ic data sheet

8/19/2019 IC data sheet

1/14

Package InformationIncluding

Surface Mount

FAST AND LS TTL

7


2/147-2

FAST AND LS TTL DATA

BIPOLAR LOGIC SURFACE MOUNT

WHY SURFACE MOUNT?

Surface Mount Technology is now being utilized to offer answers to many problems that have been created in the use of insertion technology.

Limitations have been reached with insertion packages and PC board technology. Surface Mount Technology offers the opportunity to continue to advance the State-of-the-Art designs that cannot be accomplished with Insertion Technology.

Surface Mount Packages allow more optimum device performance with the smaller Surface Mount configuration.Internal lead lengths, parasitic capacitance and inductance that placed limitations on chip performance have been reduced.

The lower profile of Surface Mount Packages allows more boards to be utilized in a given amount of space. They are stacked closer together and utilize less total volume than insertion populated PC boards.

Printed circuit costs are lowered with the reduction of the number of board layers required. The elimination or reduction of the number of plated through holes in the board, contribute significantly to lower PC board prices.

Surface Mount assembly does not require the preparation of components that are common on insertion technology lines.

Surface Mount components are sent directly to the assembly line, eliminating an intermediate step.

Automatic placement equipment is available that can place Surface Mount components at the rate of a few thousand per hour to hundreds of thousands of components per hour.

Surface Mount Technology is cost effective, allowing the manufacturer the opportunity to produce smaller units and/or offer increased functions with the same size product.

SURFACE MOUNT AVAILABILITY

Bipolar Logic is currently offering LS-TTL and FAST-TTL inproduction quantities in SOIC packages.

Refer to the following Selector Guide (SG366/D) which indi-cate availability and package type for these families.

These families may be ordered in rails or on Tape and Reel.Refer to Tape and Reel information for ordering details.

THERMAL DATA

The power dissipation of surface mount packages is depen-dent on many factors that must be taken into consideration inthe initial board design. The board material, the board surfacemetal thickness, pad area and the proximity to other heatgenerating components all have a bearing on the devicedissipation capability.

200

180

160

140

120

100

MIN DIE SIZE2K MILS2

MAX DIE SIZE8K MILS2

SEE FIG. 2 FORHEAT SINK DETAIL

SO-8 LEADFRAME SO-14 SO-16(.090″ x .110″ ) METAL = COPPER (.090″ x .170″ ) (.090″ x .170″ )

NARROWPACKAGE STYLE

DATA TAKEN USING PHILIPS SO TEST BOARD # 7322-078, 80873

° C/Wθ JA

Figure 2-1. Thermal Resistance, Junction-To-Ambient ( ° C/W)

Measurement specimens are solder mounted on printedcircuit card 19 mm × 28 mm × 1.5 mm in still air. No auxiliarythermal condition aids are used.

This data was collected using thermal test die in 20-pin PLCCpackages on PLCC test boards (2.24 ″ x 2.24 ″ x .062 ″ glassepoxy, type FR-4, with solder coated 1 oz./sq. ft. copper).


3/147-3


TAPE AND REEL

STANDARD BIPOLAR LOGIC INTEGRATED CIRCUITSMotorola has now added the convenience of Tape and Reel

packaging for our growing family of standard Integrated Circuitproducts. The packaging fully conforms to the latest EIA

RS-481A specification. The antistatic embossed tapeprovides a secure cavity sealed with a peel-back cover tape.

MECHANICAL POLARIZATION

SOIC DEVICESTypical

Linear direction of travel

View is from tape side

GENERAL INFORMATION

— Reel Size 13 inch (330 mm) Suffix R2 — Tape Width 12 mm to 24 mm (see table) — Units/Reel (see table) — No Partial Reel Counts Available and Minimum Lot Size is Per Table

ORDERING INFORMATIONTo order devices which are to be delivered in Tape and Reel, add the suffix R2 to the device number being ordered.

TABLE 2.1 Tape and Reel Data

Device TypeTape Width

(mm) Device/ReelReel Size

(inch)Min Lot Size Per Part No.

Tape and Reel

SO-8 12 2,500 13 5,000SO-14 16 2,500 13 5,000SO-16 16 2,500 13 5,000SO-16 Wide 16 1,000 13 5,000SO-20 Wide 24 1,000 13 5,000


4/147-4


PACKAGE OUTLINESSOIC

MIN MINMAX MAXMILLIMETERS INCHES

DIMABCDFGJKMPR

8.553.801.350.350.40

0.190.10

0°5.800.25

8.754.001.750.491.25

0.250.25

7°6.200.50

0.3370.1500.0540.0140.016

0.0080.004

0°0.2290.010

0.3440.1570.0680.0190.049

0.0090.009

7°0.2440.019

1.27 BSC 0.050 BSC

NOTES:1. DIMENSIONS “A” AND “B” ARE DATUMS AND

“T” IS A DATUM SURFACE.2. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.3. CONTROLLING DIMENSION: MILLIMETER.4. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

5. MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.6. 751A-01 IS OBSOLETE, NEW STANDARD

751A-02.

-A-

-B- P

G C

KSEATINGPLANE

14 PLD M F J

7 PL

R X 45 °

17

814

Case 751A-02 D Suffix14-Pin Plastic

SO-14


DIMABCDFGJKMPR

9.803.801.350.350.40

0.190.10

0°5.800.25

10.004.001.750.491.25

0.250.25

7°6.200.50

0.3860.1500.0540.0140.016

0.0080.004

0°0.2290.010

0.3930.1570.0680.0190.049

0.0090.009

7°0.2440.019

1.27 BSC 0.050 BSC

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI


PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.5. 751B-01 IS OBSOLETE, NEW STANDARD

751B-03.

1 8

916

-A-

-B- P

16 PLD

-T-

K

CG

M

R X 45 °

FJ

8 PL

SEATINGPLANE

Case 751B-03 D Suffix16-Pin Plastic

SO-16



PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.5. 751D-01, AND -02 OBSOLETE, NEW STANDARD

751D-03.

MIN MINMAX MAXMILLIMETERS INCHESDIMABCDFGJKMPR

12.657.402.350.350.50

0.250.100°

10.050.25

12.957.602.650.490.90

0.320.25

7°10.550.75

0.4990.2920.0930.0140.020

0.0100.004

0°0.3950.010

0.5100.2990.1040.0190.035

0.0120.009

7°0.4150.029

1.27 BSC 0.050 BSC

-A-

-B- P10 PL1 10

1120

G

-T-

D 20 PL K

C SEATINGPLANE

R X 45 °

M F J

Case 751D-03 DW Suffix20-Pin PlasticSO-20 (WIDE)

B0.25 (0.010) M M

B0.25 (0.010) M M

B0.25 (0.010) M M

T0.25 (0.010) B AM S S

T0.25 (0.010) B AM S S

T0.25 (0.010) B AM S S


5/147-5


PACKAGE OUTLINESSOIC (continued)

Case 751E-03 DW Suffix24-Pin PlasticSO-24 (WIDE)


DIMABCDFGJKMPR

15.257.402.350.350.41

0.2290.127

0°10.050.25

15.547.602.650.490.90

0.3170.292

8°10.550.75

0.6010.2920.0930.0140.016

0.00900.0050

0°0.3950.010

0.6120.2990.1040.0190.035

0.01250.0115

8°0.4150.029

1.27 BSC 0.050 BSC



PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. 751E-01 AND -02 OBSOLETE, NEW STANDARD751E-03.

-A-

-B- P1 12

24 13

G

-T-

D 24 PL

C

K

SEATINGPLANE

M F J

R X 45 °

12 PL

0.25 (0.010) B

0.25 (0.010) T B AM

M M

S S


6/147-6


PACKAGE OUTLINESCERAMIC DUAL IN-LINE

Case 632-08 J Suffix14-Pin Ceramic Dual In-Line




DIMABCDFGJKLMN

19.056.233.940.391.40

0.213.18

0°0.51

19.947.115.080.501.65

0.384.31

15°1.01

0.7500.2450.1550.0150.055

0.0080.125

0°0.020

0.7850.2800.2000.0200.065

0.0150.170

15°0.040

2.54 BSC

7.62 BSC

0.100 BSC

0.300 BSC


Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIM F MAY NARROW TO 0.76 (0.030) WHERETHE LEAD ENTERS THE CERAMIC BODY.5. 632-01 THRU -07 OBSOLETE, NEW STANDARD

632-08.

14 8

1 7

-A-

-B-

-T-SEATING

PLANE

F G

D 14 PLN

K

C L

J 14 PLM


DIM19.056.10 —0.39

1.40

0.23 —

0°0.39

19.557.364.190.53

1.77

0.275.08

15°0.88

0.7500.240

—0.015

0.055

0.009 —

0°0.015

0.7700.2900.1650.021

0.070

0.0110.200

15°0.035

1.27 BSC

2.54 BSC

7.62 BSC

0.050 BSC

0.100 BSC

0.300 BSC

ABCDEFGJKLMN



FORMED PARALLEL.4. DIM F MAY NARROW TO 0.76 (0.030) WHERE

THE LEAD ENTERS THE CERAMIC BODY.5. 620-01 THRU -08 OBSOLETE, NEW STANDARD

620-09.

-B-

-A-

16 PL

-T-

C

D

EF G J

K

MN

SEATINGPLANE

16 PL

L

16 9

1 8

NOTES:1. LEADS WITHIN 0.25 mm (0.010) DIA., TRUE

POSITION AT SEATING PLANE, AT MAXIMUMMATERIAL CONDITION.

2. DIM L TO CENTER OF LEADS WHEN FORMEDPARALLEL.

3. DIM A AND B INCLUDES MENISCUS.


DIM23.886.603.810.381.40

0.510.203.18

25.157.495.080.561.65

1.270.304.06

0°0.25

0.9400.2600.1500.0150.055

0.0200.0080.125

0.9900.2950.2000.0220.065

0.0500.0120.160

15°1.02

2.54 BSC

7.62 BSC

0.100 BSC

0.300 BSC

ABCDFGHJKLMN

0°0.010

15°0.040

B

C

D GH

J

M

N

AL

20 11

1 10

SEATINGPLANE K

F

0.25 (0.010) T AM S 0.25 (0.010) T BM S

0.25 (0.010) T AM S0.25 (0.010) T BM S


7/147-7


PACKAGE OUTLINESCERAMIC DUAL IN-LINE (continued)



(WIDE BODY)



DIMABCDFGJKLNP

31.507.243.680.381.14

0.202.547.620.519.14

32.647.754.440.531.57

0.334.197.871.27

10.16

1.2400.2850.1450.0150.045

0.0080.1000.3000.0200.360

1.2850.3050.1750.0210.062

0.0130.1650.3100.0500.400

2.54 BSC 0.100 BSC

NOTES:1. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.2. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5, 1973.

24 13

1 12

C

D 20 PL

F

G

JKN

INSIDE OF LEADS

L

P

B

-T-SEATINGPLANE

-A-


DIM

ABCDEFGJKLMN

60.3614.643.050.381

0.762

0.2042.54

0°1.016

2.3760.5760.1200.015

0.030

0.0080.100

0°0.040

2.4240.6040.1700.021

0.055

0.0130.165

10°0.060

1.27 BSC

2.54 BSC

15.24 BSC

0.050 BSC

0.100 BSC

0.600 BSC

NOTES:1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIM L TO CENTER OF LEAD WHEN FORMED

PARALLEL.

61.5615.344.310.533

1.397

0.3304.19

10°1.524

-B-

-A-

-T-SEATING

PLANE

48 25

1 24

F

CK

D 48 PL

N

E

J

M

L

G


DIM31.2412.704.060.411.27

0.20

3.18

32.7715.495.590.511.52

0.30

4.06

0°0.51

1.2300.5000.1600.0160.050

0.008

0.125

1.2900.6100.2200.0200.060

0.012

0.160

15°1.27

2.54 BSC

15.24 BSC

0.100 BSC

0.600 BSC0°

0.02015°

0.050

ABCDFGJ

KLMN

NOTES:1. DIM “L” TO CENTER OF LEADS WHEN

FORMED PARALLEL.2. LEADS WITHIN 0.13 mm (0.005) RADIUS OF

TRUE POSITION AT SEATING PLANE ATMAXIMUM MATERIAL CONDITION. (WHENFORMED PARALLEL).

SEATING PLANE

24 13

1 12

A

L

D

F

G JK MN

B

C

T A0.25 (0.010) M M

T A0.25 (0.010) M M T B0.25 (0.010) M M


8/147-8


PACKAGE OUTLINESPLASTIC

Case 646-06 N Suffix14-Pin Plastic




DIM18.166.103.690.381.02

1.320.202.92

19.566.604.690.531.78

2.410.383.43

0°0.39

0.7150.2400.1450.0150.040

0.0520.0080.115

0.7700.2600.1850.0210.070

0.0950.0150.135

10°1.01

2.54 BSC

7.62 BSC

0.100 BSC

0.300 BSC0°

0.01510°

0.039

ABCDFGHJKLMN

NOTES:1. LEADS WITHIN 0.13 mm (0.005) RADIUS OF TRUE

POSITION AT SEATING PLANE AT MAXIMUMMATERIAL CONDITION.

2. DIMENSION “L” TO CENTER OF LEADS WHENFORMED PARALLEL.

3. DIMENSION “B” DOES NOT INCLUDE MOLDFLASH.4. ROUNDED CORNERS OPTIONAL.5. 646-05 OBSOLETE, NEW STANDARD 646-06.

1 7

14 8

B

A NOTE 4

F

HG

DSEATINGPLANE

N

K

C

L

J

M


DIMABCDFGHJKLMS

18.806.353.690.391.02

0.212.807.50

0°0.51

19.556.854.440.531.77

0.383.307.7410°

1.01

0.7400.2500.1450.0150.040

0.0080.1100.295

0°0.020

0.7700.2700.1750.0210.070

0.0150.1300.305

10°0.040


Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION “L” TO CENTER OF LEADS WHEN

FORMED PARALLEL.4. DIMENSION “B” DOES NOT INCLUDE MOLD

FLASH.5. ROUNDED CORNERS OPTIONAL.6. 648-01 THRU -07 OBSOLETE, NEW STANDARD

648-08.

2.54 BSC1.27 BSC

0.100 BSC0.050 BSC

-A-

B1 8

916

F

H GD 16 PL

SC

-T- SEATINGPLANE

KJ

M

L

MIN MINMAX MAX

MILLIMETERS INCHES

DIM25.666.103.810.39

1.27

0.212.80

27.176.604.570.55

1.77

0.383.55

0°0.51

1.0100.2400.1500.015

0.050

0.0080.110

1.0700.2600.1800.022

0.070

0.0150.140

15°1.01

1.27 BSC

2.54 BSC

7.62 BSC

0.050 BSC

0.100 BSC

0.300 BSC

ABCDEFGJKLMN

0°0.020

15°0.040


Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION “L” TO CENTER OF LEAD WHEN

FORMED PARALLEL.4. DIMENSION “B” DOES NOT INCLUDE MOLD

FLASH.5. 738-02 OBSOLETE, NEW STANDARD 738-03.

-A-

B

C

K

NEG F

D 20 PLJ 20 PL

L

M

-T-SEATINGPLANE

1 10

1120

T A0.25 (0.010) M M

T A0.25 (0.010) M MT B0.25 (0.010) M M


9/147-9


PACKAGE OUTLINESPLASTIC (continued)



Wide Body



DIMABCDEFGJKLMN

31.256.353.690.38

1.02

0.182.80

0°0.51

15°1.01

0°0.020

15°0.040

32.136.854.440.51

1.52

0.303.55

1.2300.2500.1450.015

0.040

0.0070.110

1.2650.2700.1750.020

0.060

0.0120.140

1.27 BSC

2.54 BSC

7.62 BSC

0.050 BSC

0.100 BSC

0.300 BSC

NOTES:1. CHAMFERRED CONTOUR OPTIONAL.2. DIM “L” TO CENTER OF LEADS WHEN FORMED

PARALLEL.3. DIMENSIONS AND TOLERANCES PER ANSI

Y14.5M, 1982.

4. CONTROLLING DIMENSION: INCH.1 12

1324

-A-

-B-

C

K

N

-T-SEATINGPLANE

G

E

F

D 24 PL

J 24 PLM

NOTE 1

L


DIMABCDFGHJKLMN

51.6913.723.940.361.02

1.650.202.92

0°0.51

52.4514.225.080.561.52

2.160.383.43

15°1.02

2.0350.5400.1550.0140.040

0.0650.0080.115

0°0.020

2.0650.5600.2000.0220.060

0.0850.0150.135

15°0.040

2.54 BSC

15.24 BSC

0.100 BSC

0.600 BSC

NOTES:1. POSITIONAL TOLERANCE OF LEADS (D), SHALL

BE WITHIN 0.25 mm (0.010) AT MAXIMUMMATERIAL CONDITION, IN RELATION TO SEATINGPLANE AND EACH OTHER.

2. DIMENSION L TO CENTER OF LEADS WHENFORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

1 20

40 21

B

AC

N

K

SEATINGPLANE

M

J

L

H G F D

T A0.25 (0.010) M M

T B0.25 (0.010) M M

MSEATINGPLANE

G J

L

B

AP

HF

K

C

D

N

Q

NOTES:1. LEADS WITHIN 0.13 mm (0.005) RADIUS OF TRUE

POSITION AT SEATING PLANE AT MAXIMUMMATERIAL CONDITION.

2. DIMENSION “L” TO CENTER OF LEADS WHENFORMED PARALLEL.

3. 649-02 OBSOLETE, NEW STD 649-03 SEE ISSUE“C” FOR REFERENCE.


DIMABCDFGHJKLMNPQ

31.5013.214.700.381.02

1.650.202.92

14.99 —0.510.130.51

32.1313.725.210.511.52

2.160.303.43

15.4910°

1.020.380.76

1.2400.5200.1850.0150.040

0.0650.0080.1150.590

—0.0200.0050.020

1.2650.5400.2050.0200.060

0.0850.0120.1350.610

10°0.0400.0150.030

2.54 BSC 0.100 BSC

1 12

1324


10/147-10


PACKAGE OUTLINESPLASTIC (continued)



DIM61.3413.723.940.361.02

0.202.92

0°0.51

62.1014.225.080.551.52

0.383.81 0°

1.01

2.4150.5400.1550.0140.040

0.0080.115

0°0.020

2.4450.5600.2000.0220.060

0.0150.150

0°0.040

DETAIL X

DETAIL XTIP TAPER

GD

FPLANESEATING M

J

C

N

48 25

241

-B-

-A-

-T-

ABCDFGHJKLMN

15.24 BSC 0.600 BSC

1.79 BSC 0.070 BSC2.54 BSC 0.100 BSC

NOTES:1. DIMENSIONS AND TOLERANCING PER ANSI


FORMED PARALLEL.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLDFLASH. MAXIMUM MOLD FLASH 0.25 (0.010).5. 767-01 OBSOLETE. NEW STANDARD 767-02.

48 PL

48 PL

L

0.25 (0.010) T BM S0.51 (0.020) T AM S


11/147-11


PACKAGE OUTLINESPLCC

S

Case 775-02 FN Suffix20-Pin Plastic

ABCEFGHJKRUVWXYZ

G1K1Z1


DIM9.789.784.202.290.33

0.660.510.648.898.891.071.071.07 —2°

7.881.02

2°

10.0310.034.572.790.48

0.81 — —9.049.041.211.211.420.5010°8.38 —10°

0.3850.3850.1650.0900.013

0.0260.0200.0250.3500.3500.0420.0420.042

—2°

0.3100.040

2°

0.3950.3950.1800.1100.019

0.032 — —

0.3560.3560.0480.0480.0560.020

10°0.330

—10°

1.27 BSC 0.050 BSC

NOTES:1. DATUMS -L-, -M-, -N-, AND -P- DETERMINED

WHERE TOP OF LEAD SHOULDER EXIT PLASTICBODY AT MOLD PARTING LINE.

2. DIM GI, TRUE POSITION TO BE MEASURED ATDATUM -T-, SEATING PLANE.

3. DIM R AND U DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE MOLD PROTRUSIONIS 0.25 (0.010) PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.6. 775-01 IS OBSOLETE, NEW STANDARD 775-02.

-N- Y BRK

-M--L-

W

V-P-

D

D20 1

A

RZ

C

G

G1

E

J

DETAIL S

B

U

Z1

G1X

H

F

DETAIL S

K

K1

0.10 (0.004)SEATINGPLANE

-T-

VIEW D-D

0.18 (0.007) T N –PM S S L –MS S

0.18 (0.007) T N –PM S S L –MS S

0.25 (0.010) T N –PM S S L –MS S

0.18 (0.007) T L –MM S S N –PS S

0.18 (0.007) T N –PM S S L –MS S

0.18 (0.007) T L –MM S S N –PS S

0.18 (0.007) T N –PM S S L –MS S

0.25 (0.010) T L –MS S N –PS S

0.18 (0.007) T L –MM S S N –PS S

0.18 (0.007) T L –MM S S N –PS S


12/147-12


PACKAGE OUTLINESPLCC (continued)

S


G1

ABCEFGHJKRUVW

XYZ

G1K1Z1


DIM12.3212.324.202.290.33

0.660.510.64

11.4311.431.071.07

1.07 —2°

10.421.02

2°

12.5712.574.572.790.48

0.81 — —

11.5811.581.211.21

1.420.5010°

10.92 —10°

0.4850.4850.1650.0900.013

0.0260.0200.0250.4500.4500.0420.042

0.042 —2°

0.4100.040

2°

0.4950.4950.1800.1100.019

0.032 — —

0.4560.4560.0480.048

0.0560.02010°

0.430 —10°

1.27 BSC 0.050 BSCNOTES:

1. DUE TO SPACE LIMITATION, CASE 776-02 SHALLBE REPRESENTED BY A GENERAL (SMALLER)CASE OUTLINE DRAWING RATHER THANSHOWING ALL 28 LEADS.

2. DATUMS -L-, -M-, -N-, AND -P- DETERMINEDWHERE TOP OF LEAD SHOULDER EXIT PLASTICBODY AT MOLD PARTING LINE.

3. DIM G1, TRUE POSITION TO BE MEASURED ATDATUM -T-, SEATING PLANE.

4. DIM R AND U DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE MOLD PROTRUSIONIS 0.25 (0.010) PER SIDE.

5. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.

6. CONTROLLING DIMENSION: INCH.7. 776-01 IS OBSOLETE, NEW STANDARD 776-02.

-N- Y BRK

D

D

W

-M--L-

-P-

28 1

V

28LEADS

ACTUAL

DETAIL S

B

U

Z1

G1X

VIEW D-D

H

K1

K

F

DETAIL S

G

C

Z

A

R

E


-T-J

0.18 (0.007) T N –PM S S L –MS S

0.18 (0.007) T N –PM S S L –MS S

0.25 (0.010) T N –PM S S L –MS S

0.18 (0.007) T L –MM S S N –PS S

0.18 (0.007) T N –PM S S L –MS S

0.18 (0.007) T L –MM S S N –PS S

0.18 (0.007) T N –PM S S L –MS S

0.18 (0.007) T L –MM S S N –PS S

0.18 (0.007) T L –MM S S N –PS S

0.25 (0.010) T L –MS S N –PS S


13/147-13


PACKAGE OUTLINESPLCC (continued)


ABCEFGHJKRUVWXYZ

G1K1Z1


DIM25.0225.024.202.290.33

0.660.510.64

24.1324.131.071.071.07 —2°

23.121.02

2°

25.2725.274.572.790.48

0.81 — —

24.2824.281.211.211.420.5010°

23.62 —10°

0.9850.9850.1650.0900.013

0.0260.0200.0250.9500.9500.0420.0420.042

—2°

0.9100.040

2°

0.9950.9950.1800.1100.019

0.032 — —

0.9560.9560.0480.0480.0560.020

10°0.930

—10°

1.27 BSC 0.050 BSC

NOTES:1. DUE TO SPACE LIMITATION, CASE

779-02 SHALL BE REPRESENTED BY AGENERAL (SMALLER) CASE OUTLINEDRAWING RATHER THAN SHOWINGALL 68 LEADS.

2. DATUMS -L-, -M-, -N-, AND -P-DETERMINED WHERE TOP OF LEADSHOULDER EXIT PLASTIC BODY ATMOLD PARTING LINE.

3. DIM G1, TRUE POSITION TO BEMEASURED AT DATUM -T-, SEATINGPLANE.

4. DIM R AND U DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE MOLDPROTRUSION IS 0.25 (0.010) PER SIDE.

5. DIMENSIONING AND TOLERANCINGPER ANSI Y14.5M, 1982.

6. CONTROLLING DIMENSION: INCH.7. 779-01 IS OBSOLETE, NEW STANDARD

779-02.

68LEADS

ACTUAL

-N-

-L-

-P-V

D

D

W

-M-

168

A

R

E

JG

G1

C

Z

B

U

Z1

G1X

H

F

K

K1

DETAIL SDETAIL S

VIEW D-D


-T-

Y BRK 0.18 (0.007) T N –PM S S L –MS S

0.18 (0.007) T N –PM S S L –MS S

0.25 (0.010) T N –PM S S L –MS S

0.18 (0.007) T L –MM S S N –PS S

0.18 (0.007) T N –PM S S L –MS S

0.18 (0.007) T L –MM S S N –PS S

0.18 (0.007) T N –PM S S L –MS S

S

0.18 (0.007) T L –MM S S N –PS S

0.18 (0.007) T L –MM S S N –PS S

0.25 (0.010) T L –MS S N –PS S


14/14


ic data sheet

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