five facetts of performance testing

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Five Facets of Performance Testing

• What is Performance Testing

• Scope of testing

• Purposes

• Tools

• 1) Verification vs Validation

• 2) Simulation/Life Testing

• 3) Testing to Failure

• 4) Parameter/Feature Testing

• 5) How to synthesis a performance test

• Failure is good

• Sources of Damage

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Scope and Purposes

• Performance - The way in which a product functions.• Applies to all products that have an expected function and

duration.

• Types of Performance:• Function: the operation of a product

• Time: how fast or how long something functions

• Stress/noise factors: source of damage/interference to a product

• Accuracy: how close to the desired value the function is

• Precision: how repeatable the function is

• Information Goal: The key piece of information about the product that is needed to move the process forward.

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Performance Testing-Tools

• Stress, Time and Probability

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Infant Mortality: Production errors, material flaws

Constant Failure Rate: Random

Incident, abusive conditions

Wear out mechanism:

Fatigue, damage accumulation

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Probability

Stress

Time

Service Conditions

1 Life

2 Life

Life Test

Concept

Feasibilit

y

Development

Verifica

tion

Market R

elease

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Concept

Feasibilit

y

Development

Verifica

tion

Market R

elease

Probability

Stress

Time

Service Conditions

1 Life

2 Life

Life Test

StressStress

StressStress

StressStress

Life Test

FSLT

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Concept

Feasibilit

y

Development

Verifica

tion

Market R

elease

Probability

Stress

Time

Service Conditions

1 Life

2 Life

StressStress

StressStress

StressStress

Life Test

FSLT

Step Stress

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Concept

Feasibilit

y

Development

Verifica

tion

Market R

elease

Probability

Stress

Time

Service Conditions

1 Life

2 Life

StressStress

StressStress

StressStress

Life Test

FSLT

Step Stress

HA

LT

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Concept

Feasibilit

y

Development

Verifica

tion

Market R

elease

Probability

Stress

Time

Service Conditions

1 Life

2 Life

StressStress

StressStress

StressStress

Life Test

FSLT

Step Stress

HA

LT

FMVT

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Environmental Testing

• Exposing materials, components, sub-systems or full product to conditions that may be found in their end-use environments.

• Temperature (Hot, Cold, Ramp)

• Humidity, non-Condensing Humidity, Condensing Humidity

• Radiated (UV or Heat Lamp)

• Sunlight (Carbon Arc and Xenon exposure)

• Salt mist, Salt Spray

• Dust

• Chemical Attack

• In order to test their ENDURANCE

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Material Testing

• Measuring the Physical, Chemical or Mechanical properties of material

• Material can be raw, fabricated into a product, taken from field returns, etc.

• Physical Properties• Color, density, thermal expansion, Glass Transition Point

• Chemical Properties• Molecular make up

• Molecular structure (micro structure)

• Contaminants

• Flammability

• Melt Point

• Mechanical Properties• Tensile strength, elongation, modulus, flex modulus, HDT,

hardness, abrasion, compression, tear, peel, pull, impact

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Mechanical/Durability Testing

• Exposing a product to cyclic mechanical loads in order to measure or demonstrate life.

• Measure or Demonstrate:

• Measuring life means running to failure

• Demonstrate life means running to a target with no failures (more common)

• This type of test is often done in conjunction with Environmental exposures (Temperature, Relative Humidity, Dust, Ultraviolet)

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Vibration Testing

• Exposing a product to vibration energy in order to measure or demonstrate life.

• Measure or Demonstrate:• Measuring life means running to failure

• Demonstrate life means running to a target with no failures (more common)

• This type of test is often done in conjunction with Environmental exposures (Temperature, Relative Humidity, Dust, Ultraviolet) and functional testing (while the product is functioning)

• Vibration can be:• Single-axis (most common) sometimes called 3-axis but only one

axis at a time

• Six – Axis or 6–dof (degree of freedom).

• Often a Data Acquisition is conducted before the actual testing.

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Electrical Testing

• Measure a product’s performance at the system, sub-system or component level.

• Measurements can include• Current, voltage and power draw

• Audio performance

• Product functionality

• Temperature rise in system component or location

• Resistance or Impedance changes

• This type of test is often done in conjunction with Environmental exposures, vibration and durability (Temperature, Relative Humidity, Dust, Ultraviolet)

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MIL-STD 810

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Lighting Testing

• Light quality, brightness, color, pattern and durability.

• Automotive, Consumer, Airport

• Only approved lab - Airport Lighting Equipment Certification Program

• Testing to FAA, ICAO, IEC, NATO, and military

• To ensure that airport lighting equipment meets the applicable FAA standards for safety, performance, quality and standardization

• Where: Cortland, Grand Rapids.

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The Intertek Quality & Performance Mark

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How do you show that you’re the best choice?

• How do you translate your key differentiators to your customer as they make their purchase decision?

• How do you help customers navigate product features?

• How do you justify pricing for on-the-spot pricing comparisons?

• How do you show your product has integrity?

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In a world of product recalls, feature creep and supply chain issues, quality is top of mind.

Intertek’s Quality & Performance Mark has been created to help our customers demonstrate their commitment to quality.

To consumers the mark is third party, validated proof that a product meets or exceeds key purchasing criteria.

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What Goes Into the Mark?Third party verified testing

This line will read: “Independently tested

for Quality and Performance”

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What Goes Into the Mark?Third party verified testing

“Independently tested for Quality andPerformance”

• “Baseline” quality tests

• (1 to 5 tests are performed to

• expert specifications)

• Durability: Evaluates range of conditions product can handle and continue to function

• Functionality: Performance of product’s functions & features under normal use

• Life Cycle: Evaluates how long product lasts in normal operation

• Usability: Ease of use for intended tasks

• Workmanship: Verifies product’s physical characteristics for high quality fabrication

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What Goes Into the Mark?

• “Above and Beyond” tests

• Manufacturers Claims: (Optional 6th test highlights manufacturer’s differentiators. Test results on swing tags, POP, website)

Third party verified testing

“Independently tested for Quality andPerformance”









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What Goes Into the Mark?

• “Above and Beyond” tests

• Manufacturers Claims: (Optional 6th test highlights manufacturer’s differentiators. Test results on swing tags, POP, website)

Researchable results

• Model & certification #’s

• Intertek website link

Third party verified testing

“Independently tested for Quality and Performance”









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Verification Vs. Validation

• Verification: Proving that the out put of the design process achieved the desired parameters: Did we hit the target?

• Validation: Proving that the product is capable of meeting the requirements for the intended use. Do we have the right target?

• Example: Tightening Torque

• Parameters:

• Torque on a Fastener

• Verification – Can the device achieve the correct torque? Does the production process provide the correct torque?

• Validation – does the product perform as intended with the target torque: was it the right torque to begin with?

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Simulation – Life Testing

• Simulation-

• Goal is to simulate end use conditions precisly in the laboratory setting

• Requires:

• Knowing with a high degree of accuracy what the end use conditions are.

• Knowing what is ment by failure.

• Knowing what the end usage rate is.

• Life Testing

• Simulate the end use conditions

• Demonstrate or measure the life of the product.

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End Use Conditions

•What are the end use conditions? What do you expect the product to see?

•Make sure to ask about conditions in four areas

• Electrical

• Mechanical

• Environmental

• Chemical

•Quantify:• Value, range

• Duration, usage

•Modes:• In Use

• Storage

• Shipping

• Maintenance

•Voltage

•Current

•Pressure

•Velocity

•Flow rate

•Force

•Duty Cycle

•Temperature• Hot, Cold, Ramp

•RH%

•Sunlight

•Contaminants

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Demonstrate Life Vs. Measure Life

Demonstrate

•Beat a target value.

•Typically a truncated test.

•Shorter and easier

•Reliability and Confidence only.

•Measure

•Must go to

• End of life

• Measurable point

•Unknown time period

•Full reliability function.

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MTBF – Life Test

• Mean Time Between Failures

• MTBF = ∆ T / (ln ( 1-Nf/Ndut))

• Delta T = Change in Time

• Nf = Number of failed units

• Ndut = Total number of units under test

• OR

• MTBF must be 2000 hrs or more

• Ndut = 20 samples available

• Test for 2000*(ln(1-1/20)) = 102 hrs with no more then 1 failure

• Test for 2000*(ln(1-2/20)) =211 hrs with nor more then 2 failures

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Single Stress Model

• Determine stress to apply

• Determine service levels

• Estimate maximum levels

• Test at maximum levels until half fail

• Choose a lower stress level

• Test until half fail

Spring Force

2 N

200 N

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Single Stress Model

1

10

100

1000

10000

0 50 100 150 200 250

Push Force

Life

(C

ycle

s) Life

Test one

Test two

Test three

Expected 95% RLife

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Acceleration and Shape Coefficients

• The rate at which life is shortened by the increase in stress is expressed by a coefficient in the math model.

• The shape of the distribution is expressed as a coefficient in the math model.

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Example Math Models

• Arrhenius-Weibull Model

• F(t;T) = 1 -exp{-[t exp[-γ0-(γ1 /T)]]β

• Power-Lognormal Model

• F(t,V)=Φ{[log(t)-µ (x)]/σ}

• Cox (Proporational Hazards) Model

• R0(t) = exp[-∫0th0(t)dt]

• All models from “Accelerated Testing”, Wayne Nelson, 1990

• [email protected]

Capacitor dielectric or insulating tape

Page 82

Metal fatiguePage 88

ASTM STP 744

Biomedical Page 104Cox and Oakes (1984),

“Analysis of Survival Data”

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Testing to Failure

• Why?

• Find and fix the root cause of failure

• Faster and easier to get meaningful data

• How?

• Elevated sources of stress

• Multiple sources of stress

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Typical Procedure in Failure Analysis

•Inspection

• Visual, Optical microscope, Electronic microscope. e.g. Fractography

•Material identification

• Atomic/Molecule, Chemical composition, Microstructure, Contamination, e.g. Infrared Spectroscopy

•Property evaluation

• Chemical, Physical, Mechanical, Thermal, Electrical, e.g Tensile Test

•Cognition and recommendation

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Glasses

Metals

Plastics

Plating

Electronics

Frame

Interior Components

Environmental

Adhesives

Structural

Decorative

Functional

Material Selection

Design

Manufacturing

Factors of Failures

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Where is Failure Analysis Typically Utilized?

•Primary process problems:

• Material flows incorrectly through process

• Visual defects observed

• Performance parameters do not meet expectations (or specifications)

•Transport related failures:

• Breakage

• Contamination from environment (dirt, transfer of materials from dunnage, moisture, etc.)

• Heat or vibration damage

•Secondary process problems:

• Breakage or irregularities that interfere with assembly.

• Visual defects observed

• Adhesion problems with mating components (blocking, welding, or adhesion failures depending on desired assembly behavior)

• Failure due to contact with incompatible materials

•End-use failures:

• Incompatibilities with end-use environments

• Abuse

• Slow failures (repeated cycling, oxidation, fatigue, etc.) from processes or environments unanticipated in design

• Other failures observed in end-use but not detected in previous production or transport processes

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If all failure modes were intuitive…

• Tests would simulate what we expect.

• Tests would instrument for what we expect.

• The human ability to ignore the unexpected can be profound.

Leads to warranty…

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Stress

ProductSpecs

Margin Discovery Process.......

HALT

UpperOperating

Limit

OperatingMargin

LowerOperating

Limit

OperatingMargin

UpperDestruct

Limit

Destruct Margin

LowerDestruct

Limit

Destruct Margin

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Table 4. Hot Survey

7xiv sample reads 52.74 ohms. Soft Failure Vpdiag function check. Boot Script error. Observation. 2. XXXXXXX

Sample 1 30 40 TSDSP function check.

Functioned properly Vpdiag function check. Boot Script error. Observation. 3. XXXXXXX

Sample 1 30 50

TSDSP function check. Functioned properly

Vpdiag function check. Boot Script error. Observation. 4. XXXXXXX





Sample 1 30 80




Functioned properly Vpdiag function check.

DSP error code 707. Observation. Boot Script error. Observation. 8. XXXXXXX


Functioned properly Vpdiag function check .



Functioned properly Vpdiag function check.





Functioned properly

12. XXXXXXX Sample 1 30 140

Mounted Sample in chamber to start Step 12. Sample would not turn on. Removed sample from chamber and made several

attempts to turn sample on. Sample never turned on again. Hard Failure.

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SUMMARY OF THE HOT SURVEY

• After completing the function checks for Step 11, Sample 1 was placed back in the chamber for Step 12, and power was connected to the sample, but the sample would not turn on. Several attempts were made to turn on the sample before it was removed from testing and replaced with Sample 2.

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Table 5. Thermal Cycle (Transition)

Table 5. Thermal Cycle (Transition) Step Sample Time in

minutes Temperature

(oC) Observations

1A 30 -80 Vpdiag function check.

DSP error code 707. Observation. Boot Script error. Observation.

1B

XXXXXXX Sample 2

30 100 TSDSP function check.

Functioned properly

2A 30 -80 Vpdiag function check. Boot Script error. Observation.

2B

XXXXXXX Sample 2


Functioned properly


3B

XXXXXXX Sample 2


Functioned properly


4B

XXXXXXX Sample 2


7xiv sample reads 45.31 ohms. Soft Failure

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SUMMARY OF THE THERMAL TRANSITION SURVEY

• Sample 2 only exhibited one (1) Soft Failure during the Thermal Transition Survey After completing Step 4. During 7xiv of the TSDSP function checks, the sample was reading 45.31 ohms.

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Table 6. Vibration

Table 6. Vibration Step Samples Time in

minutes Vibration

(G’s) Observations



7xiv sample reads 45.39 ohms. Soft Failure Vpdiag function check.


Sample 2 30 10 TSDSP function check .

7xiv sample reads 45.39 ohms. Soft Failure Vpdiag function check.

DSP error code 707. Observation. Boot Script error. Observation. 3 XXXXXXX

Sample 2 30 15




7xiv sample reads 47.46 ohms. Hard Failure Vpdiag function check. Boot Script error. Observation. 5. XXXXXXX

Sample 2 30 25

TSDSP function check. 7xiv sample reads 47.46 ohms. Hard Failure



7xiv sample reads 47.46 ohms. Hard Failure Following step 7 component C904 was separated from the

PCB. Hard Failure. Reference Appendix A Figure 3 for photograph.

Vpdiag function check.

DSP error code 705. Hard Failure Boot script error. Observation.


TSDSP function check. 7xiv sample reads 47.46 ohms. Hard Failure

Vpdiag function check. DSP error code 705. Hard failure

Boot Script error. Observation.


TSDSP function check. After selecting the TSDSP icon to launch the program a window popped up displaying “DSP is not present”. Hard

Failure.

5iii through 5xxxi an error message is displayed that reads “EEPROM Read Failure”. Sample stopped responding. Reset

sample and the display was solid blue. TSDSP function checks could not be finished. Hard Failure. Continued the

vibration surveys.

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Table 6. Vibration Cont.:

Table 6. Vibration Cont.: Step Samples Time in

minutes Vibration

(G’s) Observations

After completing Step 9 both CF card were dislodged

Vpdiag function check DSP error code 705. Hard Failure

Boot script error. Observation. .


TSDSP function check . The display is solid blue could not perform function checks.

After completing Step 10 both CF card were dislodged

Vpdiag function check DSP error code 705. Hard Failure

Boot script error. Observation. CF2 error code 703. Hard Failure


TSDSP function check. The display is solid blue could not perform function checks.

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SUMMARY OF THE VIBRATION SURVEY

• During the Vibration Survey, sample 2 had compact flash cards installed in both Slot 1, and Slot 2 bays.

• Sample 2 exhibited the same Hard Failure multiple times during the TSDSP function check 7xiv. The sample was out of tolerance.

• Sample 2 exhibited a Hard Failure following Step 7 component C904 separated from the circuit board. Reference Appendix A Figure 3.

• Sample 2 exhibited a Hard Failure after completing Step 8. After selecting the TSDSP icon for the TSDSP function check a window popped up displaying an error message “DSP is not present”. The error window was closed by selecting “ok” and the functional checks were continued. During TSDSP 5iii, another window popped up displaying an error message“EEPROM Read Failure”. This message showed up every time the “Select Show ADC Counts” was selected. The Vibration Survey was continued and the sample was removed from testing after completing the Vibration Survey.

• Sample 2 exhibited a Hard Failure after completing Step 9 and Step 10. The LCD screen is solid blue and was unable to perform the TSDSP function check.

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How to design an FMVT

• Hypothesis: A good design accumulates damage (wears out) uniformly throughout the product

Lance

Electronics

Button stick

Fatigue

Screen Yellow

Button bounce

BatteriesInterface

Software

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• To test the hypothesis all of the sources of damage (stress sources) should be identified

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• What can break (wear out) the product? Operation

Dust/Contaminant

Turning on/off

Voltage variations

Hot temperature

Cold temperature

Temperature Ramp ratesDropping Pressure Changes Cleaning

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• To test the hypothesis all of the sources of damage (stress sources) should be identified

• Service conditions of each stress source

• Destruct limit of each stress source

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Str

ess

Am

plitu

de

Str

ess

Am

plitu

de

-80-60-40-20

020406080

100120140160180200220

1 10

FMVT Test Level

(C,

C)

0

5

10

15

20

25

(gR

MS

, V

)

C (hot)

C (cold)

other(s)

gRMS

V

ExpectedMaximumService

Conditions

ExpectedMaximum

Test Conditions(maximum design or test equipment

capability)

Example: FMVT Test Profile

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Example Test Plan

Random Target Test Conditions:

Relative Humidity

Slam Inducing Random Vibration

Door Assembly

Slams

units = C C C/minute % grmsMaximum Service = -30 80 10 75 1.5 36,000

Maximum Test = -60 115 10 95 2.5 360,000 Number of Steps = 10 10 10 10 10 10

EVENT LOG TEST PLAN:

fixed level length

fixed dwell length

Minimum Maximum Ramp Rate

C C C/minute % RH g g

Op-0 n.a.n.a. n.a. n.a. n.a. n.a. n.a.

1 120 88.3 -30 80 10 75 1.5 36,000 Op-1 45 45 n.a. n.a. n.a. n.a. n.a. n.a.

2 120 88.3 -30 80 10 77 1.6 72,000 Op-2 45 45 n.a. n.a. n.a. n.a. n.a. n.a.

3 120 88.8 -33.3 83.9 10.0 79 1.7 108,000 Op-3 45 45 n.a. n.a. n.a. n.a. n.a. n.a.

4 120 89.3 -36.7 87.8 10.0 81 1.8 144,000 Op-4 45 45 n.a. n.a. n.a. n.a. n.a. n.a.

5 120 89.8 -40.0 91.7 10.0 83 1.9 180,000 Op-5 45 45 n.a. n.a. n.a. n.a. n.a. n.a.

6 120 90.3 -43.3 95.6 10.0 85 2.1 216,000 Op-6 45 45 n.a. n.a. n.a. n.a. n.a. n.a.

7 120 90.8 -46.7 99.4 10.0 87 2.2 252,000 Op-7 45 45 n.a. n.a. n.a. n.a. n.a. n.a.

8 120 91.3 -50.0 103.3 10.0 89 2.3 288,000 Op-8 45 45 n.a. n.a. n.a. n.a. n.a. n.a.

9 120 91.8 -53.3 107.2 10.0 91 2.4 324,000 Op-9 45 45 n.a. n.a. n.a. n.a. n.a. n.a.

10 120 92.3 -56.7 111.1 10.0 93 2.5 360,000 Op-10 45 45 n.a. n.a. n.a. n.a. n.a. n.a.5/

24/0

2


Estimated Number of

5/20

/02

5/21

/02

Environmental Chamber Temperature

5/22

/02

5/23

/02

Event Number

Environmental Chamber TemperatureDurationRelative Humidity

Tes

t Dat

e


(minutes)

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Example Test Plan

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Parameter/Feature Testing

• Tests to check on particular parameters or features that are traecable to specific failure modes.

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Design Failure Modes and Effects Analysis

•A disciplined approach for tracking all of the POTENTIAL failure modes in a design, their causes, effects prevention and detection.

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DFMEA

What are the Functions, Features or Requirements?

What are the Effect's)?

What can go wrong?

No Function

Partial/Over/DegradationFunction

Unintended Function

How Badis it?

What are the Cause's)?

How oftendoes ithappen?

How can this beprevented and detected?

How good is thismethod at preventing and/or detecting

What can be done?

Design Changes

Process Changes

Special Controls

Changes to Standards, Procedures or Guides

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What are the Functions, Features or Requirements?

What are the Effect's)?

What can go wrong?

No Function

Partial/Over/DegradationFunction

Unintended Function

How Badis it?

What are the Cause's)?

How oftendoes ithappen?

How can this beprevented and detected?

How good is thismethod at preventing and/or detecting

What can be done?

Design Changes

Process Changes

Special Controls

Changes to Standards, Procedures or Guides

DFMEA

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Function Item

Potential Failure Mode

Potential Effect(s) of failure

Severity

Criticality

Potential Causes(s) / Mechanism(s) of Failure

Occurrence

Detectability

RP

NRecommended Action

Respons-ibility Target Date

steam generator plug

diminished steam production

10 10 calium build up 8

Inspection periodicly during operation 7

5600 n/a

Current Design ControlsPrevention Detection

With permission from:accompanying CD, Accelerated Testing and Validation Management, Alex Porter Elsevier

DFMEA

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Function ItemPotential Failure Mode


Severity

Criticality


Occurrence

Detectability

RP

N

Recommended Action

Respons-ibility

Target Date

Handle split in grip insert areaLoss of rubber grip 3 3 impact 8

Impact resistant plastic

FEA model of impact from 3 likely directions 3 216

3 3 thermal cycle 8

thermal set plastic with stable material properties from -30 deg C to 100 deg C

Thermal cycle testing 3 216

3 3chemical attack/material incompatibility 8

chemically inert plastic to mild alkali's and acids

chemical exposures 2 144

3 3 fatigue 8

FEA model of maximum loading: stress must be below 1/3 material yield.

load testing to verify models 1 72

3 3 Sharp radius 5

All design radius must be greater then 1 mm 2 90


DFMEA

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Potential Failure Vibration High Temperature Cold Temperature Temperature Ramp Humidity Salt air Torque

Filiment loss of continuity

Vibration will not cause Filiment loss of continuity

High Temperature will not cause Filiment loss of continuity

Cold Temperature will not cause Filiment loss of continuity

Temperature Ramp will not cause Filiment loss of continuity

Humidity will not cause Filiment loss of continuity

Salt air will not cause Filiment loss of continuity

Torque will not cause Filiment loss of continuity

FMVTHALTST STCMFCPropritary life durability test




FMVTHALTST STCMFCPropritary life durability test N/A N/a

CorrosionVibration will not cause Corrosion

High Temperature will not cause Corrosion

Cold Temperature will not cause Corrosion

Temperature Ramp will not cause Corrosion

Humidity will not cause Corrosion

Salt air will not cause Corrosion

Torque will not cause Corrosion

N/A

FMVTHALTST STFCASTM cyclic CorrosionPropritary life durability test




FMVTHALTST STFCASTM cyclic CorrosionPropritary life durability test N/a

Seal loss between glass and base

Vibration will not cause Seal loss between glass and base

High Temperature will not cause Seal loss between glass and base

Cold Temperature will not cause Seal loss between glass and base

Temperature Ramp will not cause Seal loss between glass and base

Humidity will not cause Seal loss between glass and base

Salt air will not cause Seal loss between glass and base

Torque will not cause Seal loss between glass and base






FMVTHALTST STFCPropritary life durability test


Base Thread does not match receptical

Vibration will not cause Base Thread does not match receptical

High Temperature will not cause Base Thread does not match receptical

Cold Temperature will not cause Base Thread does not match receptical

Temperature Ramp will not cause Base Thread does not match receptical

Humidity will not cause Base Thread does not match receptical

Salt air will not cause Base Thread does not match receptical

Torque will not cause Base Thread does not match receptical

Functional Test N/A N/A N/A N/A N/A N/A N/A

Base di-electric allows current flow

Vibration will not cause Base di-electric allows current flow

High Temperature will not cause Base di-electric allows current flow

Cold Temperature will not cause Base di-electric allows current flow

Temperature Ramp will not cause Base di-electric allows current flow

Humidity will not cause Base di-electric allows current flow

Salt air will not cause Base di-electric allows current flow

Torque will not cause Base di-electric allows current flow






FMVTHALTST STFCPropritary life durability test N/A

Mechanism of Failure

Hypothesis Matrixfrom accompanying CD ACCELERATED TESTING AND VALIDATION with permission

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Function Item



Severity

Criticality Potential Causes(s) /

Mechanism(s) of Failure

Occurrence

Detectability

RP

N

Recommended Action



Functional Item: The functional feature or

design feature from the BOM (Bill of Material)

Potential Failure Mode: Key word is POTENTIAL. What failure modes could

the feature experience. Source for this is

engineering experience, warranty data and pure

imagination.

Potential Effect(s) of failure: What are the result s of the failure on the function or behavior of the

product. Often the failure itself is not visible b ut the functional effect will be apparent. For

example a sealed bearing may have excessive wear, but the failure is not visible externally. T he

effect of increased fiction is a slowing of the motor or an increase in the power draw. The

effects are key to designing instrumentation and operational checks for tests to verify the

existence of failure modes.

Potential Causes: Key word here is mechanism.

What can break the product.

Current Design Controls: What is the current

design effort to prevent the design from failing,

and how will the success be detected.

Recommended Action: What action should be taken to improve the

PRN.

Responsibility: Who will take responsibility for

implementing the recommended action.

Target Date: When will the recommended action

be completed.

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THE WHOLE KEY TO MAKING THIS VALUABLE!!!!

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Function Item



Severity



Occurrence

Detectability

RP

N

Recommended Action



Traceability:(Drop dead rule)

Can a reasonably educated engineer, regardless of experience, read what is written

and apply the knowledge?










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Function Item



Severity



Occurrence

Detectability

RP

N

Recommended Action



Severity: How bad are the consequences of the

failure.

Criticality: How critical to the function of the device

is the failure mode.

Occurrence: What is the likelihood of failure.

Detectability: How well can the failure mode be

detected if it exists.

RPN: Risk Priority Number is the multiple of all three or four ratings

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1No discernible effectNone

2Aesthetics, workmanship – defect noticed by less then 25% of users.

Very Minor

3Aesthetics, workmanship – defect noticed by more then 50% of users.

Minor

4Aesthetics, workmanship – defect noticed by more then 75% of users.

Very Low

5Operational – but convenience or ease of use has reduced function

Low

6Operational – but convenience or ease of use is not functional.

Moderate

7Reduced level of performanceHigh

8Loss of primary functionVery High

9Very high severity ranking when a potential failure mode effects desired function and/or noncompliance with regulations without warning

Hazardous with warning

10Very high severity ranking when a potential failure mode effects desired function and/or noncompliance with regulations without warning

Hazardous without warning

RankingCriteria: Severity of EffectEffect

Example Severity Evaluation Criteria

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Function Item



Severity



Occurrence

Detectability

RP

N

Recommended Action



• Classification: This column may be used to classify any special product characteristics:

• Examples: Regulated, Europe Only, CEO’s Pet, Marketing Request, OEM

Mandate

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RankingLikely Failure Rates over Design Life

Probability of Failure

1<0.01 per Thousand

Remote: Failure is Unlikely

3

2

0.5 per Thousand

0.1 per Thousand

Low: Relatively Few Failures

6

5

4

5 per Thousand

2 per Thousand

1 per Thousand

Moderate: Occasional Failures

8

7

20 per Thousand

10 per Thousand

High: Frequent Failures

10

9

>100 per thousand

50 per thousand

Very High: Persistent Failures

Examples DFMEA Occurrence Evaluation Criteria

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1Almost Certain chance the control will detect a potential cause/mechanism and subsequent failure mode.

Almost Certain

2Very High chance the control will detect a potential cause/mechanism and subsequent failure mode.

Very High

3High chance the control will detect a potential cause/mechanism and subsequent failure mode.

High

4Moderately High chance the control will detect a potential cause/mechanism and subsequent failure mode.

Moderately High

5Moderate chance the control will detect a potential cause/mechanism and subsequent failure mode.

Moderate

6Low chance the control will detect a potential cause/mechanism and subsequent failure mode.

Low

7Very low chance the control will detect a potential cause/mechanism and subsequent failure mode.

Very Low

8Remote chance the control will detect a potential cause/mechanism and subsequent failure mode.

Remote

9Very remote chance the control will detect a potential cause/mechanism and subsequent failure mode.

Very Remote

10Controls will not and/or can not detect a potential cause/mechanism and subsequent failure mode; or there is no control

Absolute Uncertainty

RankingCriteria: Likelihood of Detection by Design Control or Detection Method

Detection

Example Detection Evaluation Criteria

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Synthesis a Performanc Test Plan

• Or – Can you get to zero field failures?

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Function ItemPotential Failure Mode


Severity

Criticality


Occurrence

Detectability

RP

NRecommended Action

Respons-ibility

Target Date

Handle split in grip insert areaLoss of rubber grip 3 3 impact 8

Impact resistant plastic

FEA model of impact from 3 likely directions 3 216

3 3 thermal cycle 8

thermal set plastic with stable material properties from -30 deg C to 100 deg C

Thermal cycle testing 3 216

3 3chemical attack/material incompatibility 8

chemically inert plastic to mild alkali's and acids

chemical exposures 2 144

3 3 fatigue 8

FEA model of maximum loading: stress must be below 1/3 material yield.

load testing to verify models 1 72

3 3 Sharp radius 5

All design radius must be greater then 1 mm 2 90


DFMEA

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Potential Failure Vibration High Temperature Cold Temperature Temperature Ramp Humidity Salt air Torque

Filiment loss of continuity

Vibration will not cause Filiment loss of continuity

High Temperature will not cause Filiment loss of continuity

Cold Temperature will not cause Filiment loss of continuity

Temperature Ramp will not cause Filiment loss of continuity

Humidity will not cause Filiment loss of continuity

Salt air will not cause Filiment loss of continuity

Torque will not cause Filiment loss of continuity





FMVTHALTST STCMFCPropritary life durability test N/A N/a

CorrosionVibration will not cause Corrosion

High Temperature will not cause Corrosion

Cold Temperature will not cause Corrosion

Temperature Ramp will not cause Corrosion

Humidity will not cause Corrosion

Salt air will not cause Corrosion

Torque will not cause Corrosion

N/A





FMVTHALTST STFCASTM cyclic CorrosionPropritary life durability test N/a

Seal loss between glass and base

Vibration will not cause Seal loss between glass and base

High Temperature will not cause Seal loss between glass and base

Cold Temperature will not cause Seal loss between glass and base

Temperature Ramp will not cause Seal loss between glass and base

Humidity will not cause Seal loss between glass and base

Salt air will not cause Seal loss between glass and base

Torque will not cause Seal loss between glass and base








Base Thread does not match receptical

Vibration will not cause Base Thread does not match receptical

High Temperature will not cause Base Thread does not match receptical

Cold Temperature will not cause Base Thread does not match receptical

Temperature Ramp will not cause Base Thread does not match receptical

Humidity will not cause Base Thread does not match receptical

Salt air will not cause Base Thread does not match receptical

Torque will not cause Base Thread does not match receptical

Functional Test N/A N/A N/A N/A N/A N/A N/A

Base di-electric allows current flow

Vibration will not cause Base di-electric allows current flow

High Temperature will not cause Base di-electric allows current flow

Cold Temperature will not cause Base di-electric allows current flow

Temperature Ramp will not cause Base di-electric allows current flow

Humidity will not cause Base di-electric allows current flow

Salt air will not cause Base di-electric allows current flow

Torque will not cause Base di-electric allows current flow

Mechanism of Failure

Hypothesis Matrixfrom ACCELERATED TESTING AND VALIDATION with permission

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Res

earc

h

Feas

ibili

ty

Dev

elop

me

nt/ d

esig

n

Des

ign

valid

ation

Prod

uctio

n ra

mp

Prod

uctio

n va

lidation

Prod

uctio

n

Serv

ice

Material Sample Compatibility Test- Low DectabilityCost 1 1 1 1 1 1 1 1Risk 1 1 2 3 4 5 8 10

Cost 10 9 8 5 3 2 2 2Risk 1 1 2 3 4 5 8 10

Material Sample Compatibility Test- Low Dectability

FMVT on Production intent with all stresses that could cause elctrolytic reaction - High Detectability

0

2

4

6

8

10

12

Research Feasibility Development/design

Designvalidation

Productionramp

Productionvalidation

Production Service

Material Sample Compatibility Test- Low Dectability

Risk

FMVT on Production intent with all stresses that could cause elctrolytic reaction - HighDetectability

Sweet Spots

Information Timing vs Accuracyfrom ACCELERATED TESTING AND VALIDATION with permission

Risk, Cost and BenefitMitigate The Risk

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Hypothesis Matrix

Three Benefits of HM

1) Double-check on the brainstorming in the DFMEA – DFMEA is a left-to-right thought process while the HM cross-references all potential mechanisms with all potential failures

2) Cross-check of current validation plan tests with the complete hypothesis – exposing duplicate tests and holes

3) Provides for identification of the most concise set of tests that satisfies all of the hypothesis

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Accelerated Validationhot cold ramp cycle basket dust hardwater rh%

cleaning solution

coffe ground level

forignin grounds

valve stuck

hot will not cause valve stuck

cold will not cause valve stuck

ramp will not cause valve stuck

cycle basket will not cause valve stuck

dust will not cause valve stuck

hardwater will not cause valve stuck

rh% will not cause valve stuck

cleaning solution will not cause valve stuck

coffe ground level will not cause valve stuck

forignin grounds will not cause valve stuck

transportaiontestFLSTHALTASTM thermal exposure FMVT hardwater test

transportation test

TCOhot will not cause TCO

cold will not cause TCO

ramp will not cause TCO

cycle basket will not cause TCO

dust will not cause TCO

hardwater will not cause TCO

rh% will not cause TCO

cleaning solution will not cause TCO

coffe ground level will not cause TCO

forignin grounds will not cause TCO

hardwater testtransportation test

Basket overflow

hot will not cause Basket overflow

cold will not cause Basket overflow

ramp will not cause Basket overflow

cycle basket will not cause Basket overflow

dust will not cause Basket overflow

hardwater will not cause Basket overflow

rh% will not cause Basket overflow

cleaning solution will not cause Basket overflow

coffe ground level will not cause Basket overflow

forignin grounds will not cause Basket overflow

rusthot will not cause rust

cold will not cause rust

ramp will not cause rust

cycle basket will not cause rust

dust will not cause rust

hardwater will not cause rust

rh% will not cause rust

cleaning solution will not cause rust

coffe ground level will not cause rust

forignin grounds will not cause rust

ASTM cyclic ASTM cyclic ASTM cyclicbasket cycle -ASTM cyclic ASTM cyclic ASTM cyclic ASTM cyclic

circuit failure

hot will not cause circuit failure

cold will not cause circuit failure

ramp will not cause circuit failure

cycle basket will not cause circuit failure

dust will not cause circuit failure

hardwater will not cause circuit failure

rh% will not cause circuit failure

cleaning solution will not cause circuit failure

coffe ground level will not cause circuit failure

forignin grounds will not cause circuit failure

auto start failed

hot will not cause auto start failed

cold will not cause auto start failed

ramp will not cause auto start failed

cycle basket will not cause auto start failed

dust will not cause auto start failed

hardwater will not cause auto start failed

rh% will not cause auto start failed

cleaning solution will not cause auto start failed

coffe ground level will not cause auto start failed

forignin grounds will not cause auto start failed

hot will not cold will not ramp will not cycle basket will not cause dust will not

hardwater will not cause no rh% will not

cleaning solution will not

coffe ground level will not

forignin grounds will not cause no

Tests

FMVT FSLT

EMC

ASTM cyclic

basket cycle

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0 200 400 600

FSLT Time (hrs)

FSLT-one life estimate

FLST-To Failrue

Typical Accelerated Development and Production

Failure Progression from Development into Production

0 500 1000 1500

Time to each unique failure (Minutes)

FMVT Development

FMVT Development

FMVT Development

Production Start

Production 1

Production 2

Production 3

EstimatedLife

five facetts of performance testing

Documents