2012/09/01 09:46 1/9 General Note #1 :Different kinds of IC Packages

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General Note #1 :Different kinds of ICPackages

Image Name Description & Examples

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Ball GridArray akaBGA

BGA packages are used to permanently mountdevices such as microprocessors. A BGA canprovide more interconnection pins than can beput on a dual in-line or flat package. The wholebottom surface of the device can be used,instead of just the perimeter.The leads are alsoon average shorter than with a perimeter-onlytype, leading to better performance at highspeeds.Soldering of BGA devices requiresprecise control and is usually done byautomated processes. A BGA device is nevermounted in a socket in use.

Plastic QuadFlat Packageaka PQFP

The Plastic Quad Flat Pack, or PQFP, is an ICpackage with leads extending from all four sidesof the package body. PQFP's are predominantlysquare in shape, although rectangular variantsdo exist. The PQFP is just one of the many typesof the quad flat pack (QFP) package.

CeramicColumn GridArray, orCCGA

The Ceramic Column Grid Array, or CCGA, is asquare-shaped or rectangular ceramic packagethat uses solder columns for external electricalconnection instead of leads or solder balls.These solder columns are arranged in a grid orarray at the bottom of the ceramic packagebody, hence the name 'ceramic column gridarray'. The CCGA is basically just a CBGApackage that has solder columns instead ofsolder balls.

PSOP - PowerSmall OutlinePackage

The Power Small Outline Package, or PSOP, is arectangular small outline IC package developedby Amkor that integrates a copper heat slug inits plastic body. The die is attached to this heatslug, increasing the chip's ability to dissipateheat and thus handle more power.

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CerDIP -Ceremic DualIn-linePackage

The Ceramic Dual In-line Package, or CerDIP isone of the most mature IC packages still in usetoday. It is a rectangular ceramic package thathas leads extending from both of its longersides, thus forming two sets of in-line pins.

QFN - QuadFlat No Leads

The Quad Flat No Leads package, or QFN, is avery small square-shaped or rectangularsurface-mount plastic package with no leads. Itis basically a quad flat package, except for theabsence of leads protruding from its sides. Metalpads or lands around the periphery of thebottom of the QFN package serve as electricalconnection points to the outside world. Becausethe QFN has no leads and has shorter bond wirelengths, it exhibits less inductance than leadedpackages and therefore provides a higherelectrical performance. The QFN package alsoincludes an exposed thermal pad at thepackage bottom to facilitate heat dissipationfrom the die.

CeramicPackage, orCerpack

The Ceramic Package, or Cerpack, is ahermetically sealed rectangular ceramicpackage that has leads extending from both ofits longer sides, thus forming two sets of in-linepins. It is therefore a type of dual-in-linepackage (DIP) like the CerDIP.

QSOP -Quarter SizeOutlinePackage

The Quarter Size Outline Package, or QSOP, is asmall rectangular surface-mount plasticpackage with gull wing leads protruding out ofits longer sides.The QSOP comes in twostandard body widths: the narrow body QSOPwhich has a nominal body thickness of 150 milsand the wide body QSOP which has a nominalbody thickness of 300 mils. Typical QSOP leadcounts range from 16 to 28 leads for the narrowbody and 36 to 44 leads for the wide body. TheQSOP lead pitch is typically 25 mils.

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CLCC or LCC -CeramicLeadless ChipCarrier

The Ceramic Leadless Chip Carrier, or CLCC orLCC, is a square or rectangular surface-mountceramic package that has no leads. Forelectrical connection to the outside world, theLCC instead uses flat metal contacts (ormetallized castellations) known as pads aroundthe four sides of the package bottom.

SidebrazePackage

The Sidebraze Package, is one of the mostmature IC packages still in use today. It is arectangular ceramic package that has leadsextending from both of its longer sides, thusforming two sets of in-line pins. It is therefore atype of dual-in-line package (DIP). Two otherwidely used DIP's are the PDIP and the CerDIP.

CPGA -Ceramic PinGrid Array

The Ceramic Pin Grid Array, or CPGA, is a squareor rectangular through-hole ceramic packagewhose pins or leads are arranged in a squarearray at the bottom of the package body. TheCPGA can either have a frit-sealed ceramic lid ora solder-sealed metal lid.The CPGA is just one ofseveral types of the PGA package. The PGA is apopular choice for devices with high I/O countssuch as microprocessors because of its high pindensity.

Small OutlineTransistor(SOT)Package

Small Outline Transistor (SOT) packages arevery small, inexpensive surface-mountplastic-molded packages with leads on their twolong sides. Due to their low cost and low profile,SOT's are widely used in consumer electronics.The SOT-23 and the SC-70 packages are two ofthe most widely used SOT packages today. Notethat aside from these two, there are many otherSOT package types used in the IC industry.

CQFP -CeramicQuad FlatPack

The Ceramic Quad Flat Pack, or CQFP, is aceramic IC package with leads extending fromall four sides of the package body. CQFP's arepredominantly square in shape, althoughrectangular variants do exist. The CQFP is justone of the many types of the quad flat pack(QFP) package.

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Single-in-LinePackage (SIP)

The Single-in-Line Package, or SIP, is an ICpackage that has a single row of leadsprotruding from the bottom of its body. It is notas widely used as dual-in-line packages such asthe PDIP and the CerDIP because of its limitednumber of pins. SIP's are often used inpackaging networks of multiple resistors.

D2PAK orDDPAK -DoubleDecawattPackage

The Double Decawatt Package, or D2PAK orDDPAK is the successor to the DPAK package,which was designed by Motorola to encasediscrete high-power devices. The D2PAK isbigger than the DPAK, and comes in severalversions with different terminal counts. TheD2PAK, which has a flat heat sink at the back, isbasically the surface-mount equivalent of theTO-220 through-hole package and is thereforesometimes referred to as 'SMD-220'. The D2PAKis also known as 'TO-263'.

SOIC - SmallOutlineIntegratedCircuit

The 'Small Outline Integrated Circuit', or SOIC, isa small rectangular surface-mountplastic-molded integrated circuit package withgull wing leads. The leads protrude from thelonger edge of the package. It is one of the mostcommonly used surface mount packages today.

D3PAK -DecawattPackage 3

The Decawatt Package 3, or D3PAK, is a biggerversion of the D2PAK package. Just like theD2PAK (and the DPAK, the D2PAK'spredecessor), the D3PAK is a surface-mountplastic-molded package intended for high-powerdiscrete devices. The D3PAK is also known byother names such as 'TO-268' and 'DiscretePackage 3'.

SOJ: SmallOutlineJ-LeadPackage

The 'Small Outline J-Lead Package', or SOJ, is asmall rectangular surface-mount plastic-moldedintegrated circuit package with J-formed leads.The leads protrude from the longer edge of thepackage. The SOJ is also sometimes referred toas 'SOIJ', or J-leaded small outline IC package.

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DFN - DualFlat No Leads

The Dual Flat No Leads package, or DFN, is avery small square-shaped or rectangularsurface-mount plastic package with no leads.Metal pads or lands along two sides of thebottom of the DFN package serve as electricalconnection points to the outside world. The DFNis similar to the QFN, except that the latter haslands all around the periphery of the packageinstead of just two sides like the DFN.

DPAK -DecawattPackage

The Decawatt Package, or DPAK, is an ICpackage developed by Motorola to encasediscrete high-power devices. The DPAK is alsoknown as the 'TO-252'. The acronym 'DPAK' canalso stand for the term 'DiscretePackage'.DPAKs can have 3 or 5 terminals.

SPDIP -Shrink PlasticDual-in-LinePackage

The Shrink Plastic Dual In-line Package, or SPDIP,is a rectangular plastic package with leadsextending from both of its long sides, thusforming two sets of in-line pins. The SPDIP isactually just a 'shrink' version of the PDIP. Assuch, the SPDIP provides a smaller package sizecompared to a standard PDIP for the same leadcount.

FBGA -Fine-PitchBall GridArray

The Fine Pitch Ball Grid Array, or FPBGA or FBGA,is a smaller version of the ball grid array (BGA)package. As in all BGA packages, FBGA's usesolder balls that are arranged in a grid or arrayat the bottom of the package body for externalelectrical connection. However, the FBGA isnear-chip-scale in size, with a smaller andthinner body than the standard BGA package.As its name implies, it also features a finer ballpitch (smaller distance between balls).

SSOP -Shrink SmallOutlinePackage

The Shrink Small Outline Package, or SSOP, is asmaller or 'shrunk' version of the SOIC package,having a compressed body and a tightened leadpitch.

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JLCC -J-LeadedCeramic ChipCarrier

The J-Leaded Ceramic Chip Carrier, or JLCC, is asquare or rectangular surface-mount ceramicpackage that has J-formed leads around itsperiphery. The plastic-molded equivalent of theJLCC is the PLCC.

TDFN - ThinDual Flat NoLeads

The Thin Dual Flat No Leads package, or TDFN,is a very small and thin square-shaped orrectangular surface-mount plastic package withno leads. Instead of leads, it uses metal padsalong two sides of the package body forelectrical connection to the outside world. It isbasically a thinner version of the dual flat noleads (DFN) package.

LFBGA - LowProfileFine-PitchBall GridArray

The Low-Profile Fine Pitch Ball Grid Array, orLFPBGA, is a smaller version of the ball gridarray (BGA) package. It is basically an FBGApackage that has a package height ranging from1.2 mm and 1.7 mm. It is therefore thicker thanthe TFBGA and the VFBGA.

TFBGA - ThinProfileFine-PitchBall GridArray

The Thin Profile Fine Pitch Ball Grid Array, orTFBGA, is a thinner version of the FBGA package.Like all BGA packages, TFBGA's use solder ballsthat are arranged in a grid or array at thebottom of the package body for externalelectrical connection. The TFBGA isnear-chip-scale in size and features ball pitchvalues that are even tighter than those of theFBGA.

TQFN - ThinQuad Flat NoLeads

The Thin Quad Flat No Leads package, or TQFN,is a very small and thin square-shaped orrectangular surface-mount plastic package withno leads. Instead of leads, it uses metal padsaround the periphery of the bottom of thepackage body for electrical connection to theoutside world. It is basically a thinner version ofthe quad flat no leads (QFN) package.

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LGA - LandGrid Array

The Land Grid Array, or LGA, is a package thatuses metal pads for external electricalconnection instead of leads (as in the pin gridarray) or solder balls (as in the ball grid array).These metal pads, which are called 'lands', arearranged in a grid or array at the bottom of thepackage body, hence the name 'land grid array'.The grid arrangement of the lands of the LGApackage allows it to have a high land count,making it a popular packaging option fordevices with high I/O requirements.

TQFP - ThinQuad FlatPack

The Thin Quad Flat Pack, or TQFP, is asurface-mount IC package with gull wing leadson all four sides of the package body. It isbasically a thinner version of the MQFP andLQFP.

LQFP - LowProfile QuadFlat Pack

The Low Profile Quad Flat Pack, or LQFP, is asurface-mount IC package with leads extendingfrom all four sides of the package body.

TSOP - ThinSmall OutlinePackage

The Thin Small Outline Package, or TSOP, is arectangular IC package with a thickness of 1.0mm. There are two types of TSOP's. The Type ITSOP has its leads protruding from the shorteredges of the package. The Type II TSOP has itsleads protruding from the longer edges of thepackage.

MLP - MicroLeadframePackage

The Micro Leadframe Package, or MLP, is aJEDEC-compliant, very thin, near-CSPsquare-shaped or rectangular surface-mountplastic package uses metal pads instead ofleads for electrical connection to the outsideworld. The MLP belongs to the same 'no leads'package family as the QFN and the DFN.

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TSSOP - ThinShrink SmallOutlinePackage

The Thin Shrink Small Outline Package, orTSSOP, is a rectangular surface mount plasticpackage with gull-wing leads. It has a smallerbody and smaller lead pitch than the standardSOIC package. It is also smaller and thinner thana TSOP with the same lead count.

MQFP -Metric QuadFlat Pack

The Metric Quad Flat Pack, or MQFP, is asurface-mount IC package with gull wing leadson all four sides of the package body.

UTDFN - UltraThin DualFlat No Leads

The Ultra Thin Dual Flat No Leads package, orUTDFN, is a very small and thin square-shapedor rectangular surface-mount plastic packagewith no leads. Instead of leads, it uses metalpads along two sides of the package body forelectrical connection to the outside world. It isbasically a thinner version of the thin dual flatno leads (TDFN) package.

MSOP - MicroSmall OutlinePackage

The Micro Small Outline Package, or micro-SOPor MSOP, is a very small rectangular plasticpackage with gull wing leads protruding out ofits longer sides. The MSOP is a miniaturizedversion of the SSOP package, having a smallerfootprint than the latter.

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UTQFN -Ultra ThinQuad Flat NoLeads

The Ultra Thin Quad Flat No Leads package, orUTQFN, is a very small and thin square-shapedor rectangular surface-mount plastic packagewith no leads. Instead of leads, it uses metalpads around the periphery of the package bodyfor electrical connection to the outside world. Itis basically a thinner version of the thin quadflat no leads (TQFN) package.

PDIP - PlasticDual-in-LinePackage

he Plastic Dual In-line Package, or PDIP, is one ofthe most mature plastic IC packages still in usetoday. It is rectangular in shape and has leadsextending from both sides along its length, thusforming two sets of in-line pins.

VSOP - VerySmall OutlinePackage

The Very Small Outline Package, or VSOP, is oneof several smaller versions of the SOIC package,having a compressed body and a tightenedpitch for its gull wing leads. Another smallerversion of the SOIC is the SSOP.

PLCC - PlasticLeaded ChipCarrier

The Plastic Leaded Chip Carrier, or PLCC is afour-sided plastic package that has “J” leadsaround its periphery. These “J” leads occupyless board space than the gull-wing leads thatother packages like the SOIC have. PLCC leadcounts range from 18 to 84. PLCC packages caneither be square or rectangular in shape. Theceramic equivalent of the PLCC is the JLCC.

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