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TRANSCRIPT
FluidANT printing
Design guidelines
2015.09.24
Version 14
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| All Rights Reserved | 2015
Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
Vocabulary and abbreviations
Term Definition
Ink Material used to print the pattern
Pattern The printed conductor composed of printed areas and printed lines
Printed area The area of the part designed to be filled with printed lines
Printed line The line printed with one printhead draw or move
Printing angle The angle of the printhead towards the substrate surface
Substrate Base material to be printed on, for example plastic, metal, glass, etc.
Via hole Conductive hole through the part
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| All Rights Reserved | 2015
Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
Contents
• Introduction
• Pattern design
• Maximum part size for printing
• Printing tool orientation
• Tolerances for printed line
• Location of printed lines on substrate
• Edge design of the printed areas
• Printed via hole design
• Via Hole; FluidANT vs LDS
• Contact methods for printed antennas
• Line width
• Line thickness
• Approved materials - updates in version 14
• Approval process for ink materials
• Environmental tests
• Tips/Lessons learnt
– Pattern design examples
– Substrate surface finish
• FluidANT printed multilayer structures – new in version 14
• Soldering on FluidANT printed pattern – new in version 14
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| All Rights Reserved | 2015
Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
Introduction on printing technology
• Printing technology is based on conductive ink which is directly
printed on the substrate surface and then dried in the oven.
• The major advantage of the printing method is that any surface
topography is possible as long as the surface is reachable from
some projection angle and nothing blocks the printing.
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Pattern design
Efficient pattern design is the best way to reduce the cycle time of
printed parts.
Optimize the cycle time by:
• Minimizing the number of printing positions
• Using the min. line width
• Minimizing the size of the printed area:
– Avoid large and solid printed areas
– Use straight line structures with uniform line widths
• Designing single line patterns
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Maximum part size for printing
• The possibility to print on parts exceeding these dimensions needs
to be evaluated with manufacturing engineers.
L: 230 mm * W: 100 mm * H: 100 mm
or
L: 300 mm * W: 60 mm * H: 60 mm
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Printing tool orientation
• As a rule of thumb the substrate surface should be reached with
max. 1 mm offset using a cone tool so that the printing angle is at a
minimum of 45 degrees.
Dimensions of printing tool
against the printable surface
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Tolerances for printed lines
• Tolerance inside the printed line: ±0.10 mm
– from printed line to printed line
• Tolerance from the substrate’s edge: ±0.15 mm
– from part to printed line
Example tolerances for printed lines
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Location of printed lines on substrate
• Printed lines should not be printed directly against walls.
• Wall height: </= 3.00 mm distance from walls: min 0.50 mm
• Wall height >3.00 mm possibility of printing needs to be evaluated
with manufacturing engineers.
• From the edges, holes and the end of the radius the minimum
distance is 0.25 mm.
Distance of the printed
line to vertical/angled
walls and edge
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Edge design on printed areas
• The recommended radius in substrate is 0,6 mm where the printed
line goes over the edge.
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Printed via hole design
Printed via hole diameter Min 0.40 mm
Cone angle Min 60°
Wall thicknessLarger wall thickness causes too big a hole: produces excess material locallymay break the printed line when drying
0.70 – 1.00 mm
Recommended to print min 0,4 mm fillet around the cone
Substrate
Examples of via hole split line
hole
Recommended to print min
0,4 mm fillet around the cone
hole
cone
fillet
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Via Hole; FluidANT vs LDS
FluidANT
LDS
Hourglass shape is preferred in FluidANT due to printing quality.
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| All Rights Reserved | 2015
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Contact methods for printed antennas
• Normal contact methods applicable
• C-clip connection:
– Printed contact area with c-clips in customer PWB is the easiest way to
connect antenna and PWB Only the flat surface for the c-clip contact
point needed
– No special requirements for antenna connections: similar to the design
of FPWB antennas
C-clip in customer PWB C-clips in antenna
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| All Rights Reserved | 2015
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Line width
It is recommended to use typical line widths as defined below:
• Minimum line width: 0.40 mm
– This is done by printing one line
• 2nd line width: 0.65 mm
– This is done by printing two lines
• 3rd line width: 0.90 mm
– This is done by printing three lines
• Minimum gap between lines: 0.40 mm
• Minimum curvature radius of line: 0.20 mm
– For example, if the inner radius of printed line is R0.2 mm, the outer radius
is R0.2 mm + line width (see figure above)
The above mentioned line widths are valid for polycarbonate. Substrate material
and surface quality have an effect on the printed line width, for other materials it is
recommended to verify the line width before design freeze.
Example dimensions of a printed line
with uniform line widths
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Line thickness
• The typical thickness of a printed line is 30-40µm.
• It is possible to print up to 80µm thickness.
0,004075
0,012166
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Approved materials
*) Surface roughness of substrate
materials may have an effect on
printing line dimensions, and
adjustment in printing parameters
may therefore be needed.
**) The minimum heat
resistance for substrate
must be 110°C.
Type Ink materialcode
Resinmaterial supplier
Substrate*, **
Silver ink
PI0225S-ASabic
Bayer
Samsung SDI
PC, Polycarbonate• Lexan™ 141R Polycarbonate, black• Thermocomp™ DX10311 compound,
Polycarbonate, 30 % GF, black• Lexan™ EXL 1132T Resin, Polycarbonate siloxane
modified, black• Lexan 3412 ECR Resin, Polycarbonate, 20% GF,
black• Lexan™ 3412 ECR Resin, Polycarbonate, 20% GF,
OR7G005, orange• Lexan™ EXL 1414T, black, bright blue• Lexan™ BY 2710x, black, modified PC• Xenoy 1731, black, PBT+PC• Makrolon® 2805 Polycarbonate, black• Makrolon® 2405 Polycarbonate, clear• INFINO® CF-1051, PC, black• INFINO® IH-1047, PC, black• INFINO® IH-1041, PC, black• INFINO® GI-3303 LW, (PC/GF30%), black• INFINO® CF-3300 LW, (PC/GF30%), black
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| All Rights Reserved | 2015
Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
Approved materials
Type Ink materialcode
Resinmaterial supplier
Substrate*, **
Silver ink
PI0225S-ADuPont
EMS
SabicSolvay
PA, Polyamide ***)• Zytel® RS HTN59G55LWSF BK083 Polyamide, 55%
GF• Zytel® RS HTN55G55LWSF BK752
A,Polyamide,55% GF• Zytel® RS HTN53G50LWSF BK083, Polyamide, 50%
GF• Grivory® GVX-5H, black 9915 50% GF PA66 +
PA6I/X• Grivory® HT XE 4134, black 9225 30% GF PA10T/X• Grilamid® TRVX-50X9, black• Thermocomp™ PA 9X10312- 701 black, 50 % GF• Kalix®2955, 27% bio-sourced, PA6,10, (55% GF)
***) PA, polyamide grades batch
to batch molding parameters must
be managed
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| All Rights Reserved | 2015
Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
Approved materials
Type Ink materialcode
Resinmaterial supplier
Substrate*, **
Silver ink
PI0225S-A Sabic
Toray
Ticona
Samsung SDI
ABS/PC• Cycoloy C1200HF, black****)
PPS, Polyphenylene sulfide• Toray A305M45, black, Polyphenylene
sulfide,45% GF
Liquid chrystal polymer, LCP• Vectra LCP E130i
PBT, Polybutylene terephthalate• INFINO® MA-5400 , (PBT/40% GF), light grey
****) Ink drying temperature
must be checked case by case
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| All Rights Reserved | 2015
Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
Approved materials
Type Ink materialcode
Resinmaterial supplier
Substrate*, **
Silver ink
PI0538S-ASabic
PC, Polycarbonate• Lexan™ 141R Polycarbonate, black
Silver ink
PI0101S-A DuPontPA, Polyamide ***)• Zytel® RS HTN59G55LWSF BK083 Polyamide, 55%
GF
***) PA, polyamide grades batch
to batch molding parameters must
be managed
Type Ink materialcode
Inkmaterial supplier
Substrate*, **
Dielectric DSU-4601B
Sun Chemical PC, Polycarbonate• Sabic Lexan™ 141R Polycarbonate, black
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| All Rights Reserved | 2015
Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
Approval process for ink materials
• Ink materials are tested and verified by FluidANT team.
• The following things are verified in the approval process:
o Conductivity
o Sheet Resistivity, mOhms/sq/mil <15
o Adhesion (tape test of cross cut printed line)
o Visual appearance
o Abrasion test
o Substrate dissolvability test
o Environmental Tests (see next slide)
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Environmental tests
Test number
Parameter Reference Requirement
1 Change of temperature
IEC 60068 2 h at +85°C2h at -40°CChange time 2 h between temperatures
5 cycles.
2 Damp heat cyclic
IEC 60068 93% RH 4 h at + 65°C , 93% RH 1h at +25°C Change time 1,5 h between cycles.
8 cycles.
3 Salt mist IEC 60068 1) 5% NaCl, expose 2 h at +35°C, then 2) 95 % RH 168 h at +40°C (1 week)
2 cycles. Total 2 weeks.
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Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
How to design a good Antenna with Fluid
Few tips / lessons learnt for good performing antenna design with Fluid:
See next pages on tips that affect
RF performance
Capacity
Cost
Ink amount
Visual Quality
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Pattern design examples
* Large solid area * Minimized solid area
Single line design
Minimizing the large solid area
Better
BestRF performance
Capacity
Cost
Ink amount
Visual Quality
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| All Rights Reserved | 2015
Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
Pattern design examples
When hatching the large solid pattern areas -> where pattern lines are
crossing no radius to the corners.
Hatched pattern area with sharp
corners.
RF performance
Capacity
Cost
Ink amount
Visual Quality
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| All Rights Reserved | 2015
Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
Pattern design examples
• Capability to print thicker lines can be used to improve RF
performance by printing higher thickness (50-60 µm) on contact
areas and on the short (six to ten mm) distance of lines from them.
From feed / ground approx 6-10mm use thicker line
RF performance
Capacity
Cost
Ink amount
Visual Quality
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| All Rights Reserved | 2015
Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
Substrate surface finish
• Printing surfaces should have as smooth surface texture as
possible, polishing according to SPI-B2, or better.
• Printed line interfaces follow the surface roughness of the substrate.
This affects accuracy, quality and resistivity of the printed line.
Polished surface (SPI-B2) VDI 18 VDI 21
Substrate (Polished) Substrate (VDI21)
Resistivity
increasesSubstrate (Polished)
RF performance
Capacity
Cost
Ink amount
Visual Quality
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| All Rights Reserved | 2015
Version 14 FluidANT is trademark registered in the US Patent and Trademark Office.
FluidANT printed multilayer structures
Materials
• Silver inkApproved high performance micron particle size silver polymer ink (like PI0225S-A)
• DielectricApproved UV cured dielectric forming an insulating layer or cross over on top of silver
• Substrate materialsApproved substrate material ensuring good adhesion with both silver ink and dielectric.
Note: Printed ink, dielectric and substrate materials are always a combination which compatibility should be ensured either by selecting already tested and approved material combination or by verifying the desired material combination’s compatibility.
Printing of multilayers
• PretreatmentBefore printing the substrate surface should be plasma treated and treatment is recommended prior printing each following layer.
• Process orderPrevious printed layer (silver / dielectric) should be dried properly before printing the following layer.
• Silver printingTypical silver ink printing parameters can be used in multilayer applications.
• Dielectric printingUV sensitive dielectric material should be protected from the light in storage and in printing process the syringe should be covered with black tape.
Diluting (max. 2w-%) of the dielectric is recommended with appropriate monomer to improve printability and print result.
UV drying time depends on printed layer thickness and used lamps, it is recommended to follow the material supplier’s instructions.
Printed pattern with dielectric:
• Single line: width 400 +/-50 μm and thickness 40-60 μm
• Two lines: width ~600 +/-50 μm and thickness 40-60 μm
• Three lines: width ~850 +/-50 μm and thickness 40-60 μm
Note: The substrate material and surface quality have effect on the actual printed line dimensions.
Quality of multilayersAdhesion of the printed layers meet the cross cut tape test (ASTM D- 3359-02).Applications have passed the change of temperature, salt mist and thermal shock environmental tests.
Note: When printing dielectric on top of silver or wise versa, the line width on printed surface may be slightly narrower than what it is on substrate surface because of surface energy differences between the materials.
This should be taken into account in print designing if seen needed.
Note: Application specific environmental tests should be renewed for each design.
Ink Dielectric
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Soldering on FluidANT printed pattern
Materials
* Silver inkApproved high performance micron particle size silver polymer ink (like PI0225S-A)
Recommended dried ink thickness is 50-60 microns in soldering pads.
* Substrate materialsHigh temperature resistant substrates (LCP, PPS)
Low temperature resistant substrates (PC)
* Solder pastesLead free no-clean, high temperature solder paste(Sn96.5Ag3Cu0.5 alloys)
Lead free no-clean, low temperature solder paste (42Sn57Bi1Ag alloys)
Also glass and coated metals work as substrate for soldering applications, but may need protective layer depending on environmental test requirements.
Soldering methods
• Reflow soldering Typical reflow profile for high temperature solder paste and high temperature substrate materials.
Typical reflow profile for low temperature solder paste and low temperature substrate materials.
• Local hot air soldering Hot air can be used especially with low temperature substrate materials. Heat is focused only on soldering point and heating profile is short.
NOTE: Soldering profiles should be optimized for each solder paste and application.
Solder joint quality in FluidAntSolder wetting angle on printed silver is higher than when soldering on gold plated PWB surface. Still solder wetting properties are appropriate also on printed silver ink and solder resist is not necessarily needed for printed ink pad as solder doesn’t spread.
Solder joints are mechanically good in both high temperature and in low temperature soldering. Over 7 N peeling off forces were measured in SMT component solder joints depending on the component type and substrate material. Typically failure mode has been cracking between ink and substrate.
NOTE: Solder pad design and solder paste dot size must be optimized to reach good soldering performance. Although as high as possible ink drying temperature is recommended to improve the conductivity, the drying temperature should not exceed 130C in applications where components will be soldered on the dried ink. Higher ink drying temperature weakens solder paste wetting on the dried ink surface.
•Done soldering applications with Fluidant - SMT component soldering
- Cable soldering
Applications have passed change of temperature, salt mist and thermal shock environmental tests.
NOTE: Application specific environmental tests should be renewed for each design.
Printed silver ink
Cable Plastic frame
Solder Paste