fujitsu microelectronics america corporate profile

Fujitsu Microelectronics America Corporate Profile

2 © Fujitsu Microelectronics America, Inc. 2008

Fujitsu Microelectronics in ReviewFujitsu Microelectronics in Review

1976 Predecessor to Fujitsu Microelectronics, Inc. (FMI) formed under Fujitsu America, Inc.

1979 FMI formed as a subsidiary of FAI, headquartered in Santa Clara, CA 1980 FMI became a wholly owned subsidiary of Fujitsu Limited 2001 Fujitsu Microelectronics America, Inc. formed 2003 FMA moved headquarters to Fujitsu North America Headquarters in Sunnyvale, CA

Fujitsu N. A. Headquarters in Sunnyvale, CA FMA (Bldg E) In Fujitsu N.A. Headquarters in Sunnyvale, CA


Fujitsu Organization

President and Representative Director

H. Kurokawa

Chairman and Representative Director N. Akikusa

Electronic DevicesBusiness

Technology Solution

Ubiquitous ProductSolution

T. Ono Corporate Senior Executive VP ( Manufacturing innovation & Electronic Device business )

S. Fujii Corporate Senior VP　　 President, Electronic Device Business Group

K. Ishizaka Corporate VP, Executive VP, Electronic Device Business Group

( Operational Management ) H.Yagi Corporate VP, Executive VP, Electronic Device Business Group ( Advanced & common technologies )

Corporate Senior Executive VP : M.Ogura (CFO)Corporate Senior Executive VP : C.Ito (Global Business)Corporate Senior Executive VP : M.Mazuka (Japan Business)

Ubiquitous Product BusinessProduct Business Support

System Product Business Service Product BusinessSolution Business SupportInfrastructure Solution BusinessFinancial Solution Business Government & Public Solution

J.Murakami Executive VP, Electronic Device Business Group ( Marketing & Product )


Global Presence / R&D and Design Centers

Regional HeadquartersRegional Headquarters

cc America, Inc.America, Inc.


FMA Channel PartnersFMA Channel Partners

Sales Reps (U.S. and Canada)

Northwest• Paragon (Northern CA)• SiFore Technical Sales (OR, WA)

Southwest• Innovation Sales (Southern CA)• Luscombe Engineering (AZ)

Central• Technical Marketing (TX)• Innovation Sales (CO, UT)

Northeast• Pipe-Thompson Technologies

(Canada)• Quality Components (NY)• Procomp (MA)• Synergistic Sales (IL, WI, MN)

Southeast• Comrep (Al, NC, GA)• Semtronic (FL) • Arbotek (MD, VA)

Middle Atlantic• Victory Sales (MI, OH)• Bear VAI Technology (IN, PA, OH)• T.A.M. (NJ)

Sales Reps (Americas)

Puerto Rico• Semtronic

Mexico• Insight Demand Creation

Argentina• Phoenix REP Sales

Brazil• Phoenix REP Sales

Distributors U.S. and Canada

• Arrow Electronics Puerto Rico

• Arrow Electronics Brazil

• Arrow Electronics Argentina

• Elko / Arrow


FMA’s Advanced LogisticsFMA’s Advanced Logistics

Warehouse Located in the Exel Inc. facility (Coppell, Texas) Close to the Dallas / Fort Worth airport Provides logistic services, including:

Buffer stock program Demand pull program Just In Time (JIT) program Quick shipment options Drop shipment options


Providing Total IC Solutions Providing Total IC Solutions


Key Market Segments

Networking Enterprise / Access Storage Wireless

Automotive Consumer Industrial Security

Key Product Groups and Services

Custom LSI Services and Manufacturing

Wireless Solutions WiMAX SoCs

Networking Solutions 10Gbps Ethernet Switch ICs

Embedded Solutions MCUs, GDCs, IDB1394 Biometric Sensor ICs

FRAM New Products

H.264 Codec & Transcoder Milbeaut Tuner

Market Segment and Application FocusMarket Segment and Application Focus


Fujitsu’s IDM Business Strategy

Foundry Foundry

System Arch / DesignSystem Arch / Design

TechnologyTechnology

ASICASIC

SoCSoCLogic DesignLogic Design

System Arch / DesignSystem Arch / Design

ManufacturingManufacturing

New IDM Conventional Business

Logic DesignLogic Design

Physical DesignPhysical Design

As we move to 65nm process technology, design and manufacturing become more complex while time-to market schedules continue to compress. The solution for companies developing new ASICs, SoCs and ASSPs is to work very closely with their foundry and fab partners.


Leadership in IDMLeadership in IDM

90nm / 65nm Technology and Beyond Designs are complex Design processes are difficult and manufacturability is questioned

Fujitsu’s Answer Integrated Device Manufacturing service business model Building strategic customer relationships Strong and close collaboration with customers from development, design to

manufacture Emphasize partnerships with third parties, e.g. IP vendors and EDA vendors

FMA Integrates Design and Manufacturing Services Advanced process technology at 90nm and 65nm Expanded foundry services, including 300mm Global packaging leadership

FMA Adds a Full Set of Capabilities AccelArray / ASIC / COT Robust design methodology Broad portfolio of complex and differentiated IP families LSI solutions – application platform approach


Fujitsu’s 300mm (90nm/65nm) Fujitsu’s 300mm (90nm/65nm) Wafer Plant in MieWafer Plant in Mie

Building 1Building 2

0

5,000

10,000

15,000

20,000

25,000

Capacity(300mm)

(wafers / month)

Sept 2006 March 2007 Sept 2007 March 2008

Building 1

Building 2


Fujitsu is now accepting ASIC designs for production using its 65nm process for its North American customers

10 products under development High-performance Products

PC CPU Large scale FPGA Graphics

Low-power Products Image processors Digital AV products

65nm Custom LSI Products (CS200/CS200A)65nm Custom LSI Products (CS200/CS200A)

SRAM Chip

Logic Chip


WiMAX – Fujitsu’s End-to-End AdvantageWiMAX – Fujitsu’s End-to-End Advantage


Mobile WiMAX Applications

Target Product Roadmap

UbiquitousBroadband

MobileVoIP & Data

UbiquitousQuad Play

Fea

ture

s

+

+


Industry's Most Powerful 20-port 10Gigabit Ethernet Switch ICIndustry's Most Powerful 20-port 10Gigabit Ethernet Switch IC

MB8AA3020 Evaluation Board

Industry Firsts 10GbE serial – direct XFP compatible interface Congestion management – BCN and priority pause On-chip micro-engine

Reduces S/W development time VLAN virtualization

Applications Blade-server switching blade ATCA carrier node blade

Mesh configuration Centralized switch

Micro-TCA hub Enterprise switching High-performance computing


MCU Roadmap – Expansion MCU Roadmap – Expansion 8-bit F2MC-8FX: Further expansion of low-end MCU family

High-performance 8-bit CISC CPU and low power consumption Improves 10MHz single-cycle operation to 16MHz single-cycle operation

16-bit F2MC-16LX and -16FX: New products for mid-range MCUs Technology migration to 0.18µm 16FX series provide more than 20MIPS, five times the performance of the

predecessor 16LX, or one fifth of the power consumption for the same task

FR60: New family of high-end MCUs Technology migration to 0.18µm, while supporting 5V power supply Up to 4MB of Flash 100MHz operation up to 105ºC, automotive environment Up to 6 CAN I/F with support for 128-message buffer per channel


MCU – Target MarketsMCU – Target Markets

Automotive Embedded Flash High-end CAN / LIN FlexRay

Industrial / home appliances Embedded Flash Security features Low power Motor controller

Consumer Embedded Flash High performance Low power Display controller


FlexRay™ ASSP – MB88121A FlexRay™ ASSP – MB88121A

FlexRay Evaluation Kit

Fujitsu FlexRay: a part of full support for automotive networks Support FlexRay Protocol Spec 2.1

Deterministic time-trigger protocol, max 10Mbps x 2ch Redundancy for safety, suitable for x-by-wire applications Support for flexible topology – bus, star, hybrid Flexible segment structure of the date – static and dynamic segment

Provides total support covering MCUs, software, transceivers, and analysis tools required for development


IDB-1394™ ASSP – MB88387 IDB-1394™ ASSP – MB88387 Fujitsu IDB-1394: full support for automotive networks Provide automotive multimedia infrastructure at 400Mbps using 1394b

standard Scheduled to support direct BT.601 I/F at next-generation ASSP MB883xx Near loss-less compression technology SmartCODEC will provide full use of

1394 bandwidth for video applications

Rear-seat Entertainment System Example Efficiency of SmartCODEC


Product family continues to expand New product announcement at Convergence Significant announcements to follow

Fujitsu GDCs are high-powered 3D GPUs that include many special display-control capabilities

Co-processor architecture completely off-loads graphic and display operations from the MCU

Graphics Display Controllers (GDC)


FMA SummaryFMA Summary

FMA’s Advantages Global Operations

• Fujitsu’s global presence and resources• Ability to offer global solutions and engage the customer irrespective

of geographic boundaries• Established sales and operations network• Advanced logistics• Business development function offering partnership options to early-

stage companies Technologies, Products and Services

• System-level expertise• Leadership in IDM• Flexible engagement models including COT, ASIC and AccelArray• Taking advantage of U.S. centric partnerships, technology and

innovation to develop complex SoCs for the worldwide market• Wide portfolio of MCUs with in-depth local technical support• Differentiated ASSPs and local applications engineering support

fujitsu microelectronics america corporate profile

Documents

fujitsu america

fujitsu organizationpresident

murakami executive vp

yagi corporate vp

ishizaka corporate vp

design centerscc america

services custom lsi

logistic services