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HighFrequencyDevices
HIGH FREQUENCY DEVICES
The Best Solution for Realizing the Information andCommunication EraCommunication networks, such as high speed Internet, and high-speed data communication,are developing rapidly. We are ready to offer the best solution to the systems for realizingthe infomation and communication era by providing of the GaN/GaAs products.
Plastic Mold Package (GD-32)
4-pin Mold Package (GD-30)
SELECTION MAP
Application
� GaAs HEMT SERIES FOR MICROWAVE-BAND LOW-NOISE AMPLIFIERS (Discrete)
�: AEC-Q101 qualified FET: Field Effect Transistor HEMT: High Electron Mobility Transistor HBT: Heterojunction Bipolar Transistor
No
ise
Fig
ure
NF
[d
B]
General Use
2.4GHz 4GHz 12GHz 24GHz20GHz
1.2
0.2
0.4
0.6
0.8
1.0
G ain G ain
MGF4921AM�
MGF4921AM�
MGF4934CMMGF4964BL
MGF4965BM
MGF4935AM
MGF4941CL�
MGF4937AM MGF4941AL
� GaAs HEMT/MES FET, InGaP HBT SERIES FOR SMALL SIGNAL AMPLIFIERS (Discrete)
�: AEC-Q101 qualified
�: New Product ��: Under Development Partially supported by Japan's New Energy and Industrial Technology Development Organization(NEDO).
� Radio Link System � Satellite Communication
Application � Satellite Broadcasting � Communication Receiver
Ou
tpu
t P
ow
er
[dB
m]
10
14
18
~L/S/C Band (~8GHz) ~X/Ku Band (~14.5GHz) Ka Band (24GHz)
MGF3022AM�
MGF4841AL
MGF1941AL
General Use
� GaN HEMT SERIES FOR MICROWAVE-BAND HIGH POWER AMPLIFIERS
MGF4841CL�
Application � Ku- SATCOM � Ka- SATCOM�3.5GHz Band Mobile Communication
50
40
Ou
tpu
t P
ow
er
[dB
m]
MGFG5H1503
MGFK50G3745��
MGFS39G38L2
MGFS38G38L2��
MGFS37G28L2��
3.5GHz Band Ka Band (27.5~31GHz)Ku Band (13.75~14.5GHz)
For Mobile Communication Base Transceiver Station For Satellite Communication (Internally Matched)
MGFK49G3745
MGFK48G3745�
MGFK47G3745A
MGFG5H3001�
� GaAs HEMT SERIES FOR MICROWAVE-BANDLOW-NOISE AMPLIFIERS (Discrete)
� GaAs HEMT/MES FET, InGaP HBT SERIES FORSMALL SIGNAL AMPLIFIERS (Discrete)
� GaN HEMT SERIES FOR SATELLITE COMMUNICATION (Internally Matched)
� GaN HEMT SERIES FOR MOBILE COMMUNICATION BASE TRANSCEIVER STATION
TYPE NAME DEFINITION OF HIGH FREQUENCY DEVICES
RoHS: Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment
High Frequenc y devices are compliant with the RoHS (2011/65/ EU).
� Discrete
MGF 49 41 A LA B C D
A Device Structure
B Chip TypeC Series NumberD Auxiliary Symbol
1x :MES FET (Small Signal)3x :HBT4x :HEMT
� For Satellite Communication (Internally Matched)
MGF K 50 G 3745A B C D
A Freq. BandB Output Power in dBmC Device StructureD Freq. Band in GHz
Kuex.50=50dBm=100W(typ.)G:GaN HEMTex.3745=13.75~14.5GHz
A Freq. BandB Output Power in dBmC Device StructureD Freq. Band in GHzE PackageF Input / Output Pair
Sex.39=39dBmG:GaN HEMTex.38=~3.8GHzL:QFNex.2=Input / Output 2 Pairs
� For Mobile Communication Base Transceiver Station
PRODUCT LIST
MGF S 39 G 38 L 2A B C FD E
MGF4941CL �
MGF4965BMMGF4964BLMGF4941ALMGF4937AMMGF4935AMMGF4934CMMGF4921AM�
2.40
0.95
0.65
0.35
0.35
0.45
0.50
0.35
3.80
1.25
0.90
0.50
0.50
0.65
0.75
0.55
7.5
9.5
11.5
12.0
11.5
11.0
11.5
11.5
10.0
11.5
13.5
13.5
13.0
12.0
13.0
13.0
24
20
20
12
12
12
12
4
1.5
2
2
2
2
2
2
2
Idss
10
10
10
10
10
10
10
GD-32
GD-30
GD-32
GD-32
GD-30
GD-30
GD-30
GD-30
Type NumberNoise Figure [dB] Associated Gain [dB]
Typ. Max. Min. Typ.
Frequency[GHz]
Drain-Source Voltage [V]
Drain Current[mA]
PackageOutline
MGF3022AM �
MGF4841CL �
MGF4841ALMGF1941AL
14.0
–
11.5
11.0
16.5
11.5
14.5
15.0 –
18.0
8.5
12.0
10.0 – – –
2.4
24
12
12
3
1.5
2.5
3
0.033
Idss
0.025
0.03 – –
– – – – – –
– – – – – –
– – – – – – GD-30
GD-32
GD-32
GD-32
Type NumberMin. Typ. Min. Typ.
PowerAdded
Efficiency[%]
Frequency[GHz]
Drain-Source Voltage
[V]
DrainCurrent
[A]
PackageOutline
Output Power at 1dBGain Compression
[dBm]
Typ. Max.
ThermalResistance
[°C/W]
OutputPower[dBm]
LinearPowerGain[dB]
3rd Order IMDistortion
[dBc]
Ta=25°C �: AEC-Q101 qualified
Ta=25°C �: AEC-Q101 qualified
Ta=25°C �: New Product ��: Under Development
Type NumberPowerAdded
Efficiency[%]
Frequency[GHz]
Drain-Source Voltage
[V]
PackageOutline
Typ. Max.
ThermalResistance
[°C/W]
OutputPower[dBm]
LinearPowerGain[dB]
MGFS37G38L2��
MGFS38G38L2��
MGFS39G38L2
37
38
39
20
20
20
67
67
67
3.4~3.8
3.4~3.8
3.4~3.8 50
50
50 13.5
11.7
10.2
–
–
–
GF-67
GF-67
GF-67
Ta=25°C ��: Under Development
GD-30 GD-32
GD-30 GD-32
GF-67
GF-38 GF-65GF-8 GF-71
Type NumberMin. Typ.
PowerAdded
Efficiency[%]
Frequency[GHz]
Drain-Source Voltage
[V]
DrainCurrent
[A]
PackageOutline
Typ. Max.
ThermalResistance
[°C/W]
OutputPower[dBm]
LinearPowerGain[dB]
3rd Order IMDistortion
[dBc]
MGFG5H1503 43 20 -25 – 18 13.75~14.5
27.5~31
24 2.7 1.51.2 GF-65
39 15 -25 – 12 24 1.5 T.B.D.2.0 GF-71MGFG5H3001�
MGFK49G3745 49 7.5 -25 – 28 13.75~14.5 24 2.1 0.60.4 GF-38
MGFK50G3745�� 50 10 -25 – 30 13.75~14.5 24 2.4 T.B.D.T.B.D. GF-38
MGFK47G3745A 47 9 -25 – 30 13.75~14.5 24 1.05 1.41.1 GF-8
1.00.8MGFK48G3745� 48.3 9.3 -25 – 33 13.75~14.5 24 1.44 GF-8
HIGH FREQUENCY DEVICES
www.MitsubishiElectric.comPlease visit our website for further details.
H-CX587-W KI-1709 Printed in Japan (TOT) ©2017 Mitsubishi Electric Corporation
New publication effective Sep. 2017.Specifications subject to change without notice.
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Attention! This overview only presents a selection of our product portfolio.With some manufacturers we may have special regulations and / or restrictions for some European countries.
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