high voltage organic non-volatilte thin film
TRANSCRIPT
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Jinimol P GeorgeECE A
Roll No.:53
LOW-VOLTAGE ORGANICNONVOLATILE THIN-FILM
TRANSISTOR MEMORY BASED ON A
P(MMA-GMA)
Al
O COMPLEX LAYER
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OBJECTIVESOVERVIEW
INTRODUCTION
FABRICATION
ELECTRICAL CHARACTERISTICS
OUTPUT CHARACTERISTICS
TRANSFER CHARACTERISTICS
DYNAMIC STORAGE CYCLES
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COMPARISON
ADVANTAGES APPLICATIONS
CONCLUSION
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OVERVIEW
Fabrication
Study of electrical characteristics of OTFTmemory.
Comparison.
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INTRODUCTION Non-volatile memory: Computer memory that
can retain the stored information even when
not powered. Thin-Film Transistor (TFT) : Field-effect
transistor made by depositing thin films of asemiconductor active layer as well as the
dielectric layer and metallic contacts over asupporting substrate.
Organic TFT: TFTs have also been made usingorganic materials.
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Two methods to fabricate OTFT memory device.
1. Use ferroelectric materials or electret as the gate
dielectric layer. The direction of the polarization ofthe gate dielectric layer modulates the channel
conductance.
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2. Use the floating-gate OTFT memory with the charge
storage in the floating-gate modulating the channel
conductance. Insert a complex layer between the semiconductor
and the dielectric.
Complex layer is: poly(methyl methacrylate co
glycidyl methacrylate)-Al-O [P(MMAGMA)-Al-O].
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FABRICATION Gate electrode: Al film(30nm) is formed on a
cleaned glass substrates thermal evaporation.
The insulator polymer P(MMA-GMA) was coatedon the Al gate electrode from a solution in butyl
acetate and cross-linked for 30 min at 120 C.
Then a thin Al layer was formed by vacuum
thermal deposition on the surface of the P(MMA-GMA) film.
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The heat treating at 120 C in the oven with
clean atmosphere.
A 30-nm-thick pentacene active layer was grownby thermal evaporation.
MoO3 (10 nm) and Al (100 nm) were thermally
deposited onto the active layer to form the
source
drain electrodes.
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ELECTRICALCHARACTERISTICS
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OUTPUT CHARACTERISTICS
Holes accumulated under applied negative VGS.
Ids(A)
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TRANSFER CHARACTERISTICS
Transfer characteristics of the present OTFT memory in
linear region, by the (a) semiexponential scale and (b)linear scale.
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Linear region , Vds= -1v.
Vgs sweeping from off to on and returning to off atthe different sweeping rates.
Cyclic Vgs - Hysteresis loop - anticlockwise
direction.Direction of Ep change with Eg - Hysteresis loop
Nonvolatile memory.
Slower the Vgs sweeps, the larger hysteresis
loop.
Vgs sweep
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DYNAMIC STORAGE CYCLEVGS = 15, 0, and 15 V forP, R, and E, respectively.
The P/R/E dynamic cyclecurrents can remain repeatable
without degradation after 100
cycles.
After being programmed, the R IDS,1-state cankeep higher than 1 A. After being erased, the R
IDS,0-state was quickly increased at the initial
seconds and then maintained at a 10^-9 A
magnitude.
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COMPARISON
Parameters Floating gateOTFT
OTFT memorybased P(MMA-GMA)
Channel
conductance
The charges
storage in thefloating-gate.
Polarization of
gate dielectriclayer.
Operatingvoltage
-50v to +50v -15v to +15v
Channel width 2000 m 2000 m
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Channel length 30m 30 m
P/R/E voltage -50/0/+50v -15/0/+15
Linear region Vds = -5v Vds = -1v
Memory ratio 32 2010
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ADVANTAGES Low operating voltage (-15 v to +15v)
Large memory ratio (2010)
Large memory window (13.3v) Long retention time (4000s)
Inexpensive
Simple fabrication
Lightweight
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