ECEN 1400 Introduction to Analog and Digital Electronics

Robert R. McLeod, University of Colorado

•  Materials: doping and metals •  Growing silicon crystals •  Optical lithography •  Moore’s Law

197

Lecture 25 Fabrication of silicon chips

• Lecture 25: Silicon chip fab

http://www-03.ibm.com/press/us/en/pressrelease/39641.wss

ECEN 1400 Introduction to Analog and Digital Electronics

Robert R. McLeod, University of Colorado 198

Doping and wiring

http://tymkrs.tumblr.com/post/3525431464/thirteenth-ham-lesson-o-de-day

http://pcplus.techradar.com/files/pcp_images/sand_to_silicon_step_8.jpg`

• Lecture 25: Silicon chip fab

ECEN 1400 Introduction to Analog and Digital Electronics

Robert R. McLeod, University of Colorado 199

Silicon boules and wafers

http://www.quora.com/Semiconductors/How-do-silicon-boules-not-break-off-during-semiconductor-fabrication

http://www.peekreview.net/the-many-processes-of-silicon-wafer-processing/

http://www.ami.ac.uk/courses/ami4202_mdesign/u02/

http://www.ami.ac.uk/courses/ami4202_mdesign/u02/

• Lecture 25: Silicon chip fab

ECEN 1400 Introduction to Analog and Digital Electronics

Robert R. McLeod, University of Colorado 200

Optical pattern transfer

http://www.hitequest.com/Kiss/VLSI.htm

http://britneyspears.ac/physics/fabrication/photolithography.htm

• Lecture 25: Silicon chip fab

ECEN 1400 Introduction to Analog and Digital Electronics

Robert R. McLeod, University of Colorado 201

Optical Lithography

ArF laser

Illumination Shaping

Mask

Projection Camera

Si Wafer Water

l=193 nm

Resist

193 nm light illuminates a mask The mask puts a pattern on the light The light is reduced 4X in size on the resist The resist hardens where illuminated A solvent washes away the soft resist An acid could then etch the Si Or a metal could be deposted on the Si

Slide adapted from Tom Milster, “Application of ODS Technology to Lithography” ODS 2008.

http://www.opticalres.com/cv/gallery.swf

http://www.nature.com/nphoton/journal/v1/n11/covers/tech_focus_index.html

• Lecture 25: Silicon chip fab

ECEN 1400 Introduction to Analog and Digital Electronics

Robert R. McLeod, University of Colorado 202

From wafer to package

http://www.sunnyray.org/Solar-pv-jargon.htm

aspentechnologies.com

http://www.chemistryexplained.com/Ru-Sp/Semiconductors.html

Structured wafer

Wafer dicing

Wire bond

Bonded and encapsualted chip

http://forsoft.pl/grommet/transponder-wirebond.html http://www.wireandtubenews.com/2012/07/09/bonding-wire-is-scalability-the-wave-of-the-future/

Wire bonder

• Lecture 25: Silicon chip fab

ECEN 1400 Introduction to Analog and Digital Electronics

Robert R. McLeod, University of Colorado 203

Moore’s Law

http://asia.stanford.edu/events/spring06/ee402s/slides/041306-Kamins.pdf

• Lecture 25: Silicon chip fab

http://en.wikipedia.org/wiki/Moore%27s_law

ECEN 1400 Introduction to Analog and Digital Electronics

Robert R. McLeod, University of Colorado 204

Moore’s “second law”

Illumination

Projection lens

Laser

Mask

Wafer

•  Resolution 40 nm •  Transfer rate ~100 THz •  Cost 41 M$

ASML TWINSCAN 1900Gi

http://asia.stanford.edu/events/spring06/ee402s/slides/041306-Kamins.pdf

• Lecture 25: Silicon chip fab