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Martin Rides, Angela Dawson 6 October 2004 Heat Transfer in Polymers

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  • Martin Rides, Angela Dawson6 October 2004

    Heat Transfer in Polymers

  • Heat Transfer in Polymers - summary

    IntroductionHeat Transfer CoefficientThermal ConductivityIndustrial DemonstrationsNPLs Polymer Processing WebsiteSummary

  • Aim of the project

    To help companies measure and model heat transfer in polymer processing

    This should lead to:

    Higher productivity (faster processing) Energy saving Fewer failures in service

    Related project : AIMTECH

  • Eureka Project: AIMTECH

    An associated Eureka project (AIMTECH) is progressingIts aim is to improve productivity of injection moulding

    Main focus is on the moulds - reduce cycle times by using copper alloy moulds in injection moulding

    NPL Role Measurement of the thermal conductivity of polymer melts (T,P) Understanding the role of the mould/melt interface:

    Modelling heat transfer and the effect of uncertaintiesSix UK companies involved25k co-funding contributionClose fit with the DTI project

  • Tasks in the DTI ProjectHeat Transfer Coefficient

    New facility Thermal Conductivity

    Uncertainty analysis Extension of method to new materials

    Simulation To identify the important data To help design equipment Moldflow & NPLs own software

    Industrial Demonstrations Zotefoams Corus

    Dissemination Web site, IAGs, PAA Newsletter articles, trade press articles,

    measurement notes, scientific paper

  • Heat Transfer CoefficientIt is the heat flux per unit area (q) across an interface from one material of temperature T1 to another material of temperature T2 :

    h = q/(T1 T2) units: Wm-2K-1

    Boundary condition for process simulation

    In injection moulding & compression moulding Polymer to metal

    In extrusion & film blowing Polymer to fluid (eg air or water)

    This project will build apparatus to measure heat transfer coefficient and investigate the significance of different interfaces to commercial processing

  • Heat Transfer Coefficient (heat transfer across an interface)

    Features of apparatus being developedRoom temperature to 275 C, pressure to at least 500 barPolymer samples 2 to 25 mm thickInterchangeable top plate to investigate

    Different surface finishes Effect of mould release agents

    Option to introduce a gap between polymer & top plate Shrinkage, sink marks

    Instrumented with thermocouples, fibre optics, heat flux sensors and calorimeter

  • Heat transfer apparatus

    Side view

    hot plate

    cold plate

    sample

  • Heat transfer apparatus

    displacement transducer

    cooling pipes thermocouples heat flux sensors pressure transducer port

    mould face

    heater element

    sample

    air gap

    outer guard ring

    PTFE seal

    thermo-couple ports

    fibre optic thermocouple port

    displacement transducer

    cooling pipes thermocouples heat flux sensors pressure transducer port

    mould face

    heater element

    sample

    air gap

    outer guard ring

    PTFE seal

    thermo-couple ports

    fibre optic thermocouple port

  • Modelling of key features

    Effect of vertical thermocouple on distort the temperature field

    Effect of an air gap

  • Effect of a thermocouple

    TherMOL 1.0

    Mould at 50 C

    Polymer at 250 C

  • Simulation of Heat Transfer with Fibre Optic (left) & Thermocouple (right)

  • Comparison of thermocouple & fibre optic

    50 C 250 C

  • Air GapMould at 50 C with air gap of 0, 0.5 & 1 mm

    Polymer at 250 C

  • Pipe T piece and 80 mm diameter disc models

  • Effect of uncertainties in HTC

  • Effect of uncertainties in HTCThe Effects of Mould-Melt Heat Transfer Coefficient Upon Tf

    Predictions For The 5 mm Thick Disc Model

    50

    51

    52

    53

    54

    55

    10 100 1000 10000 100000 1000000

    Heat Transfer Coefficient, W/(m2C)

    Tim

    e to

    Fre

    eze

    Part

    , s

    1/10

    x10Default Value

    Minimum Value

  • Effect of uncertainties in HTCThe Effect Of Mould-Melt Heat Transfer Coefficient Upon Time To Freeze Part

    For Discs Of Different Thickness

    -2

    0

    2

    4

    6

    8

    10

    12

    14

    0 5 10 15 20 25 30

    Disc Thickness, mm

    Perc

    enta

    ge V

    aria

    tion

    In T

    ime

    To F

    reez

    e Pa

    rtFr

    om T

    he S

    tand

    ard

    Sim

    ulat

    ion

    Res

    ult

    For T

    he G

    iven

    Dis

    c Th

    ickn

    ess,

    %

    Default Mould-Melt Heat Transfer Coefficient

    Minimum Mould-Melt Heat Transfer Coefficient

    1/10 Of Default Mould-Melt Heat Transfer Coefficient

    *10 Default Mould-Melt Heat Transfer Coefficient

  • NPL Report DEPC-MPR 001

    The Effect of Uncertainty in Heat Transfer Data on The Simulation

    of Polymer Processing

    J. M. Urquhart and C. S. Brown

    http://libsvr.npl.co.uk/npl_web/search.htm

    http://libsvr.npl.co.uk/npl_web/search.htm

  • Heat Transfer Coefficient Summary

    Investigate effect of:

    Different surface finishes/mould materials Mould release agents Air gap between polymer & top plate Shrinkage, sink marks

  • THERMAL CONDUCTIVITYMEASUREMENT

    Angela Dawson

  • Thermal Conductivity

    Sample Measurementcylinder

    Guiding bar

    Distance holderLower Piston

    Thermalconductivityprobe

    Heater bands

    Line source probe apparatus

    Measures at temperature and pressure conditions found in industrial polymer processing

  • Uncertainty Budget For NPL Line-Source Thermal Conductivity Probe (Atmospheric Pressure)

    Value %

    Proba bility Dis tribu tion

    Di vis or Ci Uncertainty Contri bution %

    Uncertainty S qu are d %

    Vi or Veff

    Ty pe A Re pe atability 15 .6@

    2 s td de vs

    Nor m al 2 1 7 .8 15 @ 1 s td de v 6 1 .0 7 8 9

    Re pr oduci bility 13 .6@ 2 s td de vs

    Nor m al 2 1 6 .8 01 @ 1 s td de v 4 6 .2 5 8 9

    Ty pe B Non- uni for mity o f heat in put

    0 .0 02 Rectangular 1 .73 1 0 .0 0116 1 .34 E-06

    Non-unifor mity o f tem pera ture

    0 .0 Rectangular 1 .73 1 0 .0 00 0 .00 0

    S am ple heig ht 0 .0 Rectangular 1 .73 1 0 .0 00

    0 .00 0

    Ti me 0 .0 Nor m al 1 1 0 .0 00

    0 .00 0

    Calcul ati on of Uncertainty

    S um of s quares 1 07 .3 % S qu are root of

    s um of s quares 1 0 .4 %

    M ulti plica tio n by k = 2 for 95% confi de nce le vel

    20 .7% Fin al Uncertainty Value

  • Thermal Conductivity of PDMS (Atmospheric Pressure)

  • Thermal Conductivity of HDPE (Atmospheric Pressure)

  • Thermal Conductivity of HDPE (Atmospheric and 1000 bar Pressures)

    Repeatability (95% confidence level) of thermal conductivity test data for one operator testing HDPE HCE000 from 170C to 50C

    at 1000 bar pressure (green) and at ambient pressure (blue)

    0.10

    0.15

    0.20

    0.25

    0.30

    0.35

    0.40

    0.45

    0.50

    40 60 80 100 120 140 160 180Temperature, C

    1000 bar repeatability 8%

    Ther

    mal

    Cond

    uctiv

    ity, W

    /mK

    ambient pressure repeatability16%

  • Thermal Conductivity Uncertainty Analysis Summary

    Picking data from literature expect uncertainty value +/- 50%Measurement of a typical thermoplastic at atmospheric pressure - total uncertainty value +/- 20.7%Measurement of a typical low viscosity polymer +/- 1.4% (repeatability)Measurement of a typical thermoplastic at atmospheric pressure expect +/- 16% (repeatability)Measurement of a typical thermoplastic at 1000 bar +/- 8% (repeatability)

    Conclusion: Can improve on +/- 20.7% total uncertainty value

    Action: Incorporate +/- 8% repeatability value into uncertainty budget Investigate repeatability contribution at elevated pressure and

    incorporate result uncertainty budget

    What is the commercial significance of this? Illustrated by Moldflow simulation

  • Moldflow model of HDPE Pipe T-piece

  • Changes In Cooling Times With Increasing Thermal Conductivity Values For T- Piece From Moldflow Simulation

  • Thermal Conductivity

    Extending the scope of the measurement (at least six)

    Nanoclay filled PPs 3

    Rubber toughened PMMA 3

    Rubber samples (Avon) softness project link 3

    HDPE (Durapipe grade) used for uncertainty analysis 1

    HDPE powder (rotational moulding grade) 1

    Thermosets (Railko polyesters) 2

    Glass filled nylon 1

    PC 1

    PS 1

    ABS 1

    Total 13 + 4 = 17

  • Nano-materials Thermal Conductivity (200 bar)

    Comparison of thermal conductivity behaviour on cooling of virgin polypropylene (AAATJ000) with two polymer

    nanocomposites (AAATJ001 and AAATJ002) at 200 bar pressure

    0.20

    0.25

    0.30

    0.35

    0.40

    0.45

    0.50

    0.55

    0 50 100 150 200 250

    Temperature, C

    AAATJ000 200barAAATJ001 200barAAATJ002 200barT

    herm

    al C

    ondu

    ctiv

    ity, W

    /mK

  • Nano-materials Thermal Conductivity (800 bar)

    Comparison of thermal conductivity behaviour on cooling of virgin polypropylene (AAATJ000) with two polymer

    nanocomposites (AAATJ001 and AAATJ002) at 800 bar pressure

    0.20

    0.25

    0.30

    0.35

    0.40

    0.45

    0.50

    0.55

    0 50 100 150 200 250

    Temperature, C

    AAATJ000 800barAAATJ002 800barAAATJ001 800bar

    Ther

    mal

    Con

    duct

    ivity

    , W/m

    K

  • Nano-materials Thermal Conductivity (1200 bar)

    Comparison of thermal conductivity behaviour on cooling of virgin polypropylene (AAATJ000) with two polymer

    nanocomposites (AAATJ001 and AAATJ002) at 1200 bar pressure

    0.20

    0.25

    0.30

    0.35

    0.40

    0.45

    0.50

    0.55

    0 50 100 150 200 250

    Temperature, C

    AAATJ000 1200barAAATJ001 1200barAAATJ002 1200bar

    Ther

    mal

    Con

    duct

    ivity

    , W/m

    K

  • Summary of Thermal Conductivity Study of Nano-clay Filled Polypropylene

    Can measure thermal conductivity of polymer nano-composites at range of temperatures and pressuresAddition of nano-clay filler to polypropylene increases the crystallisation temperature of the polymerAddition of nano-clay filler to polypropylene can increase the thermal conductivity of the polymer across the processing range of temperatures New area of work would be to look at addition of nano-clays to range of polymers to determine effects of nano-clays on thermal conductivity and other physical properties of polymers

  • Thermal Conductivity of Rubber

    thermal conductivity of AAATH000 rubber powder on heating and cooling from 50C to 250C at atmospheric

    pressure

    0.00

    0.05

    0.10

    0.15

    0.20

    0.25

    0.30

    0.35

    0.40

    0 50 100 150 200 250 300

    Temperature, C

    300304 AAATH000 1bar heating300304 AAATH000 1bar cooling310304 AAATH000 200 bar heating310304 AAATH000 200 bar cooling

    Ther

    mal

    Con

    duct

    ivity

    , W/m

    K

  • Thermal Conductivity of PMMA

    thermal conductivity of AAATH001 PMMA bead polymer on heating and cooling from 50C to 250C at atmospheric

    pressure

    0.00

    0.05

    0.10

    0.15

    0.20

    0.25

    0.30

    0.35

    0.40

    0 50 100 150 200 250 300

    Temperature, C

    310304 AAATH001 200bar heating310304 AAATH001 200bar cooling010404 AAATH001 1bar heating010404 AAATH001 1bar cooling

    Ther

    mal

    Con

    duct

    ivity

    , W/m

    K

  • Thermal Conductivity of Rubber/PMMA Compound

    thermal conductivity of AAATH002 rubber/PMMA granular compound on heating and cooling from 50C to 250C at

    atmospheric pressure

    0.00

    0.05

    0.10

    0.15

    0.20

    0.25

    0.30

    0.35

    0.40

    0 50 100 150 200 250 300

    Temperature, C

    010404 AAATH002 1bar heating010404 AAATH002 1bar cooling300404 AAATH002 200bar heating300404 AAATH002 200bar cooling

    Ther

    mal

    Con

    duct

    ivity

    , W/m

    K

  • Summary of Thermal Conductivity Study on Rubber, PMMA and Rubber/PMMA Compound

    Thermal conductivity measurements on powders, beads and granules are possible at range of temperatures and pressuresThermal conductivity measurements at atmospheric pressure depend on compaction of sample best results achieved with powder sampleThermal conductivity measurements of rubber samples can be made in the pre-crosslinked powder form (atmospheric pressure) and after crosslinking (200 bar)

  • Effect of Pressure on PP Thermal Conductivity

    Thermal conductivity of polypropylene (AAATK004) on cooling from 250C to 50C at pressures of 200, 800 and 1200 bar

    0.15

    0.17

    0.19

    0.21

    0.23

    0.25

    0.27

    0.29

    0.31

    0.33

    0.35

    0 50 100 150 200 250 300Temperature,C

    200 bar800 bar1200 bar

    Ther

    mal

    Con

    duct

    ivity

    , W/m

    K

  • Effect of Pressure on PE Thermal Conductivity

    Thermal conductivity of polyethylene (AAATK005) on cooling from 250C to 50C at pressures of 200, 800 and 1200 bar

    0.15

    0.20

    0.25

    0.30

    0.35

    0.40

    0.45

    0 50 100 150 200 250 300

    Temperature,C

    200 bar800 bar1200 bar

    Ther

    mal

    con

    duct

    ivity

    , W/m

    K

  • Effect of Pressure on PC Thermal Conductivity

    Thermal conductivity of polycarbonate (AAATK001) on cooling from 200C to 50C at pressures of 200 and 800 bar

    0.20

    0.25

    0.30

    0.35

    0.40

    0.45

    0.50

    0.55

    0 50 100 150 200 250Temperature,C

    200 bar800 bar

    Ther

    mal

    Con

    duct

    ivity

    , W/m

    K

  • Effect of Pressure on PS Thermal Conductivity

    Thermal conductivity of polystyrene (AAATK002) on cooling from 250C to 50C at pressures of 200, 800 and 1200 bar

    0.15

    0.17

    0.19

    0.21

    0.23

    0.25

    0.27

    0.29

    0.31

    0.33

    0.35

    0 50 100 150 200 250 300Temperature,C

    200 bar800 bar1200 bar

    Ther

    mal

    con

    duct

    ivity

    , W/m

    K

  • Summary of Pressure Effects on Thermal Conductivity of Polymers

    Increase in thermal conductivity with increase in pressure across temperature range for all crystalline and amorphous polymers

    Increase in crystallisation temperature with increase in pressure for crystalline polymers (PP and PE)

    Decrease in thermal conductivity with cooling for amorphous polymers (PS and PC) across temperature range

    Step increase in thermal conductivity with cooling for crystalline polymers (PP and PE) across temperature range

  • INDUSTRIAL TRIALSCorus & Zotefoams

  • Industrial Demonstrations

    Aim is to demonstrate practical benefits of heat transfer measurements and modelling

    Corus Thermal conductivity of plastisol coated steel before and

    after solidification

    Zotefoams Heat transfer during cooling of polyolefin foam

  • Corus

    Use DSC method to measure thermal conductivity of bilayer Plastisol/steel

    Measure before and after solidification

    Data useful in predicting optimum line speeds

    Earlier work had shown that the polymer layer was significant in terms of heat transfer

  • DSC method for thermal conductivity

    Indium or eutecticDSC pan

    Mulitlayer sample

  • Heat Transfer for sapphire

    45

    50

    55

    60

    65

    145 150 155 160 165 170 175Temperature (C)

    Hea

    t Flo

    w (m

    W)

    (1988)) al et (Khannahh

    mmKK

    i

    x

    i

    xix

    2

    =

    DSC method for thermal conductivity

  • Zotefoams

    Model heat transferMeasure (T, heat flux) over timeModel/measure shrinkageCalculate internal stressesUse bending theory to predict curvature

  • Zotefoams

    hplate

    hfoam

    hgap

    Air Flow

    Key

    Foam

    Steel or aluminium plate

    L

    hplate

    width = W

    uamb m&

  • Stress relaxation of a two layer section after cutting

    Layer 1

    Layer 2

    Layer 2

    Layer 1

    Layer 1

    Layer 2

    Cut foam layers fromfoam sheets

    Release of stressesat the free surfaces

    Onset of bending

    Lset

    Lset

    Ltop

    cut

    cut

    Lbottom

    Ltop

    Lbottom

    hstrip

  • Thermal Conductivity StandardsISO TC61 SC5 WG8 Thermal Properties

    Thermal conductivity and diffusivity: General Principles - New Work Item Proposal (NWIP) prepared

    Hot Wire Techniques:Hot Wire (S. HEYEZ, Belgium) (ISO 8894)Line Source (H. LOBO, USA) (D 5930 ASTM)Hot Disk (S. GUSTAFSSON, Sweden) - NWIP prepared

    Wave and Pulse methods:Temperature Wave Analysis (J. MORIKAWA, Japan) - NWIP preparedLaser Flash (B. HAY, France) (ISO 18755)

    Steady State methods:Guarded Hot Plate (G. SIMS, UK) (ISO 8302) cross referencedGuarded Heat Flux (G. SIMS, UK) (ISO 8301/E 1530 ASTM) cross referencedTemperature Modulated DSC (in DSC ISO 11357 series)

  • http://www.npl.co.uk/npl/cmmt/polyproc/Polymer Processing Website

    http://www.npl.co.uk/npl/cmmt/polyproc/

  • http://www.npl.co.uk/npl/cmmt/polyproc/

  • http://www.npl.co.uk/npl/cmmt/polyproc/

  • http://www.npl.co.uk/npl/cmmt/polyproc/

  • http://www.npl.co.uk/npl/cmmt/polyproc/

  • The next 6 monthsCommission and commence trials on heat transfer coefficient equipment

    Continue to extend thermal conductivity measurement procedures to new types of material thermosets, rubbers, powders, nano-materials, glass

    filled scientific paper

    Industrial demonstrations (Corus / Zotefoams) to complete/continue

  • Deliverable extensions

    Heat transfer coefficient apparatus M2/d2 Delivery of equipment: Jan 05 M3/d1 & d2 Test procedure and commissioning: March 05

    Thermal conductivity measurement M6/d3 Scientific paper: November 04

  • Summary Heat Transfer

    Heat transfer coefficient apparatus designed and now being manufactured Assisted by modelling studies Effect of uncertainties investigated (report available)

    Melt thermal conductivity Nano-fillers Powders/granules Effect of uncertainties investigated (report available)

    Standards active

    New website - IAG members facilityhttp://www.npl.co.uk/npl/cmmt/polyproc

    http://www.npl.co.uk/npl/cmmt/polyproc

    Heat Transfer in Polymers - summaryAim of the projectEureka Project: AIMTECHTasks in the DTI ProjectHeat Transfer CoefficientHeat Transfer Coefficient (heat transfer across an interface)Modelling of key featuresEffect of a thermocoupleSimulation of Heat Transfer with Fibre Optic (left) & Thermocouple (right)Comparison of thermocouple & fibre opticAir GapHeat Transfer Coefficient Summary Thermal ConductivityUncertainty Budget For NPL Line-Source Thermal Conductivity Probe (Atmospheric Pressure)Thermal Conductivity of PDMS (Atmospheric Pressure)Thermal Conductivity of HDPE (Atmospheric Pressure)Thermal Conductivity of HDPE (Atmospheric and 1000 bar Pressures)Thermal Conductivity Uncertainty Analysis SummaryMoldflow model of HDPE Pipe T-pieceChanges In Cooling Times With Increasing Thermal Conductivity Values For T- Piece From Moldflow SimulationThermal ConductivityNano-materials Thermal Conductivity (200 bar)Nano-materials Thermal Conductivity (800 bar)Nano-materials Thermal Conductivity (1200 bar)Summary of Thermal Conductivity Study of Nano-clay Filled PolypropyleneThermal Conductivity of RubberThermal Conductivity of PMMAThermal Conductivity of Rubber/PMMA CompoundSummary of Thermal Conductivity Study on Rubber, PMMA and Rubber/PMMA CompoundEffect of Pressure on PP Thermal ConductivityEffect of Pressure on PE Thermal ConductivityEffect of Pressure on PC Thermal ConductivityEffect of Pressure on PS Thermal ConductivitySummary of Pressure Effects on Thermal Conductivity of PolymersIndustrial DemonstrationsCorusDSC method for thermal conductivityZotefoamsZotefoamsStress relaxation of a two layer section after cuttingThermal Conductivity StandardsPolymer Processing Websitehttp://www.npl.co.uk/npl/cmmt/polyproc/http://www.npl.co.uk/npl/cmmt/polyproc/http://www.npl.co.uk/npl/cmmt/polyproc/http://www.npl.co.uk/npl/cmmt/polyproc/The next 6 monthsDeliverable extensionsSummary Heat Transfer