FCCL FCCL

2011. 5. 20

Slitting CTE

/

-1/13--1/16-

Cu

,

Drum Speed

,

,

(AOI)

Knife Setting

T.S

-//Lot Tracking

- Distributed Control System

- Real Time Plant Information System

- -Ray, FESEM, EDS

-,

-(AAS, ICP),

1 step

Nucleation

Copper foil

Drum (Shiny side)

Check List

Drum (Shiny side)

2Step

Growth

3Step

Growth

Drum (Shiny side)

Drum (Shiny side)

-2/13--2/16-

Anode : CuSO4

+ 2H+ + 2e Cu + H2SO

4

Cathode : H2O 2H+ + 2e + O

2

Total reation : CuSO4

+ H2O

H2SO

4+ Cu + O

2

Check List

Thickness

Roughness

Tensile strenth

Elongation

Surface (Micro-porosity, Pinhole et al)

Thickness

Roughness

Tensile strenth

Elongation

Surface (Micro-porosity, Pinhole et al)

MechanicalBonding

CorrosionResistance

ChemicalBonding

Heat/ChemicalResistance

-3/13--3/16-

Bonding Resistance BondingResistance

Check ListCheck ListPeel Strength

Roughness

Peel Strength

Roughness

Heat resistance

Chemical-resistance

Heat resistance

Chemical-resistance

Slitting

-4/13--4/16-

Check ListCheck ListPeel Strength

Roughness

Peel Strength

Roughness

Heat resistance

Chemical-resistance

Heat resistance

Chemical-resistance

FCCL (Flexible Copper Clad Laminate) FCCL , , / Pick-up

FCCL / CCL

FCCL CCL1)

FCCL

FCCL

10

PCB3) (Matte)

FPC4) (Matte)

Polyimide

FR-42)

10

CCL

-5/13--5/16-

: Polyimide

:

Barrier :

: Polyimide

Rigid PCB

1) CCL: Copper Clad Laminate, 2) FR-4 : , 3) PCB: Printed Circuit Board, 4) FPC: Flexible Printed Circuit Board

Flexible Flexible PCBPCB

PCB ,

L/S 20 / 20 L/S 30 / 30 L/S 40 / 40 L/S 50 / 50 L/S 60 / 60

Road Map

(Rz, )

3 0

4. 0

5. 0

6. 0

LSU-STN 12

LSU-STN 18

LSU-STN 35

LSB LPV 18

-6/13--6/16- ( )

5 10 15 30 50

2. 0

3. 0 LSB-FXN 12

LSB-FXN 9

LSB-FXN 7

Carrier 3~5

LSB-LPV 18

9~12

LSB-FXU 12

FCCL(Flexible Copper Clad Laminate) (, Polyimide) () LCD COF Flexible PCB Substrate

FCCL

FCCL

i i C CCL

(Flexibility)

3 Rigid PCB

Flexible PCB

CCL

FCCL

3

Width 48 158 Width 250 500

-7/13-

Polymer ()

Copper ()

COF Application FPC Application

Width 48~158 Width 250, 500

, Rigid PCB Flexible,, Fine

Pitch Flexible PCB, 2 Layer Shift

Substrate Trend

Substrate for

Ri id PCBLaminating Thick+ CCL

Copper

Rigid PCBRigid PCBaminating

Substrate for

Flexible PCB

Laminating

Sputtering

C ti

(12~70) Prepreg

+

Polyimide(PI)(75)

FCCL(3 Layer)

+

Adhesive(10~20)

(12~35)

+ FCCL( )

Polyimide

AdhesiveCopper

Prepreg Rigid PCB

Flexible PCB

TCP

-8/13-

PCB : Printed Circuit BoardCCL : Copper Clad LaminateFCCL : Flexible Copper Clad Laminate

ThinCasting

Laminating

+

Polyimide(PI)(25~38)

(2 Layer)

(12~18)

Polyimide

Copper

Prepreg : Glass fiber Epoxy

Main Trend of CCLFlexible, 2 Layer, Environment

Friendly

COF

Flexible PCB

Adhesive Type Adhesiveless Type

3 FCCL2 FCCL

Casting/Laminating Sputtering

C F il

Copper FoilSputtering +

Electroplating

2 FCCL 3 FCCL

PI (Varnish/Film)

Copper Foil

PI Film

Cu Layer

PI Film

Adhesive

PI Film

Cu Layer

PI

(Varnish/Film)

Copper FoilCopper Foil

PI Film

Adhesive

-9/13-

Fine Pitch

GoodGood

GoodGood

ng

Copper Foil

Pitch

Copper

Foil-

/

- Epoxy

FCCL

Casting, Laminating Fine Pitch ,

Sputtering Fine Pitch

Layer

Casting

Laminatin

PIAdhesive

or TPI

Copper Foil

PI

12~70

12~35

50

Copper Foil

PI Varnish

PI

Adhesive

or TPI

Foil

Roll

: , Resin, Epoxy

-

:

- PI Varnish

: ,

- Casting

-

: Tension

- Laminating

- 12

9 Fine Pitch

- Short

- Fine Pitch

Oven

x x x x

x x x x

3

2

2

-10/13-

Sputtering

Tie Coat

Electro

Plating

PI

2~8

40

40

Copper Foil : Tension

:

- Plasma

- Sputtering

-

- 2

- Fine Pitch

-Bending,

- Driver IC Bonding

PI

Vacuum

Chamber

Target

Drum

+

Anode

(Cu ball)

-

-

-

-

x x x x

2

2 FCCL

Laminating Casting Sputtering

Copper

Layer

Limited, Difficult Limited, Difficult Easy

Thickness () 12, 18 12, 18 8

Surface Defect

Etching Layer Cu layer only Cu layer onlyCu layer +

Sputtered Layer

PI

Layer

Manufacturing

Method

Thermoplastic PI

+ PI 2

Casting

(Varnish Coating+Drying)PI Film

Thickness () 40 40 38 (35)

Total Thickness() 52 52 46

-11/13-

* ILB : Inner Lead Bonding

GoodGood

GoodGood

Fine Pitch

Transparency

Peel Strength

Ion Migration

Price

2 FCCL

2 CCL

LCD

AutoMobile

PDAPMP

HDD

Notebook PC

-12/13-

2 CCL

DVCDSC

DMB

Cellular Phone

Sputter Type FCCL

Sputter Type FCCL PI Tie-coat Cu Seed ,

NiCr Tie-coat Layer( )

Cu Seed Layer

Sputtering

Electroplating Cu Layer (8)

Electroplating

PET Fillm (50)

Polyimide Film (25,38)

(100~300) (0.1~0.3)(8)

Laminating & Slitting

Stiffener (PET Film)

Slitting

: 48, 70, 96, 105, 158, 250

-13/13-

Stiffener

Polyimide

Copper

Polyimide

Copper

Copper

Polyimide

Copper

LCD COF () FPC () FPC ()

Plasma Treatment & Sputtering

( )

Electroplating

()Laminating & Slitting

(Stiffener )

FCCL Sputtering Electroplating

Sputter Type FCCL

PI Film

(PET Film)

-14/13-

PI Film (NiCr/Cu) FCCL (48~250)

PI Film ( )

Tie-coat

: PI Cu

: Cu PI

Cu seed

:

Stiffener ()

FCCL

COF fine pitch FCCL

Fine PitchFine Pitch

-

- Tiecoat Layer

- (PI film )

- Sputter Trouble

-

-15/13-

- PI Film Thermal Damage

-

(Curl, Twist )

-

- Tiecoat , ,

-

- ,

-

Etch FactorFine Pitch

/PI Low Profile

Bottom

Top

Thickness

Etched Lead

PI Film

Etch Factor =2 Thickness

( Bottom Top ) PI Film

- PI Film / Tie-coat Roughness

Tie-coat Material

M t i l (Ni C Ni C All t )Outer Lead

Semi-additive Process

-16/13-

- Material (Ni, Cr, Ni-Cr Alloy etc)

- Composition

- Thickness

Electroplated Cu Layer

- Grain Size & Distribution

- Texture (Crystallographic Orientation)

Outer Lead

Inner Lead

Chip LCD Panel, PCB FCCL

1. 4

2. (Method B)

3. 150 , 30min annealing

(Method C)

4. MD, TD

LSL USL

Potential (Within) C apability

Within

Overall

1. PI Film

: ,

2.

3. Roll to roll Tension

4. ,

-17/13-

0.090.060.03-0.00-0.03-0.06-0.09

C pm *

C p 2.27

C PL 3.57

C PU 0.96

C pk 0.96

C C pk 2.27

Pp 1.67

PPL 2.63

PPU 0.71

Ppk 0.71

O v erall C apability

Surface Morphology

(After Plasma Treatment)

-

Fine Pitch

Normal Surface Damaged Surface

: Plasma (DC, AC, RF), Ion Gun

- ,

: Ar, O2, N2

- Power

- PI film

- Tie-coat

: ,

-

-18/13-

R/W

U/W

Drum

Pretreatment

Target

Pattern

-

- PI Film

-