heterogeneous technology alliance soi mems platform hta general assembly november 12 – 13, 2013
TRANSCRIPT
HeterogeneousTechnology
Alliance
SOI MEMS Platform
HTA General Assembly
November 12 – 13, 2013
The Heterogeneous Technology Alliance HTA Status Report
Platform / Roadmap / Flagship Title:
SOI MEMS Platform
Short Description:
Platform purpose
• To create flexibility in designing and manufacturing new components
Definition
• Platform composes of process equipment, steps, modules and needed personnel of HTA partners (e.g. CSOI-AlN pMEMS platform of VTT)
Activity in practice
• Network of four platform managers having regular Telcos & meetings
• Gateway to services and facilities of other partners (= matchmaker)
• Standardized documents (RFQ-template, customer case database, equipment list)
• Main challenge: (internal) marketing => project managers and planners
Contact: [email protected]
The Heterogeneous Technology Alliance HTA Status Report
Platform / Roadmap / Flagship Title:
SOI MEMS Platform
Status & Partners (institutes, departments, contact):
CEA-Leti: [email protected]
CSEM: [email protected]
FhG: ENAS/IMS/IPMS/ISIT: [email protected]
VTT: [email protected]
Vision, Mission, Strategy:
Vision: Platform for research, prototyping and pilot production as well as production ramp-up services
Mission: Helping researcher to do their work, through networking, creating new projects and fostering innovations
Contact: [email protected]
The Heterogeneous Technology Alliance HTA Status Report
Platform / Roadmap / Flagship Title:
SOI MEMS Platform
Recent Activities (white papers, joint projects, joint PR, …)
•5 inquiries handled in 2013 (3 closed without contracts, 2 still underway)
•CSEM: Philippe Niedermann replaced by Arno Hoogerwerf
Next steps:
•Standard activities continue
•Participation to trade show under HTA banner planned (experiences of Semicon 2012 utilized)
Contact: [email protected]
The Heterogeneous Technology Alliance HTA
SOI MEMS Platform: success stories
Challenge:
•IPDiA develops in collaboration with Leti a unique technology to integrate a wide range of capacitor values on silicon. A high K dielectric
with coverage on high aspect ratio trenches is required. Leti does not have the technology.
•Solution:
•Fhg-CNT has the perfect solution
Added value of HTA:
•Access to capabilities not available within a single partner
•Project was not feasible otherwise.
Development of high density capacitors
50µm