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HP MEMS SEISMIC SENSOR Don Milligan Sensor Design Engineer [email protected]

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Page 1: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

HP MEMS SEISMIC SENSOR

Don Milligan

Sensor Design Engineer

[email protected]

Page 2: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

2

Introduction

HP MEMS Inertial Sensing Technology has been optimized to produce a

breakthrough performance needed for Seismic Imaging requirements.

Outline:

• Sensor Design

• Specifications

• Noise Optimization

• Test Results

• QC Self Tests

• Conclusions

Page 3: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

– Three single crystal silicon wafers hermetically bonded under vacuum • Pressure controlled for low thermal mechanical noise

• CTE match of substrates results in temperature stability

– Surface Electrodes • Constant gap allows large proofmass travel in open loop

• Three phase electrode configuration allows full sensitivity and range at any orientation or wafer alignment

– Custom ASIC • Low noise demodulation of capacitive sensor

• Low power

• 24 bit digital output

Stator wafer

suspension bondelectrodes

MEMS wafer

Cap wafer

HP MEMS Seismic Sensor Key Features

Page 4: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

4

Sensor Node and Tether Head Assembly

Page 5: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

5

Voyager Seismic Sensor Specifications

Max acceleration amplitude Peak (Highest Gain Mode) +/- 80 mG

Peak (Lowest Gain Mode) +/- 320 mG

Noise spectral density Noise density < 13 nG/rt Hz

Dynamic range 120 dB

Harmonic distortion THD @ 12Hz, 68.4 mg pk acceleration (0.7 in/s pk velocity)

< -80 dB

Analog to digital conversion

Depth 24 bit (20 ENOB)

Sample Rate 2ms or 4ms

Passband 1-200Hz (2ms)

Cross axis sensitivity All axes <-40 dB

Tilt Detection Resolution of vertical component of sense axis due to sensor tilt

+/- 2%

Sensor Recovery Time High Gain Mode - 300mg acceleration <1.6 seconds

Auxiliary Channel External Input into ASIC ADC 2V Fully Differential Input

Sensor power < 56mW

Operating temperature Minimum -40C

Maximum +70C

Page 6: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

6

Noise Testing Results at USGS Vault

10-3

10-2

10-1

100

101

102

10-12

10-11

10-10

10-9

10-8

10-7

10-6

10-5

10-4

Frequency [Hz]

Unf

ilter

ed P

ower

Spe

ctra

l Den

sity

[G/r

tHz]

HP MEMS

Reference Seismometer

USGS Low NoiseModel of the Earth

USGS High NoiseModel of the Earth

HP MEMS Accelerometer with discreet electronics and USGS Reference Sensor

• GS-13 short period seismometer

– 10ng/rthz base band noise floor demonstrated (matching model prediction)

Page 7: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

7

Sensor Noise Optimization

m

TbkN B

tm

4

dxdC

NN e

p

2

0222

JptmT NNNNoise

Lower

Noise

Larger Mass

Larger Electrode Area

Reduced Damping

Lower Parasitic Capacitance

Where

dxdC

NN e

p

2

0

m

TbkN B

tm

4

Thermal Mechanical Noise Position Noise

Low ASIC Noise

Johnson Noise

TRkN bJ 4

TRkN bJ 4

Lower Resistance

Page 8: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

8

USGS Sensor Testing Results

Magnitude 6.7 earthquake recorded

•Epicenter – Gulf of California

•>1250 km away from test facility (ABQ)

HP MEMS sensor matched reference sensor

down to 25 mHz

0 200 400 600 800 1000 1200 1400 1600 1800-2

-1

0

1

2x 10

5

Time [s]

AD

C C

ount

s H

P M

EM

S

0 200 400 600 800 1000 1200 1400 1600 1800-2

-1

0

1

2

3x 10

5

Time [s]

AD

C C

ount

s G

S-1

3

10-2

10-1

100

101

102

10-12

10-11

10-10

10-9

10-8

10-7

10-6

10-5

10-4

Frequency [Hz]U

nfilt

ered

Pow

er S

pect

ral D

ensi

ty [G

/rtH

z]

HP MEMS

Reference Seismometer

USGS High NoiseModel of the Earth

USGS Low NoiseModel of the Earth

Page 9: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

9

Maximum Acceleration ranges from 80mg to 320mg Sensor Gain Modes

Lower gain results in higher accelerations

detected with lower power consumption

• (56mW @ 80mg Gain Mode)

• (43mW @ 320mg Gain Mode)

Lower gain trade-offs:

• Increased Noise Floor

• Higher THD @ full range

Gain mode is user selectable at any value

between max detectable accelerations of

80-320mg.

Page 10: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

10

-0.15 -0.1 -0.05 0 0.05 0.1 0.15-2

-1.5

-1

-0.5

0

0.5

1

1.5

2

Displacement [m]

Out

put [

V]

Linear Response

Nonlinear Response

-3 -2 -1 0 1 2 3

-10

-8

-6

-4

-2

0

2

4

6

8

10

Displacement [m]

Out

put [

V]

Linear Response

Nonlinear Response

VOYAGER SENSOR nonlinearity Two main sources of nonlinearity

• Sinusoidal output due to design of electrode configuration • Non-linear forces from electrode voltages.

Both non-linearities are known functions of displacement and can be compensated for in the sensor processor before final data output

• Digital compensation to account for the known non-linear output of the sensor will be

implemented to achieve distortion requirement of < -80 db

Page 11: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

11

Compensation Results Applied correction algorithm drastically reduces the error in the output

Simulation shows 30 dB reduction in THD

• THD at 68.4mG = <-90dB

0 5 10 15 20

-0.6

-0.4

-0.2

0

0.2

0.4

0.6

Time [ms]

Acc

eler

atio

n [G

]

Input

Uncorrected Output

Corrected Output

0 5 10 15 20

-0.6

-0.4

-0.2

0

0.2

0.4

0.6

Time [ms]

Acc

eler

atio

n [G

]

Input

Uncorrected Output

Corrected Output

0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4-120

-110

-100

-90

-80

-70

-60

-50

-40

-30

Max Amplitude [G]

THD

[dB

]

Uncompensated

Compensated

Page 12: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

12

Sensor Saturation Recovery Time

0 1 2 3 4 5 6 7 8 9-1

-0.5

0

0.5

1O

utp

ut

[V]

0 1 2 3 4 5 6 7 8 9-2

-1

0

1

2

Time [s]

Ou

tpu

t [V

]

16 bit

24 bit

0.0

0.5

1.0

1.5

2.0

2.5

0 0.1 0.2 0.3 0.4 0.5

Re

cov

ery

Tim

e (

Se

con

ds)

Acceleration (g)

Sensor Recovery Time vs Acceleration

320mg GainMode

80mg Gain Mode

Sensor ring-down after large acceleration input

Page 13: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

13

Micro Controller on Sensor Board used for sensor self test processing

Sensor QC Self Tests

• Sensor On-Line Calibration Sensor can calibrate scale factor during data acquisition

• Ring-down Test Frequency, Time Constant determined

• High Frequency Noise Test Noise floor of sensor measured above resonance (Ambient Noise attenuated)

• ASIC Self Test Filter response

Amplifier High Freq Noise Test

• Tilt Detection

• Temperature

• RMS Noise

Page 14: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

14

Conclusions The HP MEMS accelerometer has been optimized to meet the performance requirements for Seismic Imaging.

−Open-loop operation results in low power consumption (<56mW)

−MEMS mechanical frequency response flat to DC

−Cross Axis sensitivity demonstrated to be < -50db

• Noise floor < 13ng/rtHz

−On-Board Microcontroller enables on-line THD compensation, self tests and

calibration

Sensor not commercially available. HP and Shell are exploring options to bring sensor technology to market

Page 15: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

15

Acknowledgements

HP Corvallis:

Rod Alley, Jenny Wu, ZZ Zhang, Bob Bicknell, Dennis Lazaroff, Dave Cook,

George Corrigan, Jeremy Sells, Mike Delos-Rey, Brian Homeijer (currently

with Sandia National Labs), Chris Davis

HP Labs Palo Alto:

Bob Walmsley, Pete Hartwell (Currently with Apple), Lenny Kiyama

Bob Hutt at the USGS ASL

Page 16: HP MEMS SEISMIC SENSOR - iris.edu · 2 Introduction HP MEMS Inertial Sensing Technology has been optimized to produce a breakthrough performance needed for Seismic Imaging requirements

HP Confidential Shell Confidential

Thank You