icept final program- · pdf file2 welcome from the general chair the 18th international...
TRANSCRIPT
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CONTENTS
WELCOME FROM THE GENERAL CHAIR .................................................................. 2
CONFERENCE ORGANIZERS ...................................................................................... 3
CONFERENCE CHAIRS ................................................................................................ 4
ADVISORY COMMITTEE ............................................................................................... 4
ORGANIZING COMMITTEE ......................................................................................... 5
TECHNICAL COMMITTEE ............................................................................................ 6
SESSION A -- ADVANCED PACKAGING .................................................................... 6
SESSION B -- PACKAGING MATERIALS & PROCESSES ............................................. 7
SESSION C – PACKAGING DESIGN & MODELING .................................................... 7
SESSION D – INTERCONECT TECHNOLOGIES .......................................................... 8
SESSION E – ADVANCED MANUFACTURING & PACKAGING EQUIPMENT ................. 9
SESSION F – QUALITY & RELIABILITY ................................................................... 9
SESSION G – SOLID STATE LIGHTING PACKAGING & INTEGRATION ........................ 9
SESSION H –MICROWAVE & POWER ELECTRONICS PACKAGING ............................. 9
SESSION I – EMERGING TECHNOLOGIES ............................................................... 10
POSTER SESSION .................................................................................................. 11
OVERVIEW OF CONFERENCE PROGRAM .............................................................. 12
OVERVIEW OF PROFESSIONAL DEVELOPMENT COURSE .................................. 13
OVERVIEW OF PLENARY TALKS ............................................................................... 16
OVERVIEW OF ORAL PRESENTATION SESSIONS .................................................. 22
OVERVIEW OF POSTER SESSIONS ........................................................................... 23
ORAL SESSIONS ........................................................................................................... 28
POSTER SESSION 1 ..................................................................................................... 42
POSTER SESSION 2 ..................................................................................................... 50
CONFERENCE GUIDELINE ....................................................................................... 58
TRANSPORTATION ...................................................................................................... 60
LAYOUT OF CONFERENCE VENUE ......................................................................... 62
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WELCOME FROM THE GENERAL CHAIR
The 18th International Conference on Electronic Packaging Technology (ICEPT) 2017 is an international conference organized by the Chinese Institute of Electronics (CIE), the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), IEEE Components, Packaging, and Manufacturing Technology Society (IEEE-CPMT), and the Electronic Manufacturing and Packaging Technology Society (EMPT) of CIE. Inaugurated in 1994, ICEPT has been successfully held seventeen times in Beijing, Shanghai, Shenzhen, Xi’an, Guilin, Dalian, Chengdu, Changsha and Wuhan. In the past 23 years, ICEPT kept offering participants, including researchers and engineers from both industry and academia with numerous opportunities for the state-of-the-art technologies in electronic packaging. Now, ICEPT is recognized as one of the top four electronic packaging academic conferences, together with ECTC, ESTC and EPTC.
ICEPT 2017 is locally hosted and co-organized by Harbin Institute of Technology (HIT). On behalf of the Organizing Committee of this conference, it is my pleasure to express my warm welcome to domestic and foreign scholars and representatives. In this conference, there are more than 500 delegates from 22 countries and regions with more than 370 papers covering nine special themes. Delegates will communicate electronic packaging technology developments through short courses, keynote lectures, invited lectures, oral presentations, poster and exhibitions. Harbin Institute of Technology (HIT) has made great efforts for preparing the ICEPT 2017. In this regard, on behalf of the Organizing Committee of the conference, I wish to express my heartfelt thanks to Harbin Institute of Technology (HIT).
After a long-term exploration from 1960s to 1990s, China’s semiconductor packaging industry has been growing rapidly in recent 30 years. In the field of advanced packaging technologies, such as SiP, 2.5D interposer, 3D IC, TSV interconnect, WLCSP, FO-WLP and R&D on packaging related materials and equipment, China is rapidly narrowing the technology gap and has accumulated distinct advantages in term of technology and industry. Some leading packaging enterprises of China is playing an important role in the global market. In the first season of 2017, China's IC industry kept a 19.5% increase rate, achieving a sales amount of 95.43 billion RMB which is 14.1 billion USD. Remarkably, the sales amount of packaging and testing industry increased 11.2%, coming up to 33.65 billion RMB, which is 4.97 billion USD, and 30% of which was produced by advanced packaging technology. The future of advanced packaging will become the driving force of continuing Moore's law. We are looking forward a golden age of Chinese advanced packaging industry.
ICEPT will face the opportunities and challenges together and continue promoting exchange of ideas and co-operation among researchers and engineers, which contributes not only to domestic high-end talent training but also to global technological exchange on electronic packaging.
Last but not least, I hope this premier international conference can enhance the long-term collaboration between domestic and international organizations and conferences, such as IEEE-CPMT, IMAPS, iNEMI, ECTC, ESTC and EPTC. You are highly welcomed to ICEPT 2017 and I am looking forward to your participation.
Prof. Tianchun Ye General Chair of ICEPT 2017
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CONFERENCE ORGANIZERS
Directed by 会议指导单位
Department of Higher Education, Ministry of Education, China
中华人民共和国教育部高等教育司
Department of Telecommunication, Ministry of Industry and Information Technology, China
中华人民共和国工业和信息化部电子信
息司
China International Culture Exchange Center, China 中国国际文化交流中心
Hosted by 会议主办单位
Chinese Institute of Electronics, China 中国电子学会
Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China
中国科学院微电子研究所
IEEE Components, Packaging and Manufacturing Technology Society (IEEE-CPMT) (Technical Sponsor)
国际电气电子工程师协会电子元件封装
和生产技术学会(技术主办)
Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics, China (CIE-EMPT)
中国电子学会电子制造与封装技术分会
Harbin Institute of Technology, China 哈尔滨工业大学
Organized by 会议承办单位
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, China
哈尔滨工业大学先进焊接与连接国家重
点实验室
Co-organized by 会议协办单位
Electronic Packaging Division of Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics, China (CIE-EMPT)
中国电子学会电子制造与封装技术分会
电子封装专委会
Beijing Faith Consulting Co., Ltd, China 北京菲尔斯信息咨询有限公司
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CONFERENCE CHAIRS
General Chair
Tianchun YE
Honorary Chair
Keyun BI
Director of Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) Vice President of China Semiconductor Industry Association Director of R&D Center for Internet of Things, Chinese Academy of Science Honorary President of Electronic Manufacturing and Packaging Technology Society (EMPT), CIE, China Standing Director of the Committee, CIE, China Vice President of China Semiconductor Industry Association (CSIA), China
Co-chairs
Jiecai HAN Vice President and Prof. of Harbin Institute of Technology, China
Member of Chinese Academy of Sciences(CAS), China
Jean Trewhella President of IEEE-CPMT, USA
Guoqi ZHANG Prof. of Delft University of Technology, Netherlands
Johan LIU Prof. of Shanghai University, China
Prof. of Chalmers Univ. of Science & Technology, Sweden
Member of Royal Swedish Academy of Engineering, Sweden
Xuejun FAN Prof. of Lamar University, USA
Secretary
Wei LIU Harbin Institute of Technology, China
Wen YIN The Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS)
Guixin YANG Electronic Packaging Division of Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics, China (CIE-EMPT)
ADVISORY COMMITTEE
Shichang ZOU Member of Chinese Academy of Sciences(CAS), China
Juyan XU Member of Chinese Academy of Engineering (CAE), China
Honorary Director of No. 58 Institute of China Electronics
Technology Group Corporation (CETC), China
Ke GONG Foreign Member of Russian Academy of Space Sciences
President of Nankai University
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Jean TREWHELLA IEEE-CPMT President, USA
Rolf ASCHENBRENNER Deputy Director of IZM, Fraunhofer, Germany
Former President of IEEE - CPMT, USA
Ricky S. W. LEE Prof. of Hong Kong University of Science and Technology
(HKUST), Hong Kong, China
Former President of IEEE - CPMT, USA
William T.CHEN Senior Director of Advanced Semiconductor Engineering
Inc.(ASE), USA
Former President of IEEE - CPMT, USA
C.P. WONG Foreign Member of Chinese Academy of Engineering, China
Dean of School of Eng., the Chinese University of Hong Kong
(CUHK), Hong Kong, China
Prof. of Georgia Institute of Technology, USA
Rao TUMMALA Pettit Chair Prof. & Director of Packaging Research Center,
Georgia Institute of Technology, USA
Tadatomo SUGA Prof. of University of Tokyo, Japan
Jie XUE Vice President, Cisco System Inc., USA
Shijing DIAO Director of Electronics Information Dept., Ministry of Industry and
Information Technology, China
Xiaolan XU Secretary-general of the Chinese Institute of Electronics, China
Changsheng CHEN Research Fellow of 15th Research Institute of CETC, China President of Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics, China (CIE-EMPT)
Shouwen YU Former Vice President of Tsinghua University, China
Yintang YANG Deputy President, Xidian University, China
Jusheng MA Prof. of Tsinghua University, China
Xiang ZHANG Prof. of University of California, Berkeley
ORGANIZING COMMITTEE
Chair
Chunqing WANG Harbin Institute of Technology, China
Liqiang CAO National Center for Advanced Packaging, China
Co-chairs
Lei SHI Nantong Fujitsu Microelectronics Co. Ltd, China
Zhong TIAN University of Electronic Science and Technology of China, China
Hongyu ZHENG China Electronics Technology Group Corporation, China
Ming Li Shanghai JiaoTong University, China
Jianhua ZHANG Shanghai University, China
Daoguo YANG Guilin University of Electronic Technology, China
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Tim CHEM Yan Tai Darbond Technology Co., Ltd., China
Secretary
Chunjin HANG Harbin Institute of Technology, China
Zhen ZHENG Harbin Institute of Technology, China
Xingzao HUANG Beijing Faith Consulting Co., Ltd, China
TECHNICAL COMMITTEE
Chair
Yanhong TIAN Harbin Institute of Technology, China
Lixi WAN Institute of Microelectronics, Chinese Academy of Sciences, China
Co-Chairs
Sheng LIU Wuhan University, China
Chiming LAI Jiangsu Changjiang Electronics Technology Co. Ltd., China
Jian CAI Tsinghua University, China
Wenhui ZHU Central South University, China
Yong LIU Fairchild, USA
Fei XIAO
Daniel SHI
Fudan University, China
ASTRI, Hong Kong
Guoliang YU Nantong Fujitsu Microelectronics Co. Ltd, China
Jicai FENG Harbin Institute of Technology, China
Peng HE Harbin Institute of Technology, China
Secretary
Chenxi WANG Harbin Institute of Technology, China
Rong AN Harbin Institute of Technology, China
Wei ZHANG Harbin Institute of Technology, China
Session A -- Advanced Packaging
Chair
Qian WANG
Jintang SHANG
Tsinghua University, China
Southeast University, China
Members
Charlie LU Altera, China
Uihyoung LEE Samsung Electronics Co., Ltd., Korea
GS KIM Kangnam University, Korea
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Cheng YANG Intel China, China
Lei SHAN IBM, USA
John XIE Altera, China
Hao YU Nanyang Technological University, Singapore
Guanglan LIAO Huazhong University of Science and Technology, China
Lixi WANG Nanjing Tech University, China
Tianchi WANG Nanjing University of Science and Technology, China
Wei LIN Apple Inc., USA
Session B -- Packaging Materials & Processes
Chairs
Liangliang LI Tsinghua University, China
Rong SUN Shenzhen Institutes of Advanced Technology Chinese Academy
of Sciences, China
Members
Anmin HU Shanghai Jiao Tong University, China
Zhiheng HUANG Sun Yat-sen University, China
Xin-Ping ZHANG South China University of Technology
Zhong CHEN Nanyang Technological University, Singapore
Young-Bae Park Andong National University, Republic of Korea
Fengqun LANG National Institute of Advanced Industrial Science and
Technology, Japan
Paul WANG MSI, China
Su WANG
Weidong Zhuang
Shanghai Sinyang Materials, China
Nanjing Silvermici, China
Shenggao XIAO Shengyi Technology (Suzhou) Co. Ltd, China
Zhuo LI Fudan Univerisity, China
Guoping ZHANG Shenzhen Institutes of Advanced Technology Chinese Academy
of Sciences, China
Limin MA Beijing University of Technology, China
Jicun LU Fudan University, China
Session C – Packaging Design & Modeling
Chairs
Changqing LIU Loughborough University,UK
Hu HE Central South University, China
Members
Yan ZHANG Shanghai University, China
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Zhongping BAO Qualcomm, USA
Bin XIE ASTRI, China
Hongfei YAN Intel, USA
Qing PENG Wuhan University, China
Wenchao TIAN Xidian University, China
Xiujuan ZHAO Philips, Netherlands
Qing ZHOU Intel, USA
An XIAO Ampleon, Netherlands
Qiang WANG Cisco Systems Inc., China
Tong AN Beijing University of Technology, China
Fei SU Beihang University, China
Xingchang WEI Zhejiang University, China
Pengli ZHU Shenzhen Institutes of Advanced Technology Chinese Academy
of Sciences, China
Yun CHEN Guangdong University of Science, China
Andrew TAY Singapore University of Technology and Design, Singapore
Session D – Interconnect Technologies
Chair
Yuan LU Institute of Microelectronics, Chinese Academy of Science
China
Zhi-Quan LIU Institute of Metal Research, Chinese Academy of Science,
China
Members
Daquan YU Huatian Technology Co., Ltd., China
Xin GU Shennan circuits Co., Ltd., China
Bing AN Huazhong University of Science and Technology, China
Mingxiang CHEN Huazhong University of Science and Technology, China
Ying-Hui WANG Institute of Microelectronics, Chinese Academy of Sciences,
China
Ran HE The University of Tokyo, Japan
Junhui LI Central South University, China
Li ZHANG JangYin ChangDian Advanced Packaging Co. Ltd, China
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Session E – Advanced Manufacturing & Packaging Equipment
Chair
Daoguo YANG Guilin University of Electronic Technology, China
Chenxi WANG Harbin Institute of Technology, China
Members
Jianmin XIONG BESI, China
Haiyang GU 45th Research Institute of CETC, China
Chang ZHOU SMEE, China
K.H. TAN JCAP, China
Li GONG
Xiangdong CAO
SUSS, China
Wuhan Hongtuo new technology limited company, China
Wenhua YANG Hefei University of Technology, China
Fengwen MU The University of Tokyo, Japan
Hongbin SHI Huawei Technologies Co. Ltd, China
Session F – Quality & Reliability
Chairs
Fei XIAO Fudan University, China
Hua LU Greenwich University, UK
Members
Ming XUE
Hsien-Chie CHENG
Infineon, Singapore
Feng Chia University, China
Dongji XIE NVIDIA Corporation, USA
Liping ZHU TriQuint Semiconductor, USA
Xiuzhen LU Shanghai University, China
Boyi WU Flextronics Manufacturing Company, USA
Klaus Galuschki SIEMENS, Germany
Fei QIN Beijing University of Technology, China
Hongtao CHEN Harbin Institute of Technology, China
Session G – Solid State Lighting Packaging & Integration
Chairs
Yunhui MEI Tianjin University, China
Wei LIU Harbin Institute of Technology, China
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Members
Yan LIU Research Institute of Tsinghua University in Shenzhen, China
Hai HU Research Institute of Tsinghua University in Shenzhen, China
Lianqiao YANG Shanghai University, China
Haibo FAN NXP, HongKong, China
Guoqiao TAO Philips Lighting Shanghai, China
Liangbiao CHEN Lamar University, USA
Cheng QIAN State Key Laboratory of Solid State Lighting, China
Yong TANG South China University of Technology, China
Jian GAO Guangdong University of Technology, China
Yi LUO Dalian University of Technology, China
Pu ZHANG State Key Laboratory of Transient Optics and Photonics,
Chinese Academy of Sciences, China
Session H – High-speed & High-frequency Microwave &
Power Electronics Packaging Chair
Chunyan YIN Greenwich University, UK
Dongyan DING Shanghai Jiaotong University, China
Members
Przemyslaw Jakub Gromala Robert Bosch GmbH, Germany
Jifa HAO Fairchild Semiconductor, USA
Jialiang WEN Smart Grid Research Institute, China
Xueru DING Autoliv Active Safety, Sweden
Zhaoqing CHEN IBM, USA
Shanqi ZHAO MacMic Science & Technology Co., Ltd., China
Ziyang GAO Hongkong Applied Science & Technology Research Institute,
China
Klaus Neumaier Fairchild Semiconductor, USA
Lihua LIANG Zhejiang University of Technology, China
Jianyong XIE Intel, USA
Meiling WU National Sun Yat-Sen University, China
Zhenqing ZHAO Delta Electronics Inc., China
Session I – Emerging Technologies Chair
Lei LIU Tsinghua University, China
Chunjin HANG Harbin Institute of Technology, China
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Members
Jian CAI Tsinghua University, China
Zhenfeng WANG SIMTech, Singapore
Changhai WANG Heriot-Watt University, UK
K. Suganuma Osaka University, Japan
Ning ZHAO Dalian University of Technology, China
Zhuo LI Houston Technology Center of CNPC, USA
Cheng YANG
Shengjun Zhou
Shenzhen Research Institute of Tsinghua University, China
Wuhan Univerisy, China
Pradeep Dixit Indian Institute of Technology Bombay, India
Poster Session
Chair
Tiesong LIN Harbin Institute of Technology, China
Ziyang XIU Harbin Institute of Technology, China
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OVERVIEW OF CONFERENCE PROGRAM
Date Time Room A Room B Room F Room E
Aug. 16
08:30--11:30 On-site registration on the 1st floor of VIP Building
11:30—13:30 Lunch: Sunlight Restaurant in VIP Building
13:30—17:30 PDC-1 & PDC-2 PDC-3 & PDC-4 PDC-5 For committee
meeting only
18:00—20:00 Dinner: Sunlight Restaurant on 1st floor of the VIP Building
Date Time Auditorium Hall on the 1st floor of the Conference Center
Aug. 17
08:30—09:10 Opening Ceremony
09:10—10:10 Plenary Talk Session 1
10:10—10:30 Coffee Break
10:30—12:00 Plenary Talk Session 2
12:00—13:30 Lunch: Sunlight Restaurant in VIP Building & Banquet Hall in Catering Building
13:30—15:10 Plenary Talk Session 3
15:10—15:30 Coffee Break
15:30—17:35 Plenary Talk Session 4
18:30—20:30 Dinner: Auditorium Hall on the 1st floor of the Conference Center
Date Time Room A RoomB Room C Room D Room E Room F RoomG
Aug. 18
08:30—09:55 Oral
Session 1 Oral
Session 2 Oral
Session 3 Oral
Session 4 Oral
Session 5 Oral
Session 6 Oral
Session 7
09:55—10:50 Poster Session 1, Exhibition & Coffee Break
10:50—12:10 Oral
Session 8 Oral
Session 9 Oral
Session 10 Oral
Session 11 Oral
Session 12 Oral
Session 13Oral
Session 14
12:10—13:30 Lunch: Sunlight Restaurant in VIP Building & Banquet Hall in Catering Building
13:30—14:50 Oral
Session 15 Oral
Session 16 Oral
Session 17 Oral
Session 18 Oral
Session 19 Oral
Session 20Oral
Session 21
14:50—15:50 Poster Session 2, Exhibition & Coffee Break
15:50—17:10 Oral
Session 22 Oral
Session 23 Oral
Session 24 Oral
Session 25 Oral
Session 26 Oral
Session 27Oral
Session 28
17:30--20:30 Dinner: Sunlight Restaurant on 1st floor of the VIP Building
Aug. 19 08:00--18:00 The End
Note: Room A: Conference Hall 1 on the 1st floor Room B: Conference Hall 3 on the 1st floor Room C: Conference Hall 9 on the 2nd floor Room D: Conference Hall 10 on the 2nd floor Room E: Conference Hall 14 on the 2nd floor Room F: Conference Hall 15 on the 2nd floor Room G: Conference Hall 16 on the 2nd floor
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OVERVIEW OF PROFESSIONAL DEVELOPMENT COURSE
Wednesday, August 16, 2017
Venue Time Topic Speaker
Room A
13:30--15:30
PDC-1 It is Time for Low Temperature – Low
Temperature Solders, New Development, and Their Applications
Ning-Cheng Lee, Indium, USA
15:30--17:30 PDC-2
Polymer Nanocomposites for Electronic Applications
Daniel Lu, Henkel Corporation, USA C. P. Wong, Chinese University of Hong Kong, HK, China
18:00--19:30 Dinner: Sunlight Restaurant on 1st floor of the VIP Building
Room B
13:30--15:30 PDC-3
Fan-Out Wafer-Level Packaging and 3D Packaging
John H Lau, ASMPT, HK
15:30--17:30 PDC-4
3D WLCSP Using TSV Technology
Daquan Yu, Huatian Technology Co.,Ltd., China
18:00--19:30 Dinner: Sunlight Restaurant on 1st floor of the VIP Building
Room F 13:30--15:30
PDC-5 Advanced Integrated Circuits Reliability
Richard Rao, Microsemi, USA
18:00--19:30 Dinner: Sunlight Restaurant on 1st floor of the VIP Building
Introduction of PDC Lecturers
Dr. Ning-Cheng Lee, Indium Corporation, USA
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development of fluxes and solders for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.
Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing
with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI or SMTA international conferences, 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference, and Best Paper Award of SMTA China South 2010. He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, and 2010 Electronics Manufacturing Technology Award from CPMT. He serves on the board of governors for CPMT and served on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.
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Dr. Daniel Lu, Henkel Corporation, USA
Dr. Daniel Lu is the Vice President of Technology, Henkel Corporation in Asia Pacific. Prior to joining Henkel, he worked for the R&D department of Intel Corp (AZ, USA), as a Sr. Scientist for 7 years. He received his MS and PhD degrees on Polymer Science and Engineering from Georgia Institute of Technology in 1996 and 2000, respectively. Dr. Lu received many awards including 2017 IEEE CPMT Electronic Manufacturing Technology Award, the IEEE/CPMT Outstanding Young Engineer Award in 2004, the IEEE ECTC best poster paper in 2007, Intel’s most patent filing in 2003-2007, etc. Dr. Lu has published more than 50 journal papers, wrote chapters for six books, and holds more than 80 US and international patents. He is the editor of
the books “Materials for Advanced Packaging (2008 edition and 2017 edition)” and co-author of the book “Electronically Conductive Adhesives with Nanotechnologies (2009)”. Dr. Lu is a senior member of IEEE, and an associate editor of IEEE Transactions on Advanced Packaging and Journal of Nanomaterials, and an editorial board member of Nanoscience & Nanotechnology-Asia. Dr. Lu also serves as the adjunct professor in Huazhong University of Science and Technology, and SIAT (Shenzhen Institute of Advanced Technologies), Chinese Academy of Science. Dr. Lu has more 15 years of experience in electronic packaging and is an expert in electronic packaging materials and processing.
Prof. Ching-Ping (C.P.) Wong, Chinese University of Hong Kong, HK, China
Prof. Ching-Ping (C.P.) Wong is the dean of Engineering with the Chinese University of Hong Kong and the Georgia Institute of Technology where he is a Regents’ Professor and the Charles Smithgall Institute-Endowed Chair at the School of Materials Science and Engineering. Professor Wong has published widely with over 1,000 technical papers and holds over 65 US patents and is considered an industry legend that has made significant contributions to the industry by pioneering new materials, which fundamentally changed the semiconductor packaging technology. He is a member of the US National Academy of Engineering and a Foreign Academician of the Chinese Academy of Engineering.
Dr. John H. Lau, ASMPT, Hong Kong, China With more than 38 years of R&D and manufacturing experience in semiconductor packaging, John has published more than 450 peer-reviewed papers, 30 issued and pending patents, and 18 textbooks on, e.g., Advanced MEMS Packaging (2010), Reliability of RoHS compliant 2D and 3D IC Interconnects (2011), TSV for 3D Integration, (2013), and 3D IC Integration and Packaging (2016), all by McGraw-Hill Book Company. John is a Fellow of IEEE, ASME, and IMAPS.
Dr. Daquan Yu, Huatian Technology Co., Ltd., China
Dr. Daquan Yu is the CTO, President of Research Academy of Advanced Packaging Technology of Huatian Group since 2014.
He received his PhD degree in Materials Science and Engineering from Dalian University of Technology in 2004. He had carried out research work on advanced packaging technology at Fraunhofer IZM in Berlin, Germany and Institute of Microelectronics in Singapore. He was a professor of Institute of Microelectronics, Chinese Academy of Sciences from 2010 to 2015.
He has authored or co-authored more than 140 peer-reviewed technical publications and holds more than 40 patents. He is an IEEE senior member since 2013, the member of expert committee of 02 National Science &Technology Major Program of China since 2014. He was awarded several honors such as Humboldt fellowship in 2006, 100 Talents Program of the Chinese Academy of Sciences in 2010, high-level innovation talent plan of Jiangsu province in 2016.
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Dr. Richard Rao, Microsemi Corporation, USA
Dr. Richard Rao is currently a Fellow of Microsemi Corp, a lead supplier of high reliability integrate circuit, located in southern California, USA and an elected Senior Member of IEEE. He is responsible for the corporate reliability and advanced packaging solutions. His focus is to find the advanced packages to meet the high performance, high reliability and high power semiconductor ICs; to study the new failure modes and mechanisms of cutting edge Silicon and packaging technologies as well as to develop design for reliability solutions for advanced circuits, packaging and chip to package interaction. He has a Ph.D. degree in solid mechanics of materials from the University of Science and Technology of China. Prior to joining Microsemi
in 2004, Dr. Rao held various academic and technical positions in reliability physics and engineering. He was an associate professor at University of Science and Technology of China, a research fellow at Northwestern University, Evanston, IL, USA and a NSTB Research Fellow of Singapore. He also held senior and principal technical positions in Motorola Electronics and Ericsson Inc. He has published over 30 papers on reliability physics and applications and also a main contributor of several JEDEC standards. He is a technical committee member of IRPS (International Reliability and Physics Symposium) and ECTC (Electronics Component and Technology Conference). He is a frequent speaker to IRPS, ECTC, ISQED (International Symposium on Quality Electronics Design), ASME Symposiums and a keynote speaker to ICEPT and International Conf on System on Chip, etc. Dr. Rao has over 20 years’ hands on experience and knowledge in silicon to package to system integration such as HKMG and FinFET, high performance FCBGA/CSP, FOWLP,2.5D/3D, silicon photonics, chip to package to board interaction, board and system level reliability physics and applications. He has conducted professional development courses on advanced IC reliability to both industrial and academic worlds.
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OVERVIEW OF PLENARY TALKS
Thursday, August 17, 2017 Auditorium Hall on the 1st floor of the Conference Center
8:30--12:10, Auditorium Hall on the 1st floor of the Conference Center Chairs: Prof. Guoqi ZHANG, Delft University of Technology, Netherlands
Prof. Chunqing WANG, Harbin Institute of Technology, China
08:30--09:10 Opening Ceremony
09:10--09:40 Heterogeneous Integration – Vertical or Horzontal Jean Trewhella IEEE-CPMT President, GLOBALFOUNDRIES, USA
09:40—10:10
Hybrid Nano Battery Supercapacitor Materials for Renewable Energy Storage Applications Prof. C.P. Wong Chinese University of Hong Kong, HK, China
10:10--10:30 Coffee Break
10:30--11:00 Future of Packaging: Embedded and Non-embedded Fan-out Prof. Rao Tummala Georgia Institute of Technology, USA
11:00--11:30 Roadmapping Heterogeneous Integration – a Key to the Future Dr. William Chen ASE Group, USA
11:30--12:00 The Rise of China in IC Packaging Dr. Ming Liu Jiangsu Changjiang Electronics Technology Co., Ltd, China
12:00--13:30 Lunch: Sunlight Restaurant in VIP Building & Banquet Hall in Catering Building
13:30--17:00, Auditorium Hall on the 1st floor of the Conference Center Chairs: Prof. Xuejun FAN, Lamar University, USA
Prof. Johan LIU, Shanghai University, China
13:30--13:55 A Boundless Packaging Future Dr. Ho-Ming Tong Great Team Backend Foundry, China
13:55--14:20
Introduction to the Innovative Interface Bonding Technology Prof. Tadatomo Suga The University of Tokyo, Japan
14:20--14:45
The Challenges of 3rd Generation Semiconductors on Packaging Prof. Guoqi Zhang Delft University of Technology, the Netherlands
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14:45--15:10 Novel multi-chip SiP heterogeneous integrated interconnection technology Prof. David Wei Zhang Fudan University, China
15:10--15:30 Coffee Break
15:30--15:55
Advances for high power and high performance interconnections for next generation electronics Prof. Katsuaki Suganuma Osaka University, Japan
15:55--16:20
UV LED Packaging for In-situ Curing in 3D Printing Prof. Shi-Wei Ricky Lee Mechanical & Aerospace Engineering, Hong Kong University of Science & Technology (HKUST)
16:20--16:45 Conductive metal nanoparticles and its applications in printed electronic technology Prof. Mingyu Li Harbin Institute of Technology, China
16:45-17:10 Advanced Passive Integration Solution for Wafer Level Packaging Dr. Liqiang Cao NCAP, China
17:10-17:35 Low temperature wafer bonding for heterogenous integrationDr. Viorel Dragoi EVG, Austria
18:30-20:30 Dinner: Auditorium Hall on the 1st floor of the Conference Center
Introduction of Invited Plenary Keynote Speakers
Jean M. Trewhella, GLOBALFOUNDRIES, USA
Jean M. Trewhella joined GLOBALFOUNDRIES, Malta, NY in 2014. She is Director of Packaging Technology Integration responsible for CPI and package robustness of GF technologies worldwide. Prior to joining GF Jean held numerous positions within IBM Research, Microelectronics, and Systems. In 2013 she drove IBM SiPhotonics initiative in Microelectronics bridging research, development and manufacturing. Earlier Jean spent 6 yrs as the Director of IBM Packaging Research and Development Center with responsibility for organic, ceramic, and emerging electronic packaging technologies. She is the President of the CPMT Society and served as the General Chair of the 60th ECTC Conference. She received her B.S. in Physics from Antioch College (1987) and M.S. in Applied Physics from Columbia University (1992).
Prof. C.P. Wong, Chinese University of Hong Kong, HK, China
Prof. Ching-Ping (C.P.) Wong is the dean of Engineering with the Chinese University of Hong Kong and the Georgia Institute of Technology where he is a Regents’ Professor and the Charles Smithgall Institute-Endowed Chair at the School of Materials Science and Engineering. Professor Wong has published widely with over 1,000 technical papers and holds over 65 US patents and is considered an industry legend that has made significant contributions to the industry by pioneering new materials, which fundamentally changed the semiconductor packaging technology. He is a member of the US National Academy of Engineering and a Foreign Academician of the Chinese Academy of Engineering.
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Prof. Rao R Tummala, Georgia Institute of Technology, USA
Professor Rao Tummalais a Distinguished and Endowed Chair Professor at Georgia Institute of Technology, USA. He is well known as an industrial technologist, technology pioneer, and educator. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering such major technologies as the industry’s first plasma display and the first and next three generations of 100-chip 2.5D like multi-chip packaging. As an educator, Professor Tummala was instrumental in setting up the largest Academic Center in Electronic Systems at Georgia Tech involving more than 200 PhD and MS students, 25 faculty from ECE, ME, MSE and CHE, and 70 companies
from the U.S., Europe and Asia, all working together with an integrated approach to research, education and industry collaborations. He received many industries, academic and professional society awards including as Distinguished Alumni from Indian Institute of Science, Bangalore and University of Illinois and Distinguished Faculty of Georgia Tech. He was President of IEEE CPMT and IMAPS. He has published more than 800 papers and holds 99 US patents. He wrote the 1st modern book called “Microelectronics Packaging Handbook” in 1988, 1st undergrad textbook called “Fundamentals of Microsystems Packaging” and 1st graduate book introducing the concept of SOP, System-On-Package Technology. He is an IEEE, IMAPS, American Ceramic Society Fellow and member of National Academy of Engineering.
William Chen, ASE Group, USA
William Chen (Bill) holds the position of ASE Fellow and Senior Technical Advisor at ASE Group. Prior to joining the ASE, he was the Director at the Institute of Materials Research & Engineering in Singapore. He retired from IBM Corporation after over thirty years in various R&D positions. He has held adjunct and visiting faculty positions at Cornell University, Hong Kong University of Science and Technology, and Binghamton University. He was a past President of the IEEE CPMT Society. He has been elected a Fellow of IEEE and a Fellow of ASME. He chairs the IEEE Heterogeneous Integration Roadmap initiative. He received B. Sc from London University, M.Sc from Brown University and PhD from Cornell University.
Dr. Ming Liu, JCET, China
Dr. Ming Liu currently the Sr. Vice President of JCET, Inc. He is in charge of Group Sales Management promoting cross-sales and coordinating different BUs’ sales teams. He also serves as an executive director for Jiangsu Changjiang Electronics Technology Co., Ltd. and STATS ChipPAC, Inc. Prior to joining JCET, Mr. Liu served as VP of STATSChipPAC, and JCETUS, Inc. between 2012 and 2016, Member of the Consulting Staff of Cadence Design Systems, Inc. from 2007 to 2012, and software engineer at Aprio Technologies, Inc. from 2005 to 2007. Mr. Liu graduated with a Bachelor of Engineering in Computer Science and Technology from Tsinghua University, Beijing in 1996. He also held Master of Science and Ph.D. degrees. Both
are in Computer Science and Engineering from the Ohio State University.
Dr. Ho-Ming Tong, Great Team Backend Foundry,�China
Currently, Dr. Tong is CEO of Great Team Backend Foundry, a leading outsourced service provider of assembly and test specializing in power and RF devices. He is also executive board member of Kingyoup Optronics which provides sputtering machines and debonders for the high-end packaging and display markets. He was President of Cyntec & Components Business Group which is a Member of Delta Electronics Group for two years, a board member of SEMI, Chairman of International SEMI Standards Committee, and an Advisory Committee Member of National Chip Implementation Center, National Applied Research Laboratories, Republic of China. Prior to joining Delta Electronics, Dr. Tong had been with ASE Group for 14 years and served as the Chief R&D Officer and GM of Group R&D which served as the central technology kitchen of the ASE Group covering all ASE factories. Dr. Tong started, as
Executive VP, the Formosa Advanced Technologies Corporation which is today a leading memory IC packaging and test service provider. Dr. Tong served 14 years at IBM as Research Staff Member at Thomas J. Watson Research
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Center, and as Senior Engineering Manager at IBM’s East Fishkill Facility. While at IBM, he was responsible for leading-edge IC and IC package developments covering C4 plating and the plated copper wiring IC technology, both of which have become world standards. Dr. Tong was elected IEEE Fellow for leadership in leading-edge integrated circuits technology for his world-standard-setting contributions in integrated circuits and advanced packaging and test covering package, module and system. He was also elected Fellow of the Chinese Society for Management of Technology. Among the awards Dr. Tong received were: (1) the Electronics Manufacturing Technology Award from IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, (2) the John A. Wagon Technical Achievements Award from The International Microelectronics and Packaging Society, (3) IBM Watson Research Division Award, (4) IBM Master Inventor, (5) the R&D Management Innovation Award from the Ministry of Economic Affairs, Republic of China, (6) the Outstanding Research Award of Pan Wen Yuan Foundation, and (7) seven IBM invention plateau awards. Dr. Tong received his Ph.D., M.S. & M. Ph. degrees from Columbia University, and his B.S. degree from National Taiwan University, all in engineering. He has authored/co-authored 112 patents, 100+ technical publications, as well as 3 books and 3 special journal issues on electronic packaging.
Prof. Tadatomo Suga, The University of Tokyo, Japan
Tadatomo Suga joined the Max-Planck Institut für Metallforschung in 1979, obtained his PhD degree in materials science from University of Stuttgart in 1983. Since 1984 he has been a faculty member of the University of Tokyo, and has been a professor in the Department of Precision Engineering of the School of Engineering since 1993. He was also the director of the Research Group of Interconnect Ecodesign at the National Institute of Materials Science (NIMS), a Member of the Japan Council of Science, the Chair of IEEE CPMT Society Japan Chapter, and the President of the Japan Institute for Electronic Packaging. His research focuses
on microelectronics and microsystems packaging, and development of key technologies related to low temperature bonding and interconnects as well as disassembly concept for EcoDesign. Since 2015, he has been also the Chair of JSPS University–Industry Cooperative Research 191st Committee for Innovative Interface Bonding Technology.
Prof. Katsuaki Suganuma, Osaka University, Japan
Prof. Katsuaki Suganuma received the degree of PhD from Tohoku University in 1982. He became a research assistant of ISIR (Institute of Scientific and Industrial Research), Osaka University in 1982, an associate professor of National Defense Academy in 1986, and a professor of ISIR of Osaka University in 1996. He was the director of Nanotechnology Center in 2007-2009, Comprehensive Analysis Center in 2009-2013, and the deputy director of ISIR in 2010-2012.
He has worked on lead-free soldering, conductive adhesive, power electronics packaging and printed electronics. He published several books in these fields. He is currently in charge of the several industrial projects such as Printed Electronics Standardization IEC TC119 Japan National Committee (JEITA), Chairman of ISO Standardization National Committee of Substrate Thermal Property Testing Methods for Next Generation Power Electronics (JFCA), Chairmans of Printed Electronics Association of Japan and WGB Systemintegration Consortium.
Prof. David Wei Zhang, Fudan University, China
Prof. David Wei Zhang is currently Dean of School of Microelectronics，Fudan University, and Deputy Chairman of Academic Committee of Fudan University. He received the Ph.D. degree from Xi’an Jiaotong University in 1995 and was a post-doc at Fudan University in 1995. He joined Fudan University in 1997 as an associate professor and then became a full professor in 1999. He is a member of the Technical Executive Experts Group of “Equipments and technologies for Ultra-Large Scale Integrated Circuit”, one of National Science & Technology Major Projects (Project 02). He has published more than 200 papers in such international journals and conferences as Science, IEEE T-ED, IEEE Electron Device Letters, Applied Physics Letters, Journal of Applied Physics, etc, and has now over authorized patent 80 patents.
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Prof. Guoqi Zhang, Delft University of Technology, the Netherlands
Prof. Guoqi Zhang is a Chair Professor with the Department of Microelectronics, Delft University of Technology. He had been with Philips for 20 years as Principal Scientist, Technology Domain Manager, Senior Director of Technology Strategy, and Philips Research Fellow, until 2013. He is the co-chair of advisor board of International SSL Alliance (ISA); secretary general of IEEE "International Technology Roadmap of Wide bandgap semiconductors" (ITRW). He is one of the pioneers in developing the “More than Moore” (MtM) strategy when he served as a Chair of MtM Technology team of European’s Nanoelectronics Platform in 2005. He has published more than 300 papers including more than
150 journal papers, 3 books, 17 book chapters, and more than 100 patents. His research interests include heterogeneous micro/nanoelectronics packaging, system integration, and reliability. Prof. Zhang received the “Outstanding Contributions to Reliability Research” Award from the European Center for Micro/Nanoreliability, in 2007, the “Excellent Leadership Award” at EuroSimE, “Special Achievement Award” at ICEPT, and the IEEE Components, Packaging, and Manufacturing Technology Society Outstanding Sustained Technical Contribution Award in 2015.
Prof. Shi-Wei Ricky Lee, Mechanical & Aerospace Engineering, Hong Kong University of Science & Technology (HKUST)
Ricky Lee received his PhD degree from Purdue University in 1992. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Dr Lee is Professor of Mechanical Engineering and Director of Center for Advanced Microsystems Packaging (CAMP) at HKUST. He also has a concurrent appointment as Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Due to his technical contributions, Dr Lee received many honors and awards over the years. In addition to being the
recipient of 12 best/outstanding paper awards and 5 major professional society awards, Dr Lee is Life Fellow of ASME and IMAPS, and Fellow of IEEE and Institute of Physics (UK). He is also a Distinguished Lecturer and the Senior Past-President of the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society.
Prof. Mingyu Li, Harbin Institute of Technology, China
Mingyu Li received the B. S., M. S., and Ph. D. degrees in department of materials science and engineering from Harbin Institute of Technology, Harbin, China, in 1994, 1996, and 2001, respectively. Currently Dr. Li is a professor/director of department of materials science and engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, China. He also is a young director of Institute of Electronics of China. Dr. Li has published many paper in Applied Physics Letters, ACTA Materialia, Scientific Reports, and ACS Applied Materials & Interface, and he received some awards of Chinese Mechanical Science and Technology over year. Currently His research interests are in the field of micro-nano joining for micro-electronic packaging, flexible printed electronics, thermal management for power electronics and sensor fabricating.
Dr. Liqiang Cao, NCAP, China
Liqiang Cao, obtained his B.S. from University of Science and Technology of China and later received his M.Sc. and PhD from Chalmers University of Technology, Göteborg, Sweden. Between 2000 and 2005, he was with IVF – The Swedish Institute of Production Engineering Research and the Sino-Swedish Microsystem Integration Technology (SMIT) Center in Sweden as the research fellow. Then He joined Intel in Oct. 2005 as senior scientist and program manager. Since Feb. 2009, he is a professor in Institute of Microelectronics Chinese Academy of Sciences. His research interests focus on the manufacturing process for system-in-a-package (SiP). At the same time, he is interesting in design and FEM modeling for mechanical point of view for advanced packaging. He is the General Manager of National Center for Advanced Packaging China (NCAP China) now.
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Dr. Viorel Dragoi, EVG, Austria
Dr. Viorel Dragoi is Chief Scientist for Wafer Bonding at EVG. He graduated Faculty of Physics at University of Bucharest, Romania, in 1995 and received his PhD from Institute of Atomic Physics, Bucharest, in 2000. After working on various thin films deposition and characterization methods applied for sensors manufacturing, in 1998 he started working in wafer bonding in Max Planck Institute of Microstructure Physics, Halle (Saale). Since 2001 he joined EV Group E. Thallner GmbH in Austria. His current activities are focusing in wafer bonding technology development. He published/co-authored over 110 papers in journals and conference proceedings, and is author/co-author of 4 book chapters on wafer bonding applications.
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OVERVIEW OF ORAL PRESENTATION SESSIONS
Friday, August 18, 2017
Parallel Sessions
Room A Room B Room C Room D Room E Room F Room G
Oral Session 1 (Session A-1)
Oral Session 2(Session B-1)
Oral Session 3(Session B-5)
Oral Session 4 (Session D-1)
Oral Session 5(Session F-1)
Oral Session 6 (Session G-1)
Oral Session 7 (Session H-1)
Chair Jintang Shang Rong Sun Qian Wang Hua Lu Paul Wang Lei Liu CH. Chew
08:30 – 09:55 Keynote 01:
Yuan Lu Keynote 02:
Changqing LiuKeynote 03:
Zhi-Quan LiuKeynote 04:
Chenxi Wang Keynote 05:
Chunyan YinKeynote 06:
Asushi Okuno Keynote 07: Boping Wu
43,72,98 11,16,102 146,153,156 116,273,225 113,123,203 18,266,169 44, 299,70
09:55 – 10:50 Poster Session 1 & Coffee Break
Oral Session 8 (Session A-2)
Oral Session 9(Session B-2)
Oral Session 10(Session B-6)
Oral Session 11 (Session B-9 &F-5)
Oral Session 12(Session F-2)
Oral Session 13 (Session G-2& H-3 & E-1)
Oral Session 14 (Session H-2)
Chair Yunhui Mei Changqing Liu Zhi-Quan Liu Liangliang Li Chunyan Yin Fei Xiao Boping Wu
10:50 – 12:10 293, 107,134,154
Keynote 08: Rong Sun 159,168,177,187 280, 322,348,149 127,142,224,320 94,199,88,360
Keynote 9: CH. Chew
20,45,103 75,65,209
12:10 – 13:30 Lunch: Sunlight Restaurant in VIP Building & Banquet Hall in Catering Building
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OVERVIEW OF ORAL PRESENTATION SESSIONS (Cont.)
Friday, August 18, 2017
Parallel Sessions
Room A Room B Room C Room D Room E Room F Room G
Oral Session 15
(Session A-3& D-2)
Oral Session 16
(Session B-3)
Oral Session 17
(Session B-7)
Oral Session 18
(Session I-1)
Oral Session 19
(Session F-3)
Oral Session 20
(Session C-1)
Oral Session 21
(Session C-3)
Chair Hu He Daoguo Yang Dongyan Ding Ran He Hongjun Ji Hongtao Chen Chunjin Hang
13:30 – 14:50 250,326,128,230 47,51,87,104 167,189,222,265 288,180,234,89 232,301,335,364 186,155,253,260 86,172,302,201
14:50 – 15:50 Poster Session 2 & Coffee Break
Oral Session 22
(Session D-3)
Oral Session 23
(Session B-4)
Oral Session 24
(Session B-8)
Oral Session 25
(Session I-2)
Oral Session 26
(Session F-4)
Oral Session 27
(Session C-2)
Oral Session 28
(Session C-4)
Chair Yuan Lu Wei Liu Rong An Wenhua Yang Fengwen Mu Yujie Li Chenxi Wang
15:50 – 17:10 SP1, 66,192,278 92,93,99,140 197,231,276,282 330,233,297,151 275,258,100,179 81,109,213,96 90,36,175,256
17:30 – 20:30 Dinner: Sunlight Restaurant on 1st floor of the VIP Building
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OVERVIEW OF POSTER SESSIONS
Poster Session 1 at the Lobby on the 1st (Area 1, 2, 3) and 2nd floor (Area 4, 5, 6) for Coffee break Friday, August 18, 2017 (09:55AM --10:50AM)
Area 1 Area 2 Area 3 Area 4 Area 5 Area 6
Session A&B Session B Session B Session B Session C Session C&D
Chairs:
Dr. Tiesong Lin
Dr. Ziyang Xiu
40, 63, 112, 135, 147,
211, 219, 257, 277,
329, 339, 12, 13, 15,
19, 23, 24, 26, 28, 30,
32
33, 38, 48, 55, 56, 61,
62, 67, 74, 76, 79,
106, 119, 124, 131,
143, 144, 145, 157,
158, 170
173, 178, 183, 184,
188, 191, 193, 196,
206, 210, 214, 215,
229, 245, 246, 247,
262, 268, 270, 284,
291
292, 306, 307, 315,
323 ,327, 332, 336,
343, 345, 346, 352,
353, 354, 356, 358,
359, 366
8, 10, 41, 42, 49, 80,
82, 117, 122, 148,
198, 200, 208, 212,
237, 242, 252, 254,
267, 269, 285, 296,
308, 311, 313, 328
333, 337, 341, 344,
349, 365, 368, 3, 64,
69, 95, 111, 115, 120,
125, 133, 152,
182,185, 235, 248,
249, 342, 361, 362
Poster Session 2 at the Lobby on the 1st (Area 7, 8, 9) and 2nd floor (Area 10, 11, 12) for Coffee break Friday, August 18, 2017 (14:50 PM --15:50 PM)
Area 7 Area 8 Area 9 Area 10 Area 11 Area 12
Session E&F Session F Session F Session F Session G&H Session I
Chairs:
Dr. Tiesong Lin
Dr. Ziyang Xiu
2, 59, 71, 73, 108,
141, 163, 236, 240,
244, 321, 325, 6, 7,
14, 17, 21, 25, 29, 31
35, 39, 46, 50, 52, 53,
54, 57, 60, 78, 83, 84,
85, 97, 105, 114, 129,
130, 137, 139, 150
161, 162, 164, 165, 16
6, 171, 176, 181, 202,
204, 205, 207, 216, 21
7, 218, 220, 223, 238,
241, 251
259, 261, 263, 264,
290, 294, 295, 298, 30
4, 309, 310, 314, 316,
324, 331, 338, 340, 35
7, 367
1, 34, 58, 68, 77, 118,
136, 138, 190, 194,
195, 227, 228, 300,
312, 363, 27, 91, 126,
174, 271, 272, 274,
334
9, 22, 37, 110, 121,
160, 221, 239, 286,
287, 289, 305, 317,
318, 319, 347, 350,
355, 369, 370, 371,
372, 373, 374, 375,
376, 378
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Introduction of Invited Session Keynotes Speakers
Dr. Yuan Lu, Institute of Microelectronics, Chinese Academy of Sciences, China
Yuan Lu: Technical Director, National Center for Advanced Packaging (NCAP-CHINA); Professor, Institute of Microelectronics, Chinese Academy of Sciences. Dr. Lu is a National Distinguished Expert (“The Thousand Talents Plan”). Dr. Lu got his PhD from Wayne State University (US) in 2006. Dr. Lu has been with Institute of Microelectronics, Chinese Academy of Sciences and working on 3D microelectronics packaging since 2012. He joined NCAP-CHINA in 2013. Before getting back to China, Dr. Lu had worked for various US semiconductor companies (Freescale Semiconductor (now NXP), FlipChip International, Lucent Technologies, Digital Semiconductor, AVX, General Motors, etc) for more than 20
years. In recent 5 years, Dr. Lu has been working on 3D semiconductor device integration, MEMS/IC integration, ultra-fine pitch IC interconnect, and high speed OE/IC integration, etc. He has applied more than 50 patents.
Prof. Changqing Liu, Loughborough University, UK
Changqing Liu received his BEng from Nanjing University of Science and Technology in 1985, and his MSc from the Institute of Metals Research of Chinese Academy of Sciences in 1988. After five years appointment as an assistant professor at the Institute of Metals Research, he secured an Overseas Research Scholarship (ORS-CVCP) and moved to UK in 1993 reading his PhD at Hull University. From 1997 he was employed as postdoctoral research fellow at Birmingham University (UK) for three years. Since 2000 he joined the Wolfson School of Mechanical, Electrical and Manufacturing Engineering at Loughborough University (UK) as research fellow, where he became Professor of Electronics Manufacture from January 2011,
following his appointment as Lecturer in 2005, Senior Lecturer in 2007. His current research focuses on advanced materials and innovative manufacturing to enable 3D multi-material heterogeneous embodiment, integration and miniaturisation of future generation multifunctional devices. He has published over 242 academic papers, and currently a Fellow of Higher Education Academy, UK, and a Senior IEEE member. He has been active in the field of electronics integration and manufacturing as a regular participant and contributor as well as technical committee member to the IEEE CPMT conferences (e.g. ECTC, ESTC, EPTC, EMPC), and previously served as Chair of the Interconnections Committee of ECTC (USA) and Chair of Packaging Materials & Processes Committee of ICEPT (China).
Prof. Zhi-Quan Liu, Institute of Metal Research (IMR), China
Professor Zhi-Quan Liu is the Group Leader of Microelectronic Interconnect Materials at Institute of Metal Research (IMR), Chinese Academy of Sciences (CAS). After received a doctor’s degree in April 2000, He worked in Japan (NIMS) for more than 6 years and then joined in IMR as a Hundred Talent Scholar of CAS since 2017. His research expertise spans across property related microstructure characterization and phase transformation, focusing on microstructure and reliability of interconnect materials under thermal, mechanical and electrical fields. He has been authored and co-authored more than 100 international
peer-reviewed journal papers, which were published in Nature, Science, Physical Review Letters, Acta Materialia, Nanotechnology, etc.
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Dr. Chenxi Wang, Harbin Institute of Technology, China
Dr. Chenxi Wang received the B.E. and M.E. degrees in materials science and engineering from Harbin Institute of Technology, China, in 2002 and 2004 respectively and the Ph.D degree in precision engineering, The University of Tokyo in 2009. From 2009 to 2011, he received postdoctoral fellowship awarded by Japan Society for the Promotion of Science (JSPS) at The University of Tokyo. From 2011 to 2014, he worked as a Senior Researcher at the Department of Applied Chemistry, The University of Tokyo. He is currently working as an Associate Professor at the School of materials science and engineering, Harbin Institute of Technology from 2014. His research involved microsystem integration and packaging,
low-temperature wafer bonding, high-precision alignment, micro/nanofabrication, micro/nanofluidic devices. He has co-authored more than 60 papers in international journals and conferences, and holds 2 Japan patents and 8 China patents (pending). He received many awards, including the Best Paper Awards of international conferences on electronic packaging technology (ICEPT) in 2003, 2007, 2010 and 2011, Chinese Government Award for Outstanding Student Abroad in 2007, IEEE-CPMT travel award for ECTC 2009, Young award of IEEE CPMT Symposium Japan 2010, and the 2010 Dean Award of School of Engineering, The University of Tokyo, Best Presentation Award of 2nd Advanced Welding & Joining Technology Conference in 2011. He is a member of IEEE and Electrochemical society (ECS).
Dr. Chunyan Yin, University of Greenwich, UK
Chunyan Yin received her Bachelor and Master Degrees in material engineering from Harbin Institute of Technology, China in 1999 and 2001, and her PhD degree in computational science and engineering from University of Greenwich, UK in 2006. She joined University of Greenwich as a PhD research student in 2002, and worked as a research fellow since 2007 and a lecturer since 2013. Prior to this, she worked at City University of Hong Kong as a research assistant. Dr Yin's main research interests are in thermo-mechanical modelling, physics-of-failure analysis, prognostic and reliability assessment. She has authored or co-authored over 50 publications in these areas.
Dr. Atsushi Okuno, Green Planets CO.,LTD, Japan
Atsushi Okuno obtained master degrees in Kansai University with Plastic materials such as epoxy resin in Osaka,Japan on 1969. Assistant professor in Kansai University. He joined SANYU REC CO.,LTD in 1959. He developed electronic insulating materials, such as semiconductor, transformation, LED, and capacitor. He is senior member of IEEE in 1995. He received the best paper at ISEPT with IC Packaging. He has been R&D Center Executive director in Fudan University. He received the best paper at ISPET with LED Packaging in 2003. He is Vice President in Japan LED Lighting association in 2004. He has been to CEO of SANYU REC CO.,LTD in 2007. He has been R&D Center Executive Director in Tongji
University in 2009. Now, He is CEO of Green Planets CO.,LTD. His current research includes LED, Semiconductor, insulating materials. He is vice president of Japan and China Friendship Association from 2015.
Dr. Boping Wu, HuaWei Central Research Institute, China
Boping Wu (S’04-M’10-SMIEEE’15) received the B.Eng. (Dean's Honor) from the City University of Hong Kong in 2005, and the M.S. and Ph.D. from the University of Washington, Seattle, in 2007 and 2010, respectively.
Presently, he is a Principal Researcher at HuaWei Central Research Institute. Prior to that, he is a System Architect at Intel Corporation, working on various SoC core products and different high speed interfaces. He has extensive industry experiences of technology development including 2004 at Philips (now NXP) and 2007 at IBM T.J. Watson Center. In 2008-09, he was a Lecturer at the University of Washington, teaching Microwave Engineering
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and Computation Electromagnetics. He has published 16 research articles in refereed journals, presented over 40 technical papers at international conferences, and awarded 4 US patents. His research interests include signal integrity, power delivery, 3D packaging, heterogeneous integration, microelectronics modeling, simulation and characterization.
Dr. Rong Sun, Shenzhen Institutes of Advanced Technology,�Chinese
Academy of Sciences, China
Dr. Rong Sun joined Shenzhen Institutes of Advanced Technology，Chinese Academy of Sciences (SIAT, CAS), in 2006. Due to her outstanding performance and contribution, she was appointed as deputy director of Shenzhen Institute of Advanced Integration Technology, one of the branch institutes of SIAT. She also acts as the executive director of Center for Advanced Materials, which is part of National Engineering Laboratory for Packaging Technology of High-Density Integrated Circuit. As a renowned researcher in electronic materials area, her current research interest focuses on advanced electronic packaging materials, embedded electronic components, controllable nano-particles, phase-change materials, energy storage
materials, etc. Dr. Sun has been involved in more than 40 national or provincial major research programs as principle investigator or core member, which include 02 Special National Grand Science-Technology Project of China, Natural Science Foundation of China, Technology Development Project granted by the Department of Science and Technology of Guangdong province, Major Project for Basic Research and Industry Development granted by Shenzhen City, etc. Up to now, Dr. Sun has published one scientific monograph and more than 120 articles in the international academic journals, with 50 patents applied for. As a reward for her profound work, Dr. Sun is authorized for special government allowance granted by the State Council of China, and also elected as member of Shenzhen Double-hundred Plan, which is an exceptional honor for those who have great contribution to Shenzhen development.
Chee-Hiong Chew, ON Semiconductor, Malaysia
Chee-Hiong Chew received Bachelor of Engineering degree with 1st Class Honors from University of Technology, Malaysia and best final year engineering student award from IEM in 1989. He received MBA from Herriot Watts University in 1998. Currently, he is Senior Director of Package Development for ON Semiconductor Malaysia, Vietnam, China and small team in Munich.
He started his career as a development engineer with Motorola Semiconductor Sector. He is pioneer to establish the packaging design group in Motorola Seremban in 1995. In 1997, He was awarded Motorola Privileged Scientific and Technology Society Engineering Award for
his leadership and Motorola Six Sigma Black Belt award. To date, he owns 15 patents.He started few new innovative platforms for ON Semiconductor like panel platform PIM, Wafer Level Micro Packaging and LLGA technology.
In early 2002, he has been working closely with Professor Seeta to startup CPMT chapter in Malaysia. He is CPMT Chair for Malaysia Chapter for the year 2005 and 2006. He startup 1st IEMT conference in Malaysia with industry colleagues and support from CPMT Santa Clara in 2006. He continues serve as key committee/ advisor for EMAP, IMPACT and IEMT conferences. He also participates in strategic discussion to growth Malaysia R&D organized by Ministry of Science and Technology Malaysia and university collaboration programs.
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ORAL SESSIONS Note: Only the affiliation information of the first author is provided due to the space constraints.
Session 1: Advanced Packaging
Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room A Chair Jintang Shang
Keynote‐01 8:30‐8:55 Advanced Memory Fabrication Technology Based on 3D FOWLP
Yuan Lu Institute of Microelectronics, Chinese Academy of Sciences, China
043 8:55‐9:15
A Study on a Simplified Liquid Cooling System
with a Pump Serving as Cold Plate Falong Liu, Bin Duan, Xingjian Yu, Ruikang Wu and Xiaobing Luo Huazhong University of Science and Technology , China
072 9:15‐9:35 Package & Board Level Reliability Study of
0.35mm Fine Pitch Wafer Level Package
Peng Sun, Jun Liu, Cheng Xu and Liqiang Cao
The National Center for Advanced Packaging, China
098 9:35‐09:55 Formation mechanism and reliability of Cu6Sn5
textures formed in‐between liquid Sn and
(111)/(001) Cu single crystals
Shun Yao, Zhihao Zhang, Huijun Cao, Xuelin Wang
and Shihua Yang
Xiamen University, China
Session2: Packaging Materials & Processes
Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room BChair Rong Sun
Keynote‐02 8:30‐8:55 Electronics manufacture for harsh, severe and extreme environments: materials, processes and interfacial behaviour
Changqing Liu Loughborough University, UK
011 8:55‐9:15
Pb‐free silver pastes with SnO‐B2O3 glass frits for
crystalline silicon solar cells
Jiachu Jiang, Changli Li, Yue He, Jinquan Wei and
Liangliang Li
Tsinghua University, China
016 9:15‐9:35
Effect of Thermal Cycling on Tensile Behaviour of
SAC305 Solder
Xu Long, Yao Yao, Yanpei Wu, Weijuan Xia and
Lianfeng Ren
Northwestern Polytechnical University, China
102 9:35‐09:55
Metallization of diamond/Al composite surface
with Ni‐P coating
Qi‐Yuan Shi, Di Wu, Ding‐rui Ni, Dong Wang, and
Zhi‐Quan Liu
Institute of Metal Research, Chinese Academy of
Sciences, China
29
Session 3: Packaging Materials & Processes
Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room C Chair Qian Wang
Keynote‐03 8:30‐8:55 Electrodeposition of nanotwinned copper film as under bump metallization
Zhi‐Quan Liu Institute of Metal Research, Chinese Academy of Sciences, China
146 8:55‐9:15 Microstructure and Intermetallic Compounds in Sn‐3Ag‐3Bi‐3In solder joints on Cu Matrix Peng Li, Jing Han, Yan Wang, Fu Guo, Limin Ma and Yishu Wang Beijing University of Technology, China
153 9:15‐9:35 Fabrication and Thermal Conduction Mechanism of Epoxy/Modified SiCNP Polymer Composites Yun Huang, Xiaoliang Zeng, Rong Sun, Jian‐Bin Xu and Ching‐Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
156 9:35‐09:55 The evaluation of mechanical properties of Sn58BiXTi solder by tensile test Shiqi Zhou, Xiangdong Liu, Omid Mokhtari and Hiroshi Nishikawa Osaka University, Japan
Session 4: Interconnect technologies
DateTimeVenueChair
Friday, August 18, 2017 8:30 AM~09:55 AM Room DHua Lu
Keynote‐04 8:30‐8:55 Room‐Temperature Wafer Direct Bonding Using a One‐Step Fluorinated Plasma Surface Activation
Chenxi Wang Harbin Institute of Technology, China
116 8:55‐9:15 Research of Via about Signal integrity Facing Complete Transmission Path Genxin Huang, Chunyue Huang, Lishuai Han, Rui Yin, Tianming Li, Ying Liang and Liangkun Lu Guilin University of Electronic Technology, China
273 9:15‐9:35 Rapid Formation of Intermetallic Joints with Sn/Metal Composite Alloys by Ultrasonic‐assisted Soldering for High‐temperature Chip Attachment Shu Ma, Hongjun Ji and Junbo Zhou Harbin Institute of Technology (Shenzhen), China
225 9:35‐09:55 Simulation of the temperature field for bonding IGBT chip and DBC substrate using Al/Ni self‐propagating foil Yuyan Xiang, Fengshun Wu, Zheng Zhou, Liping Mo and Hui Liu Huazhong University of Science and Technology, China
30
Session 5: Quality & Reliability
Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room E Chair Paul Wang
Keynote‐05 8:30‐8:55 Modelling the Impact of Conformal Coating Penetration on QFN Reliability
Chunyan Yin Greenwich University, UK
113 8:55‐9:15 Microstructures and properties of Bi‐11Ag solder doped with small amounts of Sn D. Li and Limeng Yin Chongqing University of Science and Technology, China
123 9:15‐9:35 The Effect of Voids at the Cu3Sn/Cu Interface on the Failure Behavior of the Cu/Sn63Pb37 Solder Joints under High‐speed Shear Loading Qi Lin, Li Hailong and Wang Chunqing Beijing Institute of Space Mechanics & Electricity, China
203 9:35‐09:55 Study on the Factors which Affecting the Conductive Anodic Filament Reliability for Packing Substrate Chaohui Hu China Electronic Product Reliability and Environmental Testing Research Institute, China
Session 6: Solid State Lighting Packaging Integration
DateTimeVenueChair
Friday, August 18, 2017 8:30 AM~09:55 AM Room FLei Liu
Keynote‐06 8:30‐8:55 Unique Packaging Technology of High Bright Blue LED, UV LED and Micro LED Using VPES (Vacuum Printing Systems)
Asushi Okuno Green Planets Co. Ltd., Japan
018 8:55‐9:15 White light‐emitting diodes with enhanced luminous efficiency and high color rendering using separated quantum dots@silica/phosphor structure Bin Xie, Yanhua Cheng, Xingjian Yu, Weicheng Shu, Xiaobing Luo, Junjie Hao and Kai Wang Huazhong University of Science and Technology, China
266 9:15‐9:35 Effect of Chips Surface Morphology on Optical Performance of Remote and Conformal Phosphor‐converted Light‐emitting Diodes Jiasheng Li, Caiman Yan, Dong Yuan, Zongtao Li, Binhai Yu and Yong Tang South China University of Technology, China
169 9:35‐09:55 The degradation behaviors of white LEDs under highly accelerated stress testing (HAST) Bing Yan, Dongdong Teng, Lilin Liu and Gang WangSun Vat‐sen University,China
31
Session 7: High‐speed & High‐frequency and Microwave and Power Electronics Packaging
Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room G Chairs CH. Chew
Keynote‐07 8:30‐8:55 5G Millimeter Wave and EMC Technology Development of Advanced Packaging
Boping Wu HuaWei Central Research Institute, China
044 8:55‐9:15 Antenna‐on‐Package on Low‐Cost Organic Substrate for 60 GHz Wireless Communication Applications Chen Chao Wang ASE Group, China
299 9:15‐9:35 Effect of Cryogenic Treatment on Mechanical Properties and Microstructure of Solder Joint Li Xiao and Yao Yao Northwestern Polytechnical University, China
070 9:35‐09:55 Simulations on the Effective Thermal Dissipation of the Microchannel Heat Sink with Different Pin Fins Zhiyu Jin, Yunna Sun, Jiangbo Luo and Guifu Ding Shanghai Jiao Tong University, China
Session 8: Advanced Packaging
DateTimeVenue Chairs
Friday, August 18, 2017 10:50 AM~12:10 AM Room A Yunhui Mei
293 10:50‐11:10 The Preparation of SiO2@BN/epoxy composites with high thermal conductivity and excellent thermo‐mechanical property Yuan Gao, Pengli Zhu, Gang Li, Rong Sun and Chingping Wong Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences
107 11:10‐11:30 Compact and high density integrated design with
high isolation for S‐band up‐conversion system
Zhaorong Li and Liming Lv
Institute of Electronic Engineering ， China
Academy of Engineering Physics, China
134 11:30‐11:50 Study of Wafer Warpage Evolution by Cooling to Extremely Low Temperatures Gong Cheng, Wei Gai, Gaowei Xu and Le Luo Shanghai Institute of Microsystem and Information Tehnology, Chinese Academy of Sciences , China
154 11:50‐12:10 Effect of Annealling Processon Microstructure of Cu‐TSV Zeliang Li, Limin Ma, Xuewei Zhao, Yishu Wang and Fu Guo The College of Materials Science and Engineering, Beijing University of Technology,China
32
Session 9: Packaging Materials & Processes
Date Friday, August 18, 2017 Time 10:50 AM~12:15 AM Venue Room B Chairs Changqing Liu
Keynote‐08 10:50‐11:15 Advanced Electronic Packaging Materials –Research
and Application
Rong Sun
Shenzhen Institutes of Advanced Technology, Chinese
Academy of Sciences, China
020 11:15‐11:35 The mechanism of Al contents (0‐0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn‐25Sn/Cu Xi Niu and Kwang‐Lung Lin Department of Automobile Engineering, Chongqing Vocational College of Public Transportation, China
045 11:35‐11:55 Micromechanical modeling of the cyclic behavior of Sn‐0.7Cu solder based on micromechanical polycrystalline approach Lu Liu and Yao Yao Northwestern Polytechnical University, China
103 11:55‐12:15 Investigation on the melting and tensile properties of Bi‐containing SAC105 lead‐free solder alloys Zhi‐Quan Liu Institute of Metal Research, Chinese Academy of Sciences, China
Session 10: Packaging Materials & Processes
Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room CChairs Zhi‐Quan Liu
159 10:50‐11:10 Study of the growth behavior of prism‐type Cu6Sn5 in the liquid solder Shuo Zhang, Jing Han, Limin Ma, Yishu Wang and Fu Guo The College of Materials Science and Engineering, Beijing University of Technology, China
168 11:10‐11:30 A rate‐dependent constitutive model considering effects of temperature cycles for lead‐free solders Kaimin Wang, Bingjie Chen and Yao Yao Northwestern Polytechnical University , China
177 11:30‐11:50 The effect of conductive filler on the properties of electrically conductive adhesives(ECAs) Jian Hao, Dapeng Wang, Saipeng Li, Xinyue He, Jian Zhou and Feng Xue School of Materials Science and Engineering, Southeast University, China
187 11:50‐12:10 Hermeticity Test of Low‐Melting Point Sealing Glass and Analysis of Encapsulation Failure Rui Tian, Yi Li, Luqiao Yin and Jianhua Zhang Shanghai University, China
33
Session 11: Packaging materials & Processes
Quality & Reliability
Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room D Chairs Liangliang Li
280 10:50‐11:10 Electro‐deposition of Co‐Ni sulfide nanosheet arrays on nickel foam and investigation of the pseudocapacitive performance Chao Wang, Yanbin Shen, Zijie Song, Xiaodong Zhu, Shuhui Yu, Rong Sun and Ching‐Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
322 11:10‐11:30 The investigation of interface effect on the properties of nanosilica‐based underfill Tianhao Lu, Peng Zheng, Yuanrong Cheng, Zhuo Li and Pengli Zhu Fudan University,China
348 11:30‐11:50 Size effect of Sn3.0Ag0.5Cu solder joint on intermetallic layer growth Shaobin Wang and Yao Yao School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, China
149 11:50‐12:10 Inhomogeneous Evolution of Microscopic Structure and Crystal Orientation in Sn3Ag0.5Cu under Tensile Stress Yuhan Qian, Jing Han, Limin Ma, Yishu Wang and Fu Guo The College of Materials Science and Engineering, Beijing University of Technology, China
Session 12: Quality & Reliability
Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room EChairs Chunyan Yin
127 10:50‐11:10 Finite‐Element Calculations of Elastic Fields within Flip‐chip Solder Bumps and Cu‐Pillar Bumps under the Influences of Thermal Stresses and Joule Heating Peng Zhou, Baojie Zhao, Yubao Zhen, Shuo Liu, Yuehua Hu and Jiayu Li Harbin Institiute of Technology, China
142 11:10‐11:30 Finite element analysis of micro ‐ scale CSP solder joint in 3D packaging under random vibratio Li‐Shuai Han, Chun‐Yue Huang, Rui Yin, Gen‐Xin Huang, Ying Liang, Tian‐Ming Li and Wei He GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY , China
224 11:30‐11:50 Reliability Analysis of Smartwatch Using Xiaomi Mi Band 2 as a Case Yuk Ngang Zita Yip, Zhu Ze and Yan Cheong Chan City University of Hong Kong, China
320 11:50‐12:10 Failure analysis of wire bonding EOS with FEM Xin Tao, Yuanhong Zeng, Jun Wang and Xiaojing Wu Fudan University, China
34
Session 13: Advanced Manufacturing
Technologies and Packaging Equipment Solid State Lighting Packaging & Integration
High‐speed & High‐frequency Microwave and Power Electronics Packaging
Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room F Chairs Fei Xiao
094 10:50‐11:10 A Rapid PID Control Method for High‐speed Macro‐micro Composite Positioning Stage Yutao Tan, Jian Gao, Langyu Zhang, Yongjun Jiang, Hui Tang and Yunbo He Guangdong University of Technology, China
199 11:10‐11:30 Recognition and classification of ultrasonic aluminum wire joint based on image morphology and C‐SVM Wang Rui, Long Zhili and Zhou Xing Harbin Institute of Technology Shenzhen Graduate School, China
088 11:30‐11:50 Effect of the substrate temperature on the phosphor sedimentation of phosphor‐converted LEDs Weicheng Shu, Xingjian Yu, Run Hu, Qi Chen, Yupu Ma and Xiaobing Luo Huazhong University of Science and Technology, China
360 11:50‐12:10 Rapid Fabrication of Joints Using Low Temperature Sintered Silver Nanoparticles Fan Yang, Mingyu Li and Shihua Yang Harbin Institute of Technology Shenzhen Graduate School
Session 14: Emerging Technologies
Date Friday, August 18, 2017 Time 10:50 AM~12:15 AM Venue Room GChairs Boping Wu
Keynote‐9 10:50‐11:15 Innovation in Power Integrated Modules CH. Chew Package Development for ON Semiconductor, Malaysia
075 11:15‐11:35 Design and Analysis of Minichannels Heat Sinks with Indented Fins under Impingement Flow Condition Yang Sui, Hengyun Zhang, Peichao Li and Tingyu Lin Shanghai Univ. of Engineering Sci., China
065 11:35‐11:55 Design and Simulation of a 2.4GHz bandpass filter on silicon substrate Ge Sima, Wenhua Hu, Jian Xu and Peng Sun The National Center for Advanced Packaging, China
209 11:55‐12:15 Electro‐thermal Modelling of Multichip Power Modules for High Power Converter Application Mohammad Shahjalal, Hua Lu and Chris Bailey University of Greenwich, UK
35
Session 15: Advanced Packaging & Interconnect technologies
Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room A Chairs Hu He
250 13:30‐13:50 A low cost method to synthesize silver nanoparticles for the screen printing conductive inks Wang Zhuang, Zhao Tao and Liang Xianwen Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
326 13:50‐14:10 Integrated Process for High Aspect Ratio Through Glass Vias Kai Xue, Feng Jiang, Heng Wu, Xue Fei Ming and Xiu Feng Zhou Gmax, USA
128 14:10‐14:30 Flexibale connection for Reflow Free Super Fine Pitch SMT Components Xiaosong Ma, Yongfa Cheng and Feiyang Liu Guilin University of Electronic Technology, China
230 14:30‐14:50 Analysis of Wideband Multilayer LTCC Vertical Via Transition for Millimeter‐wave System‐in‐package Zhipeng Li, Ping Wang, Rong Zeng and Wei Zhong Institute of Electronic Engineering, China Academy of Engineering Physics, China
Session 16: Packaging Materials & Processes
Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room BChairs Daoguo Yang
47 13:30‐13:50 Impact of Substrate Surface Condition and Epoxy Mixture Properties on the Overflow/Incomplete Flow Xun Lou, Li Yang, Rui Zhu, Huan Wu, Lei Chen, Wenfeng Zhang, Chong Jia, Hwai Peng Yeoh and Junhong Xu Center for Joining and Electronic Packaging,School of Materials Science and Engineering, State Key Laboratory of Materials Processing and Die&Mould Technology Huazhong University of Science and Technology, China
51 13:50‐14:10 Silver Nanoparticle deposited Boron Nitride Nanosheet/Nanofrbrillated Cellulose Composites with Enhanced Thermal Conductivity Jiajia Sun, Xiaoliang Zeng, Rong Sun, Jian‐Bin Xu and Ching‐Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
87 14:10‐14:30 Silica Doped Quantum Dots Film with Enhanced Light Conversion Efficiency for White Light Emitting Diodes Yanhua Cheng, Bin Xie, Yupu Ma, Weicheng Shu and Xiaobing Luo Huazhong University of Science and Technology, China
104 14:30‐14:50 Effect of reflux time and aging treatment on the interfacial reaction of SnAgCuSbBiNi/Cu solder joint Zhi‐Quan Liu Institute of Metal Research, Chinese Academy of Sciences, China
36
Session 17: Packaging Materials & Processes
Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room C Chairs Dongyan Ding
167 13:30‐13:50
Study of EM and TM of Sn0.3Ag0.7Cu solder joints
under high current stress and thermal gradient Zhijie Sun, Limin Ma, Yishu Wang, Fu Guo, Jing Han and Yong Zuo The College of Materials Science and Engineering, Beijing University of Technology, China
189 13:50‐14:10 Highly Sensitive Flexible Pressure Sensor Based on Microstructured PDMS For Wearable Electronics Application Yuan Zhang, Yougen Hu, Tao Zhao, Pengli Zhu, Rong Sun and Chingping Wong Shenzhen Institutes of Advanced Technology, China
222 14:10‐14:30 Effects of POSS on the interfacial reactions between Sn‐3.5Ag solders and Cu substrates during soldering Xue Wang, Jing Han, Fu Guo, Limin Ma and Yishu WangInstitute of Microelectronics of Chinese Academy of Sciences, Beijing, China
265 14:30‐14:50 Research on SnSbNi solder joints between light emitting diode chip and heat sink Wei Liu and Man Zhang PKUSZ, China
Session 18: Emerging Technologies
Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room DChairs Ran He
288 13:30‐13:50 All‐printed Paper Based Supercapacitors Lu Shi, Yang Wang, Wenhui Lai, Zhi Jiang, Ronghe Wang and Cheng Yang Division of Energy and Environment, Graduate School at Shenzhen, Tsinghua University, China
180 13:50‐14:10 Microstructure and properties of AlCrFeNi intermetallic based alloy Mingxing Ren and Guotian Wang Harbin Institute of Technology, China
234 14:10‐14:30 Fabrication and optical properties of CuInS2 quantum dots Zhe Wang, Jie Wang, Zhihao He, Te Wang, Ronggang Liu, Jinfeng Ma, Peng Zhang and Yujie Li Harbin Institute of Technology at Weihai, China
89 14:30‐14:50 Design of a hydro‐dynamically levitated centrifugal micro‐pump for the active liquid cooling system Ruikang Wu, Bin Duan, Falong Liu, Han Wu, Yanhua Cheng and Xiaobing Luo Huazhong University of Science and Technology, China
37
Session 19: Quality & Reliability Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room E Chairs Hongjun Ji
232 13:30‐13:50 Mechanical property of Cu‐Sn‐Ni intermetallics in the full intermetallic micro‐joints formed with transient liquid phase soldering Liping Mo, Zheng Zhou, Fengshun Wu, Shiyuan Liu and Changqing Liu Huazhong University of Science and Technology, China
301 13:50‐14:10 DDR4 Dual‐Contact Interconnect Methodology, Component, and Board Level Reliability Paul Wang and David He Mitac International Inc.Taiwan, China
335 14:10‐14:30 Thermal effect on material properties of sintered porous silver during high temperature ageing Chanyang Choe, Seungjun Noh, Chuantong Chen, Toshiyuki Ishina, Shijo Nagao and Katsuaki Suganuma Institute of Scientific and Industrial Research, Osaka University, Japan
364 14:30‐14:50 Void propensity in solder joints on a single copper pad with a grain size spectrum tuned by strain annealing Chongyang Cai, Rong An, Chunqing Wang and Yanhong Tian Harbin Institute of Technology, China
Session 20: Packaging Design and Modeling Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room FChairs Hongtao Chen
186 13:30‐13:50 Investigation of Design and Material Optimization on High bandwidth Package on Package Ian Hu, Wei‐Hong Lai and Ming‐Han Wang Key Laboratory of MEMS of Ministry of Education, Advanced Semiconductor Engineering,Taiwan, China
155 13:50‐14:10 Channel Concatenated Coding Transmission Scheme for TSV Array Transmission Xiaoyang Duan, Zhensong Li, Tianfang Chen, Min Miao and Yuexia Zhang Beijing Information Science and Technology University, Information Microsystem Institute, China
253 14:10‐14:30 Electromigration simulation of flip chip CSP LED Rui Ma, Fei Qin, Jiajie Fan, Xuejun Fan and Cheng Qian Beijing University of Technology, China
260 14:30‐14:50 System Level Mechanical Shock Reliability of BGA Packages: Experimental and Numerical Analysis Jianghai Gu, Weidong Xie, Cherif Guirguis, Mudasir Ahmad and Yaoyu Pang Cisco system, USA
38
Session 21: Packaging Design and Modeling
Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room G Chairs Chunjin Hang
86 13:30‐13:50 A comparative study of phosphor scattering model for phosphor‐converted light‐emitting diodes Yupu Ma, Yanhua Cheng, Weicheng Shu, Falong Liu, Run Hu and Xiaobing Luo Huazhong University of Science and Technology, China
172 13:50‐14:10 Fully‐Coupled Electromigration Simulation of Sweat Structure Yiming Jiang, Hailong Li, Yunhui Mei and Xin Li Tianjin University, China
302 14:10‐14:30 Void risk prediction for molded underfill technology on flip chip packages Cheng Xu, Jun Liu, Jian Xu, Peng Sun, Chih‐Chung Hsu and Chao‐Tsai Huang National Center for Advanced Packaging Co.,Ltd., China
201 14:30‐14:50 Fine Tuning Development Software for High Precision and Multi‐Axis Motion Control System Zhiping Zeng, Yunbo He, Yongshan Hu, Xin Chen, Jian Gao, Zhijun Yang, Yun Chen, Kai Zhang, Hui Tang and Xun Chen Guangdong University of Technology, China
Session 22: Interconnect technologies
Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room AChairs Yuan Lu
SP1 15:50‐16:10 High Density, Ultra‐thin/Small Packaging Tetsukazu Sugiya Disco Corporation, Japan
66 16:10‐16:30 Etching Process Development for 3D Wafer Level Via Last TSV Package Yulong Ren, Geng Fei, Peng Sun, Yanan Sun and Ge Sima National Center for Advanced Packaging (NCAP China), China
192 16:30‐16:50 Cu/Adhesive Hybrid Bonding Through a Cu‐first
Bonding Approach by Using H‐containing HCOOH
Vapor Surface Treatment
Ran He, Masahisa Fujino, Masatake Akaike, Taiji
Sakai, Seiki Sakuyama and Tadatomo Suga
The University of Tokyo, Japan
278 16:50‐17:10 Low Temperature Sintering of Nanosilver Paste for
Super‐Large‐Area Substrate Bonding
Han‐Ning Jiang, Xin Li and Yun‐Hui Mei
Tianjin University, China
39
Session 23: Packaging Materials & Processes
Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room B Chairs Wei Liu
92 15:50‐16:10
Hierarchically Interconnected Epoxy/BN‐SCMC
Polymer Composites with Enhanced Thermal
Conductivity
Jiantao Hu, Xiaoliang Zeng, Rong Sun, Jian‐Bin Xu
and Ching‐Ping Wong
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, China
93 16:10‐16:30
Effects of aging temperature on fatigue life of
Sn‐3.0Ag‐0.5Cu solder joints
Jundong Wang and Yao Yao
Northwestern Polytechnical University, China
99 16:30‐16:50 Polyurethane‐Based flexible conductive adhesivesMa Hongru, Yan Shaocun, Li Zhe, Tian Xun, Ma Lei and Ma Yanqing Shihezi university, China
140 16:50‐17:10 Solvent effect on pressureless and
low‐temperature sintering of Ag paste for
die‐attachment in high‐power devices
Hao Zhang, Chuantong Chen, Jingting Jiu and
Katsuaki Suganuma
Osaka University, Japan
Session 24: Packaging Materials & Processes
Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room CChairs Rong An
197 15:50‐16:10 A Facile Route to Prepare Metal Nanostructure Applied in SERS Active Substrate Qionglin Ouyang, Gang Li and Pengli Zhu Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
231 16:10‐16:30 Study on Slip Behavior of lead‐free Solder Joints under Uniaxial Stress Gaqiang Dong and Limin Ma Beijing University of Technology, China
276 16:30‐16:50 Improved permittivity and breakdown strength of PVDF composites filled with TiO2‐SrTiO3 hybrids Xiaodong Zhu, Suibin Luo, Shanjun Ding, Chao Wang, Zijie Song, Shuhui Yu, Rong Sun and Ching‐Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
282 16:50‐17:10 Corrosion process study of Zn‐30Sn
high‐temperature lead‐free solder
Zhenghong Wang, Gong Zhang, Chuantong Chen
and Katsuaki Suganuma
Tsinghua University, China
40
Session 25: Emerging Technologies
Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room D Chairs Wenhua Yang
330 15:50‐16:10 Conductivity of Silver and Copper Film Printed by Particle‐free Reactive Inks Hongbo Xu, Xingming Tang, Hailin Sun, Hongyun Zhao and Mingyu Li Harbin Institute of Technology, China
233 16:10‐16:30
Easy‐disassembly bonding of PDMS used for
leak‐tight encapsulation of microfluidic devices
Jie Wang, Shijie Wang, Peng Zhang and Yujie Li
Harbin Institute of Technology at Weihai, China
297 16:30‐16:50
CNT‐Graphene Heterostructures: First‐Principle
Study of Electrical and Thermal Conductions
Wei Yan, Guoyuan Li, Bin Li, Changjian Zhou,
Ren‐Yu Tian, Xiao‐Bao Yang and Cary Y Yang
South China University of Technology, China
151 16:50‐17:10 Study on the Influence of LED PN Junction Area on
Modulation Bandwidth in Visible Light
Communication
Lilin Liu, Zheng Zhou and Gang Wang
Sun Yat‐sen University, China
Session 26: Quality & Reliability
Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room EChairs Fengwen Mu
275 15:50‐16:10 The Mechanism Study of Low‐Temperature Brittle Fracture of Bulk Sn‐Based Solder Qi An, Chunqing Wang, Hong Wang and Xiangxi Zhao Harbin Institute of Technology, China
258 16:10‐16:30
On‐line monitoring flip LED chip performance
degradation and failure analysis
Lin Zhou
Research Institute Of Tsinghua University In
Shenzhen, China
100 16:30‐16:50 COB 3wheel Reliability Simulation Method
Development
Jianfei Long, Haomin Bao, Yonghua Zhou and
Jonghyun Chae
Samsung Semiconductor (China) R&D CO.,LTD ,
China
179 16:50‐17:10 The stress strain analysis under the reverse load
of the embedded baseplate micro‐scale grid array
welder
Rui Yin, Chun‐Yue Huang, Gen‐Xin Huang, Li‐Shuai
Han, Jian‐Pei Wang, Ying Liang and Tian‐Ming Li
School of Electro‐Mechanical Engineering, Guilin
University of Electronic Technology, China
41
Session 27: Packaging Design and Modeling
Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room F Chairs Yujie Li
81 15:50‐16:10Solderablity Degradation of Electrodeposited Tin Finishes Jing Wang, Guang Chen, Henry Forbes, Katerina Christopoulos, and Changqing Liu Loughbouough University, UK
109 16:10‐16:30 Fatigue life assessment of electronic components under vibration using displacement as a response metric Vinay Kumar, Prashant Tripathi and Wayne Sozansky DELPHI Electronics & Safety, USA
213 16:30‐16:50 The influence of heat transfer boundary
conditions on the fusion zone size of Sn solder
under localized and rapid heat source
Zheng Zhou, Anna Zhang, Hui Liu, Liping Mo and Fengshun Wu Huazhong University of Science & Technology, China
96 16:50‐17:10 Thermal‐Stress Co‐Simulation of a Ka‐band
Millimeter‐wave T/R System in Package
Gang Xu, Wei Zhong and Rong Zen
Institute of Electonic Engineering, Academy of Engineering Physics, Mianyang, China
Session 28: Packaging Design and Modeling
Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room G Chairs Chenxi Wang
90 15:50‐16:10 Structural design of LED packaging in terms of lumen reliability by a statistical method Qi Chen, Bofeng Shang, Weicheng Shu, Yanhua Cheng and Xiaobing Luo Huazhong University of Science and Technology, China
36 16:10‐16:30
Modeling and fabrication of the Redistribution
Layer on the 2.5D Si interposer Yunna Sun, Zhiyu Jin, Jiangbo Luo, Jian Li, Yating Sun, Yan Wang and Guifu Ding Shanghai Jiao Tong University, China
175 16:30‐16:50 On reproducing the copper extrusion of through‐silicon‐via from the atomic scale Jinxin Liu, Zhiheng Huang, Paul Conway, Frank Altmann, Matthias Petzold and Falk Naumann Sun Yat‐sen University, China
256 16:50‐17:10 A Hybrid Genetic Algorithm for Automatic
Layout Design of Power Module
Baisen Hao, Yunhui Mei and Puqi Ning
Tianjin University, China
42
POSTER SESSION 1 Note: Only the affiliation information of the first author is provided due to the space constraints.
Poster exhibition at the Lobby on the 1st (Area 1, 2, 3) and 2nd floor (Area 4, 5, 6) Friday, August 18, 2017 (09:55AM --10:50AM)
Area 1(Session A)
040 Multi-chip Plastic Package technology with new
substrate
Rongzhen Zhang, Yuan Zhu and Xiaoping Liao
CETC58, China
063
Effect of Electromigration and Aging on
evolution of interfacial intermetallic compounds
in Cu-Solder-Cu solder joints
Tian Wenya and Li Junhui
Central South University, China
112 3D Wafer Level Compression Molding Process
Development For Image Sensor Package
Shuying Ma, Daquan Yu and Mengqiang Li
Huatian Technology (Kunshan) Electronics Co.,
Ltd., China
135
Fabrication of high Q factor integrated passive
devices based on embedded Fan-out wafer level
package
Xiufeng Zhou, Xuefei Ming, Yong Ji, Nayan Gao,
Yang Li, Xin Yao and Kai Xue
CETC58, China
147 SiC wafer bonding using surface activation
method for power device
Fengwen Mu, Masahisa Fujino, Tadatomo Suga,
Kenichi Iguchi, Haruo Nakazawa and Yoshikazu
Takahashi
The University of Tokyo, China
211
Thermal conductivity of thin finite-size β-SiC
calculated by molecular dynamics combined
with quantum correction
Chengdi Xiao, Hu He, Junhui Li, Sen Cao and
Wenhui Zhu
Central South University, China
219 A New Approach To Minimize Package Warpage
In Reflow Process
Chuwen Liu, Liming Gao, Ming Li and Jicun Lu
Shanghai Jiao Tong University, China
257 Elimination the CMP Defects for TSV Process
by Optimizing the Copper Electrodeposition
Chuang Jiang, Ming Li and Su Wang
Shanghai Jiao Tong University, China
Shanghai Shinyang Semiconductor Mat. Co. Ltd.
277 A new fabrication method of RF interposer
applied in the integration of band pass filter in
the frequency range of X band
Weibo Zhang, Wenhua Wang and Le Luo
Shanghai Institute of Microsystem and
Information Technology, Chinese Academy of
Sciences, China
329
Study of Cu-Cu low temperature direct bonding
and contact resistance measurement on bonding
interface
Wenhua Yang, Yangting Lu, Chenggong Zhou,
Jiang Zhang and Tadatomo Suga
Hefei University of Technology, China
339Study of the Machinery Hermetic Encapsulation
Method of Ni-Ti Alloys
Yang Hai and Jing Zhu
China Electronic Technology Corporation No.10
Research Institute, China
012Grafting of perfluorinated organic film on the Si
surface in aqueous solution
Shanshan Zhang, Ming Li, Wenlong Zhang and
Junhong Zhang
Shanghai Jiao Tong University, China
013Preparation of pine-like Cu-Ni-P coating and its
application in 3D integration
Wenjing Zhang, Yinghui Wang, Tadatomo Suga
and Ming Li
Shanghai Tech University, China
015Board-Level Vapor Phase Soldering (VPS) with
Different Temperature and Vacuum Conditions
Lijuan Huang, Zhenghu Zhu, Xu Long and Yao
Yao
Northwestern Polytechnical University, China
019
Competitive Adsorption Between Suppressor and
Accelerator in Copper Methanesulfonic Acid
Bath for Electrodeposition
Dongfan Wang, Xiaoying Miao, Huiqin Ling,
Ming Li, Fengwei Dai, Wenqi Zhang and Liqiang
Cao
Shanghai Jiao Tong University, China
023
Effect of Assembly Sequence on Shear Behavior
of Solder Joints in BGA under Board-level
Structure
Keming Jia and Lifeng Wang
Hefei BOE Video Technology Co., Ltd., China
024 Sintering process of mixed solvent system frit to
43
improve the performance of the film in
glass/glass laser bonding
Yi Li, Rui Tian, Luqiao Yin and Jianhua Zhang
Shanghai University, China
026 Enhanced magnetic and dielectric properties of
(1-x)BiFeO3-xBaFe12O19 Solid Solution
Qiang Li, Shengxiang Bao, Jie Li, Tao Hong,
Libo Ai, Yanhua Sun, Chuan Luo, Yulan Jing and
Yongda Hu
University of Electronic Science and Technology
of China, China
028
Low temperature co-fired Sn-Ca co-substituted
Y3Fe5-2xSnxCaxO12 ferrites for microwave
devices application
Jie Li, Tianhui Qiu, Dandan Wen, Yingli Liu,
Yulan Jing and Weixun Huang
University of Electronic Science and Technology
of China, China
030 Introduction of capacitive fingerprint sensor
packaging technology
Wang Dong Dong
Institute of microelectronics, Tsinghua
University, China
032 Effect of Annealing Process on the Properties of
Through-Silicon-Via Electroplating Copper
Yong Guan, Shenglin Ma, Qinghua Zeng, Wei
Meng, Jing Chen and Yufeng Jin
Peking University, China
Area 2(Session A&B)
033
Oxygen and Water Barrier Performance of the
Composite Thin Film of Graphene and
Polydimethylsiloxane (PDMS)
Shiqi Liu, Zhangfu Chen, Xiaoxue Xu, Lianqiao
Yang and Bin Wei
Shanghai University, China
038
Aging Effect on Wettability of Negative
Photoresist with Fine-pitch Micro-holes after O2
Plasma Treatment
Wen Ren, Menglong Sun, Huiqin Ling, Anmin
Hu, Ming Li, Wenqi Zhang, Fengwei Dai and
Liqiang Cao
Shanghai Jiao Tong University, China
048 Microstructure and mechanical properties of
Au60AgCu joints brazed with Sn63Pb solder
Wang Xiuli, Wang Xinhua and Dong Yunsong
Beijing Institute of Control Engineering, China
055 Effective Synthesis of Al2O3-Silver
Nanoparticles Hybrids
Guiran Pan, Xiaoliang Zeng, Rong Sun, Jian-Bin
Xu and Ching-Ping Wong
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, China
056Effects of Ga addition on microstructure and
properties of Sn-0.3Ag-0.7Cu solder
Xin Yao, Xuefei Ming, Yuyuan Cao, Yanping
Zeng, Yong Ji, Nayan Gao and Xiufeng Zhou
CETC58, China
061
Jet printing morphology and rheological
characteristics of silver paste electrically
conductive adhesives (ECAs)
Saipeng Li, Dapeng Wang, Jian Zhou, Feng Xue
and Xinyue He
Southeast University, China
062
Investigation of properties and curing process of
silver paste electrically conductive adhesives
(ECAs)
Saipeng Li, Xinyue He, Jian Hao, Jian Zhou and
Feng Xue
Southeast University, China
067Research on microstructures of double interfaces
SAC305 solder joint by RPC
Jibing Chen, Nong Wan, Juying Li, Zhanwen He
and Yiping Wu
Wuhan Polytechnic University, China
074Experimental study on the viscoelastic property
of silicone
Xiuyang Shan and Yun Chen
Central South University, China
076
Thermal Analysis and Characterization of
Electronic Packages with Alternative Lid
Coatings
Hengyun Zhang, Shen Xu and Hao Chen
Shanghai Univ. of Engineering Sci., China
079Atomistic simulation on mechanical behaviors of
Al/SiC nanocomposites
Yuping Yan, Shangru Zhou and Sheng Liu
School of Power and Mechanical Engineering,
Wuhan University, China
106
Influences of the Ar/H2 Plasma Activation on the
Bonding Strength and Reliability of Chips and
Substrates Assembly
Cheng-Li Chuang, Jong-Ning Aoh and Bao-Chu
Lin
Chung Shan Medical University, China
119Low-temperature sintering of bimodal Ag
nanoparticles for power electronics applications
Yong Xiao, Yong Cao, Zhihao Zhang, Ming Yang,
Shuai Wang and Mingyu Li
Harbin Institute of Technology, China
124 Effects of Multiple Reflow Cycles on the
44
Reliability of Sn–Sb Solders for Power
Electronics Packaging
Bin Li, Zhenqing Zhao, Mingyu Li, Tao Wang
and Hui Li
Delta Electronics (Shanghai) Co., Ltd., China
131
The Preparation of Monodisperse Silver
Nanoparticles and its Application in Flexible
Printed Electronics
Weifang Shao, Pengli Zhu, Yougen Hu, Rong Sun
and Chingping Wong
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, Shenzhen, China
143
Influence of solder cap thickness on the
interfacial reaction in Cu/Sn/Ni copper pillar
bump
Ya Li, Li Rao, Huiqin Ling, Anmin Hu and Ming
Li
Shanghai Jiao Tong University, China
144
The effect of curing agent on the properties of
silver paste electrically conductive
adhesives(ECAs)
Jian Hao, Xinyue He, Saipeng Li, Jian Zhou and
Feng Xue
School of Materials Science and Engineering,
Southeast University, China
145
Analysis of Microstructure and Interface
Morphology of Sn- based Solder / Cu during
Pulsed Hot – pressing Welding
Min Wang, Zhili Zhao, Xin Liu and Shiyong
Zhang
School of Material Science & Engineering
Harbin University of Science and Technology,
China
157 Thermal cycling aging effects on the tensile
property of lead-free solder Sn-3Ag-0.5Cu
Bingjie Chen, Kaimin Wang and Yao Yao
Northwestern Polytechnical University, China
158
Research on the corrosion resistance of SAC305
solder added with Ag3Sn and Cu3Sn
nanoparticles
Chao Huang, Li Rao, Huiqin Ling, Anmin Hu
and Ming Li
Shanghai Jiao Tong University, China
170 Impact of Substrate Materials on Packages
Warpage
Jianxia Hao, Jing Shang, Xiaodong Liu, Tao
Hang, Liming Gao and Ming Li
Shanghai Jiao Tong University, China
Area 3(Session B)
173Silicon/conductive Porous Copper Layer Anode
For Rechargeable Lithium-ion Batteries
Hanzhi Ju and Tao Hang
Shanghai Jiao Tong University
178
Study on mechanical properties of low silver
lead-free solders under combined compression
and shear loading
Cong Chen, Yingjie Yu and Xiaoyan Niu
Hebei University, China
183
Aluminum coated shperical particles filled
paraffin wax as a phase-change thermal interface
materials
Dasha Mao, Jinqi Xie, Guoqing Sheng,
Huangqing Ye, Matthew M.F. Yuen, Xian-Zhu Fu,
Rong Sun and Ching-Ping Wong
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, China
184
A low-melting-point alloy filled epoxy
conductive adhesives as thermal interface
materials
Jia-Hui Kang, Jia-Li Sheng, Xian-Zhu Fu, Rong
Sun and Ching-Ping Wong
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, China
188Electroless deposition of nickel conductive
patterns using nickel-ion catalysts
Futao Zhang, Lu Xu, Jin-Qi Xie, Matthew M.F
Yuen, Xian-Zhu Fu, Rong Sun and Ching-Ping
Wong
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, Shenzhen, China
191
High efficient Pd-based bimetallic alloyed
catalyst for electroless deposition of metalic
copper
Jia-Li Sheng, Jia-Hui Kang, Xian-Zhu Fu, Rong
Sun and Ching-Ping Wong
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, China
193Enhancement of thermal conductivity of epoxy
adhesives by ball milling copper flakes
Lu Xu, Hao-Ran Wen, Futao Zhang, Matthew
M.F. Yuen, Xian-Zhu Fu, Rong Sun and
Ching-Ping Wong Wong
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences., China
196Surface modification of nano-size SiO2 filler for
flip chip underfill applications
Gang Li, Yachuan He and Pengli Zhu
Shenzhen Institutes of Advanced Technology,
45
Chinese Academy of Sciences, China
206
The effects of temperature and humidity on the
optical properties of PMMA: a hybrid first
principle calculation and molecular dynamic
simulation
Ding Ma, Daoguo Yang, Xuanyou Chen, Maofen
Zhang, Xiyou Wang and Miao Cai
Guilin University of Electronic Technology,
China
210 Research on the reliability of Cu/Sn copper pillar
bump
Wen Zhao, Li Rao, Anmin Hu, Liming Gao and
Ming Li
Shanghai Jiao Tong University, China
214 Solidification microstructure of tin-based solder
in the rapid cooling condition
Anna Zhang, Zheng Zhou, Liping Mo, Fengshun
Wu and Hui Liu
Huazhong University of Science & Technology,
China
215 Study of Epoxy Molding Compound with High
Dielectric Constant
Hongjie Liu
JiangSu Hua Hai Cheng Ke advanced materials
Co., Ltd., China
229 Effect of reflow time on shear property of
Sn-9Zn solder bumps
Menglong Sun, Qinghua Zhao, Dongfan Wang,
Anmin Hu and Ming Li
School of Materials Science and Engineering,
Shanghai Jiao Tong University, China
245
Effect of minor Ag and Cu additions on melting
characteristics , wettability and microstructures
of Sn58Bi solder
Deping Jiang, Zongxiang Yao and Limeng Yin
Chongqing University of Science and
Technology, Chongqing, China
246
Synthesis and characterization of silica–silver
core-shell structural spheres and its application
in conductive adhesive
Jinze Li, Baotan Zhang and Rong Sun
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, China
247
Liquid Epoxy Molding Compound with High
Glass Transition Temperature and High Thermal
Conductivity
Jinze Li, Baotan Zhang and Pengli Zhu
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, China
262 A conceivably stable non-cyanide electroless
gold plating for electronic packaging application
Mingqi Huang, Xiantang Li, Jianwen Xia,
Xiaohai Li, Wenyu Qiu, Guoping Zhang, Rong
Sun and Yong Mu
Shenzhen Institutes of Advanced Technology,
China
268Low temperature liquid bonding using Cu@Sn
preform for high temperature die attach
Hongyan Xu, Qilong Wu, Puqi Ning and Ju Xu
Institute of electronical engineeing, Chinese
Acedemy of Sciences, China
270Dielectric properties of epoxy nanocomposites
filled with copper oxides
Wenhu Yang, Rong Sun, Wei-Hsin Liao and
Shuhui Yu
Guangdong Ocean University, China
284Failure analysis on SAC305 large-size BGA
components attached with SnPb solder
Sen Cong and Weiwei Zhang
Institute of Electronic Engineering in China of
Academy of Engineering Physics, China
291
Effect of Sn grain orientation on Ni substrate
dissolution and intermetallic compounds
precipitation in Cu/Sn/Ni interconnect
undergoing electromigration
Xingbo Liu and Mingliang Huang
Dalian University of Technology, China
Area 4(Session B)
292
Dominant effect of Sn grain orientation on
electromigration-induced failure mechanism of
Sn-3.0Ag-0.5Cu flip chip solder interconnects
Hongyu Sun and Mingliang Huang
Dalian University of Techonlogy, China
306
A Printable and Flexible Conductive Polymer
Composite with Sandwich Structure for
Stretchable Conductor and Strain Sensor
Applications
Yougen Hu, Tao Zhao, Pengli Zhu, Yuan Zhang,
Xianwen Liang, Rong Sun and Ching-Ping Wong
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, China
307A highly sensitive flexible pressure sensor based
on multi-scale structure and silver nanowires
Longquan Ma, Xingtian Shuai, Pengli Zhu and
Rong Sun
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Science, China
315Fabricating high temperature used solders with
Cu@Ag core-shell micro-nano particle addition
Zhang Tao, Liu Yang, Zhao Kai and Sun Feng
46
Lian
Harbin University of Science and Technology,
China
323
Formation of preferred orientation of Cu6Sn5
grains in Cu/Sn/Cu interconnects by soldering
under temperature gradient
Yi Zhong, Ning Zhao, Wei Dong, Haitao Ma and
Yunpeng Wang
Dalian University of Technology, Georgia
Institute of Technology, China
327
Comparison on microstructure and mechanical
property of composite solder joints with different
reinforcements
Zhuoling Zou, Fengshun Wu, Liping Mo, Zheng
Zhou and Hui Liu
Huazhong University of Science and
Technology, China
332
Effects of Cu-Ni cross-interaction on the
interfacial reactions in Cu/Sn-9Zn/Ni micro
solder joints under temperature gradient
Ning Zhao, Mingyao Wang, Yi Zhong, Haitao Ma
and Yunpeng Wang
Dalian University of Technology, China
336 Preparation of nano Cu@Ag core shell powder
for electronic packaging
Kai Zhao, Yang Liu, Tao Zhang and Fenglian
Sun
Harbin University of Science and Technology,
China
343 Study on Preparation and Rapid Laser Sintering
Process of Nano Silver Pastes
Wei Liu, Ronglin Xu, Chunqing Wang and
Yanhong Tian
Harbin Institute of Technology, China
345 The effect of curing process on laser releasable
de-bonding temporary material for 3D packages
Xia Jianwen and Zhang Guoping
Shenzhen Samcien Semiconductor Materials
Co., Ltd, China
346
Investigation the Effect of Silane onto
Fabricating Polymer Insulation Layer by
Spin-coating for Through Silicon Vias
Qiang Liu, Guoping Zhang, Rong Sun, S. W.
Ricky Lee and Ching-Ping Wong
Shenzhen Institutes of Advanced Technology,
Chinese Academy of Sciences, China
352 Effect of Multilayer Films and Current on IMC
Formation in Solder Joints
Wei Liu, Yuzhuo Nie, Chunqing Wang and
Yanhong Tian
Harbin Institute of Technology, China
353
The Cu@SiO2 Core-Shell nanoparticles filled
polyvinylidene fluoride nanocomposites film:
Fabrication, characterization and dielectric
property analysis
Wenhu Yang, Jianying Du, Rong Sun, Shuhui Yu,
Wei-Hsin Liao, Feng Li and Zhengye Xiong
Guangdong Ocean University, China
354Study on the Pre-Tinned Effect in the Electroless
Tin Plating Process
Zhen Zheng, Zhen Qiao and Chunqing Wang
State Key Laboratory of Advanced Welding and
Joining, Harbin Institute of Technology, China
356
Effects of copper nanoparticles doped flux on the
microstructure of IMCs between Sn solder and
copper substrate
Shengyan Shang, Anil Kunwar, Yingchao Wu and
Haitao Ma
Dalian University of Technology, China
358
Effect of isothermal aging on mechanical
properties and strain rate sensitivity of the
eutectic Sn-58Bi solder alloy
Zhou Zhou, Xiao Ma, Min-Bo Zhou, Can Yin and
Xin-Ping Zhang
South China University of Technology, China
359
Copper-tin Reaction and Preparation of
Micro-solder Joints under High Frequency
Alternating Magnetic Field
Wei Liu, Yiping Wang, Chunqing Wang and
Yanhong Tian
Harbin Institute of Technology, China
366
The Fabrication of the Cu/Ni/Cu surface
multilayer nano-array and the interconnection
with the SAC305 solder
Zhen Zheng, Fan Yang, Ludong Yang and
Chunqing Wang
Harbin Institute of Technology, China
Area 5 (Session C)
8 The development of electric coupling for RF IC
package substrate
Qi Liu, Huimei Wang, Weidong Liu, Xiaolong
Wang
Packaging Technology Institute of Hua Tian
Technology (Xi’an) Co., Ltd, China
10
Design, Packaging and Test of A Planar
Double-Side Cooling IGBT Power Module
Libing Zheng, Zhuming Liu, Chunlei Wang,
Huachao Fang and Li Han
Institute of Electrical Engineering, Chinese
Academy of Sciences, China
47
41 A Design of S-band Monolithic Integrated
Switched Filter Bank
Xiaodong Yang, Mengjiang Xing and Erfan Wang
Kunming University of Science and Technology,
China
42
Multi points Temperature Measurement of
Infrared Scanning Method on Surface Mount
Technology
Xiangxi Zhao, Wei Zhang and Lingchao Kong
Harbin Institute of Technology, China
49 Process Emulation for Predicting Die Shift and
Wafer Warpage in Wafer Reconstitution
Kuo-Shen Chen, Cheng-Ying Yang and
Tian-Shiang Yang
National Cheng-Kung University, China Taiwan
80
The Simulation and Verification of The
Passivation layer’s Residual Stress Aiming at A
Silicon-based fan-out Package Structure
Jianfeng Wang, Nayan Gao, Yang Li and Xuefei
Ming
CETC58, China
82 Design of Miniaturized Tunable Band - pass
Filter Based on LTCC Process
GaoErfan Wang, Xiaodong Yang, Mengjiang
Xing, Lei Zhang, Nan Li and Zhouqiang Qian
Kunming University of Science and Technology,
China
117 Research on the structural reliability of the
ceramic package for packaging SIP
Zhen-Tao Yang
The 13th Research Institute, CETC, China
122
Electro-thermal and thermal-mechanical FE
analysis of IGBT module with different bonding
wire shape
Jingyi Zhao, Fei Qin, Tong An, Xiaorui Bie and
Chao Fang
Beijing University of Technology, China
148
Investigation on Wafer Warpage Evolution and
Wafer Asymmetric Deformation in Fan-out
Wafer Level Packaging Processes
Chunsheng Zhu, Pengfei Guo and Zibin Dai
Institute of Information Science and Technology,
China
198 Dynamic Finite Element Modeling of Backside
Grinding Process for TSV Wafer
Bo Sun, Fei Qin, Jinglong Sun, Pei Chen and
Tong An
Beijing University of Technology, China
200
Power Integrity Design for Package-Board
System Based on BGA
Haiyan Sun, Xueming Wang, Ling Sun, Jicong
Zhao and Weijun Sun
Nantong Univeristy, China
208
Research on Surface Anti-Reflection Properties
of Nanowire Array Structure Based on Silicon
Solar Cells
Qin Yao, Yinming Wu and Fengshun Wu
The University of Auckland, New Zealand
212
Study on the microstructure of Si/solder/Si joint
based on Al/Ni self-propagating exothermic
reaction
Sicong Hu, Zheng Zhou, Hui Liu, Wenbo Zhu
and Fengshun Wu
Huazhong University of Science and
Technology, China
237Design of Super Compact Bandpass Filter Using Silicon-Based Integrated Passive Device TechnologyLi Nan, Li Xiao-Zhen, Xing Meng-Jiang, Chen
Qi and Yang Xiao-Dong
Kunming University of Science and Technology,
China
242
Design of Microchannel Heat Sink using
Topology Optimization for High Power Modules
Cooling
Ling Xu, Hao Li, Xiaohong Ding and Sheng Liu
University of Shanghai for Science and
Technology, China
252A 3D interconnection model and its applications
in Package on Package
Yang Zhou, Bo Wang, Jianfeng Liu, Bowen Wu
and Qiang Ma
China Electronics Technology Group
Corporation No.38 Research Institute, China
254
A first-principle study of the adsorption behavior
of NO gas molecules on pristine and Al-doped
penta-graphene
Chuang Feng, Xing-He Luan, Ping Zhang, Jing
Xiao, Dao-Guo Yang and Hong-Bo Qin
Guilin University of Electronic Technology,
China
267
Simulation and optimization of X-band
microstrip filters based on high-resistance silicon
wafer with BCB dielectric and new shielding
TSV structure
Wenhua Wang, Gaowei Xu and Weibo Zhang
Shanghai Institute of Microsystem and
Information Technology, China
269The study on elastic properties of Cu3Sn under
pressure via first-principle calculations
48
Fan-Fan Niu, Xing-He Luan, Chuang Feng,
Ying-Hong Zhang, Dao-Guo Yang, Hong-Bo Qin,
Hong-Jie Jiang and Feng-Mei Liu
Guilin University of Electronic Technology,
China
285 Influence of the QFN creep property through the
thermal cycling reliability
He Xiaobin, Xu Yanming, Liu Shuangbao, Yang
Shihua and Wu Jinhua
Shanghai Aerospace Equipment Manufactory,
China
296 Study on temperature distribution of IGBT
module
Chao Fang, Tong An, Fei Qin, Xiaorui Bie and
Jingyi Zhao
Beijing University of Technology, China
308 Packaging Structure Design for Metal Oxide Gas
Sensors
Xiyou Wang, Maofen Zhang and Daoguo Yang
Guilin University of Electronic Technology,
China
311 Electrical Transmission Characterization of IPD
microstrips up to 30GHz Xiaodong Yang, Mengjiang Xing and Erfan WangKunminng University of Science and
Technology, China
313 Numerical simulation of the wire bonding
reliability of IGBT module under power cycling
Bie Xiaorui, Qin Fei, An Tong, Zhao Jingyi and
Fang Chao
Beijing University of Technology, China
328 Study on Cracking Failure of MLCC Body
Based on Mechanical Stress
Lu Tao and Hongqin Wang
The Fifth Research Institute of MIIT,P.R.China
(Ceprei Laboratory), China
Area 6 (Session C&D)
333
Investigation of Single Cut Process in
Mechanical Dicing for Thick Metal Wafer The
electronic properties of zinc-blende GaN,
wurtzite GaN and pnma-GaN crystals under
pressure
Xing He Luan, Chuang Feng, Hong Bo Qin, Fan
Fan Niu and Dao Guo Yang
Guilin University of Electronic Technology,
China
337
Quantitative Polynomial Free Energy based
Phase Field Model for Void Motion and
Evolution in Sn under Thermal Gradient
Anil Kunwar, Michael R Tonks, Shengyan Shang,
Xueguan Song, Yunpeng Wang and Haitao Ma
Daian University of Technology, China
341
Study on the Electrical Performance of Au Bump
in FC Ceramic Package
Feng Lu, Peifeng Hu, Yajun Ding, Yusheng Cao,
Binhao Lian and Yong Wang
Beijing Microelectronics Technology Institute,
Beijing, China
344
Thermal properties of TIM using CNTs forest
inelectronics packaging
Gaowei Xu, Wei Gai, Le Luo, Shulin Zhang and
Xiaoming Xie
Shanghai Institute of Microsystem and
Information Technology, Chinese Academy of
Sciences, China
349 The design of multilayer IC test board based
on ATE
Jianhui Liu, Fei Pan and Dexiang Zhou
Shennan circuits co., LTD, China
365 Microstructure simulation and
thermo-mechanical behavior analysis of
Cu-filled through silicon vias (TSVs) using
combined Monte Carlo and finite element
method
Shui-Bao Liang, Cheng Wei, Chang-Bo Ke,
Min-Bo Zhou and Xin-Ping Zhang
South China University of Technology a, China
368 Coupled phase field and finite element modeling
of void evolution and physical property change
of micro flip-chip solder joints under
electromigration and elastic stress field
Shui-Bao Liang, Chang-Bo Ke, Min-Bo Zhou
and Xin-Ping Zhang
South China University of Technology, China
3 The Study of The Growth Behavior of Cu6Sn5
Intermetallic Compound in Cu/Sn/Su
Interconnection System during The Ultrosonic
assisted Transient Liquid Phase Soldering
Jihou Liu, Hongyun Zhao, Zhoulin Li and
Xiaoguo Song
Harbin Institute of Technology at Weihai
64 Electromigration behavior of liquid Sn-58Bi/Cu
joints through minor Zn alloying substrates
Fengjiang Wang, Zhiping Xiao and Lili Zhou
Jiangsu University of Science and Technology,
China
69
Copper Pillar Bump Surface Smoothness
Simulation Studies in Through-Silicon Via
Technology
49
Wenhao Dong, Wen Zhao, Ming Li and Liming
Gao
Shanghai Jiao Tong University, China
95 The influence of pulse and ultrasonic agitation
on TSV filling
Peng Zeng and Xinyu Ren
Central South University, China
111
Interposer Connection Reliability using
Double-Side Solder Bump for Board-Level
Vertical Interconnection
Yue Li, Chunjin Hang, Yanhong Tian, Xuguang
Guo, Wei Liu and Chunqing Wang
Harbin Institute of Technology, China
115 A novel copper-coated ceramic substrate
prepared by nano thermocompression bonding
Yun Mou, Yang Peng, Hao Cheng, Ziliang Hao
and Mingxiang Chen
Huazhong University of Science and
Technology, China
120 Flexible Connection for Reflow Free Super Fine
Pitch QFP SMT Components
Yongfa Cheng, Xiaosong Ma and Feiyang Liu
Guilin University of Electronic Technology,
China
125 Rapid Sintering of Copper Nanopaste by Pulse
Current for Power Electronics Packaging
Yuan Huang, Chunjin Hang and Yanhong Tian
Harbin institute of technology, HIT, China
133 Step Nano-mechanical Behavior of SnAgCu
Solder Joints under nano-indentation method
Lifeng Wang ,Haitao Liu ,Wenqin Dai and Pule
Zhang
Harbin University of Science and Technology,
China
152 Characterization of TSV Transition Properties
Using TRL Method
Feiyang Liu, Xiaosong Ma and Yongfa Cheng
Guilin University of Electronic Technology,
China
182
Hollow PdCu Alloy Catalysts for Electroless
Copper/Nickel Deposition
Guoqing Sheng, Jiahui Chen, Futao Zhang,
Matthew M.F. Yuen, Xian-Zhu Fu, Rong Sun and
Ching-Ping Wong
Shenzhen Insititute of Advanced Technology,
Chinese Academy of Sciences, China
185
PdCu alloy nanoparticles supported on reduced
graphene oxide as active catalyst for electroless
copper plating
Huang-Qing Ye, Da-Sha Mao, Matthew M.F.
Yuen, Xian-Zhu Fu, Rong Sun and Ching-Ping
Wong
Harbin Institute of Technology Shenzhen
Institutes of Advanced Technology, Chinese
Academy of Sciences, China
235A Study on the Influence Factors of Parallel-Gap
Welding Heat
Jing Liu
Academy of Space Electronic Information
Technology, China
248
Design of A Modulator Based on Hybrid SPPs
Structure
Wang Quan, Xiao Jing, Wei Qiqin and Liu Ping
Guilin University of Electronic Technology,
China
249
The waveguide coupler between fiber and slab
waveguide
Liu Ping, Xiao Jing, Wei Qiqin and Wang Quan
Guilin University of Electronic Technology,
China
342
High Reliable Wire Bonding Consistency
Control in MMCM
Han Zongjie, Yan Wei, Hu Yongfang and Li
Xiaoxuan
The 14th Institute of China Electronics
Technology Group Corporation, China
361
A Novel Method for Bonding Strength
Evaluation
Jikai Xu, Chenxi Wang, Xiaoyun Qi, Yongheng
Jia, Xiaoliang Ji, Yanhong Tian and Chunqing
Wang
Harbin Institute of Technology, China
362
Investigation of Bonding Front Propagation for
Wafer Direct Bonding
Yue Li, Chenxi Wang, Yuan Wang, Xiaoyun Qi
and Yanhong Tian
Harbin Institute of Technology, China
50
POSTER SESSION 2 Note: Only the affiliation information of the first author is provided due to the space constraints.
Poster exhibition at the Lobby on the 1st (Area 7, 8, 9) and 2nd floor (Area 10, 11, 12) Friday, August 18, 2017 (14:50 PM --15:50 PM)
Area 7(Session E&F)
002 Modeling study of the dynamics of
silicone-phosphor in jet dispensing process for
LED packaging
Chen Yun, Xiaochu Wang, Yu Zhang, Jian Gao,
Xin Chen, Bo Gao, Yunbo He and Ching-Ping
Wong
Guangdong University of Technology, China
059 Study on the Process of Fluid Jet Dispensing
Based on High and Low Voltage Drive
Xikang Cheng, Guiling Deng, Can Zhou, Na
Wang and Wenjian Cui
Central South University, China
071 Research on the Temperature Field of
Piezoelectric Stack based on Different Driving
Mode
Zhixiang Yang, Guiling Deng and Can Zhou
Central South University, China
073 Residual stress distribution in wafers ground by
different grinding parameters
Jinglong Sun, Fei Qin and Pei Chen
Beijing University of Technology, China
108 Molecular dynamics simulation on subsurface
damage layer during nano grinding process of
silicon wafer
Zhiwei Zhang, Pei Chen and Fei Qin
Beijing University of Technology, China
141 Flat blowing feeding method on performance
improvement of SMD LED chip sorting
Yuxian Lou and Wu Tao
Shantou University, China
163 Double Hard Axes of Hysteresis Loop in
Wide-angle Obliquely sputtered CoFeB
Amorphous Films
Dandan Wen, Huaiwu Zhang, Jie Li and
Gongwen Gan
University of Electronic Science and Technology
of China, China
236 Optimized Design of High Precision Heating
Stage for Die Attach Equipment
Lixin Yao, Jun Wang, Zhiyue Wang, Lezhi Ye,
Pinlie Xu and Ping Lang
CETC Beijing Electronic Equipment Co., Ltd,
China
240Research of SIR Filter Based on Integrated
Passive Device Technology
Lei Zhang, Xiao-Zhen Li, Meng-Jiang Xing and
Xiao-Dong Yang
Kunming University of Science and Technology,
China
244The Characteristic Research and Application in
High Speed Pneumatic Dispensing Valve of the
New Low -Friction Cylinder
Qian Shen, Guiling Deng and Can Zhou
Central South University, China
321Study on the solder joint reliability of Plastic
Ball Grid Array package for high reliability
application
Pengrong Lin, Xiaorui Lv and Yajun Ding
Beijing Microelectronics Technology Institute,
China
325Research of SIR Filter Based on Integrated
Passive Device Technology
Lei Zhang, Xiao-Zhen Lei, Meng-Jiang Xing, Qi
Chen and Xiao-Dong Yang
Kunming University of Science and Technology,
China
006Influence of thermomigration on creep behavior
of Cu/Sn0.7Cu/Cu solder joint
Guoqiang Wei, Si Ma, Dalei Li, Yinpei Jia and
Henglin Liu
South China University of Technology, China
007Study the Effect of the Temperature on the PCB
Assembly and Solder Joints in the Vehicle
Jia-Cheng Zhou, Fang Liu and Nu Yan
Wuhan Textile University, China
014A Study for Open Circuit Failure of PCB with
Direct Plating using Conductive Polymers
Xiao He, Junming Wu, Tao Lu and Jianghua
Shen
China Electronic Product Reliability and
Environmental Testing Research Institute, China
017Investigation on the ESD failure mechanism of
integrated circuits in a 0.11μm CMOS process
Jin Shao, Yanbin Qiao, Qiang Ma, Jianqiang Li,
Yanning Chen, Yidong Yuan, Xiaoke Tang,
51
Haifeng Zhang and Dongyan Zhao
Beijing Smart-Chip Microelectronics
Technology Company Limited, China
021 The stability study of lead-free solder paste
Juanjuan Hao, Yongping Lei and Jian Lin
Beijing University of Technology, China
025 Study on Temperature Factor of LED Control
Gear Reliability
Zhiyuan He, Linyi Huang, Huawei Xu, Shen
Wang and Qunxing Liu
The Fifth Research Institute of MIIT, China
029 Failure Analysis for Bad Wetting on HASL PCB
Yang Ying
China CEPREI Laboratory, China
031 A Study on Shield Cover Fall-off Failure of
ENIG Surface Finish Pads
Li Xiaoqian
Reliability Research and Analysis Center
CEPREI (East China), China
Area 8(Session F)
035 An evaluation method for the restored
time-constant function based on the network
identification by deconvolution method
Wenhao Shu, Jianhua Zhang, Xiaoxue Xu and
Lianqiao Yang
Shanghai University, China
039 Effect of Ni/Au plating on the interconnection
reliability of bond pad
Yuyuan Cao, Xin Yao, Yanping Zeng, Bing Yang
and Xuefei Ming
CETC58, China
046 Construction Analysis of Flip Chip Package for
Aerospace Application
Liyou Zhao, Zebin Kong, Zhen Li and Kunshu
Wang
Shanghai Aerospace Technology Foundation,
China
050 Growth kinetics of Ag3Sn at the interface
between eutectic SnPb soder and electroplated
Ag layer on Ge base
Xiaoliang Ji, Rong An and Chunqing Wang
Harbin Institution of Technology, China
052 Study on Delamination Variation Trend of Two
Plastic Packaging Devices in Combination
Reliability Test
Liyuan Liu, Enliang Li and Xia Luo
CEPREI Laboratory, China
053 Effect of interfacial intermetallic compounds
morphology on mechanical properties of solder
joint with finite element simulation
Shuang Tian, Ruihua Cao, Jian Zhou and Feng
Xue
Southeast University, China
054Microstructure and mechanical properties of
resistor chip joints fabricated by laser soldering
using Sn-58Bi solder on Ni(P)/Cu pads
Shuang Tian, Ruihua Cao, Jian Zhou, Feng Xue,
Fuqiang Tu and Saipeng Li
Southeast University, China
057The shear strength and fracture mode of Sn-xBi
(x=0, 2.5, 5, 15)/Cu solder joints
Fengjiang Wang, Ying Huang and Dongyang Li
Jiangsu University of Science and Technology,
China
060The influence of adding different Sn-based
solder coating into Sn-58Bi/Cu interface on the
growth of intermetallic compound
Fengjiang Wang, Dongyang Li and Ying Huang
Jiangsu University of Science and Technology,
China
078The effect of the material and size of the
flip-chip plastic package on warping
Nayan Gao, Jianfeng Wang, Xi Zou, Bo Chen
and Xuefei Ming
CETC58, China
083Simulation Analysis and Optimization of Pin
Failure of a CSOP-Packaged Devices
Yuan Zhu, Nayan Gao and Rongzheng Zhang
CETC58, China
084Feasibility analysis of the stacked-die ceramic
packaging process in automotive electronics
Chongchong Mao, Yuan Zhu and Lianghai Li
CETC58, China
085Study on the reliability of the solder joint in the
cryogenic environment
Xu Xing, Chen Gaiqing and Cheng Mingsheng
38th Institute of China Electronics Technology
Group Corporation, China
097 The Degradation of High Power Gallium Nitride
Light-emitting Diodes
Piaopiao He, Jipeng Zhou and Luqiao Yin
Shanghai University, China
105
Microstructure evolution and mechanical
property of Sn-37Pb and Sn-3.0Ag-0.5Cu BGA
solder joints under extreme temperature
environment
Ruyu Tian, Chunjin Hang, Liyou Zhao and
Yanhong Tian
Harbin Institute of Technology, China
114 Tensile strength and interfacial reaction of
52
Cu-cored SAC305 solder joint D. Li and Limeng Yin
Chongqing University of Science and
Technology, China
129 Reliability prediction of different size solder
bumps in thermal shock test using FEM Jia Yongheng, Hang Chunjin and Tian Yanhong Harbin Institute of Technology, China
130 Design and Optimization of
Thermal-Mechanical Reliability of a TSV 3D
Packaged Thermal Wind Sensor
Shi-Xuan Gao, Zhenxiang Yi, Yizhou Ye, Qing-An
Huang and Ming Qin Southeast University, China
137 Analysis of the Structure Evolution and Crack
Propagation of Cu-Filled TSV after Thermal
Shock Test
Haixiao Dou, Miaomiao Yang, Yanning Chen
and Yanbin Qiao
Department of Beijing Smart-chip
Microelectronics Technology Company Limited,
Key Laboratory of State Grid Corporation,
Laboratory of Chip Design and Analysis, China
139 The Effect of Loading Rate on the Shear
Behavior of BGA Solder Joints under
Board-level
Shiyong Zhang, Lifeng Wang, Keming Jia, Min
Wang and Yuhui Bai
Harbin University of Science and Technology,
China
150 One failure analysis of Switching filter Tao Hong
University of Electronic Science and Technology
of China, China
Area 9 (SessionF)
161 The Study of Natural Exposure Testing for LED
Lighting System
Yao Bin, Xu Huawei, Lu Guoguang and Lai
Canxiong
CEPREI, China
162 An analysis case on the failure of BGA solder
joints
Weiming Li
Reliability Research and Analysis Center,
CEPREI, China
164 Studies of the failure mechanisms in LED and its
driving module
Guoguang Lu and Canxiong Lai
CEPREI, China
165Vibrational characteristics evaluation on
mid-infrared solid state laser
Guoguang Lu
CEPREI, China
166The influence of thermal aging on the
reliability of Sn-58Bi interconnects
Dapeng Wang, Jian Hao, Jian Zhou, Feng Xue,
Shuang Tian and Saipeng Li
Southeast university, China
171Thermo-electric coupling reliability model of
copper pillar bump based on Black equation
Bin Zhou, Zhiwei Fu, Yun Huang, Ruohe Yao and
Jinyuan Zhang
CEPREI, China
176Process Optimization for Backward Compatible
Reflow Soldering
Zou Yabing and Weiming Li
The 5th Electronics Research Institute of the
Ministry and Information Technology of China,
China
181Analysis and Characterization of Interconnect
Failure of Infrared Focal Plane Array
Lai Canxiong
CEPREI, China
202 A failure analysis of the NTC thermistors
Fuyao Mo and Wei Cai
China Electronic Product Reliability and
Environmental Testing Research Institute, China
204
Failure Analysis on the Sealing Glass Insulator
of Semiconductor Device with Low Resistance
Abnormity
Meng Meng, Wang Xu, Wang Zhibin and Sun
Jiajia
CAST, China
205The Study of LED Silver Plated Lead Frame
Discoloration Mechanism
Huanxiang Xu, Zhenbo Zhao, Lan Chen and
Youliang Wang
The Fifth Electronics Research Institute of
Ministry of Industry and Information
Technology, China
207
A coupled thermal and mechanical modeling to
investigate the stress of TSVs considering
insulation layer
Hanjie Yang, Sen Cao, Zhuo Chen and Wenhui
Zhu
Central South University, China
216
In situ study the effects of Cu addition on the
rapidly growth of Cu6Sn5 at the Sn-base
solder/Cu L-S interface during soldering heat
preservation stage
53
Bingfeng Guo, Chengrong Jiang, Anil Kuanwar,
Jun Chen, Ning Zhao, Yunpeng Wang and Haitao
Ma
Dalian University of Technology, China
217 Study of Highly Accelerated Life Test for
Merging Unit of Intelligent Substation
Zhong Jiayong, He Shengzong and Chen Tiezhu
Electric Power Company Research Institute State
Grid Chongqing, China
218
Impact of tensile strength on thermal fatigue
properties and failure modes of Sn-Ag-Cu-Ni
solder joints
Xiaodong Liu, Jing Shang, Jianxia Hao, Anmin
Hu, Liming Gao and Ming Li
Shanghai Jiao Tong University, China
220 Simulation Design of Piezoresistive Sensors
Based on COMSOL
Zhu-Er Mo, Jing Xiao and Qi-Qin Wei
Guilin University of electronic technology,
China
223 Modeling and analysis on the elastic
performance of SMT silicone rubber keypad
Xuanyou Chen, Daoguo Yang and Ding Ma
Guilin University of Electronic Technology,
China
238
QFN cutting temperature measurement and
thermal stress analysis basing on the infrared
thermal imager
Yuan Yue, Yu Huiping and Qin Fei
Beijing University of Technology, China
241
Effect of Ag concentration on the Cu6Sn5
growth in Sn-based solder/Cu joints at the
isothermal reflow stage
Bingfeng Guo, Chengrong Jiang, Anil Kuanwar,
Ning Zhao, Jun Chen, Yunpeng Wang and Haitao
Ma
Dalian university of technology, China
251 Fatigue Life Prediction of a board-level
assembly for random vibrations
Chen Yang and Jun Wang
Fudan University, China
Area 10 (SessionF)
259 Drop analysis of 3D SiP with Through Silicon
Via
Yao Ruixia, Li Tenghui, Huang Pengfei and Su
Fei
Beihang University, China
261 Research on Failures of a Microwave
Transmission Line Striding Over Structure
Wu Yilong, Zeng Yuanqi, Lu Yinquan and Chen
Chunmei
The 29th Research Institute of China Electronics
Technology Group Corporation, China
263
The degradation investigation of Al wire
bonding strength in power device under thermal
shock test
Jingming Fei, Ping Ren, Ningning Wang and
Binbin Zhang
Beijing Spacecraft, China Academy of Space
Technology, China
264Creep Fracture Analysis and Control Measures
of Aerospace Electronic Products
Binbin Zhang, Zongpeng He, Zhenming Zhang,
Jun Zhang, Ningning Wang and Jingming Fei
Beijing Spacecrafts, China Academy of Space
Technology, China
290Effect of intermetallic compound thickness on tensile behavior of Cu/Sn/Cu micro interconnects
Jiameng Kuang, Fan Yang and Mingliang Huang
Dalian University of Technology, China
294Warpage Analysis of the Capacitive Fingerprint Sensor Package with Thin-core Substrate
Bo Zhang, Fei Xiao, Chen Yang and Yu Lin Fudan University, China
295Optimization of Reflow Soldering Process for White LED Chip-Scale-Packages on Substrate
Chengshuo Jiang, Weiling Guo, Jiajie Fan, Cheng Qian, Xuejun Fan and Guoqi Zhang
Beijing University of Technology, China
298The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows
Haoran Ma, Shuang Li, Mingjun Yao, Yunpeng Wang, Jun Chen, Ning Zhao and Haitao Ma
Dalian University of Technology, China
304Application of Orthogonal Experimental Design for the interfacial reliability of Through-Silicon Vias structure
Ganglong Li, Honglong Luo and Wenhui Zhu
Central South University, China
309Effects of Bonding Parameters on the drop impact reliability of microbumps in chip on chip interconnection
Honglong Luo, Ganglong Li, Qi Su, Wenhui Zhu
and Zhuo Chen
Central South University, Singapore
310
Short-term Life Prediction Based on Field
Reliability Data and Combined Life Stress
Model
Yao Li, Hu Yingjun, Zhang Jiangming, Shen Jianliang and Wang Jun
He Nan XJ Metering Co., Ltd, China
314 The effect of reflow temperature on IMC growth
54
in Sn/Cu and Sn0.7Cu/Cu solder bumps during
multiple reflows
Haoran Ma, Yunpeng Wang, Jun Chen, Haitao Ma and Ning Zhao
Dalian University of Technology, China
316 A Kind of LGA Device Assembly Process and its
Reliability Analysis
Zhu Mei, Wen Xuesi, Ma Xiaomeng, Jin Beibei, Jiang Rongkang and Ni Zhongbiao
Electronic Technology Research Institute of Shanghai Aerospace, China
324 Failure Case Analysis of Quartz Crystal Based
on Failure Mechanism
Zhong Jia Yong, Zhang You Qiang, Liu Zu Jian, Yu Hong Xin, Chen Tie Zhu, He Sheng Zong and Hu Lin
The Fifth Electronics Research Institute of Ministry of Industry and Information Technology, China
331
Comparison of Darveaux Model and
Coffin-Manson Model for Fatigue Life
Prediction of BGA Solder Joints
Liulu Jiang, Wenhui Zhu and Hu He
Central South university, China
338 Failure Analysis on Interconnection Fault for
BGA Module after Board Assembly
Hui Xiao, Daojun Luo and Zhe Sun
China Electronic Product Reliability and Environmental Testing Research Institute, China
340 The Conductive Oxide Impact on Aluminum
Alloy of YAG Pulse Laser Welding
Yang Hai and Jing Zhu
China Electronic Technology Corporation No.10 Research Institute, China
357
Mechanical Properties and Microstructure of
Mixed SnAgCu-SnPb Solder Joints at Cryogenic
Temperature
Bin Ma, Bin Zhou, Shanlin Wang and Xunping Li
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China
367
Investigation of Moisture Diffusion in Plastic
Electronic Packages by Molecular Dynamics
Simulation
Yue Zhang, Chenxi Wang, Zhitian Yuan, Yanhong Tian, Guoliang Fan and Jason Guo
Harbin Institute of Technology, China
Area 11(Session G&H)
001 Thermal-Mechanical Analysis of High Power
LED Package during Power Cycling Test
Yongjun Pan, Fulong Zhu, Jiajie Fan, Xinxin
Lin, Jiaquan Tao and Sheng Liu
Huazhong University of Science and
Technology, China
034
Ultra-compact Warm WLEDs Fabricated by
Multi-Color Phosphor-in-Glass Directed
Bonding on Flip-Chip UV-LEDs
Pengqiang Jiang, Yang Peng, Yun Mou, Hao
Cheng and Mingxiang Chen
School of Mechanical Science and Engineering,
Huazhong University of Science and
Technology, China
058
Facile Fabrication of Microstructured
Fluoropolymer Encapsulation for Light
Extraction Enhancement of Deep Ultraviolet
LEDs
Yang Peng, Yun Mou, Hao Cheng, Pengqiang
Jiang, Zhen Chen and Mingxiang Chen
Huazhong University of Science and
Technology, China
068Performances and microstructures of a
high-power LED based on rapid thermal cycling
Jibing Chen, Nong Wan, Juying Li, Zhanwen He
and Wu Yiping
Wuhan Polytechnic University, China
077Thermal investigation of high-power UV-LEDs
using graphene oxide silicone encapsulant
Renli Liang, Linlin Xu, Yang Peng, Jiangnan Dai
and Changqing Chen
Huazhong University of Science and
Technology, China
118Influence of lens structure on the mechanical
strength of high-power light emitting diodes
Shudong Yu, Kaihang Chen, Baoshan Zhuang,
Yong Tang, Zongtao Li and Binhai Yu
South China University of Technology, China
136
Low-energy Consumption and
High-color-quality White Organic Light-emitting
Diodes
Zhenyu Tang, Kunping Guo, Changfeng Si, Saihu
Pan and Bin Wei
Shanghai University, China
138
Investigation on transient catastrophic optical
damage in high power AlGaAs/GaAs laser
diodes
Yanning Chen, Yanbin Qiao, Qiang Ma,
Jianqiang Li, Jin Shao, Yidong Yuan, Xiaoke
Tang, Haifeng Zhang and Dongyan Zhao
Beijing Smart-Chip Microelectronics
Technology Company Limited, China
190ACU improvement of CCT-tunable LED device
by electrospun nanofiber film
Guanwei Liang, Junchi Chen, Caiman Yan,
Zongtao Li and Yong Tang
55
South China University of Technology, China
194
Ultrasound-assisted soldering of Cu alloy using a
Ni-foam reinforced Sn composite solder
Qiwei Wang, Yong Xiao and Xingyi Zhang
Wuhan University of Technology, China
195 Study on organic/inorganic hybrid light emitting
diode
Xiaoxue Xu, Zhangfu Chen, Zhenyu Tang, Bin
Wei and Lianqiao Yang
Shanghai University, China
227
Chip-Package Co-design for Optimization of 5.8
GHz CMOS LNA Performance
Haiyan Sun, Xiuqing Cheng, Jicong Zhao, Ling
Sun and Lingling Yang
Nantong University, China
228
Investigation on Thermal Characteristics and
Fabrication of DUV-LEDs Using Copper Filled
Thermal Hole
Linlin Xu, Renli Liang, Jiangnan Dai, Hanling
Long and Changqing Chen
Huazhong University of Science and
Technology, China
300
Degradation Mechanism Analysis for
Phosphor/Silicone Composites Aged Under High
Temperature and High Humidity Condition
Xiao Luo, Jiajie Fan, Mengni Zhang, Cheng
Qian, Xuejun Fan and Guoqi Zhang
Hohai University, China
312 Luminous Flux Modeling for High Power LED
Automotive Headlamp Module
Chaohua Yu, Jiajie Fan, Cheng Qian, Xuejun
Fan and Guoqi Zhang
Hohai University, China
363
Preparation of core-shell structured SiO2@Ag
spheres and their role in improving micro-sized
Ag flake filled electrically conductive adhesive
for LED packaging
Han Jiang, Min-Bo Zhou, Jie-Fei Zhu and
Xin-Ping Zhang
South China University of Technology, China
027
A low dielectric loss of Y-doped BiFeO3
ceramics and its magnetic and dielectric
properties
Qiang Li, Shengxiang Bao, Jie Li, Tao Hong,
Libo Ai, Yongda Hu and Yanhua Sun
University of Electronic Science and Technology
of China, China
091 Thermo-fluid simulation of the advanced IGBT
module in a power stack
Xin-Yu Sun, Sichao Ma, Ming Li and Liming Gao
Shanghai Jiao Tong University, China
126
Reliability Evaluation of Sintered Silver and
Sn–3Ag–0.5Cu Solder Joints Using a Thermal
Cycling Test
Bin Li, Zhenqing Zhao, Mingyu Li, Tao Wang
and Hui Li
Delta Electronics (Shanghai) Co., Ltd., China
174Design of a Ku Band 7-Bit PIN Diode Phase
Shifter
Dan Yang, Wanfei Lan, Dan Zhong, Zhaojun Zhu
and Baofu Jia
University of Electronic Science and Technology
of China, China
271The Reliability Study of a Kind of Solid State
Power Controller (SSPC)
Xiaofeng Sun, Jun Zhang and Baolin Zhang
Beijing Spacecrafts Company, China
272
Method of fault analysis on typical hybrid
Integrated circuit based on nondestructive testing
technology
Tao Chen, Jingming Fei and Xiaofeng Sun
Beijing Spacecraft Company, China
274Overview of the Assembly and Packaging of
Wide Band Gap Semiconductor Technologies
Wenzhong Zhao
Beijing Microelectronic Technology Institute
(BMTI), China
334The process and reliability research of glass tube
sealed diode
Dai Chenyi, Wu Peng and Mu Ruiqiang
MXTronics, China
Area 12(Session I)
009Removal of High Dose Ion-Implanted
Photoresists Using Dry Process
Shuaipeng Wang, Jianqiang Li, Yanning Chen,
Dongyan Zhao, Yubo Wang and Haifeng Zhang
Beijing Smart-Chip Microelectronics
Technology Co., Ltd., China
022
Mechanical properties analysis of polyimide
insulating layer for the multilayer circuit boards
based on 3D printing technology
Lei Xiao, De-Jian Zhou and Lv Lin Qiao
Guilin University of Electronic Technology,
China
037
Fabrication of the Micromachined
Poly-dimethylsiloxane Pyramidal Tips Arrays for
Biotechnology Packaging Applications
Yong Guan, Shenglin Ma, Qinghua Zeng, Wei
Meng, Jing Chen and Yufeng Jin
Peking University, China
56
110 Research on Sub-system of Anti-lightning
Discrete Digital Interface Based on SiP
Sun Hanzi, Zhuang Yonghe and Zhang Qi
CETC43, China
121
The Influence of the DC Current on Directional
Crystallization Process of Peritectic Alloys
Simulation
Guotian Wang, Hongsheng Ding and Hongzhe
Sun
Harbin Institute of Technology, China
160 Chip-scale Scalar Atomic Magnetometer
Operating in Geomagnetic Environment
Pan Zhihua, Shang Jintang, Lu Lin and Ji Yu
Key Laboratory of MEMS of Ministry of
Education, Southeast University, Nanjing,
210018, China, China
221 The effect of Sb content in InAs1-xSbx/GaSb
Type-II Superlattices
Dandan Yi, Ming Li, Liming Gao, Chaoying Xie
and Liancheng Zhao
School of Materials Science and Engineering
Shanghai Jiao Tong University, China
239 The electronic structure of new rare earth
half-metallic materials TmS
Qipeng Liu, Huaiyu Ye, Xianping Chen and
Guoqi Zhang
Chongqing University, China
286
Scalable Synthesis of Mono-dispersed Nickel
Nanoparticles and Their Application as Thermal
Conductive Fillers
Jiaxing Liu, Dang Wu, Peichao Zou, Yingying
Luo, Min Wang, Ronghe Wang and Cheng Yang
Graduate School at Shenzhen, Tsinghua
University, China
287
Scalable Synthesis of Monodispersed Branched
Submicron Silver Particles as the Printed
Electrically Conductive Adhesives Fillers
Yubin Deng, Rui Yang, Dang Wu, Ronghe Wang
and Cheng Yang
Graduate School at Shenzhen, Tsinghua
University, China
289 Silver Pastes with Excellent Thermal
Conductivity
Yingying Luo, Dang Wu, Rui Yang, Jiaman Liu,
Songyang Su, Xiaoya Cui, Ronghe Wang and
Cheng Yang
Graduate School at Shenzhen, Tsinghua
University, China
305 Numerical analysis of thickness uniformity of
thin film deposited by rectangular planar target
Guo Zhu, Jiangping Sun, Xiongxiong Guo, Xixi
Zou, Libin Zhang and Zhiyin Gan
School of Mechanical Science & Engineering,
Huazhong University of Science & Technology,
China
317
Modelling for electric devices: A Hydrogen
Sulfide Gas Sensor Based on Born Phosphide
Monolayer
Zhongkang Lin, Hao Shi, Ronggang Han, Liming
Wang, Yongfa Cheng, Chunjian Tan, Huaiyu Ye
and Xianping Chen
Chongqing University, China
318Modelling for electric devices: Adsorption of
polluted gases on g-ZnO monolayer
Lifen Tian, Hao Shi, Zhongkang Lin, Ruishen
Meng, Chunjian Tan, Huaiyu Ye and Xianping
Chen
Chongqing University, China
319Modulation of the Electric properties of SnSe
bi/mono-layer by Strain and Electrical Field
Ronggang Han, Zhe Zhang, Peng Zhang, Xiang
Sun, Chunjian Tan, Huaiyu Ye and Xianping
Chen
Key Laboratory of Optoelectronic Technology &
Systems, Education Ministry of China,
Chongqing University and College of
Optoelectronic Engineering, Chongqing
University, China
347
Delamination behavior of an end-linked
PDMS/copper interface: a molecular dynamics
study
Wenjia Wang, Kailin Pan, Tingting Li, Xufeng
Han, Weiwu Cao, Siming Gong, Wenhui Wang
and Kai Fan
Guilin University of Electronic Technology,
China
350
The effects of encapsulation on fatigue lifetime
of stretchable interconnects under uniaxial cyclic
tensile loading by finite element methods
Tingting Li, Kailin Pan, Wenjia Wang, Xufeng
Han and Weiwu Cao
Guilin University of Electronic Technology,
China
355
Processing and electrical properties of sodium
citrate capped silver nanoparticle based inks for
flexible electronics
Can Yin, Hong Jin, Zhou Zhou, Min-Bo Zhou and
Xin-Ping Zhang
South China University of Technology, China
57
369
Thermal analysis and optimization of yetterbium
doped double clad fiber laser based on a general
analytic method
Yi Lv, Huai Zheng and Sheng Liu
Wuhan University, China
370
Abnormal creep behavior of micro-scale
Cu/Sn-3.0Ag-0.5Cu/Cu joints with different joint
thicknesses under electro-thermo-mechanical
coupled loads
Wang-Yun Li, Min-Bo Zhou and Xin-Ping Zhang
South China University of Technology, China
371
Microstructures and shear properties of mixed
assembly BGA structure SnAgCu/SnBi(Ag)/Cu
joints in board-level packaging
Jia-Qiang Huang, Min-Bo Zhou, Xing-Fei Zhao
and Xin-Ping Zhang
South China University of Technology, China
372
A significant blocking effect of Ni plating layer
on the diffusion of Ze element of brass substrate
Yunsong Dong, Ying Ding, Guangdong Wu, Bo
Xiao and Yanhong Tian
Beijing Institute of Control Engineering, China
Harbin Insitutute of Technology, China
373
Reliablity and failure analysis of electronic
components induced by the reflection of laser
beam in the laser jet solder ball bonding process
Wu Yue, Min-Bo Zhou and Xin-Ping Zhang
Lanzhou Institute of Technology, China
South China University of Technology, China
374
Microstructure and Properties of In-situ High
entropy Alloy Matrix Composites for electronic
packaging shell
Mingxing Ren and Guotian Wang
Harbin Insitutute of Technology, China
375
Size and boundary effects on the growth and
morphology evolution of interfacial intermetallic
compound of Sn0.3Ag0.7Cu/Cu micro-bump
joints
Min-Bo Zhou, Xing-Fei Zhao, Wu Yue, Chang-Bo
Ke and Xin-Ping Zhang
South China University of Technology, China
376
Copper and graphene composite material
prepared by electrodeposition and its potential
application for 3D integration
Xin Wang, Qian Wang, Yang Hu, Lin Tan and
Jian Cai
Tsinghua University, China
378
Drop performance evaluation for application of
different unferfill processes
Zhichao Wu, Jian Cai, Yu Chen and Jinwei Li
Tsinghua University, China
58
CONFERENCE GUIDELINE
Welcome to ICEPT 2017. Please read this guideline carefully, we will be more than happy to serve you. 感谢各位嘉宾代表对本次大会的关注与支持，为了更好地为您提供服务，请您留意会务组温馨提示：
1 Please always wear your badge during the conference period.
会议期间参会者请佩戴代表证，并凭此参加各项活动
2 Meal time and location during the conference.
会议期间用餐时间和地点（代表凭票用餐 Coupon needed）
日期 (Date) 时间 (Time) 用餐地点 (Location)
8 月 16 日
（星期三） August 16 Wednesday
12:30-13:30 午餐: 贵宾楼一楼的阳光餐厅 Lunch: Sunlight Restaurant on the 1st floor of the VIP Building
18:00-20:00 晚餐: 贵宾楼一楼的阳光餐厅 Dinner: Sunlight Restaurant on the 1st floor of the VIP Building
8 月 17 日
（星期四） August 17 Thursday
06:30-08:00 早餐: 贵宾楼一楼的阳光餐厅 Breakfast: Sunlight Restaurant on the 1st floor of the VIP Building
12:00-13:30 午餐：贵宾楼一楼的阳光餐厅和餐饮楼一楼的宴会厅 Lunch: Sunlight Restaurant on 1st floor of VIP Building & Banquet Hall on 1st floor of Catering Building
18:30-20:30 晚宴：会议中心一楼的大报告厅 Dinner: Auditorium Hall on the 1st floor of the Conference Center
8 月 18 日
（星期五）August 18
Friday
06:30-08:00 早餐: 贵宾楼一楼的阳光餐厅 Breakfast: Sunlight Restaurant on the 1st floor of the VIP Building
12:10-13:30
午餐：贵宾楼一楼的阳光餐厅和餐饮楼一楼的宴会厅 Lunch: Sunlight Restaurant on 1st floor of VIP Building & Banquet Hall on 1st floor of Catering Building
17:30-20:30 晚餐: 贵宾楼一楼的阳光餐厅 Dinner: Sunlight Restaurant on the 1st floor of the VIP Building
8 月 19 日
（星期六）
August 19 Saturday
无（会议已结束） None (Conference Closed)
3 High-speed internet is available and free of charge in the room booked for the conference. Other services
like laundry, telephone, etc. are at your own expense, please contact the hotel directly.
会议期间由会务组安排住宿的代表房间上网免费。其它洗衣和电话等服务请跟总服务台联系，费用
自理
4 Please take care of your valuables including cell phones, laptops and wallets.
请妥善保管好自己随身携带手机、电脑、钱包等贵重物品
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5 Location of Tea Break, Exhibition, and Posters: Lobby near to Conference halls on the 1st floor and 2ndfloor.
茶歇、展览、张贴地点：1 楼和 2 楼会议厅一侧的大厅
6 For more details, please read the conference programs. Please switch your phone to 'silent'mode during
conference time and help keep the auditorium in good order.
会议期间的具体安排请查阅会议日程安排，在会场参会的代表，请将手机调成震动状态，请不要大
声喧哗，随意走动，请您配合保持良好的会场秩序
7 The conference ends at 12:00 on the 19th of August. Please check-out before 12:00, otherwise, the hotel will
charge for another half-day after 14:00. If you need to stay longer, please ask for help through the
conference registration desk in advance to keep your room at the same charge rate. Please mind your
departure time to avoid any delay on your trip.
退房时间：8 月 19 日 12:00 前，如 14:00 前没退房，酒店将加收入住代表半天房费；需继续住宿的
参会代表请提前向组委会说明，会务组负责和宾馆协调保留房号，但费用自理（按会议价算）；请
参会代表注意自己的返程时间，以免晚点！
8 Please contact the ticket center in the hotel for booking your return ticket in advance.
需要预订返程票的代表请直接跟您所住酒店的票务中心联系，提前预定
9 Sun Island Garden Hotel, Tel: +86-451-51976699
太阳岛花园酒店联系电话：0451-51976699
10 Contact phone number of the hotel manager, Yanwei Zang (Cell phone: +86-15045114523).
酒店会议现场负责人：臧言玮：15045114523
ORGANIZING COMMITTEE
Wei Liu (Cell phone: +86-18646307920)
TECHNICAL COMMITTEE
Chenxi Wang (Cell phone: +86-15776807212) Rong An (Cell phone: +86-15145119819)
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TRANSPORTATION
Heilongjiang Sun Island Garden Hotel, Harbin, China 中国黑龙江太阳岛花园酒店
Address: No.869, Binghua Road, Harbin, Heilongjiang, China
地址：中国黑龙江省哈尔滨市冰花路 869 号
Transportation Guidance
From Airport (40 km from Harbin Taiping International Airport to Sun Island Garden Hotel)
By Taxi: 50 mins with price at around RMB 130.
From Harbin West Railway Station (12 km from Harbin West Railway Station to Sun Island Garden
Hotel)
By Taxi: 30 mins with price at around RMB 30.
From Harbin Railway Station (9 km from Harbin Railway Station to Sun Island Garden Hotel)
By Taxi: 30 mins with price at around RMB 25.
交通指引
飞机
距哈尔滨太平国际机场 50 分钟车程，出租车费用预计 130 元（包含过路费）；也可乘坐机场大巴火车站
线至火车站转公交线路 551 路至太阳岛道口站下车左行 1000 米即到。
火车
距哈尔滨西站 30 分钟车程，出租车费用预计 30 元；也可乘坐地铁 3 号线至医大二院站转地铁 1 号线至
西大桥站下（2b 口出），转公交线路 119 路（市骨伤科医院站上车）至太阳岛道口站下车左行 1000 米
即到；
距哈尔滨火车站 30 分钟车程，出租车费用预计 25 元；也可乘坐公交线路 127 路、551 路至太阳岛道口
站下车左行 1000 米即到。
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LAYOUT OF CONFERENCE VENUE
Layout of the Conference Center
North lobby
Auditorium Hall
会议中心一层平面图
Layout of 1st floor of Conference Center
Conference Hall 3
Conference Hall 1
To VIP Building (South lobby, Sunlight Restaurant)
To North Gate
卫生间
Restroom
卫生间
RestroomRoom A:
Room B:
Room F:Conference
Hall 15
Room G:Conference
Hall 16
卫生间
Restroom
会议中心二层平面图
Layout of 2nd floor of Conference Center
South Gate Direction
Room D:Conference Hall 10
卫生间
Restroom
Room E:Conference
Hall 14
Room C:Conference
Hall 9
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Map of Sun Island Garden Hotel
