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University of Minnesota DISKCON USA 2006
Fabrication and Testing ofExchange Coupled Composite Media
Weikang Shen and Jian-Ping Wang
The Center for Micromagnetics and Information Technologies Electrical and Computer Engineering Department
University of Minnesota
Acknowledgement Acknowledgement
Dr. S. Y. Hong and Dr. H. J. Lee, Samsung Information Systems America Inc., for spin-stand testing.
Dr. S. N. Piramanayagam, Data Storage Institute, Singapore, for supplying disk substrates with soft underlayer.
Supported by INSIC-EHDR program and Heraeus Inc.
University of Minnesota DISKCON USA 2006
Outline
Introduction to ECC media
Fabrication of ECC media using CoCrPt-SiO2
Spin-stand recording performance of ECC media
Switching mechanism of ECC media
Conclusions
University of Minnesota DISKCON USA 2006
Exchange Coupled Composite Media for Perpendicular Magnetic Recording
Perpendicular magnetic recording (PMR) is currently replacing longitudinal magnetic recording.
However, the density limit of PMR is around 500 Gbit/in2:WritabilitySide track erasure (STE)Switching field distribution (SFD)
Kryder, et al, 2004
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Exchange coupled composite (ECC) media has been proposed and demonstrated to address above issues and extend the areal density of perpendicular recording.
Victora, et al IEEE Trans. Magn. 2005Wang, et al, Appl. Phys. Lett. 2005
Prototype ECC MediaSi(2 nm)/FeSiO(6.5 nm)/PdSi(t nm)/[Co/PdSiO]n(18.2 nm)/UL & SL/GL
0 20 40 60 80 1003000
4000
5000
6000
7000
8000
9000
Hcr (O
e)
Angle (Degree)
Hard Layer ECC
Remnant Coercivity (Hcr)
β= ΔHcr/H
ΔHcr
ΔHcr
β= 30%
β= 13%
0 1 2 3 43000
4000
5000
6000
7000
8000
9000
10000
tPdSi (nm)
Hc (O
e)
0
20
40
60
80
100
120
∆Ε/k
BT
ECC Media
Less angular dependenceSTE & SFD
Lower switching fieldWritability
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J. P. Wang, el al, Appl. Phys. Lett. 86, 142504(2005).
CoCrPt-SiO2 Hard Layer for ECC Media Si(2 nm)/CoCrPt-SiO2(20 nm)/Ru(40 nm)/Ta(5 nm)/Glass
Grain size: 7.0 nm
-10000 -5000 0 5000 10000-500-400-300-200-100
0100200300400500
M (e
mu/
cm3 )
H (Oe)
Hc 5.1 kOeMs 390 emu/cm3
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-10000 -5000 0 5000 10000
-600
-400
-200
0
200
400
600 Pt: 1.8 nm
M (e
mu/
cm3 )
H (Oe)
-10000 -5000 0 5000 10000
-600
-400
-200
0
200
400
600 Pt: 3.6 nm
M (e
mu/
cm3 )
H (Oe)
-10000 -5000 0 5000 10000-600
-400
-200
0
200
400
600Pt: 0.70 nm
M (e
mu/
cm3 )
H (Oe)
-10000 -5000 0 5000 10000
-600
-400
-200
0
200
400
600
M (e
mu/
cm3 )
H (Oe)
Pt: 2.0 nm
Perpendicular Hysteresis Loops of ECC MediaSi(2 nm)/CoCrPt-SiO2 (8 nm)/Pt(t nm)/CoCrPt-SiO2(20 nm)/Ru(40 nm)/Ta(5 nm)/Glass
Hsat
HsatHsat
Hsat
HHss~ Interlayer Thickness~ Interlayer Thickness
1 2 3 47000
7500
8000
8500
9000
9500
10000
Hs (O
e)
tPt (nm)
ECC media
Si(2 nm)/CoCrPt-SiO2 (8 nm)/Pt(t nm)/CoCrPt-SiO2(20 nm)/Ru(40 nm)/Ta(5 nm)/Glass
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Disk Structures
Media Type Structures
ECC
Con. PMR
Ref. PMR N.A.
Si(1.5nm)/CoCrPt-SiO2(8nm)/Pt(1.0nm)/CoCrPt-SiO2(20nm)/Ru(20nm)/Ta(2.5nm)/SUL
Si(1.5nm)/CoCrPt-SiO2(20nm)/Ru(20nm)/Ta(2.5nm)/SUL
• After fabrication, all disks were packaged in the clean room and shipped to the company for post procession and spin-stand testing.
• Carbon overcoat was 3.5 nm thick. Lubricant is ~1.0 nm thick.• Reference PMR media is provided by a company, which is targeting for 200
Gbit/in2 areal density magnetic recording.
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Perpendicular Hysteresis Loops
-10000 -5000 0 5000 10000-600
-400
-200
0
200
400
600
M (e
mu/
cm3 )
H (Oe)-10000 -5000 0 5000 10000
-600
-400
-200
0
200
400
600
M (e
mu/
cm3 )
H (Oe)
Con. PMR (single hard layer) ECC media
Hc = 6.3 kOeHs = 12.5 kOe
Hc = 3.0 kOeHs = 7.0 kOe
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Spin-stand Test Results (1)
0 10 20 30 40 50 608
10
12
14
16
18
LF-T
AA
(mV
)
Write Current (mA)
ECC
Ref. PMR
Conv. PMR
Saturation CurveSaturation Curve
-20 -16 -12 -8 -4 0 4 8 12
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4 ECC Con. PMR Ref. PMR
Am
plitu
de (m
V/µ
A)
Write Offset(µin)
Track ProfileTrack Profile
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Spin-stand Test Results (2)
10 100 100050
60
70
80
90
100
110
Linear density: 584.4 kfci ECC Con. PMR Ref. PMR
Nor
mal
ized
Sig
nal (
%)
Time (Second)10 100 1000
50
60
70
80
90
100
110
Linear density: 52.8 kfci ECC Con. PMR Ref. PMR
Nor
mal
ized
Sin
gal (
%)
Time (Second)
HF-Time Decay LF-Time Decay
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Spin-stand Test Results (3)
0 10 20 30 40 50 608
10
12
14
16
18
LF-T
AA
(mV
)Write Current (mA)
ECC
Ref. PMR
Conv. PMR
Saturation CurveSaturation Curve
100 200 300 400 500 600 700 800 900
-20
-10
0
10
20
30 ECC Con. PMR Ref. PMR
SNR
_Tot
al (d
B)
Linear Density (kfci)
Roll-Curve
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Switching MechanismsSwitching Mechanisms
Incoherent SwitchingCoherent Switching
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Soft region
Hard region
Happ
Hex
Soft region
Hard region
CriteriaCriteria-- Exchange Length in the Soft LayerExchange Length in the Soft Layer
A Domain wall must fit in the soft layer near the switching point for exchange-spring model.
Domain Wall Width:
softappl
softsoftDW MH
A2≈l
A. Dobin and H. Richter, DB-10, Intermag 2006
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ECC Media Using [Co/ECC Media Using [Co/PdSiO]PdSiO]nn
Si(1.0 nm)/FeSiO(6.5 nm)/PdSi(t nm)/[Co/PdSiO]16(18.2 nm)/UL & SL/GL
0 1 2 3 4
4000
5000
6000
7000
8000
H
c (Oe)
tPdSi (nm)
ECC Media
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Domain Wall Width in FeSiO Domain Wall Width in FeSiO (M(Mss= 450 = 450 emu/c.cemu/c.c.).)
Domain Wall Width:
softappl
softsoftDW MH
A2≈l
A. Dobin and H. Richter, DB-10, Intermag 2006
Oe 194erg/cm 101
eum/cm 620
emu/cm 450
6
3
3
kHHA
M
M
cappl
FeSiO
CoreFeSiO
FeSiO
.≈=
×=
=
=
− nm 88.≈FeSiODWl nm) (6.5 FeSiOt>
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A domain wall can not fit in 6.5 nm FeSiO (Ms= 450 emu/c.c.) at the coercivity point. Dynamic tilted switching (two spin-model) is the main mechanism for coercivity reduction.
Domain Wall Width in CoCrPtDomain Wall Width in CoCrPt--SiOSiO22(M(Mss= 800 = 800 emu/c.cemu/c.c.).)
Domain Wall Width:
softappl
softsoftDW MH
A2≈l
A. Dobin and H. Richter, DB-10, Intermag 2006
Oe 03erg/cm 101
emu/cm 950
emu/cm 800
6
3
3
kHHA
M
M
cappl
CoCrPt
CoreCoCrPt
CoCrPt
.≈=
×=
=
=
− nm 48.≈CoCrPt
DWl nm) (8.0 CoCrPtt~
A domain wall can fit in 8.0 nm CoCrPt-SiO2 soft layer at the coercivity point. Domain wall propagation (exchange-spring model) may be the main mechanism for coercivity reduction.
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Conclusions
Compared to conventional PMR media, ECC media showed an excellent saturation writing performance.
Disk level thermal stability was tested. No thermal degrading was found for ECC media, which confirmed the thermal stability of ECC media.
The switching mechanism of ECC media can be coherent switching or incoherent switching.
University of Minnesota DISKCON USA 2006