high frequency half bridge driver

26
1 Total dose testing of the IS-2100ARH high frequency half bridge driver Nick van Vonno Intersil Corporation Revision 0 June 2011 Table of Contents 1. Introduction 2. Reference Documents 3. Part Description 4. Test Description 4.1 Irradiation facility 4.2 Test fixturing 4.3 Characterization equipment and procedures 4.4 Experimental Matrix 4.5 Downpoints 5 Results 5.1 Test results 5.2 Variables data 6 Discussion 7 Conclusion 8 Appendices 9 Document revision history

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Page 1: high frequency half bridge driver

1

Total dose testing of the IS-2100ARH high frequency half bridge driver

Nick van Vonno Intersil Corporation

Revision 0 June 2011

Table of Contents 1. Introduction 2. Reference Documents 3. Part Description 4. Test Description

4.1 Irradiation facility 4.2 Test fixturing 4.3 Characterization equipment and procedures 4.4 Experimental Matrix 4.5 Downpoints

5 Results 5.1 Test results 5.2 Variables data

6 Discussion 7 Conclusion 8 Appendices 9 Document revision history

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1. Introduction This report reports the results of a low and high dose rate total dose test of the IS-2100ARH

high frequency half bridge N-channel MOSFET driver. The test was conducted in order to determine the sensitivity of the part to the total dose environment and to determine if dose rate and bias sensitivity exist.

2. Reference Documents MIL-STD-883G test method 1019.7 IS-2100ARH data sheet DSCC Standard Microcircuit Drawing (SMD) 5962-99536 3: Part Description

The IS-2100ARH is a radiation hardened, high frequency, 130V half bridge N-channel

MOSFET driver IC, which is functionally similar to industry standard 2100 types. The low side and high side gate drivers are independently controlled. This gives the user maximum flexibility in dead-time selection and driver protocol. In addition, the device features on-chip error detection and correction circuitry, which monitors the state of the high-side latch and compares it to the HIN signal. If they disagree, a set or reset pulse is generated to correct the high-side latch. This feature protects the high-side latch from single event upset (SEU) in the high-energy ion environment.

Specifications for radiation hardened MIL-PRF-38535 (QML) devices are controlled by Standard Microcircuit Drawings (SMD) as issued by the Defense Logistics Agency (DLA) Land and Maritime in Columbus, OH. Detailed electrical specifications for the IS-2100ARH are contained in SMD 5962-99536, which must be used when ordering. A “hotlink” is provided on the Intersil website for downloading this document.

Figure 1: IS-2100ARH block diagram.

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4: Test Description

4.1 Irradiation Facilities High dose rate testing was performed using a Gammacell 220 60Co irradiator located in the

Palm Bay, Florida Intersil facility. Low dose rate testing was performed on a subcontract basis at White Sands Missile Range (WSMR) Survivability, Vulnerability and Assessment Directorate (SVAD), White Sands, NM, using a vault-type 60Co irradiator. The high dose rate irradiations were done at 55rad(Si)/s and the low dose rate work was performed at 0.010rad(Si)/s, both per MIL-STD-883 Method 1019.7. Dosimetry for both tests was performed using Far West Technology radiochromic dosimeters and readout equipment.

4.2 Test Fixturing

Figure 2 shows the configuration used for biased irradiation in conformance with Standard Microcircuit Drawing (SMD) 5962-99536.

Figure 2: Irradiation bias configuration for the IS-2100ARH per Standard Microcircuit Drawing (SMD)

5962-99536.

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4.3 Characterization equipment and procedures

All electrical testing was performed outside the irradiator using the production automated test equipment (ATE) with datalogging at each downpoint. Downpoint electrical testing was performed at room temperature. Performing low dose rate testing at a remote site introduces some challenges, and shipping was performed in a foam container with a frozen Gelpack™ along with a strip chart temperature recorder in order to remain well within the temperature limits imposed by MIL-STD-883 Test Method 1019.7. Close coordination between the two organizations is required, and support by WSMR is gratefully acknowledged.

4.4 Experimental matrix

Total dose irradiation proceeded in accordance with the guidelines of MIL-STD-883 Test Method 1019.7. The experimental matrix consisted of five samples irradiated at high dose rate with all pins grounded, five samples irradiated at high dose rate under bias, five samples irradiated at low dose rate with all pins grounded and five samples irradiated at low dose rate under bias. One control unit was used.

Samples of the IS-2100ARH die were drawn from production lot DC834A, date code

X0802ABCL, and were packaged in the standard hermetic 16-pin solder-sealed flatpack (CDFP4-F16) production package. Samples were processed through the standard burnin cycle before irradiation, as required by MIL-STD-883, and were screened to the SMD 5962-99536 limits at room, low and high temperatures prior to the test.

4.5 Downpoints

Planned downpoints for the tests were 0, 10, 25, 50, 100 and 150krad(Si) for the high and low dose rate tests. The biased low dose rate samples were run successfully to 50krad(Si) but all five were found to have failed catastrophically at the 100krad(Si) downpoint. Failure analysis of these devices was performed and determined the failures as being caused by electrical overstress.

5: Results

5.1 Test results

We report results of a total dose test of the IS-2100ARH half bridge N-channel MOSFET driver.

Parts were tested at low and high dose rate under biased and unbiased conditions as outlined in MIL-STD-883 Test Method 1019.7. Five samples each were irradiated at low and high dose rate under biased and unbiased conditions. The biased low dose rate samples were run successfully to 50krad(Si) but were found to have failed catastrophically at the 100krad(Si) downpoint. Failure analysis of these devices was performed and determined the failures as being caused by electrical overstress. The three other experimental cells were successfully run to 150krad(Si) without any problems.

All low dose rate samples passed the SMD criteria at the 50krad(Si) downpoint. All high dose

rate samples passed the SMD rad criteria through 150krad(Si). The part was found to display no discernible dose rate sensitivity or bias sensitivity, with very stable performance out to the maximum total dose level for each cell. Nonetheless the part must be considered low dose rate sensitive as the biased low dose rate test effectively proceeded to 50krad(Si) while the other three tests were run out to 150krad(Si). The demonstration of true low dose rate insensitivity for both bias conditions will require a biased low dose rate test to the 150krad(Si) level.

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5.2 Variables data

The plots in Figures 3 through 39 show data at all downpoints, with the biased low dose rate data truncated at 50krad(Si). The plots show the median of key parameters as a function of total dose for each of the four irradiation conditions. We chose to plot the median for these parameters due to the relatively small sample sizes. Also shown are the SMD parametric limits and ATE limits; the ATE limits are test equipment related and are not specified in the SMD.

Figure 3: IS-2100ARH median quiescent VB supply current, VIN = 0V, as a function of total dose irradiation at low and high dose rate for the unbiased (all pins grounded) and the biased (per Figure 2) cases. The low dose rate was 0.01rad(Si)/s and the high dose rate 50rad(Si)/s. Sample size for each cell was 5. The SMD limit is 500µA maximum.

0

100

200

300

400

500

600

0 25 50 75 100 125 150

Qu

iesc

ent V

B s

up

ply

cu

rren

t, V

IN=0

V, µ

A

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

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Figure 4: IS-2100ARH median quiescent VCC supply current, VIN = 0V, as a function of total dose irradiation at low and high dose rate for the unbiased (all pins grounded) and the biased (per Figure 2) cases. The low dose rate was 0.01rad(Si)/s and the high dose rate 55rad(Si)/s. Sample size for each cell was 5. The SMD limit is 50µA maximum.

Figure 5: IS-2100ARH median quiescent VDD supply current, VIN = 0V, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 2900µA maximum.

0

10

20

30

40

50

60

0 25 50 75 100 125 150

Qu

iesc

ent V

CC

su

pp

ly c

urr

ent,

VIN

=0V,

µA

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

0

500

1000

1500

2000

2500

3000

0 25 50 75 100 125 150

Qu

iesc

ent V

DD

su

pp

ly c

urr

ent,

VIN

=0V,

µA

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

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Figure 6: IS-2100ARH median quiescent VB supply current, VIN = VCC, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 500µA maximum.

Figure 7: IS-2100ARH median quiescent VCC supply current, VIN = VCC, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 50µA maximum.

0

100

200

300

400

500

600

0 25 50 75 100 125 150

Qu

iesc

ent V

B s

up

ply

cu

rren

t, V

IN=V

CC

, µA

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

0

10

20

30

40

50

60

0 25 50 75 100 125 150

Qu

iesc

ent V

CC

su

pp

ly c

urr

ent,

VIN

=VC

C, µ

A

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

Page 8: high frequency half bridge driver

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Figure 8: IS-2100ARH median quiescent VDD supply current, VIN = VCC, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 2900µA maximum.

Figure 9: IS-2100ARH median VB supply leakage current at 150V as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 500µA maximum.

0

500

1000

1500

2000

2500

3000

0 25 50 75 100 125 150

Qu

iesc

ent V

DD

su

pp

ly c

urr

ent,

VIN

=VC

C, µ

A

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

0

100

200

300

400

500

600

0 25 50 75 100 125 150

VB

leak

age

curr

ent,

150

V, µ

A

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

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Figure 10: IS-2100ARH median VB supply leakage current at 170V as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. This informational parameter is not specified in the SMD but has a 200µA maximum limit.

Figure 11: IS-2100ARH median HIN logic ‘1’ input current as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 75µA maximum.

0

100

200

300

400

500

600

0 25 50 75 100 125 150

VB

leak

age

curr

ent,

170

V, µ

A

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

ATE limit

0

10

20

30

40

50

60

70

80

0 25 50 75 100 125 150

Lo

gic

'1' i

np

ut c

urr

ent,

HIN

, µA

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

Page 10: high frequency half bridge driver

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Figure 12: IS-2100ARH median HIN logic ‘0’ input current as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is -10µA maximum.

Figure 13: IS-2100ARH median LIN logic ‘1’ input current as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 75µA maximum.

-12

-10

-8

-6

-4

-2

0

0 25 50 75 100 125 150

Lo

gic

'0' i

np

ut c

urr

ent,

HIN

, µA

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

0

10

20

30

40

50

60

70

80

0 25 50 75 100 125 150

Lo

gic

'1' i

np

ut c

urr

ent,

LIN

, µA

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

Page 11: high frequency half bridge driver

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Figure 14: IS-2100ARH median LIN logic ‘0’ input current as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is -10µA maximum.

Figure 15: IS-2100ARH median HIGH level output voltage, HO output, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 14.9V minimum.

-12

-10

-8

-6

-4

-2

0

0 25 50 75 100 125 150

Lo

gic

'0' i

np

ut c

urr

ent,

LIN

, µA

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

14.85

14.9

14.95

15

15.05

15.1

15.15

15.2

15.25

0 25 50 75 100 125 150

HIG

H o

utp

ut v

olt

age,

HO

ou

tpu

t, V

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

Page 12: high frequency half bridge driver

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Figure 16: IS-2100ARH median LOW level output voltage, HO output, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 0.1V maximum.

Figure 17: IS-2100ARH median HIGH level output voltage, LO output, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 14.9V minimum.

0

0.02

0.04

0.06

0.08

0.1

0.12

0 25 50 75 100 125 150

LO

W o

utp

ut v

olt

age,

HO

ou

tpu

t, V

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

14.8

14.85

14.9

14.95

15

15.05

15.1

15.15

15.2

15.25

15.3

0 25 50 75 100 125 150

HIG

H o

utp

ut v

olt

age,

LO

ou

tpu

t, V

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

Page 13: high frequency half bridge driver

13

Figure 18: IS-2100ARH median LOW level output voltage, LO output, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 0.1V maximum.

Figure 19: IS-2100ARH median undervoltage lockout threshold voltage, LOW to HIGH, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limits are 8.0V to 12.0V.

0

0.02

0.04

0.06

0.08

0.1

0.12

0 25 50 75 100 125 150

LO

W o

utp

ut v

olt

age,

LO

ou

tpu

t, V

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

7.5

8

8.5

9

9.5

10

10.5

11

11.5

12

12.5

0 25 50 75 100 125 150

UV

LO

thre

sho

ld v

olt

age,

low

to h

igh

, V

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

SMD limit

Page 14: high frequency half bridge driver

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Figure 20: IS-2100ARH median undervoltage lockout threshold voltage, HIGH to LOW, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limits are 8.0V to 12.0V.

Figure 21: IS-2100ARH median undervoltage lockout threshold voltage hysteresis as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limits are 250mV to 2000mV.

7.5

8

8.5

9

9.5

10

10.5

11

11.5

12

12.5

0 25 50 75 100 125 150

UV

LO

thre

sho

ld v

olt

age,

hig

h to

low

, V

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

SMD limit

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

0 25 50 75 100 125 150

UV

LO

hys

tere

sis,

mV

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

SMD limit

Page 15: high frequency half bridge driver

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Figure 22: IS-2100ARH median HO output pulsed HIGH current as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 900mA minimum.

Figure 23: IS-2100ARH median HO output pulsed LOW current as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 900mA minimum.

0.8

1.3

1.8

2.3

2.8

0 25 50 75 100 125 150

Ou

tpu

t HIG

H c

urr

ent,

HO

, A

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

ATE limit

0.8

1.3

1.8

2.3

2.8

0 25 50 75 100 125 150

Ou

tpu

t LO

W c

urr

ent,

HO

, A

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

ATE limit

Page 16: high frequency half bridge driver

16

Figure 24: IS-2100ARH median LO output pulsed HIGH current as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 900mA minimum.

Figure 25: IS-2100ARH median LO output pulsed LOW current as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 900mA minimum.

0.8

1.3

1.8

2.3

2.8

0 25 50 75 100 125 150

Ou

tpu

t HIG

H c

urr

ent,

LO

, A

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

ATE limit

0.8

1.3

1.8

2.3

2.8

0 25 50 75 100 125 150

Ou

tpu

t LO

W c

urr

ent,

LO

, A

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

ATE limit

Page 17: high frequency half bridge driver

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Figure 26: IS-2100ARH median HO turn-on propagation delay as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 425ns maximum.

Figure 27: IS-2100ARH median HO turn-off propagation delay as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 360ns maximum.

40

90

140

190

240

290

340

390

440

0 25 50 75 100 125 150

HO

pro

pag

atio

n d

elay

, lo

w to

hig

h, n

s

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

ATE limit

SMD limit

40

90

140

190

240

290

340

390

440

0 25 50 75 100 125 150

HO

pro

pag

atio

n d

elay

, hig

h to

low

, ns

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

ATE limit

SMD limit

Page 18: high frequency half bridge driver

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Figure 28: IS-2100ARH median HO rise time as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 40ns maximum.

Figure 29: IS-2100ARH median HO fall time as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 40ns maximum.

0

5

10

15

20

25

30

35

40

45

0 25 50 75 100 125 150

HO

ris

e ti

me,

ns

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

0

5

10

15

20

25

30

35

40

45

0 25 50 75 100 125 150

HO

fall

tim

e, n

s

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

Page 19: high frequency half bridge driver

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Figure 30: IS-2100ARH median shutdown to HO propagation delay as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 400ns maximum.

Figure 31: IS-2100ARH median LO turn-on propagation delay as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 425ns maximum.

40

90

140

190

240

290

340

390

0 25 50 75 100 125 150

Pro

pag

atio

n d

elay

, sh

utd

ow

n to

HO

, ns

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

ATE limit

SMD limit

40

90

140

190

240

290

340

390

440

0 25 50 75 100 125 150

LO

pro

pag

atio

n d

elay

, lo

w to

hig

h, n

s

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

ATE limit

SMD limit

Page 20: high frequency half bridge driver

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Figure 32: IS-2100ARH median LO turn-off propagation delay as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 360ns maximum.

Figure 33: IS-2100ARH median LO rise time as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 40ns maximum.

40

90

140

190

240

290

340

390

440

0 25 50 75 100 125 150

LO

pro

pag

atio

n d

elay

, hig

h to

low

, ns

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

ATE limit

SMD limit

0

5

10

15

20

25

30

35

40

45

0 25 50 75 100 125 150

LO

rise

tim

e, n

s

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

Page 21: high frequency half bridge driver

21

Figure 34: IS-2100ARH median LO fall time as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 40ns maximum.

Figure 35: IS-2100ARH median HO to LO propagation delay match, HIGH to LOW, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limits are -20ns to 60ns.

0

5

10

15

20

25

30

35

40

45

0 25 50 75 100 125 150

LO

fall

tim

e, n

s

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

-30

-20

-10

0

10

20

30

40

50

60

70

0 25 50 75 100 125 150

HO

to L

O p

rop

del

ay m

atch

, hig

h to

low

, ns

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

SMD limit

Page 22: high frequency half bridge driver

22

Figure 36: IS-2100ARH median HO to LO propagation delay match, LOW to HIGH, as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limits are -20ns to 60ns.

Figure 37: IS-2100ARH median shutdown to LO propagation delay as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limit is 400ns maximum.

-30

-20

-10

0

10

20

30

40

50

60

70

0 25 50 75 100 125 150

HO

to L

O p

rop

del

ay m

atch

, lo

w to

hig

h, n

s

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

SMD limit

40

90

140

190

240

290

340

390

440

0 25 50 75 100 125 150

Pro

pag

atio

n d

elay

, sh

utd

ow

n to

LO

, ns

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

ATE limit

SMD limit

Page 23: high frequency half bridge driver

23

Figure 38: IS-2100ARH median LO turnoff to HO turnon deadtime as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limits are -20ns to 75ns.

Figure 39: IS-2100ARH median HO turnoff to LO turnon deadtime as a function of total dose irradiation at low and high dose rate for the unbiased and biased cases. The SMD limits are 10ns to 100ns.

-30

-20

-10

0

10

20

30

40

50

60

70

80

0 25 50 75 100 125 150

LO

turn

off

to H

O t

urn

on

dea

dti

me,

ns

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

SMD limit

0

10

20

30

40

50

60

70

80

90

100

110

0 25 50 75 100 125 150

HO

turn

off

to L

O tu

rno

n d

ead

tim

e, n

s

Total dose, krad(Si)

High dose rate, grounded

High dose rate, biased

Low dose rate, grounded

Low dose rate, biased

SMD limit

SMD limit

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6: Conclusion This document reports the results of a total dose test of the IS-2100ARH half bridge N-channel

MOSFET driver. Parts were tested at low and high dose rate under biased and unbiased conditions as outlined in the MIL-STD-883 Test Method 1019.7 diagnostic protocol. Five samples each were irradiated at low and high dose rate under biased and unbiased conditions. The biased low dose rate samples were run successfully to 50krad(Si) but were found to have failed catastrophically at the 100krad(Si) downpoint. Failure analysis of these devices was performed and determined the failures as being caused by electrical overstress. The three other experimental cells were successfully run to 150krad(Si) with no problems.

All samples passed the SMD criteria through their respective maximum total dose exposure,

which was 50krad(Si) for the biased low dose rate samples and 150krad(Si) for all other samples. The samples displayed excellent stability for all key parameters, and Figs. 3 through 39 report the results. The part was found to display no discernible dose rate or bias sensitivity, with highly stable performance out to the maximum total dose level. Nonetheless the part must be considered low dose rate sensitive as the biased low dose rate test proceeded to 50krad(Si) while the other cells were run out to the planned 150krad(Si). The demonstration of true low dose rate insensitivity will require completion of a biased low dose rate test to the 150krad(Si) level.

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7: Appendices 7.1: Reported parameters by figure number.

Figure Parameter Limit, low

Limit, high Units Notes

3 IQB 500 µA VIN = 0 4 IQCC 50 µA VIN = 0 5 IQDD 2900 µA VIN = 0 6 IQB 500 µA VIN = VCC 7 IQCC 50 µA VIN = VCC 8 IQDD 2900 µA VIN = VCC 9 ILK 500 µA 150V

10 ILK 200 µA 170V 11 +IIN 75 µA HIN 12 -IIN -10 µA HIN 13 +IIN 75 µA LIN 14 -IIN -10 µA LIN 15 VOH .1 V HO 16 VOL .1 V HO 17 VOH .1 V LO 18 VOL .1 V LO 19 Undervoltage lockout threshold 8.0 12.0 V LOW to HIGH 20 Undervoltage lockout threshold 8.0 12.0 V HIGH to LOW 21 UVLO hysteresis 250 2000 mV 22 HO output pulsed HIGH current 0.9 A 23 HO output pulsed LOW current 0.9 A 24 LO output pulsed HIGH current 0.9 A 25 LO output pulsed LOW current 0.9 A 26 HO turnon propagation delay 425 ns 27 HO turnoff propagation delay 360 ns 28 HO rise time 40 ns 29 HO fall time 40 ns 30 SD to HO propagation delay 400 ns 31 LO turnon propagation delay 425 ns 32 LO turnon propagation delay 360 ns 33 LO rise time 40 ns 34 LO fall time 40 ns

35 HO to LO propagation delay match, HIGH to LOW 60 ns

36 HO to LO propagation delay match, LOW to HIGH 60 ns

37 SD to LO propagation delay 400 ns 38 LO turnoff to HO turnon deadtime -20 75 ns 39 HO turnoff to LO turnon deadtime 10 100 ns

Note 1: Limits are taken from Standard Microcircuit Drawing (SMD) 5962-99536.

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8: Document revision history

Revision Date Pages Comments 0 June 2011 All Original issue