fundamentals of mems - university of minnesota 01 introduction to... · fundamentals of...
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Fundamentals of MEMSProf. Tianhong Cui, Mechanical Engineering
ME 8254
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Who Cares About MEMS?
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Overview
What is micromanufacturing and MEMS?
Why the interest in MEMS?
IC Fabrication Processes
Bulk Micromachining Processes
Surface Micromachining Processes
Combined Processes
References
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Electrostatic Micromotor
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Micropump
Self-PrimingFlexibleBiocompatibleLow Cost
Self-PrimingFlexibleBiocompatibleLow Cost
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MEMS from the MicroelectronicsRevolution
IC Industry Timeline
2007
Billions of transistors
1947
single transistor
1958
first IC
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MEMS Timeline
1980
2020
1999
(1.3 million micro-mirrors)TI DMD
MedicalMEMS?
Bulk micromachinedpressure sensor
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Top 30 MEMS Manufacturers
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Top 20 MEMS Foundries
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Accelerometer, Gyroscope, and IMU’sled by Consumer Electronics
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MEMS Product Evolution
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MEMS Forecast(Courtesy from Yole Development)
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Micro-Electro-Mechanical Systems (MEMS) is theintegration of mechanical elements, sensors, actuators, andelectronics on a common substrate through the utilization ofmicrofabrication technology or “microtechnology”.
So what exactly is MEMS?
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MEMS Examples
pressure sensorsaccelerometersflow sensorsinkjet printersdeformable mirror devicesgas sensorsmicromotorsmicrogearslab-on-a-chip systems
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General MEMS Advantages
Batch fabrication– Reduced cost
Reduced size– Is everything better smaller?
Reduced power
High precision
New capabilities?
Improved performance?
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The MicroTechnology/MEMS Tool Set
Cleanroom plusmicrofab processes
+
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Micromachining Processes Standard Integrated Circuit (IC) Processes
– Identical to those used in IC fabrication
– Generally used for surface micromachining
Surface Micromachining– Additive processes
Bulk Micromachining– Subtractive Process
Dividing line can become very blurry
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Standard IC Processes
Source:CWRU
Source: Jaeger
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Standard IC Processes
Photolithography Source:Jaeger
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Standard IC Processes
• Sputtering• Evaporation• Thermal Oxidation• CVD• Spinning• Epitaxy
1) Deposit/Grow Thin Films
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Standard IC Processes
• Lithography• Etching Techniques (wet, dry, RIE)
2) Pattern Thin Films
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Standard IC Processes
• Thermal Diffusion• Ion Implantation
3) Introduce Dopants (to form electrically-activeregions for diodes, transistors, etc.)
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Micromachining Processes
• wet vs dry• isotropic vs anisotropic• subtractive process
Bulk Micromachining
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Micromachining Processes
Bulk Micromachining
Source: Maluf Source: Maluf
Source: Madou
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Micromachining Processes
• high density ICP plasma• high aspect ratio Si structures• cost: $500K
Deep Reactive Ion Etching (DRIE)
Source: LucasNova
Source: AMMISource: STS Source: STS
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Micromachining Processes
• additive process• structural & sacrificial layers
Surface Micromachining
Source: Sandia
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Micromachining Processes
• uses x-ray lithography (PMMA), electrodeposition andmolding to produce very high aspect ratio (>100) micro-structures up to 1000 um tall (1986)
LIGA (lithographie, galvanoformung, abformtechnik)
Source: Madou Source: Kovacs
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MEMS Examples
Micro-structures using LIGA
Source: UW
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Micromachining Processes
• uses optical epoxy negative-resist (SU-8) developed by IBMto produce high aspect ratio micro-structures (1995)
Poor Man’s LIGA
Source: Maluf
UofL Micro-reaction wells: 150 um wide,120 um tall, 50 um wall thickness
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Micromachining Processes
• glass-Si anodic bonding• Si-Si fusion bonding• eutectic bonding• low temp glass bonding
Wafer-Level Bonding
Source: EVSource: Maluf
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MEMS Examples
Pressure Sensor (conventional) Source: NovaSensor
Source: UofL
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MEMS Examples
Micromotors
Source: MIT and Berkeley
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MEMS Examples
Optical MEMS (MOEMS)
Source: NIST, Simon Fraser, UCLA, and MCNC
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MEMS Examples
Pressure Sensor (ultra-miniature)
Source: NovaSensor
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MEMS Examples
Lab-on-a-Chip Systems
Source: Caliper
• separation• dilution• mixing and dispensing• analysis
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MEMS Examples
Micromachined Tips for FEDs and AFMs
Source: IBMSource: Micron (?)
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MEMS Examples
Neural Probes
Source: Mich (K. Wise)
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MEMS Examples
Neural Interface Chip
Source: Stanford
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MEMS Examples
Micro-Grippers
Source: Berkeley
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MEMS Examples
Micro-Tweezers
Source: MEMS Precision Instruments
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MEMS Examples
Optical MEMS (MOEMS)
Source: IMC (Sweden), Maluf and TI
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MEMS Examples
Accelerometers
Sources: Analog Devices, Lucas NovaSensor, and EG&G IC Sensors
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MEMS Examples
Channels, Nozzles, Flow Structures, and Load Cells
Source: EG&G IC Sensors
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Microreactor
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SU8 High AR Structures
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PZT Cantilever BEAM
thickness 4.5mmwidth 300mmlength 1000mm15mm at 10 VOTS coating toprevent from stiction
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Micropump
• Bimetallic thermal actuation• Three-layer silicon• Middle layer has 2 check valves• Flowrate 190 mL/min• Back pressure 80 mm H2O
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MEMS References
Micromechanics and Mems : Classic and Seminal Papers to1990; by W. Trimmer (Editor)
Micromachined Transducers Sourcebook; G. Kovacs
Fundamentals of Microfabrication; Marc J. Madou
Microsensors; by Richard S. Muller, Roger T. Howe, StephenD. Senturia, R. Smith (Editors)
An Introduction to MEMS Engineering; by Nadim Maluf
Silicon Micromachining; by Elwenspoek and Jansen
MEMS and Nanotechnology Clearinghouse: www.memsnet.org