high voltage organic non-volatilte thin film

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    Jinimol P GeorgeECE A

    Roll No.:53

    LOW-VOLTAGE ORGANICNONVOLATILE THIN-FILM

    TRANSISTOR MEMORY BASED ON A

    P(MMA-GMA)

    Al

    O COMPLEX LAYER

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    OBJECTIVESOVERVIEW

    INTRODUCTION

    FABRICATION

    ELECTRICAL CHARACTERISTICS

    OUTPUT CHARACTERISTICS

    TRANSFER CHARACTERISTICS

    DYNAMIC STORAGE CYCLES

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    COMPARISON

    ADVANTAGES APPLICATIONS

    CONCLUSION

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    OVERVIEW

    Fabrication

    Study of electrical characteristics of OTFTmemory.

    Comparison.

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    INTRODUCTION Non-volatile memory: Computer memory that

    can retain the stored information even when

    not powered. Thin-Film Transistor (TFT) : Field-effect

    transistor made by depositing thin films of asemiconductor active layer as well as the

    dielectric layer and metallic contacts over asupporting substrate.

    Organic TFT: TFTs have also been made usingorganic materials.

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    Two methods to fabricate OTFT memory device.

    1. Use ferroelectric materials or electret as the gate

    dielectric layer. The direction of the polarization ofthe gate dielectric layer modulates the channel

    conductance.

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    2. Use the floating-gate OTFT memory with the charge

    storage in the floating-gate modulating the channel

    conductance. Insert a complex layer between the semiconductor

    and the dielectric.

    Complex layer is: poly(methyl methacrylate co

    glycidyl methacrylate)-Al-O [P(MMAGMA)-Al-O].

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    FABRICATION Gate electrode: Al film(30nm) is formed on a

    cleaned glass substrates thermal evaporation.

    The insulator polymer P(MMA-GMA) was coatedon the Al gate electrode from a solution in butyl

    acetate and cross-linked for 30 min at 120 C.

    Then a thin Al layer was formed by vacuum

    thermal deposition on the surface of the P(MMA-GMA) film.

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    The heat treating at 120 C in the oven with

    clean atmosphere.

    A 30-nm-thick pentacene active layer was grownby thermal evaporation.

    MoO3 (10 nm) and Al (100 nm) were thermally

    deposited onto the active layer to form the

    source

    drain electrodes.

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    ELECTRICALCHARACTERISTICS

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    OUTPUT CHARACTERISTICS

    Holes accumulated under applied negative VGS.

    Ids(A)

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    TRANSFER CHARACTERISTICS

    Transfer characteristics of the present OTFT memory in

    linear region, by the (a) semiexponential scale and (b)linear scale.

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    Linear region , Vds= -1v.

    Vgs sweeping from off to on and returning to off atthe different sweeping rates.

    Cyclic Vgs - Hysteresis loop - anticlockwise

    direction.Direction of Ep change with Eg - Hysteresis loop

    Nonvolatile memory.

    Slower the Vgs sweeps, the larger hysteresis

    loop.

    Vgs sweep

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    DYNAMIC STORAGE CYCLEVGS = 15, 0, and 15 V forP, R, and E, respectively.

    The P/R/E dynamic cyclecurrents can remain repeatable

    without degradation after 100

    cycles.

    After being programmed, the R IDS,1-state cankeep higher than 1 A. After being erased, the R

    IDS,0-state was quickly increased at the initial

    seconds and then maintained at a 10^-9 A

    magnitude.

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    COMPARISON

    Parameters Floating gateOTFT

    OTFT memorybased P(MMA-GMA)

    Channel

    conductance

    The charges

    storage in thefloating-gate.

    Polarization of

    gate dielectriclayer.

    Operatingvoltage

    -50v to +50v -15v to +15v

    Channel width 2000 m 2000 m

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    Channel length 30m 30 m

    P/R/E voltage -50/0/+50v -15/0/+15

    Linear region Vds = -5v Vds = -1v

    Memory ratio 32 2010

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    ADVANTAGES Low operating voltage (-15 v to +15v)

    Large memory ratio (2010)

    Large memory window (13.3v) Long retention time (4000s)

    Inexpensive

    Simple fabrication

    Lightweight

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