is the Laplace variable, g is a vector containing all thegeometric or physical parameters of the MTL, while I(0, s, g)and I(d, s, g) are N–vectors containing the MTL port currentsat the input and output ports, respectively. The N ×N dyadicGreen’s function G(z, z′, s, g) for uniform MTLs is writtenin a spectral form as

G (z, z′, s, g) = −∞∑

n=0

Ψn(s, g)−1ϕn(z)ϕn(z′) (2a)

Ψn(s, g) = γγγ2(s, g) +(nπ

d

)2

U (2b)

γγγ2(s, g) = Zpul(s, g)Y pul(s, g) (2c)

ϕn(z) = An cos(nπz

d

)(2d)

An =

√1d

if n = 0;

√2d

otherwise (2e)

where U is the N ×N identity matrix. Using (1) to calculatethe voltage at the MTL ports allows to write

V (s, g) = Z(s, g)I(s, g) (3)

where V (s, g) and I(s, g) are the 2N–vectors of the voltageand the current at the MTL ports, respectively, and the 2N ×2N impedance matrix Z(s, g) can be expressed with respectto the Green’s function [5] as

Z(s, g) =∞∑

n=0

Ψn(s, g)−1A2nZpul(s, g)Un (4)

The symbol Un represents the 2N × 2N matrix

Un =[

U (−1)nU(−1)nU U

]Referring to [5], each term of the infinite summation (4) iscalled modal impedance and is represented by the symbolZn(s, g). The series form of the dyadic Green’s function isvery general; it only assumes that the multiconductor trans-mission line supports the quasi–TEM mode and is uniformalong the z–axis. No hypothesis has been done regardingthe nature of the p.u.l. impedance Zpul(s, g) and admittanceY pul(s, g) matrices and, as a consequence, on the propagationconstant γγγ2(s, g). This means that skin–effect, slow–waveeffect and dielectric polarization losses can be easily modeledand incorporated in transient analysis once the frequency–dependent p.u.l. parameters are available [5].

Equation (3) leads to an analytical expression for the voltagesensitivity with respect to the parameters g at the MTL ports

V (s, g) = Z(s, g)I(s, g) + Z(s, g)I(s, g) (5)

The matrix Z(s, g) can be written as [6]

Z(s, g) =∞∑

n=0

(−Ψn(s, g)−1

)A2

nγγγ2(s, g)Ψn(s, g)−1

Zpul(s, g)Un

+∞∑

n=0

Ψn(s, g)−1A2nZpul(s, g)Un

(6)

where the propagation constant sensitivity with respect to g is

γγγ2(s, g) = Zpul(s, g)Y pul(s, g)+Zpul(s, g)Y pul(s, g) (7)

Each term of the infinite summation (6) can be representedwith the symbol Zn(s, g) since it is the sensitivity with respectto g of the corresponding modal impedance Zn(s, g) [6].

Note that only the matrices Zpul(s, g), Y pul(s, g) andthe corresponding derivatives with respect to parameters g(i.e., the Zpul(s, g) and Y pul(s, g) matrices) are required toobtain Z(s, g) from (6). While the p.u.l. parameters can beevaluated through direct measurements [12] on the MTL orusing full–wave electromagnetic simulators, information ontheir derivatives are not a priori known. A key aspect of theproposed technique is to find a good approximation for theZpul(s, g) and Y pul(s, g) matrices in the entire design space.

Note that relations (4) and (6) give a closed form expres-sion for the Z(s, g) and Z(s, g) matrix, respectively, withrespect to the p.u.l. parameters Zpul(s, g) and Y pul(s, g) andthe corresponding sensitivity Zpul(s, g) and Y pul(s, g), butboth expressions require to perform an infinite summation.However, only a finite number of modes is needed to modelthe impedance matrix and its sensitivity accurately over thefrequency bandwidth of interest, as shown in [3]–[6]. Hencea mode–selection criterion must be used to calculate (4) and(6) for all the values of g in the design space.

III. PARAMETRIC MACROMODELING OFMULTICONDUCTOR TRANSMISSION LINES

In this section, it is shown that the spectral decomposition[5], [6] allows to calculate a rational model of Z(s, g) andZ(s, g) for all the values of g in the design space.

To attain this goal, we start from the p.u.l. impedance andadmittance matrices evaluated for a discrete set of values ofthe parameters g in the design space. The p.u.l. impedanceand admittance are usually smooth functions with respect tofrequency and physical or geometrical parameters and thecorresponding matrices are symmetric, thus the initial datafor the p.u.l. impedance and admittance matrices can beeasily numerically interpolated leading to accurate estimationof Zpul(s, g) and Y pul(s, g) in the entire design spacewith very small computational cost. The use of continuouslydifferentiable interpolation schemes allows to obtain also theZpul(s, g) and Y pul(s, g) matrices in the entire design spacewith respect to physical or geometrical parameters g of theinterpolating function. Therefore, we have computed paramet-ric macromodels of the p.u.l. parameters and correspondingsensitivities with respect to (s, g).

Next, we switch from multivariate models to univariatemodels fixing the value of the parameters: g = g. Then, the

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D. SPINA et al.: TIME–DOMAIN GREEN’S FUNCTION–BASED PARAMETRIC SENSITIVITY ANALYSIS OF MULTICONDUCTOR TRANSMISSION LINES 3

matrices Z(s, g) and Z(s, g) can be calculated using the spec-tral decomposition (4) and (6), once the infinite summationof modes is truncated. Algorithm 1 describes the proposedadaptive criterion to choose the required number of modesM for the different values of the geometrical or physicalparameters, indicating with g a fixed set of parameters g andwith Zn(s, g) the corresponding sensitivity modal impedance.The adopted solution is shown only for the Z(s, g) matrix,since a similar procedure for the impedance matrix Z(s, g) isapplied.

Input: Zpul(s, g), Y pul(s, g), Zpul(s, g), Y pul(s, g)

Output: Number of modes M , ZM (s, g)

ZM (s, g) = Zprev(s, g) = 0;n = 0;M = Minit;error = errorchosen;rms error = ∞

if rms error > error thenwhile n < M do

ZM (s, g) = ZM (s, g) + Zn(s, g);n = n + 1;

endrms error = rms error(ZM (s, g), Zprev(s, g));M = Minit + M ;Zprev(s, g) = ZM (s, g);

end

Algorithm 1: Adaptive mode selection strategy.

The desired stable rational models for Z(s, g) and Z(s, g)are now obtained using the Vector Fitting algorithm [13], [14].Finally, the passivity of the model for the impedance matrixcan be checked and enforced in a post–processing step bymeans of standard techniques [15], [16]. To perform designactivities that need multiple simulations (e.g. design spaceexploration, optimization, sensitivity analysis), for each valueg of interest the parametric macromodels of the p.u.l. param-eters are evaluated and the related rational macromodels ofZ(s, g) and Z(s, g) are computed. The proposed parametricmacromodeling strategy is summarized in Fig. 1.

Note that the desired rational model for the impedancematrix could be calculated as explained in [5]. The combi-nation of a rational model for the p.u.l. parameters with theGreen’s function, used to expand the solution of the Sturm–Liouville problem, allows to compute poles and residues ofthe impedance matrix independently for each mode, reducingthe complexity of the system identification significantly. Infact, the technique described in [3], [4] first builds paramet-ric macromodels for the p.u.l. parameters or for the modalimpedance, using the Multivariate Orthonormal Vector FittingTechnique (MOVF) [17], then it combines the initial macro-models according to (4) to obtain the desired macromodel forthe impedance matrix Z(s, g) in the entire design space. Ourgoal, however, it is to build a parametric macromodel alsofor the Z(s, g) matrix, to be able to perform a parametricsensitivity analysis. Using the same approach as describedabove for the spectral decomposition of Z(s, g) may beinefficient. It is easy to see that computing each mode of (6)

is more expensive than computing a mode of (4). If, for eachvalue of interest of g, a large number of modes is neededto compute Z(s, g) in the frequency band of interest, thecorresponding rational model would have a high order of polesif (6) is calculated starting from a rational model for the p.u.l.parameters and the corresponding sensitivities. In the proposedapproach, the number of poles needed for the rational modelof the matrix Z(s, g) depends only on its frequency behavior,leading to an efficient calculation of the spectral decomposition(6).

Note that the Z(s, g) can also be evaluated withperturbation–based techniques, since the computation of theZ(s, g) matrix can be efficiently performed using the exacttransmission line theory. In both approaches an approximationis introduced in the sensitivity computation, but the p.u.l.parameters Zpul(s, g) and Y pul(s, g) are smoother functionswith respect to physical or geometrical parameters than theMTL impedance Z(s, g), affecting the accuracy of the numer-ical approximation. Furthermore, the proposed macromodelingtechnique uses the spectral decomposition (6) to express thesensitivity of the MTL impedance matrix in a closed form,using a numerical approximation only for the calculation ofmatrices Z(s, g) and Y (s, g), while sensitivity perturbation–based techniques are prone to inaccuracies depending on themagnitude of the perturbation [18].

IV. TIME–DOMAIN PARAMETRIC SENSITIVITY ANALYSIS

The proposed technique represents both Z(s, g) andZ(s, g) with a rational model for each desired value of gin the design space. The generation of the time–domain state–space equations in the Jordan form [18], [19] is straightfor-ward. In fact, based on (3), it is easy to calculate the time–domain model for the voltage at the MTL ports

x(t) = AZ x(t) + BZ i(t) (8a)v(t) = CZ x(t) + DZ i(t) (8b)

Hence, based on equation (5), the voltage sensitivity can berepresented by two different sets of state–space equations

x1(t) = AZ

x1(t) + BZ

i(t) (9a)

v1(t) = CZ

x1(t) + DZ

i(t) (9b)

x2(t) = AZ x2(t) + BZ i(t) (10a)

v2(t) = CZ x2(t) + DZ i(t) (10b)

where x(t), x1(t) and x2(t) are state–space variables, whilei(t) = [i0(t) id(t)]T and i(t) = [i0(t) id(t)]T are the inputs[18]. Line terminations are assumed to be modeled by currentsources iS(t) and voltage–driven lumped linear and nonlinearelements that can be described by the following equation

i(t) = iS(t) − Gv(t) − Cdv(t)

dt− f(v(t)) (11)

where v(t) and i(t) are the port voltages and currents, matricesG and C describe linear resistive and capacitive lumpedelements respectively, and f(v(t)) describes lumped nonlinearcomponents. Calculating the derivative of (11) with respect to

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4 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. XXX , NO. XXX , 2011

Fig. 1. Description of the parametric macromodeling strategy.

the parameters g, it is possible to obtain the expression ofsensitivity of the terminations

i(t) = −Gv(t) − Cdv(t)

dt− df(v(t))

dv(t)v(t) (12)

More complex termination networks can be incorporated byusing the modified nodal analysis (MNA) [20]. The portvoltage sensitivity can be finally expressed as

v(t) = v1(t) + v2(t) (13)

Once the port currents are evaluated [18] by solving (8)and (11), state variables x1, x2 and current sensitivity areobtained through (9), (10), (11), (12) and (13). The portvoltage sensitivities are finally recovered using (13).

The proposed macromodeling technique describes an uni-form MTL with state–space representation in the time–domain

as function of a set of physical or geometrical parameters g.The macromodel gives accurate sensitivity information at theports of the lines with respect to g and allows to includenon–linear terminations during the time–domain analysis. Amultistep procedure is used to calculate the state–space modelfor each value of the physical or geometrical parametersin the design space, see Fig. 1, making it suitable to beused in an optimization process. Equations (8)–(13) mustbe solved separately for each time–domain model calculatedfor particular combination g of the geometrical or physicalparameters, making the proposed technique efficient if thenumber of parameters taken into account is limited.

V. NUMERICAL EXAMPLES

In this section the presented technique is applied to differentuniform MTLs. In each example the Zpul and Y pul matricesare interpolated by two polynomial techniques: spline andpchip [21], [22]. pchip finds values of an underlying inter-polant function P (x) ∈ C1 at intermediate points under theconstraint that in each subinterval P (x) is the cubic Hermiteinterpolant, thereby preserving shape and monotonicity of thedata. spline returns the polynomial form of the cubic splineinterpolant S(x) ∈ C2 calculated at the data points, resultingin a not necessarily monotonic interpolation. To describethe accuracy of the parametric macromodeling strategy inthe frequency–domain, for each example the maximum valueof the Frobenius norm of the relative error, indicated withRMSweighted, between the two Z(s, g) macromodels overthe validation grid and the RMSweighted error between themacromodel of the Z(s, g) matrix and its computation fromthe exact transmission line theory (TLT) will be shown. Tovalidate the proposed method, port voltages and currents arecalculated using the classic transmission line theory (TLT–IFFT) in the case of linear terminations and by means ofa solver for ordinary differential equations (TLT–NLS) inthe case of non–linear terminations. The corresponding sen-sitivities are obtained using the perturbative approach. Thesesignals are compared with the ones of the MTL time–domainmacromodel obtained with the newly proposed method, whereboth the polynomial techniques spline and pchip are used tobuild the macromodel.

A. Three–conductor transmission line with non-linear termi-nations

In the first example, two coplanar microstrips over a groundplane (length d = 10 cm) with frequency–dependent p.u.l.parameters have been modeled within the frequency range[100 kHz − 10 GHz], see Fig. 2.The conductors have width w = 100 µm and thicknesst = 50 µm. The spacing S between the microstrips variesover the design range [100 − 500] µm. The dielectric is300 µm thick and it is characterized by a dispersive and lossypermittivity which has been modeled by the wideband Debyemodel [23]. The frequency–dependent p.u.l. parameters areevaluated using a commercial tool [24] over a reference gridof 250 × 20 samples, for frequency and spacing respectively,and the validation is performed over a grid of 10 spacing

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D. SPINA et al.: TIME–DOMAIN GREEN’S FUNCTION–BASED PARAMETRIC SENSITIVITY ANALYSIS OF MULTICONDUCTOR TRANSMISSION LINES 5

Fig. 2. Cross section of the two coupled microstrip.

samples that have not been used for the generation of themacromodel. The accuracy of the parametric macromodelingstrategy is good, as can be assessed in the frequency–domainfrom Table I.

TABLE IMAXIMUM PARAMETRIC MACROMODELING ERROR

Macromodel RMSweighted

Z(s, g) spline 0.0021

Z(s, g) pchip 0.0021

Z(s, g) 0.0644

The time–domain simulations are performed with the fol-lowing settings: one line is excited by a voltage pulse withamplitude 1 V , rise/fall times 900 ps, width 2 ns, initial delay7 ns and internal resistance RS = 50 Ω. The driven line isterminated on a direct biased diode. The current of the diodeis given by

iD(t) = I0

(e

v(t)VT − 1

)(14)

where I0 = 10 nA and VT = 25 mV . The victim line isterminated on the near–end by RNE = 50 Ω and on thefar–end by a direct biased diode, described by (14). Figs. 3and 4 show the accuracy of the proposed technique in thetime–domain using the pchip interpolation. Similar results areobtained for the macromodel built using spline.

B. Coupled inverted embedded microstrip lines withfrequency–dependent p.u.l. parameters and linear terminations

In this next example a three conductors transmission line(length d = 1 mm) with frequency–dependent p.u.l. pa-rameters has been modeled within the frequency range [0 −200] GHz, see Fig. 5. The two inverted microstrips areembedded in a layered background medium, consisting ofa doped Silicon substrate with thickness 30 µm, relativepermittivity εr = 11.7, conductivity σ = 10 S/m, and aninsulator, being 11.4 µm thick SiO2 with relative permittivityεr = 3.9 and loss tangent tanδ = 0.001 [25]. On the top ofinsulator the Aluminum ground plate of thickness 3 µm isfound. The Aluminum has a conductivity of 3.77 · 107 S/m.The conductors, placed at a distance of 6.4 µm above the semi-conductor, are also made of Aluminum and have width 2 µm;the spacing S ∈ [1−6] µm and the height H ∈ [1−3] µm ofthe conductors are considered design parameters in addition

0 5 10 15 20 25

−1

−0.5

0

0.5

1

1.5

Cur

rent

[mA

]

Time [ns]

TLT−NLSMacromodel PchipSpacing=171.8 µm

Spacing=448.7 µm

Fig. 3. Example A. Current at the input port of the victim line forS = [171.8, 253.8, 448.7] µm.

0 5 10 15 20 25

−600

−400

−200

0

200

400

600V

olta

ge S

ensi

tivity

[V/µ

m]

Time [ns]

PerturbativeMacromodel Pchip

Spacing=171.8 µm

Spacing=448.7 µm

Fig. 4. Example A. Voltage sensitivity at the output port of the victimline for S = [171.8, 253.8, 448.7] µm.

Fig. 5. Cross section of the two inverted coupled microstrip.

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6 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. XXX , NO. XXX , 2011

to frequency. The frequency–dependent p.u.l. parameters areevaluated using the technique presented in [26], [27] over areference grid of 101×11×11 samples, for frequency, spacingand height respectively. The validation is performed over a gridof 10× 10 samples for spacing and height, that have not beenused for the generation of the macromodel. Table II shows theaccuracy of the proposed technique in the frequency–domain.

TABLE IIMAXIMUM PARAMETRIC MACROMODELING ERROR

Macromodel RMSweighted Spline RMSweighted Pchip

Z(s, g) 0.0053 0.0033

Macromodel RMSweighted Spacing RMSweighted Height

Z(s, g) 0.0484 0.0059

One line is excited by a voltage pulse with amplitude 1 V ,rise/fall times 30 ps, width 90 ps, initial delay 100 ps andinternal resistance RS = 1 Ω. The driven line is terminated ona parallel RC load RL = 10 kΩ, CL = 1 pF . The victim lineis terminated on the near–end by RNE = 1 Ω and on the far–end by a parallel RC load RFE = 10 kΩ and CFE = 1 pF .Figs. 6 – 8 demonstrate the high accuracy in the time–domainof the proposed method using the spline interpolation for thison–chip example that exhibits a highly dynamic behavior.Similar results are obtained for the macromodel built usingpchip.

0 0.2 0.4 0.6 0.8 1−400

−300

−200

−100

0

100

200

300

400

Vol

tage

[mV

]

Time [ns]

TLT−IFFTMacromodel Spline

S=1.2 µm

S=5.7 µm

Fig. 6. Example B. Voltage at the output port of the victim line forS = [1.2, 3.3, 5.7] µm and H = 2.3 µm.

VI. CONCLUSIONS

In this paper, an innovative parametric macromodelingapproach for lossy and dispersive MTLs is presented. Thedyadic Green’s function of the 1–D wave propagation problemis used to compute a spectral decomposition for the volt-age sensitivity and this leads to a time–domain macromodelin state–space form. Using standard realization techniques,this macromodel can be easily embedded into conventional

0 0.2 0.4 0.6 0.8 1 1.2

−2000

−1500

−1000

−500

0

500

1000

1500

2000

Vol

tage

sen

sitiv

ity [V

/µm

]

Time [ns]

Perturbative ApproachSpline Macromodel

H=1.1 µm

H=2.9 µm

Fig. 7. Example B. Voltage sensitivity with respect to the spacing, at theinput port of the victim line for H = [1.1, 1.9, 2.9] µm and S = 2.8 µm.

0 0.2 0.4 0.6 0.8 1 1.2

−10

−5

0

5

10C

urre

nt s

ensi

tivity

[kA

/µm

]

Time [ns]

Perturbative ApproachSpline Macromodel

S=1.2 µm

S=5.2 µm

Fig. 8. Example B. Current sensitivity with respect to the height, at the inputport of the driven line for S = [1.2, 3.3, 5.2] µm and H = 2.1 µm.

SPICE–like solvers. Numerical interpolation of the p.u.l. pa-rameters and evaluation, performed with numerical techniques,of the corresponding sensitivity with respect to physical orgeometrical parameters, are used to calculate the spectraldecomposition over the entire design space. This leads toa parametric sensitivity analysis that avoids any similaritytransformation and incorporates non–linear terminations in astraightforward way. The new proposed technique is validatedby comparing the MTL port currents and voltages with classicapproaches (TLT–IFFT) and (TLT–NLS). Time–domain sim-ulations confirm reliability and robustness of the proposedmethod.

REFERENCES

[1] A. Deutsch, “Electrical characteristics of interconnects for high-performance systems,” Proc. IEEE, invited paper, vol. 86, no. 2, pp.315–355, 1998.

[2] M. Nakhla and R. Achar, Handbook on VLSI. Boca Raton, FL: CRC,2000.

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D. SPINA et al.: TIME–DOMAIN GREEN’S FUNCTION–BASED PARAMETRIC SENSITIVITY ANALYSIS OF MULTICONDUCTOR TRANSMISSION LINES 7

[3] F. Ferranti, G. Antonini, T. Dhaene and L. Knockaert, “Parametricmacromodeling of lossy and dispersive multiconductor transmissionlines,” IEEE Trans. Adv. Packag., vol. 33, no. 2, pp. 481–491, May2010.

[4] F. Ferranti, T. Dhaene, L. Knockaert, and G. Antonini, “Parameterizedmodels for crosstalk analysis in high-speed interconnects,” in IEEEInternational Symposium on Electromagnetic Compatibility 2009, EMC2009., Aug. 2009, pp. 180 –185.

[5] G. Antonini, “A dyadic Green’s function based method for the transientanalysis of lossy and dispersive multiconductor transmission lines,”IEEE Trans. Microw. Theory Tech., vol. 56, no. 4, pp. 880–895, Apr.2008.

[6] G. Antonini, L. De Camillis, and F. Ruscitti, “A spectral approach tofrequency-domain sensitivity analysis of multiconductor transmissionlines,” IEEE Microw. Wireless Compon. Lett., pp. 65–67, Feb. 2009.

[7] Jun-Fa Mao, E.S. Kuh, “Fast simulation and sensitivity analysis oflossy transmission lines by the method of characteristics,” Circuits andSystems I: Fundamental Theory and Applications, IEEE Transactionson, vol. 44, no. 5, pp. 391–401, May 1997.

[8] N. M. Nakhla, A. Dounavis, M. S. Nakhla, and R. Achar, “Delay-extraction-based sensitivity analysis of multiconductor transmission lineswith nonlinear terminations,” IEEE Trans. Microw. Theory Tech., vol. 53,no. 11, pp. 3520–3530, Nov. 2005.

[9] R. Achar, M. Nakhla, “Simulation of high-speed interconnects,” Proc.IEEE, vol. 89, no. 5, pp. 693–728, May 2001.

[10] G. Antonini, “Spice equivalent circuits of frequency-domain responses,”IEEE Trans. Electromagn. Compat., vol. 45, no. 3, pp. 502–512, 2003.

[11] C. R. Paul, Analysis of Multiconductor Transmission Lines, 2nd ed. NewYork, NY: John Wiley & Sons, 2008.

[12] L. Knockaert, D. De Zutter, F. Olyslager, E. Laermans, J. De Geest,“Recovering lossy multiconductor transmission line parameters fromimpedance or scattering representations,” IEEE Trans. Adv. Packag.,vol. 25, no. 2, pp. 200–205, May 2002.

[13] B. Gustavsen and A. Semlyen, “Rational approximation of frequencydomain responses by vector fitting,” IEEE Trans. Power Del., vol. 14,no. 3, pp. 1052–1061, Jul. 1999.

[14] D. Deschrijver, M.Mrozowski, T. Dhaene, and D. De Zutter, “Macro-modeling of multiport systems using a fast implementation of the vectorfitting method,” IEEE Microw. Wireless Compon. Lett., vol. 18, no. 6,pp. 383–385, June 2008.

[15] B. Gustavsen, “Fast passivity enforcement for pole-residue models byperturbation of residue matrix eigenvalues,” IEEE Trans. Power Del.,vol. 23, no. 4, pp. 2278–2285, Oct. 2008.

[16] A. Semlyen and B. Gustavsen, “A half-size singularity test matrix forfast and reliable passivity assessment of rational models,” IEEE Trans.Power Del., vol. 24, no. 1, pp. pp. 345–351, Jan. 2009.

[17] D. Deschrijver, T. Dhaene and D. De Zutter, “Robust parametric macro-modeling using multivariate orthonormal vector fitting,” IEEE Trans.Microw. Theory Tech., vol. 56, no. 7, pp. 1661–1667, Jul. 2008.

[18] G. Antonini and L. de Camillis, “Time-domain Green’s function-basedsensitivity analysis of multiconductor transmission lines with nonlinearterminations,” IEEE Microw. Wireless Compon. Lett., vol. 19, no. 7, Jul.2009.

[19] C.-T. Chen, Linear System Theory and Design, ser. Electrical andComputer Engineering. New York, NY: Oxford University Press, 1998.

[20] C. Ho, A. Ruehli, and P. Brennan, “The modified nodal approach tonetwork analysis,” IEEE Transactions on Circuits and Systems, vol. 22,no. 6, pp. 504–509, June 1975.

[21] C. de Boor, A Practical Guide to Splines. Springer-Verlag, 1978.[22] F. N. Fritsch and R. E. Carlson, “Monotone piecewise cubic interpola-

tion,” SIAM J. Numerical Analysis, vol. 17, pp. 238–246, Nov. 1980.[23] A. R. Djordjevic, R.M. Biljic, V.D. Likar-Smiljanic, T.K. Sarkar,

“Wideband frequency-domain characterization of fr-4 and time-domaincausality,” IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 662–667, Nov. 2001.

[24] Simbeor, Electromagnetic Simulation Environment with 3D Full-WaveField Solver for Multi-Layered Circuits. Seattle: Simberian Inc.

[25] D. Vande Ginste and D. De Zutter, “Influence of the trapezoidal cross-section of single and coupled inverted embedded microstrip lines onsignal integrity,” in General Assembly and Scientific Symposium, 2011XXXth URSI, Aug. 2011, pp. 1 –4.

[26] T. Demeester and D. De Zutter, “Quasi–TM transmission line parametersof coupled lossy lines based on the Dirichlet to Neumann boundaryoperator,” IEEE Trans. Microw. Theory Tech., vol. 56, no. 7, pp. 1649–1660, Jul. 2008.

[27] T. Demeester, D.Vande Ginste and D. De Zutter, “Accurate study of theelectromagnetic and circuit behavior of finite conducting wedges andinterconnects with arbitrary cross–sections,” IEEE 19th EPEPS, Austin,Texas, USA, pp. 133–136, Oct. 2010.

Domenico Spina received the M.S. degree (summacum laude) in electronic engineering from the Uni-versita degli Studi dell’Aquila in 2010. Since Oc-tober 2010, he has been pursuing the Ph.D. in theDepartment of Information Technology (INTEC) atGhent University in Belgium. His research interestsinclude modeling and simulation, system identifica-tion, microwave engineering and sensitivity analysis.

Francesco Ferranti (M’10) received the B.S. degree(summa cum laude) in electronic engineering fromthe Universita degli Studi di Palermo, Palermo, Italy,in 2005, the M.S. degree (summa cum laude andhonors) in electronic engineering from the Universitadegli Studi dell’Aquila, L’Aquila, Italy, in 2007,and the Ph.D. degree in electrical engineering fromthe University of Ghent, Ghent, Belgium, in 2011.He is currently a Post-Doctoral Research Fellowwith the Department of Information Technology(INTEC), Ghent University, Ghent, Belgium. His

research interests include parametric macromodeling, parameterized modelorder reduction, electromagnetic compatibility numerical modeling, systemidentification.

Giulio Antonini (M’94–SM’05) received the Laureadegree (summa cum laude) in electrical engineer-ing from the Universita degli Studi dell’Aquila, in1994, and the Ph.D. degree in electrical engineeringfrom the University of Rome ”La Sapienza,” in1998. Since 1998, he has been with the UAq EMCLaboratory, Department of Electrical Engineering,University of L’Aquila, where he is currently As-sociate Professor. His research interests focus onEMC analysis, numerical modeling, and in the fieldof signal integrity for high–speed digital systems.

He has authored or coauthored more than 180 technical papers and twobook chapters. Furthermore, he has given keynote lectures and chairedseveral special sessions at international conferences. He holds one Europeanpatent. Dr. Antonini was the recipient of the IEEE TRANSACTIONS ONELECTROMAGNETIC COMPATIBILITY Best Paper Award in 1997, theCST University Publication Award in 2004, the IBM Shared UniversityResearch Award in 2004, 2005, and 2006. In 2006, he received a TechnicalAchievement Award from the IEEE EMC Society ”for innovative contributionsto computational electromagnetic on the Partial Element Equivalent Circuit(PEEC) technique for EMC applications.” He also received the IET–SMTBest Paper Award in 2008. He is vice–chairman of the dell’IEEE EMC ItalyChapter, member of the TC–9 committee, and vice–chairman of the TC–10Committee of the IEEE EMC Society. He serves as member of the editorialboard of IET Science, Measurements, and Technology. He serves as reviewerin a number of IEEE journals.

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8 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. XXX , NO. XXX , 2011

Tom Dhaene was born in Deinze, Belgium, onJune 25, 1966. He received the Ph.D. degree inelectrotechnical engineering from the University ofGhent, Ghent, Belgium, in 1993. From 1989 to1993, he was Research Assistant at the Univer-sity of Ghent, in the Department of InformationTechnology, where his research focused on differ-ent aspects of full–wave electro–magnetic circuitmodeling, transient simulation, and time–domaincharacterization of high–frequency and high–speedinterconnections. In 1993, he joined the EDA com-

pany Alphabit (now part of Agilent). He was one of the key developers of theplanar EM simulator ADS Momentum. Since September 2000, he has beena Professor in the Department of Mathematics and Computer Science at theUniversity of Antwerp, Antwerp, Belgium. Since October 2007, he is a FullProfessor in the Department of Information Technology (INTEC) at GhentUniversity, Ghent, Belgium. As author or co–author, he has contributed tomore than 150 peer–reviewed papers and abstracts in international conferenceproceedings, journals and books. He is the holder of 3 US patents.

Luc Knockaert received the M. Sc. Degree in phys-ical engineering, the M. Sc. Degree in telecommu-nications engineering and the Ph. D. Degree in elec-trical engineering from Ghent University, Belgium,in 1974, 1977 and 1987, respectively. From 1979to 1984 and from 1988 to 1995 he was working inNorth–South cooperation and development projectsat the Universities of the Democratic Republic ofthe Congo and Burundi. He is presently affiliatedwith the Interdisciplinary Institute for BroadBandTechnologies (www.ibbt.be) and a professor at the

Dept. of Information Technology, Ghent University (www.intec.ugent.be). Hiscurrent interests are the application of linear algebra and adaptive methods insignal estimation, model order reduction and computational electromagnetics.As author or co–author he has contributed to more than 100 internationaljournal and conference publications. He is a member of MAA, SIAM and asenior member of IEEE.

Dries Vande Ginste was born in 1977. He receivedthe M.S. degree and the Ph.D. degree in electrical en-gineering from Ghent University, Gent, Belgium, in2000 and 2005, respectively. He is currently an As-sistent Professor with the Electromagnetics Group,Department of Information Technology, Ghent Uni-versity. In June and July 2004, he was a VisitingScientist at the Department of Electrical and Com-puter Engineering, University of Illinois at Urbana-Champaign (UIUC), IL, USA. From September toNovember 2011, he was a Visiting Professor at the

EMC Group, Dipartimento di Elettronica, Politecnico di Torino, Italy. Hiscurrent research interests comprise computational electromagnetics, electro-magnetic compatibility, signal and power integrity, and antenna design. Dr.Vande Ginste was awarded the International Union of Radio Science (URSI)Young Scientist Award at the 2011 URSI General Assembly and ScientificSymposium. He is a Member of the IEEE.