group 14671
DESCRIPTION
Group 14671. Expansion Joint Active Monitoring. Team Members. Joe Savino Mechanical Engineer Adam Remick Electrical Engineer Andrew Hintermeier Mechanical Engineer. Risk Analysis. Full Assembly. Mounting. Mounting Plates. Threaded inserts. String Potentiometer. Infrared Sensor. - PowerPoint PPT PresentationTRANSCRIPT
Group 14671Expansion Joint Active Monitoring
Team MembersJoe Savino
Mechanical Engineer
Adam RemickElectrical Engineer
Andrew Hintermeier Mechanical Engineer
Risk AnalysisID Risk Item Effect Cause Like
lihood
Severity
Importance
Action to Minimize Risk
1 Battery Life DAQ Dies before Expected
Too much Power Consumption/Not Enough Batteries
2 2 4 Add Extra Batteries to Ensure Lifespan
2 Memory Storage Loses Most Recent Readings
Too Large of a Sample Size/Not Enough Memory
1 2 2 Add Ability to Add Extra uSD Cards/Increase Size of SD Card
3 Programming Time Unfinished Project Complexity/Scope of the Project
2 1 2 Using the Arduino Micro-controller to ease programming difficulties
4 Decrease in Max PSI on EJ
Reduced EJ Specs Sensor Mounting 2 2 4 Early Testing/Insert Design/Flange Mounting
5 Sensor failure Failure to Read New Data
Misunderstood Spec Sheet
1 2 2 Re-read Data Sheet and Call Suppliers with Questions
6 Mounting Failure Interference with EJ/Failure to Read Data
Bending/Poor Dimension Selection
1 2 2 Early Testing of Design
7 Electronics Box Failure
Electronics Ruined Unexpected External Factors
1 2 2 Full Understanding of Environmental Conditions
Full Assembly
Mounting Mounting Plates
Threaded inserts
Infrared Sensor
String Potentiometer
Axial DisplacementInfrared String Potentiometer
Ultrasonic
SpecsInfared String PotentiometerAccuracy: +/- 0.04 inPrice: $305Vin:Vout:
Accuracy: +/- 0.025 inPrice: $247Vin:Vout:
TemperatureInsert mounted ProbePrice:Vin:Vout:
Flange ProbePrice:Vin:Vout:
PressureRegular sensor with heat dissipation stemPrice:Vin:Vout:
Microprocessor Arduino Due
Arm Processor 3.3V Logic 3.3V and 5V Regulator on Board 54 Digital I/O’s 12 Analog Inputs (Can have up
to 12 sensor inputs) 4 UARTS 84MHz Clock Speed $50
Goals: Input Sensor Data Store sensor Data on SD Card Control a LCD Display Control LED ‘Out of Range’
Lights
Adafruit Micro-SD Card ReaderUses 1 UART Port
and 2 Extra I/O PortsMade to Work with
Arduino Board$15
LCD Display4 Lines of 20
Characters Each+5 V input from
Arduino DueUses 11 Digital I/O
PinsWill display the max
temperature, max displacement and max pressure
$25
LED OutputPass fail system:
If the EJ has experienced out of range data, LED’s turn on and stay on until uC is reset
One for each sensorUses One I/O port
per LED
Block Diagram
Micro
Pressure Sensor
Temperature Sensor
Displacement
Sensor
Pressure LED
Temperature LED
Displacement
LED
LCD Display
Micro-SD Card
D0-D7
Enable
R/W
D-Out
D-In
DataVccDataVccDataVcc
Clk
Bill of MaterialsItem Quantity Price (Total)
Arduino Due Test Board 1 $50.00
LCD Display 1 $25.00
Micro-SD Card Reader 1 $15.00Transistors 3 $5.00LED's 3 $5.00
uSD Card (32GB) 1 $22.00
Breadboard 1 $5.00
Random Electronics X $10.00
String Potetiometer 1 $199.00
Ultrasound Ping 1 $30.00
Thermocouple 2 $76.00
Pressure transducer 1 $350.001" bar stock 1 Ft $5.00
1/8"x6" steel plate 2 Ft $75.00
1/16" - 1/8" adapter 2 $8.00
1/8" to 1/4" adapter 1 $4.00
1/8" SS Piping 18" $20.00
Misc Harware x $40.00Total = $944.00
ScheduleT R S T R S T R S T R S T R S T R S T R S T R S T R S T R S T R S T R S T R S T R S T R S
Detailed Design/Gate Review Order sensors Create insert for testing Have insert tested at Garlock Redesigned Inserts Retest Inserts Create code for DAQ Finalize drawings Determine where/how to create parts Testing Create Code for Data Analysis Create Code or Display
Questions?
Schedule Week 1 Week 2 Week 3 Week 4 Week 5 Week 6 Week 7 Week 8 Week 9 Week 10Week 11Week 12Week 13Week 14Week 15
T R S T R S T R S T R S T R S T R S T R S T R S T R S T R S T R S T R S T R S T R S T R S
Create Problem Definition
Create Customer Needs
Create Engineering Specs
Create Interview Questions
Interview Customer/Garlock Visit
Create Functional Decomposition
Concept Development
Create Pugh Charts
Risk Assesment
Benchmarking
Sensor Research
Basic ANSYS Model
Engineering Analysis (1st Order)
Engineering Analysis (2nd Order)
Sensor Selection
Test Plans Created
Custom Parts Designed
Order Sensors
Presentations
Problem Definition Presentation
System Design Review
Subsystem Design Review
Fourth Presentation
DDR Presentation
Back Up Slide
Engineering AnalysisSimulated an EJ under compression and
tension in ANSYS WorkbenchDisplacement of ±1 inchUsed to determine where stress
concentrations will beHelps to determine sensor placement
Compression
Tension
Engineering AnalysisAvoid areas in the middle of EJ and areas
right below or above flangesEmbed sensors in between these areasMinimize risk of EJ leaking after sensors are
embedded
Engineering Analysis-InsertPullout force in ABS plastic is 900lbfAssume fluid pressure of 2000psi (higher
than burst pressure of EJ)For .25 diameter thread, OD is .391
Temperature Isolation of Pressure sensorMay not be able to find a pressure sensor
that can withstand the temperature EJ doesCan use a tube protruding from EJ to
dissipate heatA stainless steel tube would need to extend at
least 6 in out for our applications
Instructions/Example CodeSD Card:
http://learn.adafruit.com/adafruit-micro-sd-breakout-board-card-tutorial/wiring
Analog Input to SD Cardhttp://arduino.cc/en/Tutorial/Datalogger
Displaying to a LCD Displayhttp://arduino.cc/en/Tutorial/LiquidCrystalSeria
l
Connection Diagram to LED Screen