group2_12d110035
DESCRIPTION
Volmer weber depositionTRANSCRIPT
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MM669
Group-2
Ravi Kumar Prajapati
12D110035
Tensile stress evolution during deposition of Volmer-Weber thin film
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Adatomadatom interactions are stronger than those of the adatom with the surface.
Islands are formed due to this interaction.
Islands grow and impinge to form a
network of islands.
Coalesce and form a polycrystalline film.
During coalescence stresses are
generated.
Volmer-Weber Deposition
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Tensile stress generation
Nix-Clemens Model
Average stress
Zipping Distance
This model predicts values higher than those observed
in experiments
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Finite Elemental Method(FEM) used to form a modal for
coalescence process.
Island was represented by a two dimensional element of
plain strain.
A series of displacement were imposed along the surface to a
height Z to mimic the zipping process.
Sum of strain energy and interfacial
energy represented as the change in
the total energy.
These energies were calculated as a
function of zipping distance and min.
value of the energy corresponds to
equilibrium zipping distance Z.
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Values obtained from FEM modal were closer to values that are obtained by experiments.
Both the modals have different relation with radius of island.
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At low substrate coverage an island will impinge on only
those island which has not impinged on any other island.
First coalescence was represented as either traction at the
island-substrate interface or sliding at island-substrate
interface.
In traction one island stretched towards the other island to
form a grain boundary and generate a tensile stress.
In sliding one island moves towards other island and
generate a small compressive stress
Traction Sliding
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At higher substrate coverage islands coalesce with that
islands which has already coalesced.
In case of traction after second coalescence stress
approximately doubled.
In case of sliding after second coalescence stress is similar
to first coalescence by traction.
(i) And (ii) are first and second coalescence by traction
(iii) and (iv) are first and second coalescence by sliding
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Stress Relaxation
Diffusion of the matter through the grain boundary and surface
Stress relaxation rate
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Experimental stress measurement
Curvature was measured using multibeam optical
deflection technique.
By Stoneys equation Stress-thickness can be measured.
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Results from Simulation
When two islands impinged, the equilibrium zipping distance and
stresses within the island were calculated using the FEM results
for the plane strain geometry with traction.
To calculate avg. stress, stress obtained from new coalescence is
added to existing avg. stress in the island.
Stress relaxation was assumed to occur via diffusion mechanism
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Results from Simulation
In case of sliding two different types of coalescence occur.
First few coalescence results in slightly compressive
stress.
Further coalescence results in tensile stress.
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Discussion
There are mainly three features of stress-thickness vs film
thickness curves
First-
Onset thickness of stress-thickness.
In simulation with traction the onset of stress-thickness
occurred at much smaller thickness than that was
observed in experiment.
With increment in temperature this onset onset thickness
increases.
In case of sliding this onset occurs at higher thickness
than both above cases.
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Discussion
Second-
Maximum value of stress-thickness and corresponding
film thickness value.
Value of max. stress-thickness decreases and
corresponding film thickness increases as deposition
temperature increases.
Third-
Temperature dependence of the curve after maximum
value.
Slope of the curve is called rate of stress relaxation
This slope is decreases with increase in temperature.
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summary
To compare with analytical modal a modal using FEM was
developed. It was found that it was more consistent than
analytical modal with experimental measurement.
Two types of island coalescence behaviour were
considered.
In situ measurement of curvature was performed and
stress-thickness calculated during experiment.
Simulation produces similar qualitative result to
experimental .
measured maximum stress-thickness decreased, and
occurred at a larger film thickness, with increasing
deposition temperature.
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