gem and micromegas production rui de oliveira te/mpe/em
DESCRIPTION
GEM and Micromegas production Rui De Oliveira TE/MPE/EM. Summary. GEM Single mask process Micromegas Bulk Classical resistive. GEM process step by step. 2 suppliers : Sheldhal (US) Nippon steel ( Jp ). 5um Copper. 50um Polyimide. CR layer 10nm. 5um Copper. Base material - PowerPoint PPT PresentationTRANSCRIPT
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Rui De Oliveira 1
GEM AND MICROMEGAS PRODUCTION
RUI DE OLIVEIRATE/MPE/EM
30/09/2010
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Rui De Oliveira 2
Summary
GEM Single mask process Micromegas
Bulk Classical resistive
30/09/2010
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Rui De Oliveira 3
GEM process step by step
30/09/2010
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5um Copper
5um Copper
50um Polyimide
Base material50um adhesiveless copper clad PolyimideRolls of 100m x 600mmPolyimide : APICAL NP or AV
30/09/2010
2 suppliers :Sheldhal (US)Nippon steel (Jp)
CR layer 10nm
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Photoresist deposition15um dry resist (KL 1015 – Korea)
15um resist
15um resist
30/09/2010
Maximum size 100m x 600mmDupont manual laminators
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Rui De Oliveira 6
Photoresist holes patterning
15um resist
15um resist
30/09/2010
70um
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Rui De Oliveira 7
Top copper etching
30/09/2010
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Resist stripping
30/09/2010
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Rui De Oliveira 9
Polyimide anisotropic etching
30/09/2010
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Bottom resist protection deposition
30/09/2010
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Rui De Oliveira 11
Bottom copper etch by chemical reaction
Top copper protected by galvanic connection
etchant
30/09/2010
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Rui De Oliveira 12
Resist stripping
30/09/2010
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Soft Polyimide etching The hole become double conical
30/09/2010
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Rui De Oliveira
cross section pictures
1430/09/2010
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Comparison with std GEM from external supplier
1530/09/2010
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examples
30/09/2010
Large GEM already produced:
ILC Dhcal: 1m x 33cm (5 pieces)Kloe: 750mm x 40cm (30pieces)CMS: 1m x 45cm (40 pieces)
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GEM single mask process summary
30/09/2010
Chemical Polyimide etching
Second Polyimide etching
Copper electro etching
Stripping
Reality
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PCB
lamination
Mesh deposit
lamination
development
Bulk Micromegas
BULK Technology
DUPONT PC 1025 coverlayBOPP MeshesSERITEC stretching
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1919
• Pad read-out 1cm², thickness 8mm for ILC Hadronic calorimetry
• Tested in the RD51 1 kHz beam.• The BULK is made on a populated PCB
Bulk Micromegas ILC DHCAL first m2
LAPP Annecy
• Pad read-out large TPC
• Neutrino detector• 10 sqr meter in
service
T2K experimentJapan (CEA Saclay)
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Resistive Bulk MicroMegas
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PCB
PCB
PCB
-Not compatible with pitchessmaller than 0.4mm-Thixotropic paste
Screen printing of for the resistive strips
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Double sided BoardResistive strip deposit
Bulking
Test before closingClosing
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Rohacell
Aluminum support plate
Stiffening panel
Drift electrode
Pillars (128 µm)
PCB1 PCB2
Classical MicroMegas resistive or not
1 x 1m2 not to scale detector opened
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Stiffening panel
Rohacell
Aluminum support plate
5.00
PCB1 PCB2
1 x 1m2 not to scale detector closed
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flat gluing < 10um error
Flat board < 30um error
Mesh on drift (10Ncm )