GLANZOX'Silicon Polish

TGLANZOX

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GLANZOXØftF.ÉN+hÉTypical Physical Properties of GLANZOX

TGLANZOXlVith the increasing integration of semiconductor der,ices and the

larger size of wafers, a damage-, haze- and heavy metal contamination

free, flat, as ¡¡u'ell as nanotopography mirrorìike silicon surface is

essentiâI. Fujimi's GLANZOX series was developed to meet such

requirement. GLANZOX polish consists of colloidal silica dispersed in a

liquid composed of special ingredients. This product results in an

almost perfectly polished surface. In response to the recent demand for

considerable reductions in the metal impulities that affect device

characteristics, higher-grades of polish containing ultra-pure colloidal

siìica have been developed.

-=.-.t----jlëft€ rypeIFE ltem -----=\- HP-20 1 100

ÈFiâ\Main component

#ãffiÉ. ultra-pureSiOzf, tr I I )v (colloidal)

ËËlúÉ ultra-pureSiOzrtrl9), Golloidal)

SiOze:Content of SiOz (%)

17.5 17.5

PH 11 .4 11.5

bLÉ Specific gravity 1.11 1.10

+fi#n+ÆAveraqe particle size (nm) 35 35

E\A¡HrõApplication

1'^, 2'&For First and second polishing

1>k, 2>k.

For First and second oolishino

{+#^äIStandard Net weighl

20kg 20kg

1..'7ÀDrum

220k9

---------------€¡fr8 rypeiFE ltem ------=\ 3900 3900RS 3950 31 00

ÈFJ¿â.Main comoonenl

ËËËlÉË Ultra-pureSiOzrtrlS), Golloidal)

frËËlÉÉ Ultra-pureSiOzf tr I I Jt' (colloidal)

frËËfÉÉ Ultra-pureSiOzrtr19), Golloidal)

ËËË=lÉË Ultra-pureSiOzr tr I I )v (colloidal)

SiOaËContent of SiOz (%)

9.1 9.1 4.5 9.1

PH 10.5 10.5 10.8 10.3

btê Specific qravity 1.05 1.05 1.03 1.05

+Jâ+n+æ.Averaqe particle size (nm) 35 .J3 aà 35

ÆËApplication

FinalÆFor final polishinq

FinalÆFor final oolishino

l-tnalFH

For final oolishinqFinalÆ

For final polishing

++#^äfStandard Net weiqht

10k9,20kg 1 Okg 1 Okg 1 0kg

F'ADrum

200k9 200k9 200k9 200k9

FUJIMI INCOFIPOFIATED

H14 7 1000

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TEL(052)503-91 1 2 F AxßsÐ5æ7734

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